JPH10312754A - Electrode protection layer for plasma display panel substrate and method of manufacturing the same - Google Patents

Abstract

[PROBLEMS] To provide a PDP substrate having an electrode protection layer made of a dielectric film having a uniform thickness and a good flatness, covering an electrode of a discharge display cell having excellent plasma resistance, and having a large size. It is possible to obtain a stable and accurate light-emitting display capable of realizing a high-definition discharge display cell that can be easily formed into a screen and a PDP excellent in durability. An electrode protection layer of a PDP substrate having a thickness variation and a flatness within ± 3 μm of a dielectric film covering an electrode provided at the bottom of a discharge display cell composed of a back plate and a partition wall. The electrode protection layer may be formed at the same time as the partition using a partition forming mold, or the electrode pattern and the electrode protection layer may be formed at the same time as the partition and transferred to the back plate by the same method as the formation of the electrode protection layer, followed by firing and integration. .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode protection layer for a plasma display panel (hereinafter abbreviated as PDP) used for a high-precision, inexpensive, thin, large-screen color display device or the like, and a method of manufacturing the same. Things.

[0002]

2. Description of the Related Art Conventionally, CRTs have been widely used as image display devices. However, these CRTs have drawbacks such as a large external volume, a large weight, and a high voltage. Flat-panel image display devices such as light-emitting diodes (LEDs), liquid crystal display devices (LCD), and PDPs have been developed, and their use ranges are expanding.

[0003] Above all, with the spread of multimedia,
The PDP used as an information interface for color display devices for large screens, etc., has a simple structure using plasma emission, and is a future-proof image display device with a large screen, high image quality, light weight, thinness and no restrictions on installation locations. Is attracting attention.

In such a PDP, a small space surrounded by two flat insulating substrates and a partition partitioning the space is used as a discharge display cell, a pair of discharge electrodes are provided in each of the discharge display cells, and a pair of discharge electrodes are provided at the bottom thereof. A plasma is generated by discharge between the discharge electrode and an address electrode for switching emission of the discharge display cell is provided, and the space has an airtight structure in which a dischargeable gas such as a rare gas is sealed. As a light emitting element of an image display device, a plasma is generated by discharge by selectively applying a voltage between opposing electrodes, and a phosphor formed in a discharge display cell is caused to emit light by ultraviolet light emitted from the plasma. To use.

Therefore, it is necessary to apply a voltage between the electrodes in order to perform the switching. However, if the capacitance of the discharge display cell is large, the driving current between the electrodes becomes large, and the power consumption of the PDP is reduced. However, there is a disadvantage that the power supply equipment is enlarged.

Although the PDP having the above structure has a simple device structure and can realize high definition, the electrodes and phosphors in the discharge display cell are directly exposed to the generated plasma, so that sputtering or the like is required. There is also a problem that the surface is deteriorated and the luminous efficiency is easily lowered.

Therefore, in order to solve the above-mentioned problems, the capacitance of the discharge display cell is reduced, and in order to prevent the deterioration of the electrode and the phosphor due to the generated plasma, the discharge display cell is provided on the opposite electrode in the discharge display cell. A dielectric film is formed, a charge is stored in the dielectric to obtain a priming effect of starting discharge at a voltage lower than a theoretical discharge start voltage, and a surface of each electrode is protected by the dielectric film to form a PDP. It has been proposed to improve the durability (see JP-A-8-77930 and JP-A-7-57630).

[0008]

Generally, as a method of forming a dielectric film with a uniform thickness on the address electrodes of the discharge display cells, a method of printing a dielectric paste to form a dielectric film by a leveling action on the surface of the paste is used. It is intended to obtain uniformity and flatness.

However, in order to ensure uniform thickness and flatness of the dielectric film, a low-fluid dielectric paste is used, and a thickness of about 5 μm is formed on a general electrode pattern having a thickness of about 10 μm. In order to form the electrode protective layer of FIG. 4, as shown in FIG. 4, there is unevenness in the portion where the electrode pattern 12 exists and in the portion where it does not exist. This causes a variation of about ± 5 μm.

Further, when a dielectric paste having high leveling property and high fluidity is used with emphasis on the flatness of the electrode protection layer, the thickness of the electrode protection layer on the address electrode becomes insufficient, and the address electrode is partially removed. May be exposed, and the obtained thickness has a variation of about ± 5 μm at best, and it is extremely difficult to form an electrode protection layer having a uniform thickness and excellent flatness. Had become.

Further, when forming the partition walls, if the partition walls are formed by the printing method, the partition wall paste will drips and partially covers the address electrodes, and if the partition walls are formed by the sandblast method, the partition walls are covered on the address electrodes. In addition to the problem that the deposited dielectric layer is ground to cause variations in thickness,
When forming a partition using a partition mold, the mold is floated due to the thickness of the electrode pattern adhered to the back plate when the mold and the back plate are brought into close contact, and the mold and the back plate are There is also a problem that the partition wall material flows into the gap and covers the address electrodes.

As a result, the address electrodes located between the partition walls have a thickness or flatness of the dielectric layer formed on the surface of which is at most about ± 5 μm as described above. There is a problem that the amount of stored electric charge is different, and the voltage for controlling light emission is different for each discharge display cell, so that stable and accurate light emission display cannot be performed.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object to stabilize a voltage for controlling light emission of a PDP, to enable stable light emission display, and to have excellent plasma resistance. An electrode protection layer of a PDP substrate made of a dielectric film having a uniform thickness and good flatness covering an address electrode of a discharge display cell, and a large screen of 40 inches or more can be easily formed.
An object of the present invention is to provide a method of manufacturing an electrode protective layer of a PDP substrate capable of obtaining a stable and accurate light emitting display capable of realizing high definition with a pitch of a discharge display cell of less than 0.25 mm and a PDP excellent in durability. .

[0014]

The present inventors have conducted intensive studies in view of the above-mentioned problems, and as a result, the mold for forming the partition wall constituting the discharge display cell has a portion in contact with the back plate at the top of the partition mold. An electrode protective layer having a uniform thickness and excellent flatness is provided by applying a material that functions as an electrode protective layer by baking on the top of the partition mold because it corresponds to an electrode forming portion between partition walls to be formed. Was formed simultaneously with the partition walls.

That is, the electrode protective layer of the PDP substrate of the present invention is a dielectric film that covers an address electrode provided at the bottom of a discharge display cell composed of a back plate and partition walls integrated on the back plate. The thickness variation and flatness of the dielectric film are within ± 3 μm.

In the method of manufacturing an electrode protective layer of a PDP substrate according to the present invention, a dielectric material is first placed on the top of a partition forming die corresponding to an address electrode forming portion at the bottom of a discharge display cell comprising a back plate and a partition. A body paste is applied to form an electrode protection layer, and then the partition wall material is filled into the recess of the partition mold, and then the electrode protection layer covers the electrode pattern previously formed on the back plate. The method is characterized in that the partition mold is positioned and brought into close contact with the back plate, the electrode protective layer is transferred and formed on the back plate simultaneously with the partition, and then fired and integrated.

Alternatively, as another method of manufacturing an electrode protective layer of a PDP substrate according to the present invention, a dielectric paste is applied to the top of the partition mold to form an electrode protective layer. After forming an electrode material to be an address electrode on the rear plate, the concave portion of the partition wall mold is filled with a partition wall material, and then the partition wall mold is brought into close contact with a back plate to form an electrode protective layer and an electrode on the back plate. Is transferred and molded at the same time as the partition walls, and then fired and integrated.

In particular, in the above-mentioned method for producing an electrode protective layer, a low-melting glass paste to which a binder containing a heat or photopolymerizable resin is added is applied to the top of a partition mold and then cured to form an electrode protective layer. Is the most desirable.

[0019]

According to the electrode protection layer of the PDP substrate and the method of manufacturing the same according to the present invention, the PDP substrate is provided at the bottom of the discharge display cell surrounded by the back plate constituting the PDP substrate and the partition wall integrated on the back plate. Since the thickness and the flatness of the electrode protection layer made of the dielectric material are within ± 3 μm, the amount of charge of the dielectric material forming the electrode protection layer is made uniform, and the light emission control of each discharge display cell is performed. Voltage is almost the same, and stable and accurate light-emitting display can be performed.

Even if an electrode pattern is previously formed on the back plate or an electrode is formed thereon after forming the electrode protection layer, they are formed on the top of the partition mold. After that, the partition wall mold is filled with the partition wall material and adhered to the back plate, and they are transferred onto the back plate to simultaneously form the electrode protection layer and the partition wall, or the electrode protection layer and the electrode and the partition wall, and are obtained. The resulting electrode protection layer has a uniform thickness and flatness.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electrode protection layer of a PDP substrate according to the present invention and a method for manufacturing the same will be described in detail with reference to the drawings.

FIG. 1 shows a PD provided with an electrode protection layer according to the present invention.
It is a perspective view which shows the principal part of the board | substrate for P. In the figure, 1 is a back plate 2, a partition wall 3 integrally formed on the back plate 2,
A discharge display cell 4 surrounded by a back plate 2 and a partition 3 and an electrode 6 forming an address electrode formed at the bottom of the discharge display cell 4
And a flat electrode protection layer 5 covering the electrode 6
Substrate.

In the present invention, when the thickness variation and flatness of the electrode protection layer 5 exceed ± 3 μm, the voltage for controlling the light emission of each discharge display cell becomes out of the allowable range, and the luminance varies and the stable light emission display is performed. Can not be done.

The thickness of the electrode protection layer can be as large as 5 μm if the electrode pattern formed on the back plate is formed by a thin film etching method or the like. By controlling the characteristics such as the particle size of the inorganic component, the variation becomes ± 3 μm or less.

Next, a method for manufacturing an electrode protective layer of a PDP substrate according to the present invention will be described with reference to the process charts shown in FIGS.

In the method for producing an electrode protective layer of a PDP substrate according to the present invention, the method of providing an electrode protective layer on the bottom of a discharge display cell composed of a back plate and partition walls is as shown in FIG. A dielectric paste is applied to the top 8 of the partition mold 7 corresponding to the bottom of the display cell 4 to form the electrode protection layer 5.

Next, the recess 9 of the partition wall forming mold 7 is filled with the partition wall material 10, and the electrode protection layer 5 is positioned so as to cover the electrode pattern 11 previously formed on the rear panel 2, and then the rear panel 2 is The partition mold 7 is closely attached, and the electrode protective layer 5 and the partition 3 are transferred onto the back plate 2 and are simultaneously formed.

Thereafter, the substrate is fired and integrated with the back plate 2 to obtain the PDP substrate 1 having the electrode protection layer 5.

Alternatively, as shown in FIG. 3, after the electrode protection layer 5 is formed on the top 8 of the partition mold 7, the electrode material is formed on the surface of the electrode protection layer 5 and the electrode 6 is laminated. After the formation, the concave portion 9 of the partition wall forming mold 7 is filled with the material 10 for the partition wall, and then the back plate 2 and the partition wall forming mold 7 are closely adhered and molded in the same manner as described above, and then fired and integrated to have the electrode protection layer 5. PDP
To obtain a substrate 1 for use.

As the material for forming the partition wall mold used in the method of manufacturing the electrode protective layer of the PDP substrate of the present invention, a rubber mold is preferable from the viewpoint of mass production and the releasability of the partition wall. The material is not particularly limited as long as it does not react with the components contained in the protective layer and the material for the partition.

Further, when the obtained molded body is integrated by firing, if the partition mold can be removed by firing, breakage and deformation of the molded body can be prevented and the manufacturing process can be shortened. Thermoplastic plastic materials such as polyethylene terephthalate (PET), which can be mass-produced inexpensively by injection molding or extrusion molding, etc. Rubber materials typified by neoprene rubber and silicon rubber can be used.

Next, as the electrode protective layer, a dielectric material composed of various ceramic powders or glass powders such as MgO or a composite oxide of an alkaline earth element and a rare earth element having a spinel structure, which is conventionally used, is contained in a binder. It is possible to use a low-melting paste dispersed in the binder, and particularly from the viewpoint of unevenness and flatness of the thickness of the obtained electrode protection layer, the binder preferably contains a heat or photopolymerizable resin. .

Therefore, the sintering temperature of the partition walls, 550 to 600, is obtained only by adding a binder to the dielectric material.
Since sintering is not performed at a temperature of ° C., it is desirable to appropriately mix an additive made of a low-melting glass.

The method for applying the electrode protective layer to the top of the partition wall mold includes a method of printing a thick plate by positioning a screen plate having a predetermined shape on the top, a method of coating with a roll coater, and the like. Although there is a method of offset printing, etc., the method of printing a dielectric paste by the offset printing method is the most excellent in that the positioning accuracy is not required, the method is simple, and the manufacturing cost is low.

On the other hand, as an electrode material, for example, silver (A
g), metals such as aluminum (Al), nickel (Ni), platinum (Pt), gold (Au), and palladium (Pd); and conductive ceramics such as carbides and nitrides of various metals. The electrode material can be deposited or deposited by dipping, coating, plating, or the like, but various methods can be adopted, but in terms of simplicity, the electrode material is deposited using a paste-like material. Is preferred.

Therefore, just by adding a binder to the electrode material, the same as in the case of the dielectric material, the sintering temperature of 5% is required.
Since sintering is not performed at a temperature of 50 to 600 ° C., it is desirable to appropriately add an additive made of low-melting glass in order to maintain the shape of the electrode material.

The same method as that for forming the electrode protective layer can be applied as a method for forming an electrode material at a predetermined position.

As a result, both of the electrode protective layer and the electrode material made of the dielectric paste are co-fired with the material for the partition wall, so that the binder is decomposed and volatilized.
The electrode protection layer and the electrode held by the low melting point glass are integrated with the partition.

On the other hand, as a material for partition walls, silicate is used as a main component, and lead (Pb), sulfur (S), selenium (Se),
Known glass powders such as various glasses containing at least one kind of alum or the like, as well as the glass powders and ceramic powders or various metal oxide powders for coloring may be added and mixed, and there is no particular limitation. However, for the purpose of filling the partition mold, a low-viscosity one is good, and the addition of a component that decomposes below the softening temperature of the material constituting the mold to generate gas is performed from the back plate of the partition mold. Is not preferred because of the peeling off.

Further, the glass powder constituting the material for the partition walls can be fired at a low temperature of 550 ° C. or less, and the fired body obtained preferably has a dielectric constant of 8.0 or less. As the oxide, it suppresses the deformation of the partition wall due to the dripping of the partition wall molded body and the melting of the low melting point substance,
In order to improve the strength of the compact, for example, alumina (Al
₂ O ₃ ), zirconia (ZrO ₂ ), titania (TiO ₂ )
₂ ) or other oxide-based ceramics or silicon nitride (Si ₃ N
_{In addition to} non-oxide ceramics such as ₄ ), oxides of rare earth elements and oxides of Group 3a elements of the periodic table, etc., among others, from the viewpoint of plasma resistance, the content of alkali metals is 1% by weight. % Is desirable.

The glass or ceramic powder preferably has a particle size of several tens of microns to sub-microns, specifically 0.2 to 10 μm, preferably 0.2 to 10 μm.
５5 μm.

The organic additives to be added to the partition wall material include acrylic resin, urea resin, melamine resin, phenol resin, epoxy resin, unsaturated polyester resin, alkyd resin, urethane resin, ebonite, polysiloxy silicate. And its monomers and oligomers. Examples of means for reacting and curing these organic additives include heat curing, ultraviolet (UV) irradiation curing, and X
Although there are ray irradiation curing and the like, heat curing is most suitable in terms of work and equipment, and acrylic resin, unsaturated polyester resin and its monomer are particularly preferable in terms of pot life.

In order to maintain the fluidity and moldability of the mixture of the glass or ceramic powder and the sintering aid, the content of the organic additive must be such that the viscosity does not increase. On the other hand, since it is desirable to have sufficient shape retention during curing, the content of the organic additive is 0.5 parts by weight or more based on 100 parts by weight of the glass or ceramic powder. From the viewpoint of shrinkage of the molded body due to curing, the amount is preferably 35 parts by weight or less. Among them, from the viewpoint of shrinkage during firing, 1 to 15 parts by weight is most preferable.

The solvent to be added to the mixture is not particularly limited as long as it is compatible with the organic additive. For example, toluene, xylene, benzene,
Aromatic solvents such as phthalic acid esters, higher alcohols such as hexanol, octanol, decanol and oxyalcohol, and esters such as acetic acid ester and glyceride can be used.

In particular, the above-mentioned phthalic acid esters, oxyalcohols and the like can be suitably used, and two or more of the above-mentioned solvents can be used in combination in order to volatilize the solvent slowly.

From the viewpoint of moldability, the content of the solvent is required to be at least 0.1 part by weight based on 100 parts by weight of glass or ceramic powder in order to maintain the shape retention of the molded article. On the other hand, since it is desirable to lower the viscosity of the mixture of the glass or ceramic powder and the organic additive, it is more preferably 35 parts by weight or less, and 1 to 15 parts by weight in consideration of shrinkage during drying and firing. Is most desirable.

Further, in the above mixture, for improving the dispersibility of glass or ceramic powder, for example, polyethylene glycol ether, naphthalene sulfonate,
A surfactant such as a polycarboxylate or an alkylammonium salt may be added. The content of the surfactant may be improved in terms of the dispersibility and the thermal decomposition property.
0.05 to 5 parts by weight relative to 00 parts by weight is desirable.

Next, the back plate is an unfired green sheet or a sintered body having a strength enough to withstand handling in each step, and the material is not particularly limited. For example, soda lime glass, low soda glass, It is desirable that the thermal expansion coefficient and the material of the partition wall of a general translucent glass substrate such as lead alkali silicate glass and borosilicate glass, various ceramic green sheets, and porcelain substrates be similar to each other. A relatively inexpensive glass such as a material in which an inorganic filler is dispersed can be used to improve the quality.

On the other hand, the sintering may be performed by densifying the inorganic material in the partition wall material to be used, closely adhering to the back plate, and simultaneously sintering the electrode protective layer or the electrode. The temperature is preferably not less than the temperature but not more than the softening point of the back plate, and more preferably, in the temperature range of 550 to 600 ° C.

[0050]

Next, the electrode protective layer of the PDP substrate of the present invention and the method of manufacturing the same were evaluated based on the following examples.

(Example 1) A partition mold having a thickness of 2
A PET plate having a width of 50 μm and a depth of 150 μm formed in parallel on a 00 μm PET plate at a pitch of 220 μm was prepared.

On the other hand, as a back plate for forming a partition,
Using an electrode material obtained by mixing an Ag powder having an average particle diameter of 1 μm with a phosphate dispersant and a lead-based low melting point glass powder on a soda lime glass substrate having a thickness of 00 mm, a width of 500 mm and a thickness of 2 mm, a screen printing method of 90 μm width. , Pitch 22
An electrode pattern of 0 μm was formed.

The dielectric paste for forming the electrode protective layer is composed of a lead-based low melting glass powder and
Partition material consisting of a mixture of l ₂ O ₃ powder and TiO ₂ powder mixed with a phosphate dispersant and a lead-based low melting glass powder, butyral resin 60 as a binder
%, A thermosetting epoxy resin 35% by weight, and a silane coupling agent 5% by weight were prepared.

On the other hand, as a material for the partition, a paste was prepared by mixing α-terpineol, ethylcellulose, a phosphate dispersant, and a viscosity modifier with the material for the partition.

First, a dielectric paste for an electrode protection layer was applied to the top of the partition mold by a roll printing method.
The operation of curing the dielectric paste by irradiation was repeated twice.

Next, a paste-like material for a partition is filled in the recess of the partition forming die by a doctor blade method.

Thereafter, an electrode having a partition wall portion of the partition wall mold formed in advance on the back plate from which the surface was sufficiently washed beforehand to remove foreign matters and organic deposits which adversely affect the adhesion of the partition wall mold. After pressing the partitioning mold so as to be located between the two, heating is performed at 100 ° C. to adhere the partitioning mold to the back plate, and then, firing is performed in the air at a temperature of 580 ° C. for 10 minutes, A PDP substrate in which an electrode, an electrode protective layer, and a partition were integrated on a back plate was produced.

With respect to the thus obtained electrode protection layer of the PDP substrate, the cross section at the center and four corners of the substrate was observed with a scanning electron microscope, and the thickness and variation of the electrode protection layer were measured to be 8 ± 3 μm. When the flatness of the electrode protective layer in each discharge display cell was measured in the same manner, it was confirmed that the variation was ± 3 μm or less.

The partition walls obtained by molding at the same time had a uniform surface with a width of 45 ± 5 μm and a height of 140 ± 5 μm.

Further, the continuity test and the presence / absence of a short circuit between the adjacent electrodes were examined by applying a voltage of 50 V to the electrodes, and it was confirmed that there was no disconnection or short circuit. The protective layer side had a curved shape.

(Example 2) As a back plate on which a partition is formed, an electrode pattern is not formed and the length is 400 mm and the width is 5 mm.
A soda lime glass substrate having a thickness of 00 mm and a thickness of 2 mm was prepared.

First, after forming an electrode protective layer on a partition mold in the same manner as in Example 1, an electrode material is applied on the electrode protective layer by a roll printing method, and cured at a temperature of 100 ° C. Was repeatedly formed twice on the protective layer.

Thereafter, the material for the partition was filled in the same manner as in Example 1, and the material was brought into close contact with the back plate and fired and integrated to prepare a PDP substrate for evaluation.

When the electrode protective layer of the obtained PDP substrate was evaluated in the same manner as in Example 1, the thickness of the electrode protective layer was within the range of 7 ± 3 μm irrespective of the position of the substrate. Was also within the range of ± 3 μm, and it was confirmed that it had a flat surface.

The partition walls obtained by molding at the same time had a uniform surface with a width of 45 ± 5 μm and a height of 140 ± 5 μm.

Further, the electrodes were also confirmed in the same manner as in Example 1. As a result, there was no disconnection or short circuit, and the obtained electrode had a rectangular cross section.

The PDPs obtained in Examples 1 and 2 were used.
A predetermined amount of phosphor is filled in the bottom surface of each discharge display cell using a substrate for forming a phosphor layer, and then a front plate having discharge electrodes is bonded, and then baked at a temperature of 500 to 550 ° C. for 10 minutes. Then, a He—Xe gas containing 10% of Xe gas was sealed in the discharge display cell at 250 to 300 Torr to produce a PDP for evaluation.
An AC voltage of 200 V was applied to the discharge electrode to emit light, and the variation in the luminance of each discharge display cell was examined. The variation was within the allowable range, and the luminance of 80% or more was maintained even after the continuous light emission test for 50 hours. It was confirmed that it was stable and the plasma resistance was also improved.

The present invention is not limited to the above-described embodiment.

[0069]

As described above, according to the electrode protective layer of the PDP substrate of the present invention and the method of manufacturing the same, the electrode protective layer and the partition, and further, the electrode is placed on the bottom of the discharge display cell using the partition mold. Simultaneous molding and firing and integration make the thickness of the electrode protective layer uniform and provide excellent flatness.
If the height, width, pitch and other dimensional accuracy of the partition walls and the positional accuracy with the electrodes are improved, a partition wall with a smooth surface can be formed in a short time, and if it can be filled in the recess of the partition wall mold Various materials can be applied without being affected by the composition or viscosity. As a result, the voltage for controlling the light emission of the PDP becomes constant, the light emission by the discharge display cell becomes stable, and the light emission display becomes stable. Excellent 40
A PDP substrate capable of producing a stable and accurate light-emitting display capable of realizing high definition with a discharge display cell pitch of less than 0.25 mm and a PDP having excellent durability can be easily formed into a large screen of inches or more. .

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of a PDP substrate having an electrode protection layer of the present invention.

FIG. 2 is a process chart showing a method for manufacturing an electrode protective layer of a PDP substrate of the present invention.

FIG. 3 is a process chart showing another method for manufacturing an electrode protection layer of a PDP substrate according to the present invention.

FIG. 4 is a perspective view showing a main part of a conventional PDP substrate having an electrode protection layer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 PDP board 2 Back plate 3 Partition wall 4 Discharge display cell 5 Electrode protection layer 6 Electrode 7 Partition mold 8 Top 9 Depression 10 Partition material 11 Electrode pattern

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tetsuya Maeda 1166, Haseno, Snake-cho, Yokaichi-shi, Shiga Pref.

Claims (4)

[Claims] An electrode protection layer comprising a back plate constituting a substrate for a plasma display panel and a dielectric provided at the bottom of a discharge display cell surrounded by a partition integrated on the back plate, wherein The thickness variation and flatness of the protective layer are ±
An electrode protection layer for a plasma display panel substrate, wherein the thickness is within 3 μm. 2. An electrode protection layer is formed by applying a dielectric paste on the top of a partition mold corresponding to the bottom of a discharge display cell composed of a back plate and a partition. Filling the partition wall material, positioning the electrode protection layer so as to cover the electrode pattern of the back plate previously formed, and bringing the partition mold into close contact with the back plate, and forming the partition wall on the back plate. A method for producing an electrode protective layer of a substrate for a plasma display panel, which comprises simultaneously molding and firing and integrating. 3. An electrode protection layer is formed by applying a dielectric paste on the top of a partition forming die corresponding to the bottom of a discharge display cell comprising a back plate and a partition, and then forming an electrode on the electrode protection layer. A material is applied to form an electrode, and thereafter, the concave portion of the partition mold is filled with a material for a partition, and then the partition mold is brought into close contact with a back plate to form an electrode protective layer and an electrode on the back plate. A method for producing an electrode protective layer of a substrate for a plasma display panel, wherein the electrode protective layer is formed after being molded at the same time as the partition walls and then integrated by firing. 4. The electrode protective layer is formed by applying a low-melting glass paste to which a binder containing a heat or photopolymerizable resin is added to the top of a partition mold and then curing the paste. A method for producing an electrode protective layer of a substrate for a plasma display panel according to any one of claims 2 and 3.