JPH10321967A - Printed circuit board and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a printed circuit board and a method of manufacturing the same, in which a current-carrying electrode wiring is easily removed. SOLUTION: A substrate 11, a wiring portion 12 made of a conductive pattern formed on the substrate and covered by electrolytic plating, and an electroplating plate made of the same conductive pattern and connected to the wiring portion are provided. The current-carrying electrode wiring including the current-carrying electrode wiring 13 is provided with a separating portion 13a for separating the current-carrying electrode wiring from the wiring portion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board in which the surface of a wiring portion is covered with electrolytic plating and which is provided with an electrode wiring for energization at the time of electrolytic plating adjacent to the wiring portion and a method of manufacturing the same. is there.

[0002]

2. Description of the Related Art Conventionally, such a printed circuit board is configured, for example, as shown in FIG. In FIG.
The printed board 1 includes a substrate 2, a wiring portion 3 made of a conductive pattern formed on the surface of the substrate 2, and a wiring portion 3.
, And a current-carrying electrode wiring 4 connected to the power supply line.

[0003] The printed circuit board 1 configured as described above includes:
After forming the wiring portion 3 and the current-carrying electrode wiring 4 on the surface of the substrate 2 by a conductive pattern, the whole is immersed in the electrolytic solution accommodated in the plating tank, and the current-carrying electrode wiring 4 is formed.
On the other hand, by connecting the cathode side of the power source for electrolytic plating, for example, metal such as gold is electrolytically plated on the surface of the wiring portion 3 of the printed circuit board 1 and the surface of the conductive electrode wiring 4. become.

Thus, the printed board 1 on which the surface of the wiring portion 3 is electrolytically plated is provided with the respective lands 3a and 3b of the wiring portion 3.
By mounting various electronic components, etc.
Various circuits are configured.

[0005]

However, in the printed circuit board 1 configured as described above, as described above, the electrolytic plating on the surface of the wiring section 3 is performed by the energizing electrode wiring 4 connected to the wiring section 3. Is performed by connecting the cathode side of the power source for electrolysis. Therefore, even after completion, since the current-carrying electrode wiring 4 is still connected to the wiring portion 3 of the printed circuit board 1, the use of the printed circuit board 1, that is, for example, a high-frequency circuit, Depending on the type of circuit,
The presence of the current-carrying electrode wires 4 may be harmful in function, such as being a source of noise or a source of noise.

For this reason, it is conceivable to remove the energizing electrode wiring 4 after the completion of the printed circuit board 1. However, since the energizing electrode wiring 4 cannot be easily removed, it is usually used as it is. Has been neglected. In addition, if it is necessary to remove the energizing electrode wiring 4, it is necessary to use a large-scale facility such as a trimming device.
There was a problem that the production cost would be high.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a printed circuit board and a method of manufacturing the same, in which the electrode wiring for energization is easily removed.

[0008]

According to the present invention, there is provided a semiconductor device comprising: a substrate; and a wiring portion comprising a conductive pattern formed on the substrate and having a surface covered by electrolytic plating.
The present invention is achieved by a printed circuit board including: an energizing electrode wiring for electrolytic plating connected to the wiring section; and the energizing electrode wiring includes a separating portion for separating from the wiring section.

[0009] According to the above configuration, the energizing electrode wiring used for the electroplating of the wiring portion is provided with the separating portion formed in advance. The part is separated from the conducting electrode wiring or the wiring part.

In the case where the separation portion of the current-carrying electrode wiring is formed to have a smaller width than other portions, the separation of the current-carrying electrode wiring from the wiring portion by the separation portion is easily performed.

In the case where the separation portion of the current-carrying electrode wiring is separated by burning due to the electric current flowing between the regions sandwiching the separation portion and the electrical resistance of the separation portion, By a simple operation of merely passing a current to the separation section, the separation of the current-carrying electrode wiring from the wiring section by the separation section is easily performed.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS. still,
Since the embodiments described below are preferred specific examples of the present invention, various technically preferred limitations are added.
The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description.

FIG. 1 shows an embodiment of a printed circuit board to which the present invention is applied. That is, in FIG. 1, the printed board 10 includes a board 11, a wiring section 12 formed of a conductive pattern formed on the surface of the board 11, and a current-carrying electrode wiring 13 connected to the wiring section 12. ing.

In the case of the drawing, the wiring section 12 is
Are arranged so as to connect the two lands 12a and 12b on the surface of the substrate, and the surface is electrolytically plated as described later.

The current-carrying electrode wiring 13 is formed of a conductive pattern formed on the surface of the substrate 11, similarly to the wiring section 12. Further, the current-carrying electrode wiring 13 is
In the case shown, one end is connected to one land 1 of the wiring portion 12.
2b, and the other end extends to, for example, the vicinity of an edge of the substrate 11 (not shown), and is formed so as to have an electrode portion (not shown) at the edge.

Further, in the printed circuit board 10, the energizing electrode wiring 13 is provided with a separating portion 13a for separating from the wiring portion. This separation part 13a
As shown in detail in FIG. 2, is formed so as to have a narrower width than other portions of the current-carrying electrode wiring 13.

The printed circuit board 10 according to the present embodiment is configured as described above. Next, the manufacturing process will be described. First, the wiring portion 12 and the current-carrying electrode wiring 13 are formed on the surface of the substrate 11 by a conductive pattern.
Thereafter, the entire printed circuit board 10 is immersed in the electrolytic solution contained in the plating tank, and the cathode side of the electrolytic plating power supply is connected to the energizing electrode wiring 13. Thereby, a metal such as gold is plated by electrolysis on the surfaces of the wiring portion 12 and the current-carrying electrode wiring 13 of the printed circuit board 10.

After the surface of the wiring portion 12 is electroplated in this manner, the printed circuit board 10 has a region, as shown in FIG. The electrode probes 15 and 16 connected to the positive and negative poles of the power supply 14, respectively, come into contact with the lands 12b of the wiring section 12 and the other end of the current-carrying electrode wiring 13. As a result, the current i flows through the separating portion 13 as shown in the figure, and the thin separating portion 13 has a high electric resistance, so that the separating portion 13 generates heat by passing the current i. Here, by appropriately selecting the current i, the disconnecting portion 13 is melted off by heat, so that the energizing electrode wiring 13 is separated from the wiring portion 12 as shown in FIG.

The printed circuit board 10 from which the energizing electrode wiring 13 is separated from the wiring section 12 in this manner is
Various circuits are configured by mounting various electronic components and the like on each of the lands 12a and 12b.

In this case, the current-carrying electrode wiring 13 is
2 is separated from the electrode wiring 13 for energization.
Therefore, the generation and reception of noise due to noise are suppressed, and the reliability of the printed circuit board 10 is improved. Further, as described above, the current-carrying electrode wiring 13 is separated from the wiring portion 12 by, for example, the electrode probes 15 and 16.
Is easily electrically removed by this contact, so that large-scale equipment such as a conventional trimming device is not required, and the separation is performed at low cost.

In the above-described embodiment, the wiring portion 12 is simply constituted by a single conductive pattern connecting the lands 12a and 12b. However, the present invention is not limited to this. It may be constituted by a pattern, and in this case, for each conductive pattern that is not electrically connected to each other, the current-carrying electrode wiring 13 having the separation portion 13a is connected to each other. Further, in the above-described embodiment, the separation unit 1
When removing the electrode probes 3a by burning, the electrode probes 15, 16
Are brought into contact with the lands 12b of the wiring portion 12 and the other end of the current-carrying electrode wires 13, but the present invention is not limited to this. Obviously, the probes 15 and 16 may be brought into contact.

[0022]

As described above, according to the present invention, it is possible to provide a printed circuit board and a method of manufacturing the same, in which the current-carrying electrode wiring is easily removed.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a first embodiment of a printed circuit board according to the present invention.

FIG. 2 is a partially enlarged plan view showing a main part of the printed circuit board of FIG. 1;

FIG. 3 is a plan view showing a state at the time of cutting a current-carrying electrode wiring on the printed circuit board of FIG. 1;

FIG. 4 is a plan view showing a state after cutting a current-carrying electrode wiring on the printed circuit board of FIG. 1;

FIG. 5 is a plan view showing an example of a conventional printed circuit board provided with a current-carrying electrode wiring.

[Explanation of symbols]

10 ... printed circuit board, 11 ... board, 12 ...
Wiring part, 12a, 12b ... land, 13 ... energizing electrode wiring, 13a ... disconnecting part, 14 ... power supply, 15, 16 ... electrode probe.

Claims (4)

[Claims] 1. A substrate, comprising: a wiring portion made of a conductive pattern formed on the substrate and having a surface covered by electrolytic plating; and a conductive electrode wiring for electrolytic plating connected to the wiring portion. A printed circuit board, characterized in that the current-carrying electrode wiring is provided with a separating portion for separating from the wiring portion. 2. The printed circuit board according to claim 1, wherein the cut-off portion of the current-carrying electrode wiring is formed to have a smaller width than other portions. 3. The disconnecting portion of the current-carrying electrode wiring is prevented from being separated by a current flowing between the regions sandwiching the disconnecting portion and burning out based on the electric resistance of the disconnecting portion. The printed circuit board according to claim 2, wherein: 4. A conductive pattern forming step of forming a wiring portion made of a conductive pattern and a current-carrying electrode wire connected to the wiring portion on a substrate; And an electroplating step of performing electrolytic plating on the surface of the wiring section.In the conductive pattern forming step, forming a separating section for separating the wiring section from the wiring section, A method of manufacturing a printed circuit board, comprising: a step of removing the disconnection section after the electrolytic plating step to separate the current-carrying electrode wiring from the wiring section.