JPH10328754A - Cutting dies for semiconductor devices - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent the rising of cutting waste and suppress the potential of cutting failure caused by a miss shot. When an object to be cut is punched by a punch, an inflow air flows through a groove in the air on a side surface of the punch, thereby improving an effect of absorbing dust (vacuum). To absorb the cutting waste 6 downward,
The cutting waste 6 is prevented from rising.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a cutting die for a semiconductor device, and more particularly to a cutting die for a semiconductor device used in a molding device for a semiconductor device.

[0002]

2. Description of the Related Art As shown in FIG. 2A, a conventional cutting die for a semiconductor device (hereinafter referred to as a cutting die) has a punch 1 and a die 2 serving as cutting blades. As a variation, there is one provided with a punch guide 13 for guiding the punch 1 (Japanese Patent Application Laid-Open No. 60-160132,
JP-A-5-226539).

In the operation of the cutting die, as shown in FIG. 2A, first, the workpiece 4 is placed on the die 2 and the punch 1 and the punch guide 13 are lowered. Next, when cutting the semiconductor device or the object to be cut, as shown in FIG. 2B, when the punch 1 comes into contact with the object to be cut 4 on the die 2, a shear force acts to punch the object to be cut. Thereafter, the punch 1 continues to descend to the bottom dead center 5 and stops. Thereafter, as shown in FIG. 2C, the punch 1 and the punch guide 13 move up and return to their original positions, thereby completing a series of cutting operations. There is also a variation in which dust is collected (vacuum) from the lower part of the lower mold. The cutting waste 6 generated when cutting is generally discharged from the tapered portion 7 as shown in FIG. 2C.
Since the punch 1 adheres the cutting debris 6 or is in a vacuum state when it is raised, the cutting debris 6 is not absorbed downward, and FIG. 2D
As shown in FIG. Since this phenomenon caused a serious quality accident, several precautions were taken.

As a typical example of the mechanical prevention means, as shown in FIGS. 3A and 3B, a method of forcibly dropping cutting waste 6 by protruding an injection pin 10 (single pin or multiple pins) as shown in FIG. And a forced peeling method using a differential punch 11.

[0005] Typical structural preventing means include:
As shown in FIG. 5, the bottom dead center 5 of the punch is increased to the bottom dead center 12, and the rising bottom dead center method of reducing the rising potential of the cutting waste 6. As shown in FIG. 6, the punch 1 is guided to the cutting position. A ventilation hole 14 is provided in the punch guide 13 to be cut, and cutting dust 6 is cut by the inflow air 15 due to dust collection from below.
Air flow system for absorbing air.

[0006]

The first problem is that the conventional method cannot obtain a sufficient effect of preventing the cutting waste 6 from rising. The reason is that, even when the punch 1, the cutting waste 6 and the vicinity of the die 2 are in a vacuum state at the time of cutting, and the dust is collected (vacuum) from the lower part of the die 2, the cutting waste 6 flies up with the rise of the punch 1. It is.

[0007] The second problem is that it is difficult to recycle the punch 1 in the conventional method. The reason for this is that the punch 1 is made of a material having high hardness, and the punch 1 of the prior art has a complicated shape and structure, which causes poor recyclability due to additional processing.

A third problem is that the provision of the vent hole 14 in the punch guide 13 increases the potential for frequent occurrence of miss shots (cutting mistakes) during cutting due to the structure.
The reason is that by increasing the ventilation hole of the punch guide 13 having the guide descent when the punch 1 is lowered, the effect of the guide 13 is reduced, the cutting position shifts, abnormal friction of the punch / die, etc., and the mold due to misshot. This is because the potential for destruction increases.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the potential of defective cutting due to a missed shot without adversely affecting the life cycle and recyclability of a punch, to simplify the structure, and to prevent the removal of cutting waste. The present invention provides a cutting die for a semiconductor device.

[0010]

According to the present invention, there is provided a cutting die for a semiconductor device which is mounted on the lower die in a state where a punch of an upper die and a die of a lower die are engaged with each other. In a cutting die for a semiconductor device for processing a cut object, a groove through which air flows is provided below a punch of the upper die.

According to the present invention, dust is collected (vacuum) from the lower part of the lower mold at the time of cutting, and cutting dust is forcibly absorbed by air flowing downward from a groove provided on the side surface of the punch. The strength is increased, the vacuum is released, and cutting waste is prevented from rising.

[0012]

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are cross-sectional views illustrating the operation of a cutting die for a semiconductor device according to an embodiment of the present invention.
1D are cross-sectional views showing variations of FIG. 1A.

1A and 1B show a configuration of a semiconductor device mold according to an embodiment of the present invention, in which a groove (hole) 3 through which air flows into a punch 1 for punching an object 4 to be cut. And extends from the side surface of the punch 1 to the lower surface of the punch edge. Other components are the same as those shown in FIGS.

The effect of the operation of the embodiment of the present invention is that, as shown in FIG. 1B, dust is collected (vacuum) 8 from the lower part of the lower mold with the punch 1 lowered to the bottom dead center 5,
The inflow air 9 flows into the lower mold from the groove (hole) 3 into which the air flows into the side surface of the punch 1, so that the cutting waste 6 is strongly absorbed in the downward direction.
Yes, it is designed to prevent rising. Structural advantages include simplified processing of the grooves (holes) 3, improving additional workability and recyclability,
Another object of the present invention is to suppress the potential of a miss shot by not changing other important function parts.

Next, a variation other than FIG. 1A will be described with reference to FIGS. 1C to 1E. The embodiment illustrated in FIG. 1C is configured to provide grooves (holes) 3 on both the left and right sides to prevent cutting debris from rising due to inflowing air. The embodiment shown in FIG. 1D has a configuration in which a groove (hole) 3 is provided in the central portion of the punch 1 so as to prevent cutting waste from flowing in. The embodiment shown in FIG. 1E has a configuration in which a portion having a function of the groove (hole) 3 is provided by cutting the punch 1 by inclining the tip. It was done.

[0017]

The first effect is that the vacuum state generated in the punch / die portion at the time of cutting is eliminated, and the cutting waste can be prevented from rising. The reason for this is that by providing a groove (hole) into which air flows into the punch, the effect of collecting dust (vacuum) from the lower mold part is enhanced, and cutting waste can be more forcibly absorbed. .

The second effect is that the recyclability of the punch can be improved. The reason for this is that by changing the conventional punching from a hole to a groove (hole), the structure can be simplified, and additional workability is improved, thereby improving the recyclability of the punch.

A third effect is that the potential of a miss shot generated at the time of cutting can be suppressed by simplifying the structure. The reason is that by simplifying the structure without changing or processing a portion for determining the cutting position accuracy such as a punch guide, it is possible to prevent cutting scraps from rising without cutting down their functions.

[Brief description of the drawings]

FIGS. 1A to 1E are cross-sectional views illustrating the operation of a cutting die for a semiconductor device according to an embodiment of the present invention, and FIGS.

FIGS. 2A to 2D are cross-sectional views illustrating the operation of a conventional cutting die for a semiconductor device.

FIGS. 3A and 3B are cross-sectional views illustrating an example of conventional mechanical prevention means.

FIG. 4 is a cross-sectional view of one example of a conventional forced peeling method using a differential punch.

FIG. 5 is a cross-sectional view of an example of a structural prevention unit.

FIG. 6 is a sectional view of another example of the structural prevention means.

[Explanation of symbols]

 Reference Signs List 1 punch 2 die 3 groove 4 cut object 5 bottom dead center 6 cutting waste 7 taper section 8 dust collection (vacuum) 9 inflow air 10 injection pin 11 differential punch 12 increased bottom dead center 13 punch guide 14 vent hole 15 Inflow air

Claims (5)

[Claims] 1. A cutting die for a semiconductor device for processing an object mounted on a die of a lower die in a state where a punch of an upper die and a die of a lower die are engaged with each other. A cutting die for a semiconductor device, wherein a groove through which air flows is provided under a gold punch. 2. The cutting die for a semiconductor device according to claim 1, wherein the groove is provided so as to extend from a side surface of the punch to a lower surface of a cutting edge of the punch. 3. The cutting die for a semiconductor device according to claim 1, wherein the groove is provided on both right and left sides of the punch. 4. The cutting die for a semiconductor device according to claim 1, wherein said groove is provided at a central portion of a punch. 5. The cutting die for a semiconductor device according to claim 1, wherein said groove is provided so as to incline a cutting destination of the punch.