JPH10340924A - Electronic components - Google Patents
Electronic componentsInfo
- Publication number
- JPH10340924A JPH10340924A JP9148884A JP14888497A JPH10340924A JP H10340924 A JPH10340924 A JP H10340924A JP 9148884 A JP9148884 A JP 9148884A JP 14888497 A JP14888497 A JP 14888497A JP H10340924 A JPH10340924 A JP H10340924A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- tab film
- semiconductor chip
- grease
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Transmission And Conversion Of Sensor Element Output (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は自動車や産業機器に
使用される回転センサ等のＴＡＢフィルムを用いた電子
部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component using a TAB film, such as a rotation sensor used for automobiles and industrial equipment.
【０００２】[0002]
【従来の技術】従来、半導体チップをＴＡＢフィルムに
実装し回路基板等に接続する場合、ＴＡＢフィルムのＯ
ＬＢ端子を直接回路基板の電極や端子に半田付けや溶接
を行い電気的接続を行っていた。2. Description of the Related Art Conventionally, when a semiconductor chip is mounted on a TAB film and connected to a circuit board or the like, the O.D.
The LB terminals have been directly connected to the electrodes and terminals of the circuit board by soldering or welding.
【０００３】[0003]
【発明が解決しようとする課題】しかし、ＴＡＢフィル
ムのＯＬＢ端子は、３５μｍ〜８０μｍ程度の銅箔で構
成されているために、耐落下性や耐振動性に対しての信
頼性に不安がある。However, since the OLB terminal of the TAB film is made of a copper foil of about 35 μm to 80 μm, there is a concern about the reliability of drop resistance and vibration resistance. .
【０００４】本発明はこのようなＴＡＢフィルムを用い
た電子部品において、耐落下・耐振動性の信頼性を高め
ることを目的とする。An object of the present invention is to enhance the reliability of drop resistance and vibration resistance in an electronic component using such a TAB film.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に本発明は、ＴＡＢフィルムに実装した半導体チップの
ＯＬＢ端子を回路基板の電極と接続し、その接続部周辺
にグリスを充填したものである。In order to solve the above-mentioned problems, the present invention relates to a method in which an OLB terminal of a semiconductor chip mounted on a TAB film is connected to an electrode of a circuit board, and grease is filled around a connection portion. is there.
【０００６】これにより、ＯＬＢ端子及び接続部の耐落
下・耐振動性について高い信頼性が得られることにな
る。As a result, high reliability can be obtained with respect to the drop resistance and vibration resistance of the OLB terminal and the connection portion.
【０００７】[0007]
【発明の実施の形態】本発明の請求項１に記載の発明
は、ＴＡＢフィルムに実装した半導体チップのＯＬＢ端
子を回路基板の電極と接続し、その接続部周辺にグリス
を充填していることを特徴としたものであり、ＯＬＢ端
子及び回路基板の電極の接続部周辺にグリスを充填する
ことによりＯＬＢ端子のダンパー作用を有する。According to the first aspect of the present invention, an OLB terminal of a semiconductor chip mounted on a TAB film is connected to an electrode of a circuit board, and grease is filled around a connection portion. The grease is filled around the connection portion between the OLB terminal and the electrode of the circuit board to have a damper function of the OLB terminal.
【０００８】請求項２に記載の発明は、ＴＡＢフィルム
に実装した半導体チップのフォーミングされたＯＬＢ端
子を回路基板の電極と接続し、その接続部周辺にグリス
を充填していることを特徴としたものであり、フォーミ
ングされたＯＬＢ端子及び回路基板の電極の接続部周辺
にグリスを充填することによりＯＬＢ端子のダンパー作
用を有する。According to a second aspect of the present invention, a formed OLB terminal of a semiconductor chip mounted on a TAB film is connected to an electrode of a circuit board, and grease is filled around a connection portion. The grease is filled around the connection between the formed OLB terminal and the electrode of the circuit board, thereby having a function of damping the OLB terminal.
【０００９】請求項３に記載の発明は、ＴＡＢフィルム
に実装した半導体チップのＯＬＢ端子を回路基板から直
接取り出された金属端子と接続し、その接続部周辺にグ
リスを充填していることを特徴としたものであり、回路
基板から直接取り出された金属端子及びＴＡＢフィルム
のＯＬＢ端子の接続部周辺にグリスを充填することによ
りＯＬＢ端子のダンパー作用を有する。According to a third aspect of the present invention, an OLB terminal of a semiconductor chip mounted on a TAB film is connected to a metal terminal directly taken out of a circuit board, and grease is filled around a connection portion. The grease is filled around the connection between the metal terminal directly taken out of the circuit board and the OLB terminal of the TAB film, thereby having a function of damping the OLB terminal.
【００１０】請求項４に記載の発明は、金属端子をイン
サート成形することにより形成されたケースの片側端子
に回路基板が接続し、もう一方の端子にＴＡＢフィルム
に実装した半導体チップのＯＬＢ端子と接続され、その
接続部周辺にグリスを充填していることを特徴としたも
のであり、ＴＡＢフィルムのＯＬＢ端子及び金属インサ
ート端子が接続部周辺にグリスを充填することによりＯ
ＬＢ端子のダンパー作用を有する。According to a fourth aspect of the present invention, a circuit board is connected to one terminal of a case formed by insert molding of a metal terminal, and the other terminal is connected to an OLB terminal of a semiconductor chip mounted on a TAB film. Are connected, and grease is filled around the connection portion. The OLB terminal and the metal insert terminal of the TAB film are filled with grease around the connection portion.
It has a damper function of the LB terminal.
【００１１】以下、本発明の実施の形態について、図面
を用いて説明する。 （実施の形態１）図３，図４は半導体チップをＴＡＢフ
ィルムに実装した状態を示し、図１，図２は実装済ＴＡ
ＢフィルムのＯＬＢ端子をフォーミングし回路基板に実
装した図を示す。図１〜図４において、１はＴＡＢフィ
ルム、２は半導体チップ、３はＯＬＢ端子、４はインナ
ーリード、５は半導体チップ２を保護するモールド材、
６は回路基板、７は回路基板６上の導電パターン、８は
フォーミングされたＯＬＢ端子３と導電パターン７の接
続部、９は接続部８からＴＡＢフィルム１の引出部まで
のＯＬＢ端子３に施されたグリスである。接続部８は溶
接または半田付けにより接続されている。そのＴＡＢフ
ィルム１から接続部８にかけてグリス９を充填すること
により、ダンパー効果が得られＯＬＢ端子３の断線防止
ができ高信頼性が確保できる。An embodiment of the present invention will be described below with reference to the drawings. (Embodiment 1) FIGS. 3 and 4 show a state in which a semiconductor chip is mounted on a TAB film, and FIGS.
The figure which formed the OLB terminal of the B film and mounted it on the circuit board is shown. 1 to 4, 1 is a TAB film, 2 is a semiconductor chip, 3 is an OLB terminal, 4 is an inner lead, 5 is a molding material for protecting the semiconductor chip 2,
Reference numeral 6 denotes a circuit board, 7 denotes a conductive pattern on the circuit board 6, 8 denotes a connection between the formed OLB terminal 3 and the conductive pattern 7, and 9 denotes a connection to the OLB terminal 3 from the connection 8 to a lead-out portion of the TAB film 1. Grease. The connection portion 8 is connected by welding or soldering. By filling the grease 9 from the TAB film 1 to the connection portion 8, a damper effect is obtained, the disconnection of the OLB terminal 3 can be prevented, and high reliability can be secured.
【００１２】（実施の形態２）図５，図６は回転センサ
に用いられている実施の形態である。回路基板と接続す
るための端子１０がケース１１にインサート成形されて
おり、このケース１１にマグネット１２が圧入され、マ
グネット１２上に半導体チップ２を実装したＴＡＢフィ
ルム１が実装されている。そのＴＡＢフィルム１からフ
ォーミングされたＯＬＢ端子３がインサートされた端子
１０と接続部１３で溶接されている。(Embodiment 2) FIGS. 5 and 6 show an embodiment used for a rotation sensor. A terminal 10 for connection to a circuit board is insert-molded in a case 11, a magnet 12 is press-fitted in the case 11, and a TAB film 1 on which a semiconductor chip 2 is mounted is mounted on the magnet 12. The OLB terminal 3 formed from the TAB film 1 is welded to the inserted terminal 10 at the connection portion 13.
【００１３】その溶接された接続部１３からＴＡＢフィ
ルム１にかけてグリス９を図のように充填することによ
り、ダンパー効果が得られＯＬＢ端子３の断線防止がで
き高信頼性が確保できる。By filling the grease 9 from the welded connection portion 13 to the TAB film 1 as shown in the figure, a damper effect is obtained, the disconnection of the OLB terminal 3 can be prevented, and high reliability can be secured.
【００１４】[0014]
【発明の効果】以上のように本発明によれば、ＴＡＢフ
ィルムを用いた実装形態でも、耐衝撃・耐振動性の過酷
な自動車用部品として高信頼性を確保できるという有利
な効果が得られる。As described above, according to the present invention, even in a mounting mode using a TAB film, there is obtained an advantageous effect that high reliability can be ensured as an automobile component having severe shock and vibration resistance. .
【図１】本発明のＴＡＢフィルムを回路基板に実装した
電子部品を示す上面図FIG. 1 is a top view showing an electronic component in which a TAB film of the present invention is mounted on a circuit board.
【図２】同正面図FIG. 2 is a front view of the same.
【図３】同ＴＡＢフィルムに半導体チップを実装した状
態を示す上面図FIG. 3 is a top view showing a state where a semiconductor chip is mounted on the TAB film.
【図４】同正面図FIG. 4 is a front view of the same.
【図５】本発明の電子部品を回転センサとした状態を示
す上面図FIG. 5 is a top view showing a state where the electronic component of the present invention is a rotation sensor.
【図６】同断正面図FIG. 6 is a sectional front view of the same.
１ ＴＡＢフィルム ２ 半導体チップ ３ ＯＬＢ端子 ６ 回路基板 ７ 導電パターン ８ 接続部 ９ グリス １０ 端子 １１ ケース １２ マグネット １３ 接続部 DESCRIPTION OF SYMBOLS 1 TAB film 2 Semiconductor chip 3 OLB terminal 6 Circuit board 7 Conductive pattern 8 Connection part 9 Grease 10 Terminal 11 Case 12 Magnet 13 Connection part
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 1/18 Ｈ０５Ｋ 1/18 Ｇ 3/28 3/28 Ｇ Continued on the front page (51) Int.Cl. 6 Identification code FI H05K 1/18 H05K 1/18 G 3/28 3/28 G
Claims (4)
のＯＬＢ端子を回路基板の導電パターンと接続し、その
接続部周辺にグリスを充填した電子部品。An electronic component in which an OLB terminal of a semiconductor chip mounted on a TAB film is connected to a conductive pattern of a circuit board, and grease is filled around a connection portion.
のフォーミングされたＯＬＢ端子を回路基板の導電パタ
ーンと接続し、その接続部周辺にグリスを充填した電子
部品。2. An electronic component in which a formed OLB terminal of a semiconductor chip mounted on a TAB film is connected to a conductive pattern of a circuit board, and a grease is filled around a connection portion.
のＯＬＢ端子を回路基板から直接取り出された金属端子
と接続し、その接続部周辺にグリスを充填した電子部
品。3. An electronic component in which an OLB terminal of a semiconductor chip mounted on a TAB film is connected to a metal terminal directly taken out of a circuit board, and grease is filled around a connection portion.
り形成されたケースの片側端子に回路基板が接続され、
もう一方の端子にＴＡＢフィルムに実装した半導体チッ
プのＯＬＢ端子と接続され、その接続部周辺にグリスを
充填した電子部品。4. A circuit board is connected to one terminal of a case formed by insert molding a metal terminal,
An electronic component in which the other terminal is connected to the OLB terminal of a semiconductor chip mounted on a TAB film, and the periphery of the connection is filled with grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9148884A JPH10340924A (en) | 1997-06-06 | 1997-06-06 | Electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9148884A JPH10340924A (en) | 1997-06-06 | 1997-06-06 | Electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10340924A true JPH10340924A (en) | 1998-12-22 |
Family
ID=15462869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9148884A Withdrawn JPH10340924A (en) | 1997-06-06 | 1997-06-06 | Electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10340924A (en) |
-
1997
- 1997-06-06 JP JP9148884A patent/JPH10340924A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040526 |
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| RD01 | Notification of change of attorney |
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| A977 | Report on retrieval |
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| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20050624 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20061101 |