JPH10340947A - Spin processor - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a spin processing apparatus capable of releasing a locked state of a semiconductor wafer by a simple mechanism. SOLUTION: A plurality of holding members 17 are provided on a rotating body 12 so as to be rotatable at predetermined intervals in a circumferential direction and provided with support pins 21 for supporting a semiconductor wafer U and lock pins 22 for holding a peripheral portion of the semiconductor wafer. A parent gear 25 rotatably provided on the lower surface side of the rotating body, and a child gear 23 provided at the lower end of each holding member so as to mesh with the parent gear, respectively.
A torsion coil spring 26 urges the holding member through a parent gear and a child gear in a rotation direction in which the lock pin holds the semiconductor wafer, and is rotated by the pulse control motor 9 in a state where the rotation of the parent gear is prevented. A release mechanism 31 for releasing the holding state of the semiconductor wafer by the lock pin by rotating the body against the biasing force of the torsion coil spring applied to the holding member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin processing apparatus for cleaning or drying while rotating a work.

[0002]

2. Description of the Related Art For example, in the manufacturing process of a semiconductor device or a liquid crystal display device, there are a film forming process and a photo process for forming a circuit pattern on a semiconductor wafer or a liquid crystal glass substrate as a work. In these processes, the above-described work processing and cleaning are repeatedly performed.

[0003] A spin processing apparatus is used to clean and dry the work. This spin processing device has a rotating body driven to rotate by a rotating motor, and holding members are rotatably provided at predetermined intervals in a circumferential direction at a peripheral portion of an upper surface of the rotating body. At the upper end of the holding member, a support pin for supporting the peripheral portion of the lower surface of the work, and eccentric rotation by the rotation of the holding member to engage with the peripheral portion of the work supported by the support pin, and And a lock pin for holding the lock is projected.

The holding member is urged by a spring in a rotational direction in which the lock pin is engaged with the outer peripheral surface of the work, and when the work is attached or detached, the holding member resists the urging force of the spring. By rotating the lock pin, the locked state by the lock pin is released.

In order to release the holding state of the work by the lock pin, the holding member is rotatable by a link mechanism provided integrally with the rotating body, and a peripheral portion of the rotating body is provided. And a release mechanism for releasing the lock state by the lock pin by operating the link mechanism.

When the rotation of the rotator is stopped after processing such as washing and drying of the work is completed, the link mechanism is operated by the release mechanism, whereby the work by the lock pin is performed. Is released, the work is unloaded and an unprocessed work is supplied.

In order to operate the above link mechanism, an actuator for that purpose must first be engaged with the link mechanism and then driven in the release direction. Therefore, a drive source for driving the actuator in a direction for engaging the link mechanism and a drive source for driving in the release direction are required.

That is, according to the conventional configuration, in order to release the locked state of the work by the lock pin, two dedicated driving sources for operating the link mechanism are required, so that the number of parts is increased. This may lead to an increase in cost and a complicated configuration. In addition, since the release mechanism must be disposed around the rotating body, the size of the entire apparatus may be increased.

[0009]

As described above, in the conventional spin processing apparatus, in order to release the locked state of the work, two dedicated driving sources had to be used. In some cases, an increase in the number of points leads to an increase in cost, a complicated configuration, and an increase in the size of the apparatus.

The present invention provides a spin processing apparatus capable of simplifying the configuration by using a driving means for driving a rotating body to release a locked state of a work. Is to do.

[0011]

According to the first aspect of the present invention, there is provided a word processor.
In a spin processing apparatus that performs processing by holding and rotating a rotating body, a cup body, a rotating body disposed in the cup body, a driving unit that rotationally drives the rotating body, and a radial periphery of the rotating body. At the upper end, a support pin for supporting the periphery of the lower surface of the work and a lock pin for holding the periphery of the work by eccentric rotation are provided at the upper end thereof. A plurality of holding members, a parent gear rotatably provided on the lower surface side of the rotator with respect to the rotator, and a child gear provided at the lower end of each holding member so as to mesh with the parent gear. Urging means for elastically urging the holding member via the master gear and the child gear in a rotational direction in which the lock pin holds a peripheral portion of the work;
The driving means engages with the master gear to prevent the master gear from rotating together with the rotating body and prevents the master gear from rotating. A release means for releasing the holding state of the work by the lock pin by rotating against the urging force of the urging means.

According to a second aspect of the present invention, in the first aspect of the present invention, the rotating body is rotated by the restoring force of the biasing means when the work holding state by the lock pin is released. And a brake means for preventing the occurrence of the air pressure.

According to a third aspect of the present invention, in the first aspect of the present invention, the driving means comprises a hollow stator and a hollow shaft rotor rotatably provided inside the stator. The rotator is attached to the upper end of the rotator and has a through hole formed in the center thereof. The through hole faces the lower surface of the work held by the holding member of the rotator. A cleaning nozzle for ejecting a cleaning liquid is provided.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the upper surface side of the rotating body is provided on the lower surface side of the work held by the holding member. A turbulence prevention cover is provided.

According to the first aspect of the present invention, when the releasing means is engaged with the parent gear, the driving means for rotating and driving the rotating body is operated to rotate the rotating body by a predetermined angle.
Since the holding means can be rotated against the urging force of the urging means, the locked state of the work by the lock pin provided on the holding means can be released.

According to the second aspect of the present invention, the driving force of the driving means is increased when the driving means is operated to rotate the rotating body by a predetermined angle and the work held by the lock pin is released. Even if it disappears, the above-mentioned rotating body is rotated by the restoring force of the urging means, and the lock pin is prevented from eccentrically rotating in the direction for holding the work.

According to the third aspect of the present invention, the rotor of the driving means has a hollow shaft shape, and a rotating body having a through hole formed in the center at the upper end thereof is attached. In addition to cleaning the lower surface of the work held by the rotating body, the rotating body and the driving means are provided coaxially, so that they are compactly arranged to reduce the size of the apparatus. Can be measured.

According to the fourth aspect of the present invention, a turbulence prevention cover for preventing turbulence from being generated due to the shape of the upper surface of the rotating body is provided on the upper surface side of the rotating body and on the lower surface side of the work. This can prevent, for example, the mist-like cleaning liquid generated during cleaning from rising and adhering to the upper and lower surfaces of the work.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The spin processing apparatus of the present invention shown in FIG. The cup body 1 includes a lower cup 3 provided on a mounting plate 2 and an upper cup 4 provided on the upper side of the lower cup 3 so as to be vertically driven by a vertical driving mechanism (not shown).

The center of the bottom wall of the lower cup 3 and the mounting plate 2
The upper cup 4 is formed with a through hole 5 penetrating therethrough, and the peripheral wall 3a of the lower cup 3 is slidably inserted into the double peripheral wall 4a of the upper cup 4 to form a labyrinth structure by these peripheral walls. ing.

The upper surface of the upper cup 4 is open, and when the upper cup 4 is driven in a downward direction, for example, a semiconductor wafer U as a work processed in the cup body 1 will be described later. And an unprocessed semiconductor wafer U can be supplied. Further, one ends of a plurality of discharge pipes 6 are connected to the bottom wall of the lower cup 3 at predetermined intervals in a circumferential direction, and the other ends are connected to a suction pump (not shown). Thereby, the cleaning liquid scattered in the cup body 1 by cleaning or drying the semiconductor wafer U is discharged.

A base 7 is arranged on the lower surface side of the cup body 1. A mounting hole 8 is formed in the base 7 at a position corresponding to the through hole 5 of the cup body 1, and the mounting hole 8 has a stator 9a of a pulse control motor 9 constituting driving means. Is fitted and fixed.

The stator 9a has a cylindrical shape, and a cylindrical rotor 9b is rotatably fitted therein. A cylindrical connecting body 11 is provided on the upper end surface of the rotor 9b.
Are fixed integrally by joining the lower end surfaces. A flange 11a having a diameter larger than the inner diameter of the stator 9a is formed on the lower end surface of the connecting body 11. The flange 11a is slidably joined to the upper end surface of the stator 9a, thereby preventing the rotor 9a from falling off the stator 9b without preventing the rotation of the rotor 9b. I have.

The connecting body 11 is provided with the through hole 5 of the cup body 1.
From the inside, and a disk-shaped rotating body 12
Is attached and fixed. As shown in FIG. 1, the rotating body 12 has a double plate structure in which a lower plate 13a and an upper plate 13b are joined, and a through hole 14 is formed at the center thereof.

An annular wall 3b protrudes from the periphery of the through hole 5 of the lower cup 3, and an outer peripheral surface of the rotating body 12 is an annular wall having an inner peripheral surface facing the outer peripheral surface of the annular wall 3b. A labyrinth structure is provided to prevent the cleaning liquid from flowing to the lower surface of the rotating body 12 on these annular walls 3b, 12a.

On the upper surface of the rotating body 12, six bosses 15 are provided at predetermined intervals in the circumferential direction, in this embodiment, at 60 ° intervals.
Is protruding. A sliding bearing 16 is fitted in the boss 15, and a holding member 17 is rotatably inserted and supported in the sliding bearing 16.

As shown in FIG. 1, the holding member 17 has an upper portion formed on a large-diameter portion 18 having substantially the same diameter as the outer diameter of the boss portion 15. The shaft 19 to be supported is integrally formed. A conical support pin 21 protrudes from the upper surface of the large-diameter portion 18 at the center, and an inverted tapered lock pin 22 protrudes from an eccentric position which is a radial peripheral portion.

On the support pins 21 of the six holding members 17, the semiconductor wafer U is placed with its lower surface supported. In this state, as shown in FIG. 3, the lock pins 22 contact the outer peripheral surface of the semiconductor wafer U, so that the semiconductor wafer U is integrally held with the rotating body 12. As will be described later, when the rotating member 12 rotates (revolves), the holding member 17 rotates (rotates) from the state indicated by X in FIG. 17, the semiconductor wafer U is eccentrically rotated with respect to the rotation center of the semiconductor wafer U.
Is released.

As shown in FIG. 1, the lower end of each shaft 19 of the holding member 17 protrudes from the lower surface of the rotating body 12, and a child gear 23 composed of a sector gear is fitted and fixed to the lower end thereof. Each child gear 23 meshes with a parent gear 25 made of a spur gear provided rotatably by a bearing 24 on the outer peripheral surface of the connecting body 11. As shown in FIG. 3, the main gear 25 has six protrusions 2 at intervals corresponding to the six child gears 23.
5a are formed at predetermined intervals in the circumferential direction.
A tooth meshing with the above-mentioned child gear 23 is formed on the outer peripheral surface of the distal end of a.

A torsion coil spring 26 as an urging means is mounted on the outer peripheral surface of the connecting body 11. This torsion coil spring 26 has one end engaged with the connecting body 11,
By engaging the other end with the master gear 25, the master gear 25 is urged in the rotational direction (counterclockwise) indicated by the arrow A in FIG. As a result, the child gear 23 is urged clockwise as indicated by an arrow B in FIG.
The lock member 22 is eccentrically rotated toward the center of the rotating body 12 and abuts on the outer peripheral surface of the semiconductor wafer U.

The semiconductor wafer U by the lock pin 22
Is released by a release mechanism 31 shown in FIG. The release mechanism 31 has a release cylinder 32 with a guide. The release cylinder 32 is attached to the other end of a substantially L-shaped bracket 33 having one end fixed to the lower end surface of the stator 9a with its axis perpendicular to the other end.

The lower end of an arm 35 is connected to the drive shaft 34 of the release cylinder 32. The upper end of the arm 35 extends through the insertion hole 7a formed in the base 7 and extends to the vicinity of the lower surface side of the parent gear 25, and a release pin 36 stands vertically at the upper end thereof. Have been.

As shown in FIG. 3, when the lock pins 22 of the holding member 17 are in contact with the outer peripheral surface of the semiconductor wafer U and the semiconductor wafer U is held, the release cylinder 32 operates to drive the drive shaft. When the arm 34 is driven in the projecting direction and the arm 35 is linked to the movement, the arm 3
A release pin 36 provided at the upper end of the lock 5 engages the side surface of one of the protrusions 25a of the master gear 25, and prevents the master gear 25 from rotating in the direction of arrow A.

When the rotation of the master gear 25 in the direction of arrow A is prevented by the release pin 36, the pulse control motor 9 is driven to rotate the rotor 9b in the direction of arrow C shown in FIG. , The rotating body 12 is a torsion coil spring 26.
Rotate together with the connecting body 11 against the urging force.

When the rotating body 12 is rotated by an angle θ in the direction of arrow C, the parent gear 25 does not rotate integrally with the rotating body 12, and only the rotating body 12 rotates by an angle θ together with the rotor 9b. As a result, the child gear 23 meshed with the parent gear 25 revolves while revolving with the rotating body 12, so that the holding member 17 provided integrally with the child gear 23 is provided.
Rotates counterclockwise, which is the opposite direction to the direction of arrow B. As a result, the holding member 17 changes from the state indicated by X in FIG. 3 to the state indicated by Y, and the lock pins 22 rotate eccentrically in a direction away from the outer peripheral surface of the semiconductor wafer U. The holding state is released.

A gage 37 is provided on the lower end face of the rotor 9b as shown in FIG. 2, and this gage 37 is detected by a sensor 38 provided on the lower end face of the stator 9a. You. The position at which the sensor 38 detects the gauge 37 is recognized as the origin of the rotation angle of the rotor 9b, and the rotation angle of the rotor 9b is controlled based on the recognition.

A hollow fixed shaft 41 is inserted inside the rotor 9b. The lower end of the fixed shaft 41 is fitted and fixed in a mounting hole 42a of a support member 42 arranged below the pulse control motor 9. The support member 42
, A brake cylinder 43 is attached with its axis vertical. A brake shaft 45a is attached to a drive shaft 44 of the brake cylinder 43.

When the brake cylinder 43 is operated and its drive shaft 44 is driven in the upward direction, the brake cylinder
Reference numeral 45a presses against a brake disk 45b provided on the lower end surface of the rotor 9b to prevent the rotation of the rotor 9b.

That is, when the restoring force of the torsion coil spring 26 is applied to the rotor 9b,
2 is rotated by an angle θ in the direction of arrow C by the pulse control motor 9 against the urging force of the torsion coil spring 26, and the locked state of the semiconductor wafer U by the lock pin 22 is released. For example, in the event of a power failure, the pulse control motor 9
Even if the driving force of the torsion coil spring 26 disappears, the rotating body 12 is prevented from returning in the direction opposite to the arrow C by the restoring force of the torsion coil spring 26.

The semiconductor wafer U by the lock pins 22
In the state where the locked state is released, the processed semiconductor wafer U is unloaded from the rotating body 12 or an unprocessed semiconductor wafer U is supplied by a robot (not shown).

Therefore, the semiconductor wafer U
Even if a power failure or the like occurs during unloading and supply of the rotating body, the rotating body 12 does not rotate and return in the direction opposite to the direction of the arrow C due to the restoring force of the torsion coil spring 26. The position of the holding member 17 does not change.

Therefore, the arm of the robot introduced from between the holding members 17 to the lower surface side of the semiconductor wafer U collides with the holding members 17 due to the brake cylinder 43 at the time of a power failure, and the semiconductor wafer U is unloaded. In addition, it is possible to prevent the supply operation from being disabled.

The upper end of the fixed shaft 41 is
Through the through hole 14. A nozzle head 46 is fitted and fixed to the upper end of the fixed shaft 41. The nozzle head 46 protrudes from the upper surface side of the rotating body 12, and has an outer peripheral portion provided with an annular wall 47 protruding from the periphery of the through hole 14.
Is formed on the lower surface thereof. That is, a labyrinth structure is formed by the annular wall 47 and the annular groove 48, and the cleaning liquid or the like scattered on the upper surface side of the rotating body 12 flows out of the cup body 1 along the fixed shaft 41 through the through hole 14. Has been prevented.

A first nozzle hole 51 is formed in the center of the nozzle head 46, and three second nozzle holes 52 are formed around the first nozzle hole 51. A first supply tube 53 for supplying a gas for drying such as nitrogen is connected to a lower end of the first nozzle hole 51, and a second supply tube 53 for supplying a cleaning liquid to the second nozzle hole 52. 2
Supply tube 54 is connected. These tubes 53 and 54 pass through the inside of the fixed shaft 41 and are led out to the outside, and are connected to supply sources (not shown).

At the upper end of the second nozzle hole 52, a lower cleaning nozzle 55 for setting the jetting direction and spreading angle of the cleaning liquid is attached. Gases and liquids are jetted from the first and second nozzle holes 51, 51 toward the lower surface of the semiconductor wafer U held by the holding member 17. Thereby, the lower surface of the semiconductor wafer U can be cleaned or dried.

Although not shown, an upper drying nozzle and an upper cleaning nozzle for drying and cleaning the upper surface are arranged on the upper surface side of the semiconductor wafer U. Further, a turbulence prevention cover 56 is provided on the upper surface side of the rotating body 12. The turbulence prevention cover 56 is located on the lower surface side of the semiconductor wafer U held by the holding member 17,
A first opening 57 exposing an upper portion of the holding member 17 is formed in a peripheral portion, and the nozzle head 46 is formed in a central portion.
A second opening 58 exposing each of the nozzle holes 51 and 52 is formed.

The rotator 1 is rotated by the turbulence prevention cover 56.
2, the upper surface of the uneven shape is covered. As a result, the generation of turbulent flow due to the rotation of the rotating body 12 is suppressed, so that the cleaning liquid containing dust that has cleaned the semiconductor wafer U scatters in all directions in the cup body 1, for example, on the lower surface side of the semiconductor wafer U It is designed to be able to prevent fluttering and sticking. In particular, when the distance between the upper surface of the turbulence prevention cover 56 and the lower surface of the semiconductor wafer U is set to a predetermined distance, the effect of suppressing turbulence increases.

Next, a case where the semiconductor wafer U is cleaned by the spin processing apparatus having the above configuration will be described with reference to FIGS. Rotating body 12 of semiconductor wafer U
Before the supply, the lock pin 22 of the holding member 17 is in an unlocked state. That is, the release cylinder 32
When the release pin 36 is engaged with the side surface of the projection 25a of the master gear 25, the rotating body 12 is rotated by the pulse control motor 9 in the direction indicated by arrow C in FIG.
Is rotated by an angle θ against the urging force of As a result, the holding member 17 is rotated, so that the lock pin 22 is eccentrically rotated. is there.

When the lock pin 22 is in the unlocked state, an unprocessed semiconductor wafer U is supplied to the rotating body 12 through the arm between the holding members 17 by an unillustrated robot. That is, the arm holding the semiconductor wafer U enters the upper surface of the rotating body 12 and then descends, passes the semiconductor wafer U from the arm to the support pins 21, and then retreats to supply the semiconductor wafer U. Is completed.

When the semiconductor wafer U is supplied, the brake cylinder 43 is operated, and the brake 45a presses against the brake disk 45b to prevent the rotation of the rotor 9b. Therefore, even if a power failure or the like occurs during the supply of the semiconductor wafer U, the rotation of the rotor 9b in the direction opposite to the arrow C direction due to the restoring force of the torsion coil spring 26 is prevented.

Therefore, the rotation angle of the rotating body 12 is kept constant by the brake cylinder 43.
Even if a power failure or the like occurs and the driving force of the pulse control motor 9 is lost, the rotating body 12 rotates and the arm of the robot collides with the holding member 17 and the semiconductor wafer U cannot be supplied. Absent.

When the semiconductor wafer U is supplied to the rotating body 12, the driving of the release cylinder 32 is released, and the release pin 36 is released.
From the projection 25a of the parent gear 25. As a result, the parent gear 25 is rotated in the direction of arrow A by the urging force of the torsion coil spring 26.
3 is rotated together with the holding member 17 in the direction of arrow B.

When the holding member 17 rotates in the direction of arrow B,
Since the lock pin 22 provided on the holding member 17 rotates eccentrically in a direction in which it comes into contact with the outer peripheral surface of the semiconductor wafer U,
The semiconductor wafer U is held by the lock pins 22.

When the semiconductor wafer U is held by the lock pins 22, the drive of the brake cylinder 43 is released, and the rotation prevention state of the rotor 9b by the brake 45a is also released. Then, the pulse control motor 9 is operated to rotate the rotating body 12 at a high speed, and the upper and lower surfaces of the semiconductor wafer U are supplied by supplying the cleaning liquid to the upper surface of the semiconductor wafer U and the lower surface as necessary. Can be washed.

A turbulence prevention cover 56 is provided on the lower surface side of the semiconductor wafer U so that even if the rotating body 12 rotates at a high speed,
Turbulence is prevented from being generated by the uneven shape on the upper surface. Therefore, since the cleaning liquid containing the dust after cleaning the semiconductor wafer U is smoothly discharged from the discharge pipe 6, it is prevented that the cleaning liquid soars in the cup body 1 and adheres again to the semiconductor wafer U.

When the cleaning of the semiconductor wafer U is completed,
The drying process is performed by high-speed rotation while supplying a drying gas to the upper and lower surfaces. When the drying process has been completed, the rotation of the rotating body 12 is stopped, and then the sensor 38
The rotating body 12 is pulse-driven to the origin position at which 7 is detected. When the rotating body 12 is rotated to the origin position, the release cylinder 32 is operated to engage the release pin 36 with the side surface of the convex portion 25 a of the master gear 25.

Next, the rotor 9b of the pulse control motor 9
Is rotated by a predetermined number of pulses, and the rotating body 12 is rotated by an angle θ in the direction of arrow C against the urging force of the torsion coil spring 26. That is, by stopping the rotation of the master gear 25 with the release pin 36 and rotating only the rotating body 12, the rotating body 12 can be rotated against the biasing force of the torsion coil spring 26.

Thus, the child gear 23 meshed with the parent gear 25 revolves with the rotating body 12 while revolving.
Since the holding member 17 rotates in the direction opposite to the arrow B in conjunction with the rotation, the locked state of the semiconductor wafer U by the lock pin 22 is released.

When the locked state of the semiconductor wafer U is released, the brake cylinder 43 is operated to rotate the rotor 9b.
Is fixed, and the rotating body 12 is prevented from rotating in the direction opposite to the arrow C direction by the restoring force of the torsion coil spring 26,
The processed semiconductor wafer U in the cup body 1 is taken out of the rotating body 12 by a robot (not shown).

When the processed semiconductor wafer U is taken out of the rotating body 12, the unprocessed semiconductor wafer U is supplied, and the above-described steps are repeated to perform the cleaning process and the drying process of the semiconductor wafer U. Can be.

According to the spin processing apparatus having the above-described configuration, the unlocked state of the semiconductor wafer U supplied to the rotating body 12 and held by the lock pins 22 is released by driving the release pins 36 by the release cylinder 32 and the parent gear. 25, the rotating body 12 can be rotated by the pulse control motor 9 for driving the rotating body 12 to rotate against the biasing force of the torsion coil spring 26.

That is, since the locked state of the semiconductor wafer U can be released by using the pulse control motor 9 for rotatingly driving the rotating body 12, the number of parts can be reduced by that much, and thereby the number of parts can be reduced. The size and cost of the entire device can be reduced.

Since the above-described pulse control motor 9 has a stator 9a and a rotor 9b formed in a cylindrical shape,
It can be provided coaxially with the rotating body 12. Therefore, since the pulse control motor 9 can be arranged without protruding outward in the radial direction of the rotating body 12, the size of the apparatus can be reduced.

Further, since the stator 9a and the rotor 9b are cylindrical, the fixed shaft 41 passes through the inside of the rotor 9b, and the upper end thereof protrudes from the through hole 14 of the rotating body 12 to the upper surface side. A nozzle head 46 can be mounted. This nozzle head 46 faces the lower surface of the semiconductor wafer U.

Therefore, by providing the lower cleaning nozzle 55 in the nozzle head 46 or forming the first nozzle hole 51 for supplying the drying gas, the semiconductor wafer U
A cleaning liquid or a gas for drying can be sprayed on the lower surface of the device.

[0066]

According to the first aspect of the present invention, if the release means is engaged with the parent gear and rotation of the parent gear is prevented,
By actuating driving means for rotating and driving the rotating body and rotating the rotating body by a predetermined angle, the holding means holding the work is biased in the direction of holding the work. It is now possible to rotate against the power.

Therefore, the locked state of the work by the lock pin provided on the holding means can be released by using the driving means for rotatingly driving the rotating body. Can be simplified.

According to the second aspect of the invention, the locked state of the work by the lock pin is released, and an unprocessed work is supplied to the rotating body by a robot or the like, or the processed work is supplied to the rotating body. Even if a power failure occurs during the removal of the brakes and the driving force of the driving means is lost, the braking means can prevent the rotating body from rotating with the restoring force of the urging means. It is possible to prevent the robot from hitting the holding member provided on the rotating body so that the robot cannot supply or take out the work.

According to the third aspect of the present invention, the rotor of the driving means has a hollow shaft shape, and a rotating body having a through hole formed in the center at the upper end thereof is attached, so that the washing nozzle is arranged in the through hole. Therefore, the lower surface of the work held by the rotating body can be cleaned.

Further, since the rotating body and the driving means can be provided coaxially, the size of the entire apparatus can be reduced as compared with the case where the driving means is arranged radially outward of the rotating body.

According to the fourth aspect of the present invention, a turbulence prevention cover for covering the upper surface of the rotating body is provided on the upper surface side of the rotating body and on the lower surface side of the work. Cover
Therefore, even if the upper surface of the rotating body has an uneven shape, it is possible to prevent turbulence from occurring when the rotating body rotates at a high speed due to the shape.

For this reason, for example, when the work is cleaned, it is possible to prevent the cleaning liquid containing dust from being randomly scattered in all directions in the cup body and reattaching to the upper and lower surfaces of the work.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view of a part of a rotating body according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view showing the entire configuration.

FIG. 3 is a plan view of the rotator from which a turbulence prevention cover is removed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Cup body 9 ... Pulse control motor (driving means, release means) 9a ... Stator 9b ... Rotator 12 ... Rotating body 14 ... Through hole 17 ... Holding member 21 ... Support pin 22 ... Lock pin 23 ... Child gear 25: lead gear 26: torsion coil spring (biasing means) 31: release mechanism (release means) 43: brake cylinder (brake means) 45a: brake kish (brake means) 45b: shake -Disc (Brake means) 56 ... Turbulence prevention cover-

Claims (4)

[Claims] 1. A spin processing apparatus for processing by holding and rotating a work, comprising: a cup body; a rotating body disposed in the cup body; a driving means for rotating and driving the rotating body; A support pin is provided at a radially peripheral portion of the rotating body so as to be rotatable at predetermined intervals in a circumferential direction and supports a peripheral portion of a lower surface of the work at an upper end thereof and eccentrically rotates to hold the peripheral portion of the work. A plurality of holding members provided with lock pins for locking, a main gear rotatably provided on the lower surface side of the rotator with respect to the rotator, and a lower gear of each holding member meshing with the main gear, respectively. A biasing means for elastically biasing the holding member via the master gear and the slave gear in a rotational direction in which the lock pin holds a peripheral portion of the work; The parent gear engages with the parent gear, and this parent gear The rotation pin is rotated by the driving means against the urging force of the urging means applied to the holding member while the rotation of the master gear is prevented and the lock pin is prevented from rotating. And a canceling means for canceling the holding state of the work. 2. A brake means for preventing the rotating body from rotating with the restoring force of the urging means when the work holding state by the lock pin is released. The spin processing device according to claim 1, wherein 3. The driving means comprises a hollow stator and a hollow shaft rotor rotatably provided inside the stator, wherein the rotating body is attached to an upper end of the rotor. And a through hole is formed in the center thereof, and a cleaning nozzle for ejecting a cleaning liquid toward the lower surface of the work held by the holding member of the rotating body is disposed in the through hole. The spin processing device according to claim 1, wherein: 4. A turbulence prevention cover for covering the upper surface of the rotating body is provided on the upper surface side of the rotating body and on the lower surface side of the work held by the holding member. The spin processing device according to claim 1, wherein: