JPH1034526A - Mirror polishing method of circular rod - Google Patents
Mirror polishing method of circular rodInfo
- Publication number
- JPH1034526A JPH1034526A JP22431996A JP22431996A JPH1034526A JP H1034526 A JPH1034526 A JP H1034526A JP 22431996 A JP22431996 A JP 22431996A JP 22431996 A JP22431996 A JP 22431996A JP H1034526 A JPH1034526 A JP H1034526A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- platen
- round bar
- rotary
- load
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この考案は表面粗さ、真円度、円
筒度、直径相互差等、高精度を必要とする円棒部品、主
に回転機主軸やコロ軸受けコロ、ニードルベアリングの
転動体等の外周面を研磨する方法に関するものである。This invention is intended for circular rod parts requiring high accuracy such as surface roughness, roundness, cylindricity, diameter difference, etc., mainly for rotating machine spindles, roller bearing rollers, and needle bearings. The present invention relates to a method for polishing an outer peripheral surface of a moving body or the like.
【0002】[0002]
【従来の技術】従来の円棒部品は材質が金属製で研磨
は、固定砥粒砥石を使ったセンターレス研磨機で行われ
ていた。近年、材質が金属より軽く、耐磨耗性に優れて
いるセラミック製の円棒部品が要求されるようになって
来た。高精度の寸法や面粗度を得るには、砥粒が微細な
砥石で研磨する必要があるが、硬いセラミックの研磨で
は、砥石の砥粒粒度を細かくすると充分な切り込み量が
得られず、砥石が逃げてしまい精度の良いものが得られ
なかつた。2. Description of the Related Art Conventional round bar parts are made of metal and polished by a centerless polishing machine using fixed abrasive grains. In recent years, there has been a demand for a ceramic rod part which is lighter in material than metal and has excellent wear resistance. In order to obtain high-precision dimensions and surface roughness, abrasive grains need to be polished with a fine grindstone, but in the case of hard ceramic polishing, if the abrasive grain size of the grindstone is made fine, a sufficient cutting amount can not be obtained, The whetstone escaped and a high-precision one could not be obtained.
【0003】[0003]
【考案が解決しょうとする課題】そこで、固定砥粒研磨
方法のセンターレス研磨機研磨から遊離砥粒研磨方法の
ラッピング研磨機で研磨することを考えた。しかし、従
来のラッピング研磨機は、平面の研磨を目的としている
ため、円棒の研磨では、回転定盤と被加工物の摩擦抵抗
力だけで円棒を自転させる、連れ廻りのため円棒が止ま
ったり、転がったりの繰り返しで研磨されてゆく為、均
一に研磨されず多角形に研磨されてしまい充分な真円
度、円筒度の精度を得ることが出来なかった。この考案
は、そのような欠点を除くために考えたものである。Therefore, it has been considered that the polishing is performed by a lapping polishing machine of a free abrasive polishing method from a centerless polishing machine of a fixed abrasive polishing method. However, since the conventional lapping grinder is intended for polishing a flat surface, in the polishing of a circular bar, the circular bar is rotated only by the frictional resistance between the rotating platen and the workpiece, and the circular bar is rotated due to the rotation. Since the polishing was repeated by stopping and rolling, the polishing was not performed uniformly, but was performed in a polygonal shape, and sufficient roundness and cylindricity could not be obtained. The present invention is designed to eliminate such disadvantages.
【0004】[0004]
【課題を解決するための手段】回転定盤(2)の半径面
上でキャリア(5)等が円棒(1)を公転させるラッピ
ング機において、荷重定盤(3)が回転定盤(2)と同
じ回転方向となる、円棒(1)が接している回転定盤
(2)の外周部位(A)又は内周部位(B)で、荷重定
盤(3)の回転周速が、回転定盤(2)の回転周速より
速くする。逆に、荷重定盤(3)の回転が、回転定盤
(2)より周速が遅い場合、円棒(1)の自転がりが止
まつた状態が出来る為、真円に研磨されない。SUMMARY OF THE INVENTION In a lapping machine in which a carrier (5) or the like revolves a circular bar (1) on a radial surface of a rotating platen (2), a load platen (3) is used as a rotating platen (2). ) At the outer peripheral portion (A) or the inner peripheral portion (B) of the rotary platen (2) in contact with the circular rod (1), which has the same rotational direction as the rotational speed of the load platen (3), The rotation speed is higher than the rotation peripheral speed of the rotation platen (2). Conversely, when the rotation of the load platen (3) is slower than the peripheral speed of the rotation platen (2), the rotation of the circular rod (1) is stopped, so that it is not polished to a perfect circle.
【0005】[0005]
【作用】円棒(1)が回転定盤(2)の半径面上を公転
する間、常に回転定盤(2)と荷重定盤(3)の周速差
が円棒(1)に自転の転がり力を与え、円棒(1)の自
転が止まることは無い。この間に、円棒(1)と遊離砥
粒を介した回転定盤(2)との摺動により円棒(1)の
外周が研磨される。平面のでた回転定盤(2)と平面の
でた荷重定盤(3)の間で、円棒(1)が転がり、凸部
が強く、早く研磨される為、直径差が無くなり真円に近
づいてくる。[Function] While the circular bar (1) revolves on the radial surface of the rotary platen (2), the peripheral speed difference between the rotary platen (2) and the load platen (3) always rotates on the circular plate (1). And the rotation of the circular rod (1) does not stop. During this time, the outer circumference of the circular rod (1) is polished by sliding between the circular rod (1) and the rotary platen (2) via loose abrasive grains. The circular plate (1) rolls between the rotating platen (2) and the load platen (3), and the convex portion is strong and is polished quickly. Come.
【0006】[0006]
実施例1 図面1は実施例1を示す斜視断面図である。ラッピング
研磨機で回転定盤(2)の半径面上に修正リング(4)
を置き、その中に円棒(1)を回転定盤(2)の半径面
上で公転させる様に配置する為に円盤を円棒(1)が入
るサイズに等間隔で切り抜いたキャリア(5)置く。円
棒(1)をキャリア(5)の切り抜いた穴に配置する。
荷重定盤(3)を円棒(1)の上に乗せる。回転定盤
(2)を左回りに、荷重定盤(3)も左回りに定速度で
回転させる。この時に荷重定盤(3)の円棒(1)が接
している面の周速が、回転定盤(2)の円棒(1)が接
している外周部位(A)の周速より速くする。円棒
(1)に下の回転定盤(2)と荷重定盤(3)の周速の
差により一方向の回転力を常に強制されるため円棒
(1)の回転が止まること無く研磨されて真円になる。
研磨途中の一定時間に、円棒(1)をキャリア(5)か
ら取り出して、キャリア内で配置の入れ替えを繰り返す
ことに依り、円棒(1)の直径相合差を0に近づけるこ
とがが出来る。センターレス粗研磨品をラッピング研磨
機で砥粒6μmダイヤモンドスラリーで加工後、中仕上
げを3μmダイヤモンドスラリーで、仕上げ研磨を1μ
mダイヤモンドスラリーを使って研磨した。First Embodiment FIG. 1 is a perspective sectional view showing a first embodiment. Fixing ring (4) on radial surface of rotating platen (2) with lapping grinder
And a carrier (5) in which the disk (1) is cut out at equal intervals in order to arrange the disk (1) so that it revolves on the radial surface of the rotary platen (2). )Put. Place the rod (1) in the cut out hole of the carrier (5).
Place the load platen (3) on the circular bar (1). The rotating platen (2) is rotated counterclockwise, and the load platen (3) is also rotated counterclockwise at a constant speed. At this time, the peripheral speed of the surface of the load platen (3) in contact with the circular bar (1) is faster than the peripheral speed of the outer peripheral portion (A) of the rotary platen (2) with which the circular bar (1) is in contact. I do. The rotating force in one direction is always forced by the difference between the peripheral speeds of the rotating platen (2) and the load platen (3) below the circular plate (1), so the rotation of the circular plate (1) is stopped and polished. It becomes a perfect circle.
By taking out the circular rod (1) from the carrier (5) at a certain time during the polishing, and repeatedly changing the arrangement in the carrier, it is possible to make the diameter phase difference of the circular rod (1) close to zero. . After processing the centerless rough polished product with a 6μm diamond slurry using a lapping polisher, the medium finish is 3μm diamond slurry and the final polishing is 1μ.
Polished using diamond slurry.
【0007】実施例2 図面2は実施例2を示す斜視断面図である。回転定盤
(2)の回転方向は、実施例(1)と同様左回りである
が、荷重定盤(3)が右回りの場合である。この場合
は、回転方向が同一となる回転定盤(2)の内径部位
(B)で荷重定盤(3)の回転周速が回転定盤(2)の
回転周速より速くする。Second Embodiment FIG. 2 is a perspective sectional view showing a second embodiment. The rotation direction of the rotary platen (2) is counterclockwise as in the embodiment (1), but the load platen (3) is clockwise. In this case, the rotation peripheral speed of the load platen (3) is higher than the rotation peripheral speed of the rotation platen (2) at the inner diameter portion (B) of the rotation platen (2) where the rotation direction is the same.
【0008】[0008]
【発明の効果】この考案に係るラッピング研磨方法で外
径φ7長さ19.5のアルミナセラミック質円棒を加工
した結果、真円度0.8μm、円筒度が0.8μm、直
径の相互差1μm以下、表面粗さ0.02Raとコロ軸
受け用コロの超精密級の精度を得ることが出来た。As a result of processing an alumina ceramic rod having an outer diameter of φ7 and a length of 19.5 by the lapping polishing method according to the present invention, the circularity is 0.8 μm, the cylindricity is 0.8 μm, and the difference between the diameters is 0.8 μm. It was possible to obtain an accuracy of 1 μm or less, a surface roughness of 0.02 Ra, and an ultraprecision grade of rollers for roller bearings.
【図1】実施例1を示す斜視断面図である。FIG. 1 is a perspective sectional view showing a first embodiment.
【図2】実施例2を示す斜視断面図である。FIG. 2 is a perspective sectional view showing a second embodiment.
1 円棒 2 回転定盤 3 荷重定盤 4 修正リング 5 キャリア A 回転定盤の円棒が接する外周部位 B 回転定盤の円棒が接する内周部位 DESCRIPTION OF SYMBOLS 1 Circular bar 2 Rotating surface plate 3 Load surface plate 4 Correction ring 5 Carrier A Outer peripheral region where circular disk of rotating surface plate contacts B Inner peripheral region where circular plate of rotating surface plate contacts
Claims (1)
(5)等が円棒(1)を公転させるラッピング機におい
て、荷重定盤(3)が回転定盤(2)と同じ回転方向と
なる、円棒(1)が接している回転定盤(2)の外周部
位(A)又は内周部位(B)で、荷重定盤(3)の回転
周速が、回転定盤(2)の回転周速より速くすることを
特徴とする。1. A wrapping machine in which a carrier (5) or the like revolves a circular rod (1) on a radial surface of a rotary platen (2), wherein a load platen (3) has the same rotation as the rotary platen (2). At the outer peripheral portion (A) or inner peripheral portion (B) of the rotating platen (2) in contact with the circular bar (1), the rotating peripheral speed of the load platen (3) is It is characterized in that it is faster than the rotational peripheral speed of 2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22431996A JPH1034526A (en) | 1996-07-23 | 1996-07-23 | Mirror polishing method of circular rod |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22431996A JPH1034526A (en) | 1996-07-23 | 1996-07-23 | Mirror polishing method of circular rod |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1034526A true JPH1034526A (en) | 1998-02-10 |
Family
ID=16811896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22431996A Pending JPH1034526A (en) | 1996-07-23 | 1996-07-23 | Mirror polishing method of circular rod |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1034526A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005239534A (en) * | 2004-01-28 | 2005-09-08 | Mino Ceramic Co Ltd | Method for producing ceramic sliding member |
| JP2013532548A (en) * | 2010-07-29 | 2013-08-19 | ボストン サイエンティフィック ニューロモデュレイション コーポレイション | System and method for making and using an electrical stimulation system having a multi-lead element lead body |
| CN116872077A (en) * | 2023-07-17 | 2023-10-13 | 重庆川仪自动化股份有限公司 | How to grind the outer circle of sapphire rod |
| CN117583830A (en) * | 2023-11-06 | 2024-02-23 | 光微半导体材料(宁波)有限公司 | A kind of copper sputtering target processing technology |
-
1996
- 1996-07-23 JP JP22431996A patent/JPH1034526A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005239534A (en) * | 2004-01-28 | 2005-09-08 | Mino Ceramic Co Ltd | Method for producing ceramic sliding member |
| JP2013532548A (en) * | 2010-07-29 | 2013-08-19 | ボストン サイエンティフィック ニューロモデュレイション コーポレイション | System and method for making and using an electrical stimulation system having a multi-lead element lead body |
| US9238132B2 (en) | 2010-07-29 | 2016-01-19 | Boston Scientific Neuromodulation Corporation | Systems and methods for making and using electrical stimulation systems having multi-lead-element lead bodies |
| CN116872077A (en) * | 2023-07-17 | 2023-10-13 | 重庆川仪自动化股份有限公司 | How to grind the outer circle of sapphire rod |
| CN117583830A (en) * | 2023-11-06 | 2024-02-23 | 光微半导体材料(宁波)有限公司 | A kind of copper sputtering target processing technology |
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