JPH1031224A - Display substrate and liquid crystal display device using the same - Google Patents
Display substrate and liquid crystal display device using the sameInfo
- Publication number
- JPH1031224A JPH1031224A JP18761896A JP18761896A JPH1031224A JP H1031224 A JPH1031224 A JP H1031224A JP 18761896 A JP18761896 A JP 18761896A JP 18761896 A JP18761896 A JP 18761896A JP H1031224 A JPH1031224 A JP H1031224A
- Authority
- JP
- Japan
- Prior art keywords
- transparent electrode
- lead
- substrate
- region
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
(57)【要約】
【課題】 引出線の抵抗値のバラツキに起因する表示品
位低下の防止。引出線を構成する透明電極の設計を容易
化。
【解決手段】 基板30と、該基板の一方の面の点灯領
域A内に形成した複数の透明電極34と、前記各透明電
極の幅よりも狭い幅の外部接続端子36を所定数集合し
て前記基板の1辺に離間配置した複数の外部接続端子部
37と、前記透明電極34の一端を対応する前記外部接
続用端子36に接続するように傾斜した引出線38を所
定数集合して離間配置した複数の引出線部39とを備え
る表示用基板において、前記引出線部39は、その引出
線38を透明電極層38aとその上に形成した該透明電
極層38aよりも低抵抗の金属層38bとによって構成
したことを特徴とする。
(57) [Abstract] [Problem] To prevent display quality deterioration due to variation in resistance value of a lead wire. Easier design of the transparent electrode that composes the lead wire. SOLUTION: A predetermined number of sets of a substrate 30, a plurality of transparent electrodes 34 formed in a lighting area A on one surface of the substrate, and external connection terminals 36 having a width smaller than the width of each transparent electrode are collected. A plurality of external connection terminal portions 37 spaced apart from one side of the substrate and a predetermined number of lead wires 38 inclined to connect one end of the transparent electrode 34 to the corresponding external connection terminal 36 are collected and separated. In a display substrate having a plurality of lead-out portions 39 disposed, the lead-out portion 39 is formed by forming the lead-out line 38 on a transparent electrode layer 38a and a metal layer having a lower resistance than the transparent electrode layer 38a formed thereon. 38b.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、表示用の電極に透
明電極を用いる液晶表示装置等の表示装置に係わり、特
に、点灯領域の電極を外部接続用の端子部に引き出すた
めの引出線に金属配線を用いた表示用基板、及びそれを
用いる液晶表示装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device such as a liquid crystal display device using a transparent electrode as a display electrode, and more particularly to a lead wire for drawing an electrode in a lighting area to a terminal for external connection. The present invention relates to a display substrate using metal wiring and a liquid crystal display device using the same.
【0002】[0002]
【従来の技術】単純マトリックス型の表示装置において
は、表示用基板の点灯領域に複数の透明電極をストライ
プ状に配置し、基板の一端に駆動用素子との接続を行う
ための接続端子部を設け、その接続端子部を互いに離間
して複数配置し、点灯領域と接続端子部の間に、透明電
極の一端を前記接続端子部に引き出すための透明電極と
同じ部材で構成した引出線部を配置している。そして、
接続端子部が離間配置され、透明電極とそれに対応する
接続端子の位置がずれている関係上、引出線は透明電極
の一端近傍から屈曲され、透明電極に対して斜め方向に
引き出される。ここで、引出線はITOなどの比較的抵
抗値が高い部材によって構成されているので、引出線が
引出線部の中央に位置する場合と端に位置する場合と
で、その長さに相違が生じ、その長さの相違が抵抗値に
大きな影響を与える。引出線の抵抗値に相違が生じる
と、それが表示品位に大きく影響するので、従来は引出
線の幅を調節して引出線の抵抗値の均一化を図ってい
た。2. Description of the Related Art In a simple matrix type display device, a plurality of transparent electrodes are arranged in a stripe shape in a lighting area of a display substrate, and a connection terminal portion for connecting to a driving element is provided at one end of the substrate. Provided, a plurality of the connection terminal portions are arranged apart from each other, and between the lighting region and the connection terminal portion, a lead wire portion formed of the same member as the transparent electrode for leading one end of the transparent electrode to the connection terminal portion is provided. Have been placed. And
Since the connection terminal portions are spaced apart from each other and the positions of the transparent electrode and the corresponding connection terminal are shifted, the lead wire is bent from near one end of the transparent electrode and drawn obliquely with respect to the transparent electrode. Here, since the lead wire is made of a member having a relatively high resistance value such as ITO, there is a difference in the length between the case where the lead wire is located at the center of the lead wire portion and the case where it is located at the end. And the difference in length greatly affects the resistance value. If a difference occurs in the resistance value of the lead line, the difference greatly affects the display quality. Conventionally, the width of the lead line is adjusted to make the resistance value of the lead line uniform.
【0003】しかしながら、表示画面の大型化に伴い、
引出線部を構成する引出線数が増大するに従って、引出
線の幅による調整が困難になりつつある。特に、引出線
部の端に位置する引出線は比較的その長さが長くなるの
でその幅を増加させて抵抗値が減少するような調整が行
われるが、端に位置する引出線はその引出し角度が鋭角
化するに従って、引出線の幅を広くするような調整が困
難になりつつある。However, as the display screen becomes larger,
As the number of leader lines constituting the leader part increases, it is becoming difficult to adjust the width of the leader lines. In particular, since the length of the lead wire located at the end of the lead wire portion is relatively long, adjustment is made to increase the width and reduce the resistance value, but the lead wire located at the end is provided with the lead wire. As the angle becomes acute, it is becoming difficult to make adjustments to increase the width of the leader line.
【0004】[0004]
【発明が解決しようとする課題】本発明は、上記の点を
考慮し、引出線部の抵抗値のバラツキに起因する表示品
位の低下を防止することを課題の1つとする。引出線部
を構成する透明電極の設計を容易化することを課題の1
つとする。引出線部の改良に伴い新たに発生する問題点
を解決し、表示品位の向上を図ることを課題の1つとす
る。SUMMARY OF THE INVENTION An object of the present invention is to prevent the deterioration of display quality due to the variation of the resistance value of the lead wire portion in view of the above points. One of the problems is to facilitate the design of the transparent electrode constituting the lead wire portion.
One. One of the problems is to solve a new problem caused by the improvement of the lead line portion and to improve display quality.
【0005】[0005]
【課題を解決するための手段】本発明の表示用基板は、
基板と、該基板の一方の面の点灯領域内に形成した複数
の透明電極と、前記各透明電極の幅よりも狭い幅の外部
接続端子を所定数集合して前記基板の1辺に離間配置し
た複数の外部接続端子部と、前記透明電極の一端を対応
する前記外部接続用端子に接続するように傾斜した引出
線を所定数集合して離間配置した複数の引出線部とを備
える表示用基板において、前記引出線部は、その引出線
を透明電極層とその上に形成した該透明電極層よりも低
抵抗の金属層とによって構成したことを特徴とする。A display substrate according to the present invention comprises:
A predetermined number of a substrate, a plurality of transparent electrodes formed in a lighting area on one surface of the substrate, and external connection terminals having a width smaller than the width of each of the transparent electrodes are separately arranged on one side of the substrate. A plurality of external connection terminal parts, and a plurality of lead lines inclined at predetermined intervals to connect one end of the transparent electrode to the corresponding external connection terminal, and a plurality of lead line parts spaced apart from each other. In the substrate, the lead line portion is characterized in that the lead line is formed by a transparent electrode layer and a metal layer formed thereon and having a lower resistance than the transparent electrode layer.
【0006】また、前記金属層は、幅が狭い領域と幅が
広い領域を備え、前記幅が広い領域をシール剤配置予定
線に沿って配置したことを特徴とする。また、前記引出
線部と引出線部の間の領域に、前記引出線と同じ構造の
ダミー電極を前記シール剤配置予定線に沿って複数離間
配置したことを特徴とする。Further, the metal layer has a narrow region and a wide region, and the wide region is arranged along a sealing agent arrangement line. Further, a plurality of dummy electrodes having the same structure as the lead lines are arranged in a region between the lead line portions and separated from each other along the sealing agent arrangement line.
【0007】さらにまた、本発明の表示用基板は、基板
と、該基板の一方の面の略領域に形成した複数の透明電
極と、前記基板の一辺に設けた外部接続端子部と、点灯
領域の内側に位置する透明電極と前記外部接続端子部に
設けた外部接続端子を接続するように、透明電極層とそ
の上に設けた金属層からなる引出線を所定数集合した引
出線部を備え、前記点灯領域の外周部に位置する透明電
極上には、点灯領域を囲むように設定されたシール剤配
置予定線に沿って、前記引出線の金属層と同じ厚みの金
属層を形成したことを特徴とする。Further, the display substrate of the present invention comprises: a substrate; a plurality of transparent electrodes formed in a substantially area on one surface of the substrate; an external connection terminal provided on one side of the substrate; A transparent electrode layer and a lead line portion formed by assembling a predetermined number of lead lines formed of a metal layer provided thereon so as to connect the transparent electrode located inside and the external connection terminal provided in the external connection terminal portion. A metal layer having the same thickness as the metal layer of the lead wire is formed on the transparent electrode located at the outer peripheral portion of the lighting region, along a sealing agent arrangement line set so as to surround the lighting region. It is characterized by.
【0008】さらにまた、本発明の液晶表示装置は、少
なくとも一方の表示用基板に前記表示用基板を用いたこ
とを特徴とする。Further, the liquid crystal display device of the present invention is characterized in that the display substrate is used as at least one display substrate.
【0009】[0009]
【発明の実施の形態】以下本発明の実施例について図面
を参照して説明する。本発明の一実施例に係わるカラ−
液晶表示装置1は、図1にその要部断面図を示すよう
に、第1の表示用基板2と第2の表示用基板3の外周部
をシール剤(図示せず)を用いて図2に示すシール配置
予定線Lに沿ってシールし、その間に液晶分子が90〜
270度捩れるように液晶4を封入して構成された単純
マトリックス型の表示装置で、これらを挟むように、偏
光板や位相差板(いずれも図示せず)を必要に応じて配
置して構成される。Embodiments of the present invention will be described below with reference to the drawings. Color according to one embodiment of the present invention
The liquid crystal display device 1 uses a sealant (not shown) to seal the outer peripheral portions of the first display substrate 2 and the second display substrate 3 as shown in FIG. Are sealed along the planned seal arrangement line L shown in FIG.
A display device of a simple matrix type in which the liquid crystal 4 is sealed so as to be twisted by 270 degrees, and a polarizing plate and a phase difference plate (neither is shown) are arranged as necessary so as to sandwich the display device. Be composed.
【0010】第1の表示用基板2は、ガラス等の基板2
0の一方の面上にストライプ状にセグメント線用透明電
極21を複数本形成して構成している。The first display substrate 2 is a substrate 2 made of glass or the like.
A plurality of segment line transparent electrodes 21 are formed in a stripe shape on one surface of the substrate.
【0011】第2表示用基板3は、ガラス等の基板30
の一方の面上にブラックマトリックス層31を形成し、
その上に3つの色要素(赤,緑,青)を前記セグメント
線用透明電極21と同じ幅で同方向にストライプ状に順
次配置してカラーフィルター層32を形成し、それを覆
うようにオ−バ−コ−ト膜33を形成し、その上にカラ
ーフィルター層32のストライプ方向と直交する方向の
コモン線用透明電極34を複数形成している。複数の透
明電極21,34は、ITO(Snをド−プしたIn2
O3)薄膜等の透明導電性金属酸化物層によって形成
し、透明電極21の厚みを300nm程度に設定し、透
明電極34の厚みを100nm程度に設定している。各
コモン線用透明電極34の上には、それぞれ無電解メッ
キ処理によって、Ni−Au(ニッケル−金)合金等の
金を含み、前記透明電極34よりも導電性が格段に良い
(抵抗値が1/100程度と低抵抗)金属配線35を形
成している。The second display substrate 3 is a substrate 30 made of glass or the like.
Forming a black matrix layer 31 on one surface of
On top of this, three color elements (red, green, blue) are sequentially arranged in stripes in the same direction with the same width as the segment line transparent electrode 21 to form a color filter layer 32, and the color filter layer 32 is formed so as to cover it. A bar coat film 33 is formed, and a plurality of common line transparent electrodes 34 in a direction perpendicular to the stripe direction of the color filter layer 32 are formed thereon. The plurality of transparent electrodes 21 and 34 are made of ITO (Sn-doped In 2
O 3 ) It is formed of a transparent conductive metal oxide layer such as a thin film. The thickness of the transparent electrode 21 is set to about 300 nm, and the thickness of the transparent electrode 34 is set to about 100 nm. Each of the common line transparent electrodes 34 includes gold such as a Ni-Au (nickel-gold) alloy by electroless plating, and has much higher conductivity than the transparent electrodes 34 (having a resistance value of much higher). The metal wiring 35 is formed.
【0012】第1,第2表示基板の互いに対向する面に
は、必要に応じて配向膜を設けることができる。An alignment film can be provided on the surfaces of the first and second display substrates facing each other as needed.
【0013】第2の表示用基板3は、図2にその平面図
を概略的に示すように、中央に点灯領域A、この点灯領
域Aを囲むように配置された外周領域B、この外周領域
Bに隣接して基板3の一辺に位置する外部配線との接続
用の接続端子領域Cが形成されている。The second display substrate 3 has a lighting area A at the center, an outer peripheral area B surrounding the lighting area A, and an outer peripheral area as schematically shown in a plan view of FIG. A connection terminal area C for connection to an external wiring located on one side of the substrate 3 adjacent to B is formed.
【0014】点灯領域Aには図2にその一部を拡大して
示すように、透明電極34の上面に金属配線35を形成
した複数のコモン線COMが左右方向にストライプ状に
配列されている。金属配線35は、光透過率の低下を抑
えるために、透明電極34(幅300μm前後)よりも
かなり狭い幅(20〜50μm)に設定され、透明電極
34の中央部にその長手方向に沿って配置されている。
金属配線35を透明電極34の中央部に配置することに
よって、金属配線35の剥離を防止する構造としてい
る。In the lighting area A, a plurality of common lines COM each having a metal wiring 35 formed on the upper surface of a transparent electrode 34 are arranged in a stripe pattern in the left-right direction, as shown in a partially enlarged view in FIG. . The metal wiring 35 is set to a width (20 to 50 μm) which is considerably narrower than the transparent electrode 34 (around 300 μm in width) in order to suppress a decrease in light transmittance. Are located.
By arranging the metal wiring 35 at the center of the transparent electrode 34, the metal wiring 35 is prevented from peeling off.
【0015】接続端子領域Cには、図2,図3に示すよ
うにコモン線COMよりも幅が狭い外部接続端子36を
コモン線COMよりも狭いピッチで所定数集合して構成
した外部接続端子部37を基板30の一端に沿って複数
離間配置している。In the connection terminal area C, as shown in FIGS. 2 and 3, an external connection terminal 36 is formed by assembling a predetermined number of external connection terminals 36 having a width smaller than the common line COM at a smaller pitch than the common line COM. A plurality of the portions 37 are arranged along one end of the substrate 30.
【0016】外周領域Bは、点灯領域Aと接続端子領域
Cの間に位置してコモン線引出領域として機能する左領
域B1と、点灯領域Aの右側に位置する右領域B2と、
点灯領域Aの上下に位置する上領域B3、並びに下領域
B4とによって形成されている。The outer peripheral area B includes a left area B1 located between the lighting area A and the connection terminal area C and functioning as a common line drawing area, and a right area B2 located on the right side of the lighting area A.
It is formed by an upper region B3 located above and below the lighting region A and a lower region B4.
【0017】左領域B1には、図2,図3に示すよう
に、点灯領域Aのコモン線COMの一端を接続端子部3
7に引出すための引出線38を所定数集合して構成した
引出線部39が離間して複数形成されているとともに、
引出線部39の両側部分にダミー電極40を所定数集合
して構成したダミー電極領域41が複数形成されてい
る。As shown in FIGS. 2 and 3, one end of the common line COM of the lighting area A is connected to the connection terminal section 3 in the left area B1.
A plurality of lead wire portions 39 formed by assembling a predetermined number of lead wires 38 for leading to 7 are formed apart from each other,
A plurality of dummy electrode regions 41 formed by assembling a predetermined number of dummy electrodes 40 are formed on both sides of the lead wire portion 39.
【0018】引出線38の大部分は、図3に詳細に示す
ように、コモン線COMの一端を対応する接続端子36
に接続するように、コモン線COMに対して所定の角度
をもって屈曲形成されている。各引出線38は、透明電
極34の形成と同時に図4に示すように形成される透明
電極層38aとその上に金属配線35の形成と同時に形
成される金属層38bによって構成されている。As shown in detail in FIG. 3, most of the lead wire 38 is connected to one end of a common line COM by a corresponding connection terminal 36.
Are bent at a predetermined angle with respect to the common line COM. Each lead line 38 is constituted by a transparent electrode layer 38a formed simultaneously with the formation of the transparent electrode 34 as shown in FIG. 4 and a metal layer 38b formed thereon simultaneously with the formation of the metal wiring 35.
【0019】引出線38は透明電極層38aの上に金属
層38bを設けることによって、透明電極層38aのみ
の場合に比べてその抵抗値を1/100程度に低減する
ことができるので、接続端子部37までの引出長さに応
じた抵抗値の変動を殆ど無視することができる程度に小
さく設定でき、引出線38の引出角度や幅の設計自由度
を極めて高くすることができる。よって、透明電極層3
8a上に金属層38bを設けた引出線38は、点灯領域
Aの配線として、この例のように透明電極34上に金属
配線35を設けた場合のみならず、透明電極34のみと
した場合にも、引出線38の引出角度や幅の設計自由度
を高める上で有用である。By providing the metal layer 38b on the transparent electrode layer 38a, the resistance of the lead 38 can be reduced to about 1/100 as compared with the case where only the transparent electrode layer 38a is used. The variation of the resistance value according to the lead length to the portion 37 can be set small enough to be almost negligible, and the degree of freedom in designing the lead angle and width of the lead wire 38 can be extremely increased. Therefore, the transparent electrode layer 3
The lead wire 38 provided with the metal layer 38b on 8a is used not only when the metal wiring 35 is provided on the transparent electrode 34 as the wiring of the lighting area A as in this example but also when only the transparent electrode 34 is provided. This is also useful for increasing the degree of freedom in designing the extraction angle and width of the extraction line 38.
【0020】金属層38bには、幅狭の領域38b1と
幅広の領域38b2が形成されている。幅狭領域38b
1は、点灯領域A側に設けられ、その幅が金属配線35
の幅と同じ程度になるように狭く設定されている。この
幅狭領域38b1は、金属配線35と同様に、透明電極
層38a(特に点灯領域A外周部に設定され有効表示領
域)を通過する光の遮断防止と、金属層38bを構成す
る材料(特に高価な金)の使用量の削減に寄与する。The metal layer 38b has a narrow region 38b1 and a wide region 38b2. Narrow area 38b
1 is provided on the lighting area A side and has a width of the metal wiring 35.
Is set to be as narrow as the width of. Like the metal wiring 35, the narrow region 38b1 prevents the light passing through the transparent electrode layer 38a (especially, the effective display region set at the outer peripheral portion of the lighting region A) from blocking the material (particularly, the material forming the metal layer 38b). This contributes to a reduction in the amount of expensive gold) used.
【0021】幅広領域38b2は、接続端子領域C側に
設けられ、その幅が金属配線35ないし幅狭領域38b
1における金属層38bの幅の数倍程度と充分広くなる
ように、透明電極層38aの幅と同じか若干狭い幅に設
定されている。この幅広領域38b2は、シール剤の下
地部分の平坦化に寄与する。すなわち、シール剤配置予
定線L部分に沿った下地層としてコモン線COMと同じ
幅の幅狭領域38b1が位置すると、幅狭の金属層38
bによってシール剤の厚みが凸凹になり易い。そこで、
これを防ぐように、シール剤配置予定線Lに沿った引出
線38上に金属層38bの幅広領域38b2を形成して
いる。金属層38bの幅を広くする部分は、シール剤配
置予定線Lの幅より若干広い領域で良いので、金属層3
8bを構成する材料の使用量増加を最小限に抑えること
ができる。The wide region 38b2 is provided on the connection terminal region C side, and has a width of the metal wiring 35 or the narrow region 38b.
The width of the transparent electrode layer 38a is set to be equal to or slightly smaller than the width of the transparent electrode layer 38a so as to be sufficiently wide, which is about several times the width of the metal layer 38b in FIG. The wide region 38b2 contributes to the flattening of the base portion of the sealant. In other words, when the narrow region 38b1 having the same width as the common line COM is located as a base layer along the portion L where the sealant is to be arranged, the narrow metal layer 38 is formed.
b tends to make the thickness of the sealant uneven. Therefore,
In order to prevent this, a wide area 38b2 of the metal layer 38b is formed on the lead line 38 along the sealing agent arrangement line L. The portion where the width of the metal layer 38b is widened may be a region slightly larger than the width of the sealing agent planned line L.
8b can be minimized.
【0022】ダミー電極領域41は、複数のダミー電極
40を、シール剤配置予定線Lに沿って、引出線部38
の間や周辺部分を埋めるように、離間配置して構成され
る。ダミー電極40は、引出線38と同様に、透明電極
34の形成と同時に形成される透明電極層40aとその
上に金属配線35と同時に形成される金属層40bによ
って構成され、引出線38と同じ厚みに設定されてい
る。ダミー電極40上の金属層40bは、引出線38の
幅広領域38b2における金属層38bと同様に、その
幅が金属配線35ないし幅狭領域38b1における金属
層38bの幅の数倍程度と充分広くなるように、透明電
極層40aの幅と略同じか若干狭い幅に設定されてい
る。In the dummy electrode region 41, a plurality of dummy electrodes 40 are formed along the lead line portion 38 along the sealing agent arrangement line L.
It is configured so as to be spaced apart so as to fill the space between and around it. The dummy electrode 40 includes a transparent electrode layer 40a formed simultaneously with the formation of the transparent electrode 34 and a metal layer 40b formed simultaneously with the metal wiring 35 thereon, similarly to the lead line 38, and is the same as the lead line 38. The thickness is set. Like the metal layer 38b in the wide area 38b2 of the lead wire 38, the width of the metal layer 40b on the dummy electrode 40 is sufficiently large, about several times the width of the metal layer 38b in the metal wiring 35 or the narrow area 38b1. As described above, the width is set to be substantially the same as or slightly smaller than the width of the transparent electrode layer 40a.
【0023】右領域B2には、図5に示すように、前記
左領域B1に形成された引出線部39と類似形状の疑似
引出線部42を形成している。但し、この疑似引出線部
42の金属層42bは、コモン線COMの金属配線35
と同じ幅に設定され、引出線38に形成した幅広領域3
8b2に部分に相当する領域は、疑似引出線部42と離
間したダミー電極領域43部分に形成されている。この
ダミー電極領域43は、シール剤配置予定線Lに沿って
離間配置した複数のダミー電極44によって構成されて
いる。このダミー電極44は、前記ダミー電極40と同
様に、透明電極34の形成と同時に形成される透明電極
層44aと、その上に金属配線35と同時に形成される
金属層44bによって構成され、引出線38と同じ厚み
に設定されている。ダミー電極44上の金属層44b
は、前記ダミー電極40と同様に、その幅が金属配線3
5ないし幅狭領域38b1における金属層38bの幅の
数倍程度と充分広くなるように、透明電極層44aの幅
と略同じか若干狭い幅に設定されている。As shown in FIG. 5, in the right area B2, a pseudo lead line section 42 having a similar shape to the lead line section 39 formed in the left area B1 is formed. However, the metal layer 42b of the pseudo lead line portion 42 is formed of the metal wiring 35 of the common line COM.
And the wide area 3 formed on the leader line 38
The region corresponding to the portion 8b2 is formed in the dummy electrode region 43 that is separated from the pseudo lead line portion 42. This dummy electrode region 43 is constituted by a plurality of dummy electrodes 44 spaced apart along the sealing agent arrangement line L. Like the dummy electrode 40, the dummy electrode 44 includes a transparent electrode layer 44a formed simultaneously with the formation of the transparent electrode 34, and a metal layer 44b formed thereon simultaneously with the metal wiring 35. 38 is set to the same thickness. Metal layer 44b on dummy electrode 44
The width of the metal wiring 3 is the same as that of the dummy electrode 40.
The width of the transparent electrode layer 44a is set to be substantially the same as or slightly smaller than the width of the transparent electrode layer 44a so as to be sufficiently wide, which is about several times the width of the metal layer 38b in the 5 to narrow region 38b1.
【0024】上領域B3には図6に示すように、シール
剤配置予定線Lに沿って複数のダミー電極45を離間形
成したダミー電極領域46を設けている。このダミー電
極45は、コモン線COMに垂直な点を除いて、前記ダ
ミー電極40,44と同様に構成される。下領域B4に
も、図2に示すようにシール剤配置予定線Lに沿ってダ
ミー電極領域47が設けられており、このダミー電極領
域47は図6に示すダミー電極領域46と同様にして構
成される。As shown in FIG. 6, the upper region B3 is provided with a dummy electrode region 46 in which a plurality of dummy electrodes 45 are formed apart from each other along the sealing agent arrangement line L. The dummy electrode 45 has the same configuration as the dummy electrodes 40 and 44 except for a point perpendicular to the common line COM. The lower region B4 is also provided with a dummy electrode region 47 along the sealing agent arrangement line L as shown in FIG. 2, and the dummy electrode region 47 is configured in the same manner as the dummy electrode region 46 shown in FIG. Is done.
【0025】このようにして点灯領域Aを囲む外周領域
Bには、そのほぼ全領域に亘って複数の透明電極層が形
成され、その結果、第2の表示用基板3には、その一方
の面の略全面に亘って、複数の透明電極が形成される。In this manner, a plurality of transparent electrode layers are formed in substantially the entire outer peripheral area B surrounding the lighting area A. As a result, the second display substrate 3 has one of the transparent electrode layers formed thereon. A plurality of transparent electrodes are formed over substantially the entire surface.
【0026】引出線部39が設けられる左領域B1にお
いては、引出線38が金属層38bが配置されてその厚
みが他の領域B2〜B4に比べて厚くなるので、配置し
たシール剤の厚みにアンバランス生じて、液晶層4の厚
みが不均一になる要因となるが、他の領域B2〜B4に
は、シール剤配置予定線Lに沿って引出線38と同じ厚
みのダミー電極を有するダミー電極領域43,46,4
7を形成しているので、シール剤配置予定線Lの下地層
部分を全体的に平坦化でき、引出線38の厚みが増加し
たことによる影響を打消すことができる。In the left region B1 where the lead portion 39 is provided, the lead 38 is thicker than the other regions B2 to B4 because the lead 38 is disposed with the metal layer 38b. Although imbalance occurs and causes the thickness of the liquid crystal layer 4 to be non-uniform, the other regions B2 to B4 have dummy electrodes having the same thickness as the lead lines 38 along the sealing agent arrangement lines L. Electrode areas 43, 46, 4
Since the underlayer 7 is formed, the underlying layer portion of the sealing agent disposition line L can be entirely flattened, and the influence of the increase in the thickness of the lead wire 38 can be eliminated.
【0027】また、ダミー電極領域は、引出線38が配
置されない領域B2〜B4のみならず、引出線38が設
けられる左領域B1においても、引出線部39の間や周
辺部分を埋めるように形成しているので、シール剤配置
予定線Lの下地層部分を全体的により平坦化でき、シー
ル剤の厚みを均一に保って液晶層4の厚みも均一化する
ことができる。The dummy electrode region is formed not only in the regions B2 to B4 where the lead-out lines 38 are not arranged but also in the left region B1 where the lead-out lines 38 are provided so as to fill the space between the lead-out portions 39 and the peripheral portion. Accordingly, the underlying layer portion of the sealing agent disposition line L can be made flatter as a whole, and the thickness of the liquid crystal layer 4 can be made uniform by keeping the thickness of the sealing agent uniform.
【0028】ここで、引出線38に形成する金属層38
bは、幅狭領域38b1と幅広領域38b2とを有し、
幅広領域38b2をシール剤配置予定線Lに沿って設け
ているので、下地部分の平坦領域をより広く確保するこ
とができる。そして、この幅広領域38b2と点灯領域
Aの間に幅狭領域38b1が存在するので、幅広領域3
8b2によって光が遮光されるのを防止することもでき
る。Here, the metal layer 38 formed on the lead wire 38
b has a narrow region 38b1 and a wide region 38b2,
Since the wide region 38b2 is provided along the sealing agent disposition line L, the flat region of the base portion can be more widely secured. Since the narrow area 38b1 exists between the wide area 38b2 and the lighting area A, the wide area 3
8b2 can also prevent light from being blocked.
【0029】また、引出線38に形成した金属層38b
の幅は、シール剤配置予定線Lに対応した部分のみ幅広
くし、点灯領域Aと接続する側の幅は狭く設定している
ので、金属層を構成する材料の使用を最小限に抑えるこ
とができる。The metal layer 38b formed on the lead wire 38
Is set to be wide only in the portion corresponding to the sealing agent arrangement line L, and the width on the side connected to the lighting region A is set to be narrow, so that the use of the material forming the metal layer can be minimized. it can.
【0030】同様に、ダミー電極領域41,43,4
6,47においても、その金属層の幅は、シール剤配置
予定線Lに対応した部分のみ幅広く設定しているので、
金属層を構成する材料の使用を最小限に抑えることがで
きる。特に、金属材料に金を含むこの例においては、金
の使用量を削減してコストダウンに寄与することができ
る。Similarly, dummy electrode regions 41, 43, 4
6 and 47, the width of the metal layer is set to be wide only in the portion corresponding to the sealing agent arrangement line L.
Use of the material forming the metal layer can be minimized. In particular, in this example in which the metal material contains gold, the amount of gold used can be reduced, which can contribute to cost reduction.
【0031】引出線部39の近傍に位置するダミー電極
領域41、他のダミー電極領域は、点灯領域Aから離間
して設けているので、その金属層によって点灯領域A近
傍の光が遮光されるのを防止することができる。Since the dummy electrode region 41 and the other dummy electrode regions located near the lead line portion 39 are provided separately from the lighting region A, the light near the lighting region A is blocked by the metal layer. Can be prevented.
【0032】尚、上記実施例における各ダミー電極は、
長方形状を成しているが、これに代えて、図7に示すよ
うな、一辺が300μm前後の正方形状を成すダミー電
極48(透明電極層48aと金属層48bによって構成
される)を用いることもできる。Each of the dummy electrodes in the above embodiment is
Although it has a rectangular shape, a dummy electrode 48 (formed of a transparent electrode layer 48a and a metal layer 48b) having a square shape with a side of about 300 μm as shown in FIG. 7 is used instead. Can also.
【0033】また、上記実施例は、コモン線COMが設
けられた側の表示用基板3に本発明を適用した場合を例
示したが、本発明は、セグメント線が設けられた側の表
示用基板2にも適用でき、両方の表示用基板2,3に同
時に適用することもできる。In the above-described embodiment, the case where the present invention is applied to the display substrate 3 on the side provided with the common line COM is illustrated. However, the present invention relates to the display substrate 3 on the side provided with the segment lines. 2 and can be applied to both display substrates 2 and 3 at the same time.
【0034】[0034]
【発明の効果】以上のように本発明によれば、引出線部
の低抵抗値化を図ってその引出線の設計自由度を高める
ことができるとともに、引出部分の長さの相違に起因す
る表示ムラを解消して表示品位を高めることができる。
引出線部の低抵抗値化のために設けた金属層によってシ
ール剤の下地部分に凸凹が生じるが、シール剤配置予定
線に沿って設けた透明電極層上に前記金属層と同じ厚み
の金属層を設けたので、シール剤の下地部分を平坦に維
持し、液晶層の厚みを均一に維持することができる。As described above, according to the present invention, it is possible to reduce the resistance value of the lead wire portion, thereby increasing the degree of freedom in designing the lead wire, and to reduce the length of the lead wire portion. The display quality can be improved by eliminating display unevenness.
The metal layer provided for lowering the resistance of the lead line portion causes irregularities in the base portion of the sealant, but the metal layer having the same thickness as the metal layer is provided on the transparent electrode layer provided along the scheduled sealant arrangement line. Since the layer is provided, the base portion of the sealant can be kept flat, and the thickness of the liquid crystal layer can be kept uniform.
【図1】本発明の一実施例に係わる液晶表示装置の要部
断面図である。FIG. 1 is a sectional view of a main part of a liquid crystal display device according to an embodiment of the present invention.
【図2】同表示装置の表示用基板3の概略平面図であ
る。FIG. 2 is a schematic plan view of a display substrate 3 of the display device.
【図3】図2の要部拡大図である。FIG. 3 is an enlarged view of a main part of FIG. 2;
【図4】図3に示す拡大図において、透明電極部分のみ
を示した要部拡大図である。4 is an essential part enlarged view showing only a transparent electrode part in the enlarged view shown in FIG. 3;
【図5】(a)は図2の要部(右領域B2)の拡大図、
(b)は透明電極部分のみを示した要部拡大図である。FIG. 5A is an enlarged view of a main part (right region B2) of FIG. 2;
(B) is an enlarged view of a main part showing only a transparent electrode portion.
【図6】(a)は図2の要部(上領域B3)の拡大図、
(b)は透明電極部分のみを示した要部拡大図である。FIG. 6A is an enlarged view of a main part (upper region B3) of FIG. 2;
(B) is an enlarged view of a main part showing only a transparent electrode portion.
【図7】ダミー電極の他の構成例を示し、(a)はその
拡大図、(b)は透明電極部分のみを示した拡大図であ
る。7A and 7B show another configuration example of the dummy electrode, FIG. 7A is an enlarged view thereof, and FIG. 7B is an enlarged view showing only a transparent electrode portion.
1 液晶表示装置 2 第1表示用基板 3 第2表示用基板 4 液晶層 21 透明電極 34 透明電極 35 金属配線 37 接続端子部 38 引出線 39 引出線部 40 ダミー電極 41 ダミー電極領域 43 ダミー電極領域 44 ダミー電極 45 ダミー電極 46 ダミー電極領域 47 ダミー電極領域 48 ダミー電極 DESCRIPTION OF SYMBOLS 1 Liquid crystal display device 2 1st display substrate 3 2nd display substrate 4 Liquid crystal layer 21 Transparent electrode 34 Transparent electrode 35 Metal wiring 37 Connection terminal part 38 Lead wire 39 Lead wire part 40 Dummy electrode 41 Dummy electrode area 43 Dummy electrode area 44 Dummy electrode 45 Dummy electrode 46 Dummy electrode area 47 Dummy electrode area 48 Dummy electrode
───────────────────────────────────────────────────── フロントページの続き (72)発明者 稲村 弘 鳥取県鳥取市南吉方3丁目201番地 鳥取 三洋電機株式会社内 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Hiroshi Inamura 3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori Sanyo Electric Co., Ltd.
Claims (5)
に形成した複数の透明電極と、前記各透明電極の幅より
も狭い幅の外部接続端子を所定数集合して前記基板の1
辺に離間配置した複数の外部接続端子部と、前記透明電
極の一端を対応する前記外部接続用端子に接続するよう
に傾斜した引出線を所定数集合して離間配置した複数の
引出線部とを備える表示用基板において、前記引出線部
は、その引出線を透明電極層とその上に形成した該透明
電極層よりも低抵抗の金属層とによって構成したことを
特徴とする表示用基板。A substrate, a plurality of transparent electrodes formed in a lighting area on one surface of the substrate, and a predetermined number of external connection terminals each having a width smaller than a width of each of the transparent electrodes; 1
A plurality of external connection terminal portions disposed on the side and a plurality of lead line portions which are separated by a predetermined number of sets of lead lines inclined to connect one end of the transparent electrode to the corresponding external connection terminal; The display substrate according to claim 1, wherein the lead line portion is formed by a transparent electrode layer and a metal layer formed on the transparent electrode layer and having a lower resistance than the transparent electrode layer.
領域を備え、前記幅が広い領域をシール剤配置予定線に
沿って配置したことを特徴とする請求項1記載の表示用
基板。2. The display according to claim 1, wherein the metal layer includes a narrow region and a wide region, and the wide region is arranged along a sealing agent disposition line. substrate.
前記引出線と同じ構造のダミー電極を前記シール剤配置
予定線に沿って複数離間配置したことを特徴とする請求
項2記載の表示用基板。3. In a region between the lead line portion and the lead line portion,
3. The display substrate according to claim 2, wherein a plurality of dummy electrodes having the same structure as the lead lines are arranged apart from each other along the sealing agent arrangement line.
成した複数の透明電極と、前記基板の一辺に設けた外部
接続端子部と、点灯領域の内側に位置する透明電極と前
記外部接続端子部に設けた外部接続端子を接続するよう
に、透明電極層とその上に設けた金属層からなる引出線
を所定数集合した引出線部を備え、前記点灯領域の外周
部に位置する透明電極上には、点灯領域を囲むように設
定されたシール剤配置予定線に沿って、前記引出線の金
属層と同じ厚みの金属層を形成したことを特徴とする表
示用基板。4. A substrate, a plurality of transparent electrodes formed in a substantially area of one surface of the substrate, an external connection terminal provided on one side of the substrate, a transparent electrode located inside a lighting area, and A lead wire portion formed by assembling a predetermined number of lead wires made of a transparent electrode layer and a metal layer provided thereon so as to connect an external connection terminal provided in the external connection terminal portion is provided at an outer peripheral portion of the lighting region. A display substrate, wherein a metal layer having the same thickness as the metal layer of the lead wire is formed on the transparent electrode along a sealing agent arrangement line set so as to surround the lighting region.
もしくは請求項4記載の表示用基板を用いたことを特徴
とする液晶表示装置。5. The method according to claim 1, wherein at least one display substrate is provided.
A liquid crystal display device using the display substrate according to claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18761896A JPH1031224A (en) | 1996-07-17 | 1996-07-17 | Display substrate and liquid crystal display device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18761896A JPH1031224A (en) | 1996-07-17 | 1996-07-17 | Display substrate and liquid crystal display device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1031224A true JPH1031224A (en) | 1998-02-03 |
Family
ID=16209268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18761896A Pending JPH1031224A (en) | 1996-07-17 | 1996-07-17 | Display substrate and liquid crystal display device using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1031224A (en) |
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| KR100435796B1 (en) * | 2001-03-14 | 2004-06-10 | 세이코 엡슨 가부시키가이샤 | Structure of substrate terminal, liquid crystal device, and electronic apparatus |
| JP2005157353A (en) * | 2003-11-20 | 2005-06-16 | Samsung Oled Co Ltd | Organic electroluminescent device with low resistance wiring |
| KR100777596B1 (en) * | 2000-12-30 | 2007-11-16 | 엘지.필립스 엘시디 주식회사 | LCD and its manufacturing method |
| JP2009265484A (en) * | 2008-04-28 | 2009-11-12 | Hitachi Displays Ltd | Liquid crystal display device |
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1996
- 1996-07-17 JP JP18761896A patent/JPH1031224A/en active Pending
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| KR100777596B1 (en) * | 2000-12-30 | 2007-11-16 | 엘지.필립스 엘시디 주식회사 | LCD and its manufacturing method |
| KR100435796B1 (en) * | 2001-03-14 | 2004-06-10 | 세이코 엡슨 가부시키가이샤 | Structure of substrate terminal, liquid crystal device, and electronic apparatus |
| JP2003050401A (en) * | 2001-08-07 | 2003-02-21 | Seiko Epson Corp | Electro-optical devices and electronic equipment |
| JP2005157353A (en) * | 2003-11-20 | 2005-06-16 | Samsung Oled Co Ltd | Organic electroluminescent device with low resistance wiring |
| US8634049B2 (en) | 2008-04-28 | 2014-01-21 | Hitachi Displays, Ltd. | Liquid crystal display device |
| JP2009265484A (en) * | 2008-04-28 | 2009-11-12 | Hitachi Displays Ltd | Liquid crystal display device |
| US8867011B2 (en) | 2008-04-28 | 2014-10-21 | Japan Display Inc. | Liquid crystal display device |
| US9041893B2 (en) | 2008-04-28 | 2015-05-26 | Japan Display Inc. | Liquid crystal display device |
| US9389471B2 (en) | 2008-04-28 | 2016-07-12 | Japan Display Inc. | Liquid crystal display device |
| US9576985B2 (en) | 2008-04-28 | 2017-02-21 | Japan Display Inc. | Liquid crystal display device |
| US9804456B2 (en) | 2008-04-28 | 2017-10-31 | Japan Display Inc. | Liquid crystal display device |
| US9964817B2 (en) | 2008-04-28 | 2018-05-08 | Japan Display Inc. | Liquid crystal display device |
| CN102890380A (en) * | 2012-10-12 | 2013-01-23 | 京东方科技集团股份有限公司 | TFT (thin film transistor) array base plate, manufacture method thereof and liquid crystal display device |
| CN102890380B (en) * | 2012-10-12 | 2014-11-05 | 京东方科技集团股份有限公司 | TFT (thin film transistor) array base plate, manufacture method thereof and liquid crystal display device |
| CN114063832A (en) * | 2020-08-06 | 2022-02-18 | 郡是株式会社 | Capacitive touch panel |
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