JPH1032375A - Socket for component with lead - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for component with lead in which only reflow of surface mounting technology is required as soldering work even when components with leads and surface mounting components are mounted mixedly on a board. SOLUTION: The socket 1 for component with lead comprises a surface mounting base part 2 comprising a conductor, and clamping members 3, 4 comprising conductor. The surface mounting base part 2 is soldered to a board 10 by reflow of surface mounting technology. The lead of a component with lead is pushed into a lead lock area 5, i.e., a space between the clamping members 3, 4, and clamped in place thereat. When the lead is removed, it is pushed downward to a lead unlock area 6 and removed thereat. A surface mounting component 20 is soldered to the board 10 by reflow.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead component socket, which is designed so that a component with a lead can be mounted on a substrate although only a surface mounting technique is used for soldering.

[0002]

2. Description of the Related Art In recent years, chip components (surface mounted components) are often used as electronic components mounted on a substrate of an electronic device, and these surface mounted components are mounted on a substrate by surface mounting technology. In other words, after printing the cream solder on the board and placing the surface mount type components on the cream solder,
The soldering is performed by melting (reflowing) the cream solder through a furnace.

However, in order to construct an electronic circuit having the characteristics required for an electronic device, it is not enough to use only surface-mounted components, and it is necessary to use some leaded components or the like. There is. This is due to the fact that the required characteristics are often not satisfied only by surface mount components. Examples of a component with a lead include a dip component such as an electrolytic capacitor and a resistor, a shield case, a jumper wire, and a wire.

In the case where such a leaded component is partially used, conventionally, a through hole or a land for mounting the leaded component is provided in advance on a substrate, and the surface-mounted component is surface-mounted by reflow. Later, the leaded component was inserted into the through hole and the like, and the leaded component was manually soldered.

[0005]

As described above, when a surface-mounted component and a component with a lead are mixed and soldered to a board, a manual soldering of the component with the lead is performed in a process separate from reflow. Must be attached. As described above, conventionally, two steps of the reflow step and the manual soldering operation step are required, so that the soldering operation is troublesome.

The present invention has been made in view of the above prior art, and provides a lead component socket which can be soldered only by a reflow process even when a surface mount component and a component with a lead are mixedly mounted on a board. Aim.

[0007]

The structure of the present invention to solve the above-mentioned problems comprises a surface-mounting base made of a conductor soldered to a substrate by a surface-mounting technique, and a surface-mounting base which is opposed to the surface-mounting base. And a holding member made of a conductor disposed therein. The upper space of the space between the holding members has a width narrow enough to hold the lead of the leaded component. The lower space is characterized in that it has a width larger than the diameter of the lead of the leaded component.

[0008] The structure of the present invention for solving the above-mentioned problems is as follows.
It has a surface mounting base made of a conductor that is soldered to a substrate by surface mounting technology, and a holding member made of a conductor disposed on the surface mounting base so as to face each other, and at least one of the holding members is And a locking mechanism for locking the mutual holding members in a state in which the rotating holding member stands up, so that the rotating holding member can be rotated. When standing up and locked,
The space between the mutually holding members is characterized in that it is narrow enough to hold the lead of the leaded component.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a lead component socket 1 according to a first embodiment of the present invention (FIG. 1 (a) is a plan view, FIG. 1 (b) is a front view, and FIG. 1 (c) is Side view). As shown in FIG.
It comprises a surface mounting base 2 formed of a conductor and holding members 3 and 4 formed of a conductor having a certain degree of elasticity. The surface mounting base 2 and the holding members 3 and 4 are electrically connected. I have. As will be described in detail later, the surface mounting base 2 is soldered to the substrate by surface mounting technology, and the holding members 3 and 4 hold and support the leads of the leaded component.

The holding members 3 and 4 are arranged on the surface mounting base 2 so as to face each other, and the holding surfaces 3a and 4a facing each other.
Is a zigzag surface, and the holding members 3, 4
There is a space between them. The upper space (the space between the holding surfaces 3a and 4a) of the above space has a width narrow enough to hold the leads of the leaded component. Further, a lower space (a space closer to the surface mounting base 2) of the space has a width larger than a diameter of the lead,
This portion is referred to as a read unlock area 6.

A state in which components are mounted using the lead component socket 1 having the above-described configuration will be described with reference to FIG.
As shown in FIG. 2, in addition to a wiring pattern (not shown) and a component land 11, a board land 1
2 are formed. The cream solder is printed on the substrate 10, the surface mount type component 20 is placed on the component land 11, and the lead component socket 1 is placed on the socket land 12. Then, the surface mounting component 20 and the lead component socket 1 are soldered to the substrate 10 by reflow.

When the soldering by reflow is completed, as shown in FIG.
It is inserted into the lead lock area 5 of the lead component socket 1 by being pushed downward from above. As described above, when the lead 31 is pushed into the lead lock area 5 and inserted, the holding members 3 and 4 are expanded, and the lead 31 is held and supported between the holding surfaces 3a and 4a. By doing so, the component 30 with leads is mounted. That is,
The leaded component 30 is mechanically supported by the lead component socket 1 and is electrically connected to the substrate 10 via the lead component socket 1.

Also, as shown in FIG. 4, in the case of the axial lead component 40, the lead 41 is similarly mounted by pushing the lead 41 into the lead lock area 5 of the lead component socket 1.

As described above, the leads 3 of the components 30 and 40
Since the components can be mounted simply by charging and inserting the components 1 and 41 into the lead lock area 5, only the reflow is required as the soldering operation, and the soldering operation is simplified.

Further, since the lead component socket 1 only clamps and supports only one lead, even if the lead pitch of the lead component changes, it can easily cope with the change in the lead pitch. .

When the components 30 and 40 are to be removed, the leads 31 and 41 are pushed further downward from the lead lock section 5 to reach the lead unlock section 6. The intervals between the lead unlock areas 6 are the leads 31 and 4
1, the leads 31, 41 are positioned in the lead unlocking area 6 so that the parts 30, 4
0 can be easily removed.

As shown in a front view of FIG. 5 and a plan view of FIG.
1 are extended in parallel in the same direction, a plurality of socket lands 12 are formed in parallel, the lead component socket 1 is soldered to the socket lands 12, and the lead 31 is If it is held and supported by the socket 1, it is easier to remove components. That is, when removing the component, the lead 31 is pushed downward to be positioned in the lead unlock area 6 and then the component 3 is removed.
By pulling 0 in the direction of arrow A, a plurality of leads 31 can be removed from the lead component socket 1 at the same time.

Next, a second embodiment of the present invention will be described with reference to FIG.
((A) is a plan view, (b) is a front view) and FIG.
((A) shows a locked state, and (b) shows a released state). Note that portions having the same functions as those in the first embodiment are denoted by the same reference numerals, and redundant description will be omitted.

In the lead component socket 1a according to the second embodiment, the holding member 3 is fixed to the surface mounting base 2, but the holding member 4 is rotatable with respect to the surface mounting base 2. Provided. Further, the holding member 4 is provided with a locking arm 7 so as to be rotatable, and a locking portion 7a is formed at the tip of the locking arm 7.

The lead component socket 1a is soldered to the substrate 10 by reflow in the same manner as the lead component socket 1. Then, as shown in FIG. 8B, with the holding member 4 open, the lead of the component is positioned in the lead lock area 5 which is the holding position. Next, the holding member 4 is raised and closed, and the locking portion 7a of the locking arm 7 is locked to the holding member 3 so that the lead is held and supported between the holding surfaces 3a and 4a. can do.

When the lead is to be removed, the locking arm 7 is released from the holding member 3 to bring it to the state shown in FIG.
In this way, the parts can be easily removed.

It is needless to say that the present invention can be easily implemented even if the components with leads are other than those described above.

[0024]

According to the present invention, as described specifically with the above embodiments, the lead component socket for holding and holding the lead of the component with the lead is soldered to the substrate by reflow. Even in a circuit in which a surface mount component and a component with a lead are mixed and mounted on a board, the soldering operation only requires a reflow process, and the soldering operation is simplified. Further, the connection of the leaded component can be performed simply by inserting the lead into the lead component socket by pushing it into the socket, so that the connection operation can be easily performed.

Furthermore, since the lead component socket is compatible with one lead, even if the lead pitch of the component changes, this change can be easily handled.

If a lock mechanism is provided, the mounting of the lead component can be surely performed, and the removal of the lead component can be extremely easily performed.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a socket for lead components according to a first embodiment of the present invention, where (a) is a plan view,
(B) is a front view, (c) is a side view.

FIG. 2 is a perspective view showing a mounting state using a lead component socket.

FIG. 3 is a perspective view showing an attached state of a component with leads.

FIG. 4 is a perspective view showing an attached state of an axial lead component.

FIG. 5 is a front view showing another mounted state of the component with leads.

FIG. 6 is a plan view showing another mounting state of the component with leads.

FIG. 7 is a configuration diagram showing a socket for lead components according to a second embodiment of the present invention, where (a) is a plan view,
(B) is a front view.

FIGS. 8A and 8B are views taken along a line BB in FIG. 7, wherein FIG. 8A is a configuration diagram showing a locked state, and FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Lead component socket 2 Surface mounting base 3, 4 Holding member 3 a, 4 a Holding surface 5 Lead lock area 6 Lead unlock area 10 Board 11 Component land 12 Socket land 20 Surface mount type component 30 Leaded component 31 Lead 40 Axial lead parts 41 Lead

Claims (2)

[Claims] 1. A surface mounting base comprising a conductor which is soldered to a substrate by a surface mounting technique, and a holding member comprising a conductor disposed on the surface mounting base so as to face each other. The upper part of the space between the holding members is narrow enough to hold the lead of the component with lead.
A lead component socket characterized in that a lower space of the space between the mutually holding members has a width larger than a diameter of a lead of a component with a lead. 2. A holding member comprising a surface mounting base made of a conductor soldered to a substrate by a surface mounting technique, and a holding member made of a conductor disposed on the surface mounting base so as to face each other. At least one of them is provided rotatably with respect to the surface mounting base, and further provided with a lock mechanism for locking the mutual holding members in a state where the rotating holding member stands up. A lead component socket characterized in that a space between the mutual clamping members is narrow enough to clamp the leads of a leaded component when the moving clamping members are raised and locked.