JPH10340773A - Socket for ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket right fit for an IC, in which a number of bumps are arranged at small intervals in a lattice shape. SOLUTION: A base block 25 is disposed on the side of one surface of a printed circuit board 21 on the one surface, of which a plurality of contact electrodes 22 are formed at the same intervals as arrangement intervals of IC bumps and on the other surface, of which terminal electrodes 23 connected with those contact electrodes 22 respectively are formed at expanded intervals. A plurality of pass-through holes 31, respectively confronting the contact electrodes 22 are formed in a bottom surface of a recessed part 29 of the base block 25, and contact parts with the IC bumps are constituted by disposing coil-shaped contacts 33 in these pass-through holes 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket used for a so-called inner surface mount type IC, in which bumps are arranged and formed on the bottom surface of an IC body.

[0002]

2. Description of the Related Art FIG. 10 shows a conventional example of this type of IC socket. FIG. 10 shows a state where the IC is mounted. A contact terminal 13 is provided on the main body 12 of the socket 11.
Are arranged and planted in a predetermined number, and the portion located in the main body 12 is bent as shown in the figure, and the tip is a contact portion 13a. The other end of the contact terminal 13 protrudes from the bottom surface of the main body 12 to form a terminal portion 13b. A holding member 15 is attached to the main body 12 via a hinge 14, and the holding member 15 is rotatable with respect to the main body 12.

The IC 16 is housed in the main body 12 with its bumps 17 positioned on the corresponding contact portions 13a, and the upper surface of the IC main body 18 is pressed down by the pressing member 15 and attached. Although not shown in the drawing, the holding member 15 is locked in this state by a locking member attached to the main body 12.

[0004]

In the above-described socket structure, the arrangement pitch of the bumps 17 is relatively wide, and as shown in FIG. This can be adopted in the case of being arranged in rows. However, since the contact terminals 13 made of metal pins are arranged on the main body 12, a large number of bumps are arranged in a grid pattern at a narrow pitch.
It is structurally difficult to apply to an SP (chip size package) type IC, and a socket corresponding to such an IC is demanded.

[0005] An object of the present invention is to respond to such demands by, for example, using a bump pitch of 0.5 mm and a bump number of 40 to 10.
It is an object of the present invention to provide a socket which can be used for a CSP type IC or the like in which zero and many bumps are arranged in a grid at a narrow pitch.

[0006]

According to the first aspect of the present invention, a plurality of contact electrodes are formed on one surface at the same pitch as the arrangement pitch of the IC bumps, and a plurality of contact electrodes are respectively connected on the other surface to the contact electrodes. And a plurality of terminal electrodes arranged on the one surface side of the printed wiring board, the plurality of terminal electrodes being opposed to the plurality of contact electrodes on a bottom surface of a concave portion provided on a central outer surface. An IC socket is constituted by a base having a through hole formed therein, and a coil-shaped contact arranged at the through hole and having one end in contact with the contact electrode and the other end slightly projecting from the bottom surface. .

According to the second aspect of the present invention, a plurality of contact electrodes are arranged on one surface at the same pitch as the arrangement pitch of the IC bumps, and a plurality of terminal electrodes respectively connected to the contact electrodes are enlarged on the other surface. The formed printed wiring board and the printed wiring board are disposed on the one surface side of the printed wiring board,
A base having a plurality of through-holes formed on the bottom surface of the recess provided on the outer surface of the central portion, the plurality of through-holes being respectively opposed to the plurality of contact electrodes; an adapter fitted into the recess to form an IC positioning frame; An IC socket is constituted by the coil-shaped contacts arranged in the through holes, one end of which is in contact with the contact electrode, and the other end of which is slightly projected from the bottom surface.

According to a third aspect of the present invention, in any one of the first and second aspects of the present invention, a holding plate is rotatably mounted on the base, and a holding member for holding the IC on the bottom surface of the holding plate is a seesaw movement. It can be installed freely.

[0009]

Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 shows an embodiment of the first aspect of the present invention, and FIG. 2 is an exploded view of the embodiment. The rectangular printed wiring board 21 has a plurality of contact electrodes 22 arranged in a lattice at the center of one surface 21a, and the arrangement pitch and number of these contact electrodes 22 are determined by the bumps of the IC to be mounted. The same as the arrangement pitch and number. FIG. 3 shows the configuration of the printed wiring board 21. In this example, the contact electrodes 22 are 0.5
A total of 49 pieces, 7 pieces each in the vertical and horizontal directions, are arranged at a pitch of mm.

On the other surface 21b of the printed wiring board 21,
The terminal electrodes 23 connected to the respective contact electrodes 22 are formed by the multilayer printed wiring technique. Each terminal electrode 23
Are arranged along four sides of the printed wiring board 21 with the pitch increased with respect to the contact electrodes 22. The arrangement pitch of the terminal electrodes 23 is, for example, 2.5 mm. In this example, a through hole is formed in each terminal electrode 23 and a pin terminal 24 is attached.

A base 25 made of a synthetic resin material has a substantially rectangular plate shape, and a step portion 26 for accommodating the printed wiring board 21 is formed on one of the plate surfaces. The depth of the step 26 is slightly larger than the thickness of the printed wiring board 21, and connecting pins 27 project from four corners of the step 26, respectively. At four corners of the printed wiring board 21, connection holes 28 for engaging with the connection pins 27 are formed, and one surface 21a on which the contact electrode 22 is formed is used as the base 25 side and connected to each connection pin 27. The hole 28 is inserted and positioned, and the printed wiring board 21 is accommodated in the step 26. The printed wiring board 21 and the base 25 are fixed to each other by caulking the tips of the connection pins 27.

A recess 29 is formed in the outer surface of the base 25, that is, in the center of the plate surface opposite to the plate surface on which the step portion 26 is formed.
A plurality of through-holes 31 facing one contact electrode 22 are arranged and formed. The concave portion 29 is used to position and house the IC, and a taper 32 for shaping is formed at an open end thereof.

A coil-shaped contact 33 is inserted into each through hole 31 of the base 25. One end of the coil-shaped contact 33 is located on the contact electrode 22 of the printed wiring board 21 and is in contact with the contact electrode 22, while the other end is slightly projected from the bottom surface of the concave portion 29. In this example, the coil-shaped contact 33 is simply inserted and arranged in the through hole 31.
For example, one end may be fixed to the contact electrode 22 using a conductive adhesive or solder.

FIG. 4 shows a state in which the socket 34 constructed as described above is mounted on the circuit board 35 of the tester for shipping inspection, and the IC 36 is mounted. By fitting the IC main body 37 into the concave portion 29 of the base 25, the bumps 38 arranged in a grid are respectively positioned on the corresponding coil-shaped contacts 33, and the upper surface of the IC main body 37 is, for example, a robot (not shown). ), Each bump 38 is elastically contacted with the coil-shaped contact 33. FIG. 5 is an enlarged view showing a contact state between the bump 38 and the coil contact 33.

According to the structure of the above-described socket 34, the coil-shaped contacts 33 arranged in each through hole 31 of the base 25 constitute a contact portion that makes good contact with the narrow pitch IC bumps. The substrate 21 constitutes a mounting terminal portion which is derived by converting the pitch from the contact portions, so that it can correspond to an IC in which a large number of bumps such as a CSP type IC are arranged in a grid pattern at a narrow pitch. Become.

FIG. 6 shows an embodiment of the second aspect of the present invention. In this example, the bump pitch of the IC is generally standardized and a fixed value is adopted in a wide range. However, since the number of bumps and the outer dimensions of the IC main body vary depending on the function of the IC and the like, and there are various types, the bump pitch is the same. ,
The socket has versatility for various ICs having different numbers of pumps.

That is, in this example, the recess 29 provided in the base 25 is made larger than that shown in FIG.
The adapter 41 is fitted in the connector 41, and the IC 41 is positioned by the adapter 41. The number of contact electrodes 22 arranged and formed on the printed wiring board 21 is equal to the maximum number of bumps of an IC that can be mounted on the socket 42. Note that a slightly larger number may be formed.
In this example, a total of 100 contact electrodes 22 are formed in each of the vertical and horizontal directions, and the coil-shaped contacts 33 are arranged on them. The adapter 41 has a frame shape having an IC hole 43, and an IC is positioned and accommodated in the IC hole 43.

According to the socket 42 shown in FIG.
By preparing various adapters 41 having different IC holes 43 corresponding to the external shapes of various ICs, it is possible to cope with various ICs having different external shapes, that is, different numbers of bumps only by replacing the adapter 41. Next, a socket having an IC holding mechanism suitable for burn-in, for example, will be described with reference to FIG. The socket 44 shown in FIG.
A holding mechanism is provided.

A holding plate 45 is rotatably mounted on the base 25. The holding plate 45 is made of a metal plate. A pair of mounting portions 46 formed by bending one end of the holding plate 45 are mounted on a bearing 48 projecting from an edge of the base 25 by pins 47. It is free to move. Presser plate 45
A pair of mounting legs 49 are formed on both sides of the middle portion of the first bending portion, and a pressing member 51 is mounted between the mounting legs 49 by a pin 52. The holding member 51 has a substantially rectangular parallelepiped shape and is made of a synthetic resin. The center of both sides of the holding member 51 is supported by the pin 52 so that the seesaw can be freely moved around the pin 52. In this example, as shown in the figure, a pair of coil springs 53 are provided between the holding plate 45 and the holding member 51 so as to rotate and bias the holding member 51 in opposite directions.

In this socket 44, after the IC body 37 is fitted into the IC hole 43 of the adapter 41, the holding plate 45 is closed, so that the IC 36 is held on the bottom surface of the recess 29 by the holding member 51 as shown in FIG. The IC 36 is mounted and fixed to the socket 44 by locking the rotating end side of the holding plate 45 with the lock member 54 in this state. The lock member 54 is made of a bent bar as shown in FIG. 9, and both ends thereof are rotatably supported by the base 25.

According to the above-described IC pressing mechanism, since the pressing member 51 is capable of seesaw movement, the IC main body 37 can be moved.
Good surface contact following the upper surface of the
Are uniformly pressed, and a good connection state between each bump 38 and the coil-shaped contact 33 can be obtained. In addition, since the pressing member 51 does not come into contact with one side, the one-sided pressurization causes
Problems such as breakage of C36 are also prevented. Note that the coil spring 53 may be omitted.

[0022]

As described above, according to the present invention, the coil-shaped contacts 33 which are inserted into the through holes 31 of the base 25 and are arranged on the contact electrodes 22 are arranged in a grid at a narrow pitch. The contact portion can be formed, and the terminal portion can be enlarged to a required pitch by the printed wiring board 21, so that a socket suitable for, for example, a CSP type IC can be obtained.

According to the second aspect of the present invention, it is not necessary to prepare sockets for various ICs having the same bump pitch and a different number of bumps. You can get a socket that can. Furthermore, according to the third aspect of the present invention, the IC can be mounted and fixed by the IC pressing mechanism, and the pressing member 51 is made to be able to move in a seesaw motion, and the IC comes into good surface contact with the IC. A good connection state can be obtained, and there is no risk of damaging the IC.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is an exploded sectional view of FIG.

FIG. 3 is a perspective view of the printed wiring board in FIG. 1;

FIG. 4 is a sectional view showing a use state of the socket of FIG. 1;

FIG. 5 is an enlarged sectional view showing a contact state between an IC bump and a coil-shaped contact.

FIG. 6 is a sectional view showing an embodiment of the invention of claim 2;

FIG. 7 is a partial sectional view showing an embodiment of the invention of claim 3;

FIG. 8 is a view for explaining a use state of the socket of FIG. 7;

FIG. 9 is a perspective view showing a base to which the holding plate in FIG. 7 is attached.

FIG. 10 is a sectional view showing an example of a conventional socket.

Claims (3)

[Claims] 1. A printed wiring in which a plurality of contact electrodes are arrayed and formed on one surface at the same pitch as the arrangement pitch of IC bumps, and a plurality of terminal electrodes connected to the contact electrodes are formed on the other surface with an enlarged pitch. A substrate, which is disposed on the one surface side of the printed wiring board and has a plurality of through holes formed on a bottom surface of a concave portion provided on a central outer surface, the plurality of through holes respectively facing the plurality of contact electrodes; A coil-shaped contact disposed at each of the holes and having one end in contact with the contact electrode and the other end slightly projecting from the bottom surface. 2. A printed wiring in which a plurality of contact electrodes are arrayed and formed on one surface at the same pitch as the arrangement pitch of IC bumps, and a plurality of terminal electrodes respectively connected to the contact electrodes are formed on the other surface with an enlarged pitch. A substrate, a base disposed on the one surface side of the printed wiring board and having a plurality of through-holes formed on a bottom surface of a concave portion provided on a central outer surface and facing the plurality of contact electrodes, respectively; An adapter that is fitted into the IC and forms a positioning frame for the IC; and a coil-shaped contact that is disposed in each of the through holes and has one end in contact with the contact electrode and the other end slightly projecting from the bottom surface. Characteristic socket for IC. 3. The IC socket according to claim 1, wherein a holding plate is rotatably mounted on the base, and a holding member for holding the IC against the bottom surface is provided on the holding plate. An IC socket characterized by being freely movable.