JPH10324735A - Epoxy resin composition, prepreg and laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition giving laminates excellent in adhesive strengths of bonding wires to metal foils without deteriorating dielectric constant, dielectric loss tangent and soldering heat resistance by including a specific epoxy resin, a curing agent and a modified phenol product obtained by reacting a specified polyphenylene ether resin with a phenolic compound. SOLUTION: This epoxy resin composition comprises (A) a modified phenol product obtained by subjecting a polyphenylene ether resin having a number- average mol.wt. of 10000-30000 [e.g. poly(2,6-dimethyl-1,4-phenylene oxide] and a phenolic compound to a redistribution reaction in the presence of a reaction initiator so that the number-average mol.wt. of the modified phenol product is 5-70% of that of the used polyphenylene ether resin, (B) an epoxy resin and (C) a curing agent (e.g. dicyandiamide). Therein, an epoxy resin of the formula (R<1> to R<6> are each H, etc.), is contained as the epoxy resin B preferably in an amount of 1-40 pts.wt. per 100 pts.wt. of all the epoxy resins.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate used for a printed wiring board used in, for example, a high frequency region, a prepreg used for producing the laminate, and an epoxy resin composition used for producing the prepreg. Things.

[0002]

2. Description of the Related Art An X band (8
(12 GHz) region, that is, a laminated board used for manufacturing a printed wiring board used in a so-called ultra-high frequency region, the dielectric constant and the dielectric loss tangent are both constant over a wide high frequency range, temperature range and humidity range, and preferably, It is desired that the dielectric loss tangent is small. For such applications, epoxy resin and polyphenylene ether resin (hereinafter referred to as PPE) are used.
Laminated boards using an epoxy resin composition containing

Conventionally, as a laminate using the epoxy resin composition containing the epoxy resin and the PPE, a cured product of the epoxy resin and the PPE using an epoxy resin composition obtained by simply blending the epoxy resin and the PPE is used. Laminates that exist independently of each other, or the epoxy group of epoxy resin and P
A laminate made of a cured product in which PPE and an epoxy resin are crosslinked by reacting with a terminal hydroxyl group of PE has been studied.

When the former laminate is immersed in alkali or chloroform and subjected to an alkali resistance test or a solvent resistance test, delamination may occur due to insufficient bonding between the epoxy resin and PPE. There is a problem that there is
In the latter laminate, when the used PPE has a high molecular weight, the reactivity between the terminal phenolic hydroxyl group of the PPE and the epoxy group of the epoxy resin is low, and unreacted PPE which does not participate in the crosslinked structure is contained in the cured product. Due to the presence of a large amount, the problem of low interlayer adhesion strength, and when the solvent resistance test is performed in the same manner as the former laminate, it is superior to the former laminate,
There has been a problem that delamination may still occur.

[0005] Therefore, by reacting a high molecular weight PPE with a phenolic compound in the presence of a reaction initiator such as a peroxide, a modified phenol modified by PPE having a molecular weight lower than the number average molecular weight of the used PPE is produced. It has been studied to produce a laminate having excellent solvent resistance using an epoxy resin composition obtained by mixing a modified phenol product and an epoxy resin. In the case of this laminate, it is considered that PPE is taken into the crosslinked structure in the cured product by the reaction between the phenolic hydroxyl group of the modified phenol product and the epoxy group of the epoxy resin, so that the solvent resistance is excellent.

However, after manufacturing a laminate having a layer such as a copper foil on the surface using the epoxy resin composition containing the modified phenol product and the epoxy resin, a gold wire or the like is used for connection with a semiconductor chip. When bonding the bonding wire with the metal foil on the surface of the laminated board, in the evaluation of the bonding strength between the bonding wire and the metal foil at the time of heating, the bonding portion between the bonding wire and the metal foil may be peeled off, and there is room for improvement. .

Therefore, when a bonding wire is bonded to a metal foil on its surface without deteriorating the dielectric constant, dielectric loss tangent, and solder heat resistance, which are characteristics required for a laminate used in a high-frequency region. There is a demand for a laminate having excellent bonding strength at the joint.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to react PPE with a phenolic compound in the presence of a reaction initiator. An epoxy resin composition comprising a modified phenol product and an epoxy resin, comprising:
When bonding wires are bonded to the metal foil on the surface without lowering the dielectric loss tangent and solder heat resistance, an epoxy with a metal foil-clad laminate with excellent adhesive strength between the metal foil and the bonding wires is obtained. It is to provide a resin composition.

Further, when a bonding wire is bonded to a metal foil on the surface thereof without lowering the dielectric constant, the dielectric loss tangent, and the heat resistance of the solder, the metal foil has excellent adhesion strength between the metal foil and the bonding wire. An object of the present invention is to provide a prepreg from which a laminated board can be obtained.

Further, the present invention provides a laminate having excellent dielectric constant, dielectric loss tangent, and soldering heat resistance, and having excellent bonding strength between the metal foil and the bonding wire when the bonding wire is bonded to the metal foil on the surface thereof. It is in.

[0011]

The epoxy resin composition according to claim 1 of the present invention has a number average molecular weight of 10,000 to 3.
A modified phenol obtained by redistributing 0000 polyphenylene ether resin and a phenolic compound in the presence of a reaction initiator so that the number average molecular weight is 5 to 70% of the number average molecular weight of the used polyphenylene ether resin. An epoxy resin composition containing a product, an epoxy resin, and a curing agent for an epoxy resin, wherein the epoxy resin is an epoxy resin represented by the following formula (a). In the formula (a), R ^{1 to} R ⁶ are any functional group selected from the group consisting of a monovalent hydrocarbon group having 1 to 5 carbon atoms, a hydroxyl group and a glycidyl ether group, or a hydrogen atom. Represents

[0012]

Embedded image

The epoxy resin composition according to a second aspect of the present invention is the epoxy resin composition according to the first aspect, wherein the epoxy resin represented by the above formula (a) is represented by the following formula (b): It is characterized by containing an epoxy resin.

[0014]

Embedded image

According to a third aspect of the present invention, there is provided the epoxy resin composition according to the first or second aspect, wherein the epoxy resin represented by the formula (a) is added to the epoxy resin composition in an amount of 100% by weight. 1 to 40 parts by weight per part.

The epoxy resin composition according to a fourth aspect of the present invention is the epoxy resin composition according to any one of the first to third aspects, wherein the modified phenol product has a number average molecular weight of 1,000 to 3,000. It is characterized by.

The epoxy resin composition according to claim 5 of the present invention is characterized in that, in the epoxy resin composition according to any one of claims 1 to 4, the reaction initiator is benzoyl peroxide. I do.

According to a sixth aspect of the present invention, there is provided the epoxy resin composition according to any one of the first to fifth aspects, wherein the phenolic compound has two or more phenolic compounds per molecule. It is a phenolic compound having a hydroxyl group.

A prepreg according to a seventh aspect of the present invention is obtained by impregnating and drying a substrate with the epoxy resin composition according to any one of the first to sixth aspects.

The laminate according to claim 8 of the present invention is obtained by laminating a metal foil on the prepreg according to claim 7 and applying heat and pressure.

According to the present invention, the epoxy resin composition comprises:
In order to contain the epoxy resin represented by the above formula (a),
It is considered that the high-temperature characteristics of the cured product of the resin are improved, and a laminate having excellent adhesion strength between the metal foil and the bonding wire on the surface when heated is obtained. Further, the epoxy resin represented by the above formula (a) crosslinks with the modified phenol product and both are taken into a crosslinked structure,
The properties of epoxy resin and PPE are not impaired, permittivity,
A laminate having excellent dielectric loss tangent and solder heat resistance can be obtained.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin composition according to any one of claims 1 to 6 of the present invention has a number average molecular weight of 10,000.
A redistribution reaction is carried out between の 30,000 PPE and a phenolic compound in the presence of a reaction initiator so that the number average molecular weight of the phenolic compound becomes 5 to 70% of the number average molecular weight of the used PPE. At least a modified phenol product, an epoxy resin and a curing agent for the epoxy resin.

The PPE used for the production of the modified phenol product is a resin also called a polyphenylene oxide resin. One example is poly (2,6-dimethyl-1,4-phenylene oxide). Such PPE is described, for example, in US Pat.
No. 8 can be synthesized by the method disclosed in the specification.

Examples of the phenolic compound used for producing the modified phenol product include bisphenol A, bisphenol F, phenol novolak, cresol novolak and the like. Note that it is preferable to use a phenol having two or more phenolic hydroxyl groups in the molecule. The upper limit of the number of phenolic hydroxyl groups of the phenols is not particularly limited, but those having 30 or less in the molecule are generally used. The appropriate amount of the phenolic compound is 1 to 20 parts by weight based on 100 parts by weight of PPE, and is generally the same as the amount of the reaction initiator.

The reaction initiator used for producing the modified phenol product includes benzoyl peroxide, dicumyl peroxide, t-butylcumyl peroxide, di-t
-Butyl peroxide, 2,5-dimethyl-2,5-
Di-tert-butylperoxyhexine-3, 2,5-dimethyl-2,5-di-tert-butylperoxyhexane,
peroxides such as α, α′-bis (t-butylperoxy-m-isopropyl) benzene. Although it is not a peroxide, it is a commercially available reaction initiator “Biscumil” manufactured by NOF Corporation (1 minute half-life temperature 330
° C) can also be used. The use of benzoyl peroxide is preferred because of its excellent reactivity. The appropriate amount of the reaction initiator is 1 to 20 parts by weight based on 100 parts by weight of PPE.

In the case of producing a modified phenol product, the above-mentioned PPE and the phenolic compound are redistributed in an organic solvent in the presence of a reaction initiator, so that the PPE is lower than the number average molecular weight of the used PPE. Produce a modified phenolic product of molecular weight. Conditions for the redistribution reaction include, for example,
The above-mentioned PPE, the phenolic compound and the reaction initiator are stirred and heated at 80 to 120 ° C. for about 10 to 100 minutes. In addition, as an organic solvent to be used, aromatic hydrocarbon solvents such as toluene, benzene, and xylene are exemplified.

In the presence of a reaction initiator, the number average molecular weight is 10
When a phenolic compound is reacted with PPE having a molecular weight of 3,000 to 30,000, it is considered that the PPE is radicalized first, and a redistribution reaction in which straight chains are cut proceeds to reduce the molecular weight of the PPE. The phenolic compound is modified.

The resulting modified phenol product has a structure in which a phenolic compound is bonded to one or both terminals of a low-molecular-weight PPE and has a phenolic hydroxyl group at one or both terminals of the PPE. Conceivable. Therefore, it is considered that this terminal phenolic hydroxyl group reacts with the epoxy group of the epoxy resin, and the PPE and the epoxy resin are strongly crosslinked.

It is important that the modified phenol product obtained by the redistribution reaction has a number average molecular weight of 5 to 70% of the number average molecular weight of the PPE used. If it exceeds 70%, the viscosity of the epoxy resin composition increases, impregnating properties when impregnating the base material decrease, the amount of resin adhered to the obtained prepreg varies, and the resin is peeled off when the prepreg is handled and the resin is removed. There is a problem that the amount of adhesion varies and the electrical characteristics may vary, and the storage stability of the epoxy resin composition decreases, the viscosity tends to increase in a short period of time, and the usable time of the epoxy resin composition is reduced. As a result, a problem that production is likely to be hindered is likely to occur. If it is less than 5%, the mechanical strength and heat resistance of the obtained laminate may be reduced.

If the number average molecular weight of the modified phenol product is 5 to 70% of the number average molecular weight of the PPE used and is in the range of 1000 to 3000, the resulting epoxy resin composition Is particularly excellent when impregnating the base material with is preferable.

When the PPE used is a mixture of a plurality of PPEs having a number average molecular weight, the reaction is carried out so that the number average molecular weight is 5 to 70% with respect to the average value of the mixture. The number average molecular weight of the modified phenol product to be obtained is preferably adjusted by adjusting the amount of the reaction initiator since the number average molecular weight tends to decrease when the amount of the reaction initiator is increased.

The epoxy resin contained in the epoxy resin composition includes an epoxy resin represented by the above formula (a) (hereinafter referred to as an epoxy resin).
It is important to contain the formula (a). When not containing the resin of the formula (a), a laminate having a metal foil layer on the surface is manufactured using this epoxy resin composition,
When the bonding strength between the bonding wire and the metal foil is evaluated after bonding the bonding wire to the metal foil on the surface of the laminate, the bonding wire may be peeled off at the bonding portion between the bonding wire and the metal foil. In addition, when the epoxy resin represented by the above formula (b) is contained as the resin of the formula (a), the bonding strength of the bonding portion between the bonding wire and the metal foil is particularly excellent, which is preferable. The epoxy resin represented by the formula (b)
It is commonly named 1,6-bis (2,3-epoxypropoxy) naphthalene.

The epoxy resin contained in the epoxy resin composition is not limited to the resin of formula (a), but may be other than the resin of formula (a), such as an epoxy resin having two or more epoxy groups in the molecule. To make the resin of formula (a) 1 to 4 in 100 parts by weight of the total epoxy resin.
When it is contained in an amount of 0 part by weight, a laminate having excellent heat resistance as well as excellent adhesion strength between the metal foil and the bonding wire is preferable. When the amount is less than 1 part by weight, the effect of improving the bonding strength between the metal foil and the bonding wire is small. When the amount exceeds 40 parts by weight, the moisture absorption rate is increased and the solder heat resistance may be reduced.

Examples of the epoxy resin that can be contained include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydantoin type epoxy resin, alicyclic epoxy resin, Epoxy resins having two epoxy groups in the molecule, such as biphenyl type epoxy resins and epoxy resins obtained by halogenating these resins, and epoxy resins having three or more epoxy groups in the molecule, such as novolak type epoxy resins, are mentioned. And two or more types may be used in combination. In addition, an epoxy resin having one epoxy group in the molecule may be used in combination.

Examples of the curing agent for the epoxy resin contained in the epoxy resin composition include amide-based curing agents such as dicyandiamide and aliphatic polyamide, and amine-based curing agents such as diaminodiphenylmethane, metaphenylenediamine, ammonia, triethylamine and diethylamine. Or bisphenol A, bisphenol F, phenol novolak resin, cresol novolak resin, p-xylene-
Examples include phenolic curing agents such as novolak resins, acid anhydrides, and the like, and two or more kinds may be used in combination.

It is practical to add a curing accelerator to the epoxy resin composition in order to accelerate the curing reaction. As the curing accelerator that can be contained, for example, 2-
Imidazoles such as methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole,
1,8-diaza-bicyclo [5.4.0] undecene-
7, tertiary amines such as triethylenediamine and benzyldimethylamine; organic phosphines such as tributylphosphine and triphenylphosphine; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. Two or more types may be used in combination.

The epoxy resin composition may contain an inorganic filler, a solvent and the like, if necessary. As inorganic fillers that can be contained, titanium dioxide-based ceramics, barium titanate-based ceramics, lead titanate-based ceramics, strontium titanate-based ceramics, calcium titanate-based ceramics, bismuth titanate-based ceramics, magnesium titanate-based ceramics ceramic,
Examples include inorganic fillers having a dielectric constant of 100 or more, such as lead zirconate-based ceramics, silica powder, glass fibers, and talc. Two or more kinds may be used in combination. Dielectric constant is 100
When the inorganic filler described above is contained, the high-frequency characteristics are particularly excellent and are preferable. Further, as a solvent that can be contained,
Organic solvents such as toluene, xylene, benzene, ketone, and alcohols are exemplified.

The resulting epoxy resin composition is impregnated into a substrate and dried to produce a prepreg. The method of impregnating and drying the epoxy resin composition on the base material is not particularly limited.For example, after the base material is immersed in the epoxy resin composition and impregnated, the solvent is removed by heating, The prepreg is manufactured by semi-curing the resin composition. The amount of resin impregnated in the base material is not particularly limited, but when the resin content after drying is impregnated so as to be 30 to 70% by weight with respect to the weight of the prepreg, a laminate having particularly excellent electric properties can be obtained. preferable.

In addition, at the time of impregnation, 25%
When the temperature is maintained at ~ 35 ° C, the impregnation property of the substrate can be stabilized, and the characteristics of the laminate can be improved. Also,
After impregnating the epoxy resin composition, on drying,
Temperatures of 80-180 ° C are preferred. If this drying is insufficient, only the surface of the prepreg will be dried, and the solvent will remain inside, causing distortion due to the resin concentration difference between the surface and the inside of the prepreg. Cracks may occur. In addition, if excessive drying is performed, the viscosity of the prepreg surface changes drastically during the drying process, causing uneven streaks and resin dripping on the prepreg surface, resulting in variations in the adhesion between the metal foil and the prepreg. Variations may occur in the peel strength, dielectric properties, and the like of the metal foil.

The substrate impregnated with the epoxy resin composition includes glass cloth, aramid cloth, polyester cloth, glass nonwoven fabric, aramid nonwoven fabric, polyester nonwoven fabric, pulp paper, linter paper and the like. In addition, it is preferable to use a glass cloth because a laminate having excellent mechanical strength can be obtained. The thickness of the substrate is 0.04
の も の 0.3 mm is commonly used.

A predetermined number of the obtained prepregs and a metal foil are laminated to form a pressure-receiving body, and the pressure-receiving body is heated and pressed to produce a laminate. As the metal foil, copper foil, aluminum foil or the like is used, and as the thickness, 0.012 to 0.070 m
m are commonly used. In addition, it is preferable to use a copper foil because a laminate having excellent electric characteristics can be obtained.

The conditions for heating and pressurizing the object to be pressed are P
Since the cross-linking reaction between the modified phenol product modified by PE, the epoxy resin, and the curing agent for the epoxy resin mainly depends on the reaction temperature of the curing agent for the epoxy resin, the heating temperature and the heating are determined according to the type of the curing agent for the epoxy resin. Choose a time. The pressure is appropriately adjusted to such a level that no air bubbles remain in the obtained laminate, and the pressure is applied. In addition, generally, temperature 150-300 degreeC, pressure 1-6MPa, time 10-1.
Heat and pressurize under conditions of about 20 minutes.

The laminate thus obtained has excellent high-frequency characteristics such as dielectric characteristics, solder heat resistance, adhesive strength, etc. since the characteristics of the epoxy resin and PPE are not impaired. When a bonding wire is bonded to the foil, a laminate having excellent adhesion strength between the metal foil and the bonding wire is obtained.

The use form of the epoxy resin composition of the present invention is not limited to a form in which a base material is impregnated and dried to produce a prepreg. For example, a sheet containing no base material is prepared by a casting method. This sheet can be used as a prepreg. The method according to the casting method is, for example, a polyester film, a polyimide film, etc., to a sheet insoluble in the solvent contained in the epoxy resin composition, apply the epoxy resin composition to a thickness of 5 to 700 μm, after drying, the sheet It is manufactured by peeling, or manufactured by extrusion molding by hot-melting an epoxy resin composition. In the case of the method of manufacturing by applying to a sheet, the sheet can be easily formed at a relatively low temperature as compared with the extrusion molding method, which is preferable. Note that the sheet to which the epoxy resin composition is applied is preferably excellent in productivity because the use of a sheet surface-treated with a release agent facilitates peeling.

[0045]

【Example】

(Preparation of modified phenol product) Number average molecular weight 2000
0 PPE [Japan G.P. E. FIG. Plastics Co., Ltd., product number 640-111], bisphenol A as a phenolic compound, benzoyl peroxide as a reaction initiator, and toluene as a solvent at a ratio shown in Table 1 (unit: parts by weight), and mixed at 90 ° C. A redistribution reaction was performed with stirring for 60 minutes to obtain liquid modified phenol products (A) to (G). The modified phenol products (A) to (G) were subjected to gel permeation chromatography [column configuration: manufactured by Tosoh Corporation, S
upperHM-M (1) + SuperHM-H (1
This) was used to measure the molecular weight distribution, and the number average molecular weight was determined. Table 1 shows the results. In Table 1, the molecular weight ratio represents the ratio of the number average molecular weight of the obtained modified phenol product to the number average molecular weight of the used PPE.

[0046]

[Table 1]

(Examples 1 to 10, Comparative Examples 1 to 5) The modified phenol products (A) to (G), the following three types of epoxy resins, diaminodiphenylmethane as a curing agent for the epoxy resin, and curing acceleration 2-ethyl-4- as an agent
Methylimidazole and toluene as a solvent were mixed in the separable flask in the ratio (unit: parts by weight) shown in Table 2, and the mixture was stirred at room temperature for 30 minutes and air-cooled to obtain an epoxy resin composition at 25 ° C.

In Table 2, the blended weight of the modified phenol product represents the weight as solid content. The formula (a) resin ratio represents the weight part of the formula (a) resin in 100 parts by weight of the total epoxy resin.

The epoxy resins used were: epoxy resin 1: brominated bisphenol A type epoxy resin (trade name: YDB500, manufactured by Toto Kasei Co., Ltd.) (epoxy equivalent: 500); epoxy resin 2: brominated bisphenol A type Epoxy resin [trade name: YDB400, manufactured by Toto Kasei Co., Ltd.] (Epoxy equivalent: 400) Epoxy resin 3: 1,6-bis (2,3-epoxypropoxy) naphthalene [Dai Nippon Ink Co., Ltd. Manufactured by Chemical Industry Co., Ltd., trade name: HP4032] (epoxy equivalent: 272).

[0050]

[Table 2]

Next, the obtained epoxy resin composition was stored at room temperature for 24 hours, and then impregnated with a glass cloth having a thickness of 0.1 mm [trade name: 216L, manufactured by Asahi Schwebel Co., Ltd.] and dried at 140 ° C. for 4 minutes. Resin content 65% by weight
Prepreg was obtained.

18 μm copper foil [manufactured by Nikko Gould Foil Co., Ltd., trade name JTC] on both sides of the obtained prepreg.
Was placed under pressure and heated and pressed at a temperature of 190 ° C. and a pressure of 2 MPa for 100 minutes to obtain a laminate having copper foils bonded to both surfaces.

(Evaluation and Results) The initial viscosity and storage stability of the obtained epoxy resin composition were evaluated. The initial viscosity was measured at 25 ° C. using a B-type viscometer and measured at 500 cps.
The following cases were evaluated as good (○), and the cases exceeding 500 cps were evaluated as poor (x). In addition, the measurement of the storage stability
After storing for 24 hours, measurement and determination were performed in the same manner as in the initial viscosity.

As shown in Table 2, the epoxy resin compositions obtained in Examples and Comparative Examples 1, 3, and 5 had low initial viscosity, no precipitation phenomenon, and excellent storage stability. However, it was confirmed that Comparative Examples 2 and 4 using the modified phenol product (F) having a number average molecular weight of 17000 were inferior in both initial viscosity and storage stability.

The appearance, handleability and impregnation of the obtained prepreg were evaluated. The external appearance was visually observed for the presence or absence of a streak-like or sagging external appearance defect, and the absence was evaluated as good (○), and the existence was evaluated as poor (x). Also,
The handleability was determined by bending the prepreg by 180 degrees and visually observing the presence or absence of resin detachment.
When there was, it was determined to be defective (x). The impregnating property was evaluated by SEM observation of the cut surface at a magnification of 1000 times. Good results were obtained when there were no air bubbles inside (o), poor when there were a few bubbles, and poor (x) when there were many bubbles.

The results are shown in Table 2. As shown in Table 2, the prepregs obtained in each of the Examples and Comparative Examples 1, 3, and 5 were obtained by using the modified phenol product (F) having a number average molecular weight of 17000. It was confirmed that the appearance, the handleability, and the impregnation were superior to those of Examples 4 and 4. Further, it was confirmed that Examples 1 to 8 in which the number average molecular weight of the modified phenol product was in the range of 1000 to 3000 had particularly excellent impregnation properties as compared with Examples 9 and 10.

The obtained laminate was measured for the dielectric constant, the dielectric loss tangent, the solder heat resistance, the peel strength of the copper foil, and the wire pull strength as an evaluation of the adhesive strength between the copper foil and the bonding wire. . The dielectric constant and the dielectric loss tangent were measured based on the MIL standard. Solder heat resistance and peel strength were measured based on JIS standard C6481.

The wire pull strength was measured using a wire bonder (trade name: FB-118A) manufactured by Kaijo Co., Ltd.
After bonding a 30 μm gold wire [manufactured by Tanaka Kikinzoku Kogyo Co., Ltd.] to the copper foil on the surface of the laminate, the temperature was adjusted to 180 ° C. using a bond tester [trade name BT22] manufactured by Dage.
The strength at which the gold wire was peeled was measured under the conditions of ° C and a head speed of 0.3 mm / sec.

The results are shown in Table 2. As shown in Table 2, the laminates obtained in each of the examples are superior in the wire pull strength as compared with Comparative Examples 1 to 3 containing no resin of the formula (a). confirmed.

Further, the laminates obtained in the respective Examples were compared with Comparative Examples 2 to 5 in which the number average molecular weight of the modified phenol product was out of the range of 10 to 70% of the number average molecular weight of the PPE used. It was confirmed that the solder heat resistance was excellent. In addition, it was confirmed that the laminate obtained in each of the examples had excellent dielectric constant and dielectric loss tangent.

From the above evaluation results, each of the examples has good epoxy resin composition properties, prepreg properties, and laminate properties, but each comparative example is inferior in at least one of these properties. It was confirmed that.

[0062]

When the epoxy resin composition according to any one of claims 1 to 6 of the present invention is used, the metal foil and the bonding wire on the surface thereof can be obtained without lowering the dielectric constant, dielectric loss tangent and solder heat resistance. When these are bonded, a laminate having excellent adhesion strength between the metal foil and the bonding wire can be obtained.

When the epoxy resin composition according to the fourth aspect of the present invention is used, a prepreg excellent in impregnation property in addition to the above-mentioned effects can be obtained.

When the prepreg according to claim 7 of the present invention is used, the metal foil on the surface and the bonding wire can be bonded without reducing the dielectric constant, the dielectric loss tangent, and the soldering heat resistance. A laminate having excellent bonding strength with the bonding wire can be obtained.

The laminate according to claim 8 of the present invention is excellent in dielectric constant, dielectric loss tangent, and solder heat resistance, and when the metal foil and the bonding wire on the surface are joined, the metal foil and the bonding wire are not bonded. A laminate having excellent adhesive strength is obtained.

Claims (8)

[Claims] 1. A compound having a number average molecular weight of 10,000 to 30,000
Polyphenolene ether resin and a phenolic compound are redistributed in the presence of a reaction initiator to form a modified phenol in which the number average molecular weight is reacted so as to be 5 to 70% of the number average molecular weight of the used polyphenylene ether resin. An epoxy resin composition containing a product, an epoxy resin and a curing agent for the epoxy resin, wherein the epoxy resin comprises an epoxy resin represented by the following formula (a) as the epoxy resin.
In the formula (a), R ^{1 to} R ⁶ are any functional group selected from the group consisting of a monovalent hydrocarbon group having 1 to 5 carbon atoms, a hydroxyl group and a glycidyl ether group, or a hydrogen atom. Represents Embedded image 2. The epoxy resin composition according to claim 1, wherein the epoxy resin represented by the formula (a) contains an epoxy resin represented by the following formula (b). Embedded image 3. The epoxy resin composition according to claim 1, wherein the epoxy resin represented by the formula (a) is contained in an amount of 1 to 40 parts by weight based on 100 parts by weight of the total epoxy resin. Stuff. 4. The epoxy resin composition according to claim 1, wherein the modified phenol product has a number average molecular weight of 1,000 to 3,000. 5. The epoxy resin composition according to claim 1, wherein the reaction initiator is benzoyl peroxide. 6. The epoxy resin composition according to claim 1, wherein the phenolic compound is a phenolic compound having two or more phenolic hydroxyl groups in a molecule. 7. A prepreg obtained by impregnating and drying a base material with the epoxy resin composition according to any one of claims 1 to 6. 8. A laminate obtained by laminating a metal foil on the prepreg according to claim 7, and applying heat and pressure.