JPH1032290A - Thermoelectric cooling structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable electronic parts on a package to be cooled down with a single thermo-module. SOLUTION: An grounding pattern 8e is formed on the first layer of a package 6 where a thermo-module 1 is mounted, and the thermo-module 1 is mounted on the grounding pattern 8e making its cooling fin 4a come into contact with the grounding pattern 8e. The grounding pattern 8e is connected to a second grounding layer 8b through a soldered through-hole 9. Another grounding pattern is formed on the first layer located under target electronic parts which are to be cooled down and connected to the second grounding layer 8b through the soldered through-hole.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic cooling structure for cooling electronic components mounted on a communication device or the like by a thermo module utilizing the Peltier effect.

[0002]

2. Description of the Related Art FIG. 11 is an explanatory view showing an example of a thermo module utilizing the Peltier effect. The thermo module 1 is composed of two types of thermoelectric semiconductors composed of a P-type element 2a and an N-type element 2b and two types of metal electrodes 3 of different types.
The elements are connected in a π-type at a and 3b. The element pair is sandwiched between ceramic plates and connected to a series circuit.

When a current flows in the NP direction, heat is absorbed on the metal electrode 3a side by the Peltier effect, and the metal electrode 3b
Heat is generated on the metal electrode 3a side, and the ceramic plate on the metal electrode 3a side is used as the cooling fin 4a, and the ceramic plate on the metal electrode 3b side is used as the heating fin 4b. Cooling was performed by absorbing heat from the parts.

[0004]

However, in the above-mentioned conventional cooling structure, one thermo module requires one thermo module.
There is a problem that only electronic components can be cooled, and other electronic components mounted on the package cannot be cooled. Therefore, when cooling a large number of electronic components, a plurality of thermo modules have been required.

Further, there is another problem that the heat released from the heat generating fins of the thermo module raises the ambient temperature of the thermo module peripheral components and shortens the component life.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to an electronic cooling structure of a package having a thermo module for performing cooling by the Peltier effect. A cool air transmitting means for transmitting cool air between the plurality of electronic components to be cooled.

[0007]

FIG. 1 is an explanatory view showing a first embodiment of an electronic cooling structure according to the present invention. FIG.
FIG. 1B is an enlarged view of a main part. In the figure, 1 is a thermo module. This thermo module 1
It has the same structure as that described with reference to FIG.
And two types of thermoelectric semiconductors comprising an N-type element 2b and two types of metal electrodes 3a and 3b connected in a π-type. This element pair is sandwiched between ceramic plates and connected to a series circuit. . And of the two ceramic plates,
Cooling fins 4 are used for heat absorption by the Peltier effect.
a, the heat-dissipating fin is referred to as the heat-generating fin 4b. Here, the ceramic plate constituting the cooling fins 4a and the heat generating fins 4b is made of ceramics such as alumina and beryllia having excellent electric insulation and heat conductivity.

Reference numeral 6 denotes a package, which is a multilayer printed circuit board having four or more layers. The package 6 includes a signal layer 8a as a first layer, an earth layer 8b as a second layer,
The layer is a power supply layer 8c, the fourth layer is a signal layer 8d, and each layer is insulated by an insulating layer 7. The first and fourth layers are the surface layers of the package 6, and the second and third layers are the middle layers of the package 6.

Then, an earth pattern 8e for cooling is formed on the first layer assigned to the signal layer in the package 6, separately from the signal pattern. Here, the pattern formed on each layer of the package 6 has thermal conductivity,
A copper foil or the like having an excellent dielectric constant is used. Reference numeral 9 denotes a plurality of soldering through holes, which connect the ground pattern 8e of the first layer and the ground layer 8b of the second layer.

In the thermo module 1, the cooling fins 4a are connected to the ground pattern 8 of the first layer of the package 6.
e and ground pattern 8e of soldering through hole 9
And is fixed to the package 6 by the resin 10 so as to be in contact with a portion on the same plane as the above. 2A and 2B are explanatory views showing the entire structure of the package having the electronic cooling structure according to the first embodiment described above. FIG. 2A is a plan view, and FIG. 2B is a side view.

The ground pattern 8e formed on the first layer of the package 6 is provided under the thermo module 1, under the electronic component 11 to be cooled, and at a portion along the outer periphery of the package 6. The earth pattern 8e of
It is connected to the second earth layer 8b by a soldering through hole 9. If the signal pattern of the first layer has a high density and a ground pattern cannot be formed on the first layer below the electronic component 11, the ground layer 8b is provided between the signal patterns.
And only the soldered through hole 9 whose head is exposed is formed.

Reference numeral 12 denotes a power supply module of the thermo module 1, which is connected to the thermo module 1 by a conducting wire 12a and is connected to the package 6 by soldering lead wires (not shown). The package 6 is mounted on the back board 14 via the connector 13. The mounting direction of the package is set up.

FIG. 3 is an explanatory view showing an electronic component mounting structure in the electronic cooling structure according to the first embodiment. The electronic component 11 is fixed by soldering a lead wire 11a to a soldering through hole 13. A ground pattern 8e is formed on the first layer at a position below the electronic component 11 of the package 6, and a solder through hole for connecting the ground pattern 8e to the second ground layer 8b. A hole 9 is formed.

Next, the operation of the electronic cooling structure according to the first embodiment will be described. When the thermo module is driven by receiving power supply from the power module 12, the cooling fins 4a are cooled by the Peltier effect. When the cooling fin 4a is cooled, the portion exposed to the grounding pattern 8e in contact with the cooling fin 4a and the first layer of the soldering through hole 9, and then the entire soldering through hole 9 by heat conduction. Next, the ground layer 8b, the soldering through hole 9 formed below the electronic component 11, and the ground pattern 8e formed below the electronic component 11 are cooled in order,
The heat is transmitted from the ground pattern 8e, so that the electronic component 11
Are locally cooled by heat conduction sequentially from the bottom of the component.

The ground pattern 8e formed along the outer periphery of the package 6 is also cooled by heat conduction from the ground layer 8b, and the entire package 6 is cooled by convection of heat indicated by an arrow A in FIG. The heat released from the heat generating fins 4b of the thermo module 1 is used by mounting the thermo module 1 above the package 6 when the package 6 is used upright.
Is cooled and cooled by the convection in the direction of arrow A generated by cooling the ground pattern 8e formed along the outer periphery of the device, and is convected out of the package area.

As described above, according to the first embodiment of the electronic cooling structure of the present invention, the ground pattern is formed in the first layer of the package below the thermo module and the component to be cooled. By connecting each ground pattern and the ground layer of the second layer using the soldering through hole, a plurality of electronic components can be cooled by heat conduction from the cooling fins of the thermo module.

Further, by providing the ground pattern of the first layer connected to the cooling fins of the thermo module at a position along the outer periphery of the package, the whole package can be cooled. Further, as described above, the ground pattern is provided at a position along the outer periphery of the package so as to cool the entire package, and the thermo module is mounted on the upper side of the package, so that the heat is released from the heat generating fins of the thermo module. Heat can be carried by the convection from below to convection outside the package area.

Further, since cooling is performed using the ground layer of the multilayer printed circuit board, a plurality of electronic components can be cooled without providing a separate cooling layer. FIG. 4 is an explanatory view showing another embodiment of the package. The package 15 has a ground layer 15a as a first layer serving as a surface layer, a signal layer 15b as a second layer and a third layer as a middle layer, and a surface layer on the back side. The power supply layer 15c is provided on the fourth layer.

The thermometer mounted on the package 15
The module 1 is the same as that described with reference to FIGS. 1 and 11. A ground pattern is formed at the mounting position of the thermo module 1 on the first ground layer 15a, and the cooling fins 4a come into contact with the ground pattern. Like thermo
The module 1 is mounted on the package 15. Also, the first
In the ground layer 15a, a ground pattern is also formed at the mounting position of the electronic component, and the ground pattern under each electronic component and the ground pattern under the thermo module 1 are connected.

According to the above configuration, the thermo module 1
Is driven to cool the cooling fins 4a, the heat conduction cools the ground pattern in contact with the cooling fins 4a. Since the ground pattern is also formed below the electronic component, each electronic component is cooled by heat conduction by cooling the ground pattern below the thermo-package 1.

At this time, since the first layer is an earth layer,
The soldering through hole described with reference to FIGS. 1 and 3 becomes unnecessary. When the surface layer of the ground pattern under the thermo module 1 is made into a non-resistable area, the thermal conductivity is further improved and the cooling capacity is also improved. Further, among the electronic components to be cooled, the thermal conductivity of the electronic component whose bottom is insulated is improved if the ground pattern below the electronic component is a resist-impossible region.

FIG. 5 is an explanatory view showing a second embodiment of the electronic cooling structure of the present invention, and FIG. 5 shows a configuration of a thermo module. The overall configuration of the thermo module 1 is the same as that described with reference to FIGS.
A plurality of lead wires 21 are joined to the bottom of a. The material and plating method of the lead wire 21 are the same as those of the lead wire used for the electronic component.

FIG. 6 is an explanatory view of a main part of a package on which the thermo module according to the second embodiment is mounted. FIG. 6A shows the entire thermo module mounting part.
FIG. 6B shows a portion of a lead wire in an enlarged manner. The package 6 includes an insulating layer 7 similar to that described with reference to FIG.
The ground layer 8a and the signal layer (not shown) are formed on the first layer, the ground layer 8b is formed on the second layer, the power layer 8c is formed on the third layer, and the signal layer 8 is formed on the fourth layer.
d is formed.

Reference numeral 22 denotes a plurality of through holes for soldering, which connect the ground pattern 8e of the first layer and the ground layer 8b of the second layer. The soldering through hole 22 is opened in accordance with the arrangement of the lead wire 21 of the thermo-package 1. The lead wire 21 is passed through the soldering through-hole 22 and soldered, so that the thermo module 1 is packaged. Fix to 6. At this time, the cooling fins 4a are brought into contact with the ground pattern 8e of the package first layer.

The arrangement of the lead wires 21 shown in FIG. 6 is an example, and other arrangements may be used. Package 6
If the wiring density is high and not all the leads 21 can be soldered, the unnecessary portions of the leads 21 are cut and used. Next, the operation of the electronic cooling structure according to the second embodiment will be described. When the thermo module 1 is driven, the cooling fins 4a are cooled by the Peltier effect.

When the cooling fin 4a is cooled, heat conduction causes the ground pattern 8e in contact with the cooling fin 4a, the vicinity of the joint of the lead wire 21 with the cooling fin 4a, and the first layer of the soldering through hole 9. Is cooled first, and then the lead wire 21, the entire soldering through hole 9, and the ground layer 8b are sequentially cooled. Hereinafter, when the mounting form of the electronic component is as shown in FIG. 3, the soldering through hole 9 formed below the electronic component 11 from the ground layer 8 b and the ground pattern 8 e formed below the electronic component 11. Are sequentially cooled by heat conduction, and then the electronic component 11 is locally cooled sequentially from the bottom of the component by heat transfer from the ground pattern 8e.

Although the entire structure of the package 6 is not shown in FIG. 6, if an earth pattern is formed on the first layer along the outer periphery of the package 6 as described with reference to FIG. When the entire package 6 is cooled and the thermo module 1 is mounted on the upper side of the package 6, heat released from the heat generating fins 4b is
Of the ground pattern formed along the outer periphery of the package is cooled by cold air riding on convection from the bottom to the top generated by cooling, and is convected out of the package area.

As described above, according to the second embodiment of the electronic cooling structure of the present invention, a plurality of leads are joined to the cooling fin of the thermo module, and the leads are connected to the through holes of the package. , The thermal conductivity is improved by the lead wires, and the electronic component to be cooled can be further cooled. Further, since the thermo module is fixed to the package by soldering the lead wires, it is not necessary to fix the thermo module using a resin.

FIG. 7 is an explanatory view showing a third embodiment of the electronic cooling structure of the present invention. The overall structure of the thermo module 1 is the same as that described in FIG. Reference numeral 31 denotes an electronic component joined to the cooling fin 4a of the thermo module 1, reference numeral 32 denotes a receptacle joined to the cooling fin 4a, and reference numeral 33 denotes a cooling pipe having a plug which can be screwed and fixed to the receptacle 32. FIG. 7A shows the cooling pipe 33.
FIG. 7B shows a state in which the cooling pipe 33 is attached.

FIG. 8 is an explanatory view showing the overall structure of a package having the electronic cooling structure according to the third embodiment.
FIG. 8A is a plan view, and FIG. 8B is a side view. In the thermo module 1, the heat generating fins 4b are
Is fixed by the resin in contact with The electronic component 31 to be joined to the thermo module 1 has a lead 31a and a package 34 connected by a conductor 31b.

An electronic component 35 and a power supply module 36 of the thermo module 1 are mounted on the package 34.
The electronic component 35 is fixed to the package 34 by soldering lead wires 35a. The power supply module 36
Are connected to the thermo module 1 by the conducting wire 36a, and are connected to the package 34 by soldering the lead wire 36b.

The package 34 is mounted on a back board 38 via a connector 37. Here, package 3
4 is mounted in an upright state. Also. A front plate 39 is fixed to the front side of the package 34 by screwing. The front plate 39 attached to the package 34 on which the thermo module 1 is mounted is connected to a receptacle into which a plug of the cooling pipe 33 can be screwed and fixed. By connecting one side of the cooling pipe 33 to this receptacle, Cooling fins 4a and front plate 3 of thermo module 1
9 are connected by a cooling pipe 33, and a front plate 39 of a package 34 in which the thermo module 1 is mounted is
The cooling pipe 33 is fixed and serves as a cooling fin.
Here, the cooling pipe 33 passes between the electronic components 35.

The material of the receptacle 32 joined to the cooling fin 4a, the cooling pipe 33, the front plate 39, and the receptacle joined to the front plate 39 are made of metal having excellent heat conductivity. The cooling pipe 33 is made of a metal or the like which is easily plastically deformed by thermal processing or the like. Here, in FIG. 7, the cooling pipe 33 is hollow, but may be solid. Next, the operation of the electronic cooling structure according to the third embodiment will be described.

When the thermo module 1 is driven, the cooling fins 4a are cooled by the Peltier effect. When the cooling fin 4a is cooled, the electronic component 31 in contact with the cooling fin 4a is cooled by heat conduction, and the cooling pipe 33 is cooled. Cooling pipe 33 and electronic component 3
When the electronic components 35 are arranged so as to be in contact with each other, the electronic component 35 can be cooled by heat conduction.

The electronic component 35 above the cooling pipe 33 can be cooled by convection of heat from below to above as indicated by arrow B. Further, the electronic component 35 which is not in contact with the cooling pipe 33 but is in the vicinity can be cooled by heat transfer even if it is below the cooling pipe 33. As described above, according to the third embodiment of the present invention, the cooling pipe is provided between the cooling fin of the thermo module and the front plate provided on the front side of the package. The electronic components on the package that are not in direct contact with the thermo module can be cooled by heat conduction and heat transfer by the cooling pipe or by heat convection. Thereby, a plurality of electronic components can be cooled by one thermo module.

In the above-described third embodiment, the cooling pipe is provided between the cooling fin of the thermo module and the front plate provided on the front side of the package. A similar effect can be obtained by providing a receptacle, joining both ends of the cooling pipe to the cooling fins, and arranging the middle part so as to pass between electronic components.

FIG. 9 is an explanatory view showing the overall structure of a package having an electronic cooling structure according to the fourth embodiment.
9A is a plan view, and FIG. 9B is a side view. Thermo
The overall configuration of the module 1 is the same as that described with reference to FIG. 11, with the cooling fins 4a facing the package 34 and the electronic components 31 joined to the cooling fins 4a.
Are fixed to the package 34 by soldering.

A receptacle is joined to the heat generating fins 4b of the thermo module 1 and the package 3
Receptacles are also joined to the front plate 39 fixed to the front side of the front panel 4, and the heat generating fins 4b of the thermo-module 1 and the front plate 39 are connected by pipes 41 having plugs at both ends which can be screwed and fixed to these receptacles. Between them.

When the package 34 is mounted upright, the tube 41 does not come into contact with the electronic components 35 on the package 34 above the package, that is, on the downstream side in the convection direction. The material of the tube 41 is a metal having excellent heat conductivity. The tube 41 is made of a metal or the like which is easily plastically deformed by thermal processing or the like. Here, the tube 41 may be hollow or solid.

Since the other structures of the package and its surroundings are the same as those described with reference to FIG. 8, the description is omitted here. Next, an operation in the electronic cooling structure according to the fourth embodiment will be described. When the thermo module 1 is driven, the cooling fins 4a are cooled by the Peltier effect.

When the cooling fins 4a are cooled, the electronic components 31 that are in contact with the cooling fins 4a by heat conduction.
Is cooled. The heat generated by the heat generating fins 4b is radiated from the heat generating fins 4b and also transmitted to the pipe 41 and the front plate 39 by heat conduction. It is discharged outside.

As described above, in the fourth embodiment of the present invention, since the heat generating fin plate of the thermo module and the front plate of the package are connected by the pipe to increase the heat radiation area, -The cooling capacity of the module can be improved. Further, since the heat of the heat generating fins is transmitted to the tube and the front plate by heat conduction, the environmental temperature of the peripheral parts of the heat generating fins can be reduced, and the life of the parts can be prolonged.

FIG. 10 is an explanatory view showing the overall structure of a package having an electronic cooling structure according to the fifth embodiment.
10A is a plan view, and FIG. 10B is a side view. The overall configuration of the thermo module 1 is the same as that described with reference to FIG. 11, and the heat generating fins 4b are fixed with resin while in contact with the package. A plurality of receptacles are joined to the cooling fins 4a of the thermo module 1. Further, among the electronic components on the package 34, the receptacles are also joined to the respective heat radiating plates 51 of the plurality of electronic components 52 to which the heat radiating plates 51 are fixed by screws. Cooling fins 4 of the thermo-module 1
a and the heat sink 51 of the electronic component. Here, the heat radiating plate 51 is fixed to the package 34 by screwing, and the material of the heat radiating plate 51 and the receptacle joined to the heat radiating plate 51 is a metal or the like having excellent heat conductivity. The material of the cooling pipe 33 is a metal or the like which has excellent thermal conductivity and is easily plastically deformed by thermal processing or the like. Here the cooling pipe 33
May be hollow or solid.

Since the structure of the package and its surroundings are the same as those described with reference to FIG. 8, the description is omitted here. Next, the operation of the electronic cooling structure according to the fifth embodiment will be described. When the thermo module 1 is driven, the cooling fins 4a are cooled by the Peltier effect.

When the cooling fins 4a are cooled, the cooling pipe 33 is cooled by heat conduction. When the cooling pipe 33 is cooled, the radiator plate 51 is also cooled by heat conduction, and the radiator plate 51 is cooled.
The electronic component 52 to which is fixed is cooled.
Also, due to the convection of heat from below to above as shown by arrow D,
If there is an electronic component above the cooling pipe 33, it is cooled.

As described above, according to the fifth embodiment of the present invention, the cooling fin of the thermo module and the heat radiating plate fixed to the electronic component are connected by the cooling pipe, so that this heat radiating is achieved. The electronic component to which the plate is fixed is cooled. At this time, when there are a plurality of electronic components having a radiator plate, by connecting each radiator plate and the heat-absorbing ceramic plate, a plurality of electronic components can be cooled by one thermo module.

[0047]

As described above, the present invention relates to an electronic cooling structure for a package provided with a thermo module for cooling by the Peltier effect, wherein the cooling side of the thermo module and a plurality of cooling objects on the package are provided. And a cool air transmitting means for transmitting cool air between the electronic components.

For example, by connecting the cooling side of a thermo module to the ground layer of a package composed of a multi-layer substrate and using this ground layer as a cooling air transmission medium, a single thermo module can be used to provide a plurality of electronic components. Can be cooled.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a first embodiment of an electronic cooling structure of the present invention.

FIG. 2 is an explanatory diagram showing the overall structure of a package having an electronic cooling structure according to the first embodiment;

FIG. 3 is an explanatory view showing an electronic component mounting structure in the electronic cooling structure according to the first embodiment;

FIG. 4 is an explanatory view showing another embodiment of the package.

FIG. 5 is an explanatory view showing a second embodiment of the electronic cooling structure of the present invention.

FIG. 6 is an explanatory view of a main part of a package on which the thermo module according to the second embodiment is mounted.

FIG. 7 is an explanatory view showing a third embodiment of the electronic cooling structure of the present invention.

FIG. 8 is an explanatory view showing the entire structure of a package having an electronic cooling structure according to a third embodiment;

FIG. 9 is an explanatory view showing the overall structure of a package having an electronic cooling structure according to a fourth embodiment.

FIG. 10 is an explanatory diagram showing the overall structure of a package having an electronic cooling structure according to a fifth embodiment.

FIG. 11 is an explanatory diagram showing an example of a thermo module using the Peltier effect

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermo module 4a Cooling fin 4b Heating fin 6 Package 8b Ground layer 8e Ground pattern 9 Solder through hole

Claims (7)

[Claims] 1. A thermo-cooler for cooling by the Peltier effect
An electronic cooling structure for a package having a module, comprising: a cool air transmitting means for transmitting cool air between a cooling side of the thermo module and a plurality of electronic components to be cooled on the package. Construction. 2. The electronic cooling structure according to claim 1, wherein said cool air transmitting means is a multilayer substrate having a ground layer formed in a middle layer, and a ground pattern on a surface layer below a mounting position of said thermo module. In addition to contacting the cooling side of the thermo module with this ground pattern, a ground pattern is also formed on the surface layer below the electronic component to be cooled, and the ground pattern of each surface layer and the middle ground layer are formed by through holes. An electronic cooling structure characterized by being connected. 3. The electronic cooling structure according to claim 2, wherein a lead wire is provided on a cooling side of the thermo module, and the lead wire is soldered to the through hole. 4. The electronic cooling structure according to claim 1, wherein said cool air transmitting means is a multilayer substrate having a ground layer formed on a surface of said package, and a ground pattern provided on a ground layer below a mounting position of said thermo module. An electronic cooling structure characterized in that a cooling side of a thermo module is brought into contact with the ground pattern and a ground pattern is formed under an electronic component to be cooled. 5. The electronic cooling structure according to claim 1, wherein the cool air transmitting means is arranged such that a cool air transmitting member connected to a cooling side of the thermo module passes between the electronic components. An electronic cooling structure, characterized in that: 6. The electronic cooling structure according to claim 1, wherein said cool air transmitting means is connected between a cooling side of the thermo module and a radiator plate of the electronic component by a cool air transmitting member. Electronic cooling structure. 7. A thermostat for cooling by the Peltier effect
An electronic cooling structure for a package having a module, comprising: a heat radiating means for connecting between a heat generation side of the thermo module and a metal member on the package.