JPH1036415A - Ultraviolet-curing heat-ray-shielding resin composition and film coated with the composition - Google Patents
Ultraviolet-curing heat-ray-shielding resin composition and film coated with the compositionInfo
- Publication number
- JPH1036415A JPH1036415A JP8214022A JP21402296A JPH1036415A JP H1036415 A JPH1036415 A JP H1036415A JP 8214022 A JP8214022 A JP 8214022A JP 21402296 A JP21402296 A JP 21402296A JP H1036415 A JPH1036415 A JP H1036415A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- meth
- resin
- acrylate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 31
- 239000000203 mixture Substances 0.000 title abstract description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 31
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 12
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 12
- SOLUNJPVPZJLOM-UHFFFAOYSA-N trizinc;distiborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-][Sb]([O-])([O-])=O.[O-][Sb]([O-])([O-])=O SOLUNJPVPZJLOM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920000642 polymer Polymers 0.000 claims abstract description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 5
- 239000011230 binding agent Substances 0.000 claims abstract description 5
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 4
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 4
- 239000011164 primary particle Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 19
- 239000002270 dispersing agent Substances 0.000 claims description 8
- 239000010419 fine particle Substances 0.000 claims description 8
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 125000002091 cationic group Chemical group 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 239000002245 particle Substances 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 238000002834 transmittance Methods 0.000 abstract description 4
- 239000000178 monomer Substances 0.000 abstract description 3
- 238000006116 polymerization reaction Methods 0.000 abstract description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 2
- 229910001111 Fine metal Inorganic materials 0.000 abstract 2
- 239000002923 metal particle Substances 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- -1 2-hydroxypropyl Chemical group 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000004094 surface-active agent Substances 0.000 description 6
- 238000005299 abrasion Methods 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 239000002250 absorbent Substances 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 4
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910007657 ZnSb Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- CZJCMXPZSYNVLP-UHFFFAOYSA-N antimony zinc Chemical compound [Zn].[Sb] CZJCMXPZSYNVLP-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001983 poloxamer Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- ZSVFYHKZQNDJEV-UHFFFAOYSA-N (2,3,4-tribromophenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(Br)C(Br)=C1Br ZSVFYHKZQNDJEV-UHFFFAOYSA-N 0.000 description 1
- BUPRYTFTHBNSBD-UHFFFAOYSA-N (2,3,4-tribromophenyl) prop-2-enoate Chemical compound BrC1=CC=C(OC(=O)C=C)C(Br)=C1Br BUPRYTFTHBNSBD-UHFFFAOYSA-N 0.000 description 1
- JHVQWALHXJPODC-ALCCZGGFSA-N (z)-2-[2-(2-methylprop-2-enoyloxy)ethyl]but-2-enedioic acid Chemical compound CC(=C)C(=O)OCC\C(C(O)=O)=C\C(O)=O JHVQWALHXJPODC-ALCCZGGFSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- SLMUVSVDXGWVBG-UHFFFAOYSA-N 1,4-dimethylcyclohexa-2,4-diene-1-carboxylic acid Chemical compound CC1=CCC(C)(C(O)=O)C=C1 SLMUVSVDXGWVBG-UHFFFAOYSA-N 0.000 description 1
- YUTHQCGFZNYPIG-UHFFFAOYSA-N 1-[2-(2-methylprop-2-enoyloxy)ethyl]cyclohexane-1,2-dicarboxylic acid Chemical compound CC(=C)C(=O)OCCC1(C(O)=O)CCCCC1C(O)=O YUTHQCGFZNYPIG-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- IJQXJNFUDNCYAX-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;ethane-1,2-diol Chemical compound OCCO.OCC(CO)(CO)CO IJQXJNFUDNCYAX-UHFFFAOYSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- COORVRSSRBIIFJ-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCOCCO COORVRSSRBIIFJ-UHFFFAOYSA-N 0.000 description 1
- LBNDGEZENJUBCO-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethyl]butanedioic acid Chemical compound CC(=C)C(=O)OCCC(C(O)=O)CC(O)=O LBNDGEZENJUBCO-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- LBOWDTAJSXKQTL-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;propane-1,2-diol Chemical compound CC(O)CO.CCC(CO)(CO)CO LBOWDTAJSXKQTL-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- ZAWQXWZJKKICSZ-UHFFFAOYSA-N 3,3-dimethyl-2-methylidenebutanamide Chemical compound CC(C)(C)C(=C)C(N)=O ZAWQXWZJKKICSZ-UHFFFAOYSA-N 0.000 description 1
- UXTGJIIBLZIQPK-UHFFFAOYSA-N 3-(2-prop-2-enoyloxyethyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(CCOC(=O)C=C)=C1C(O)=O UXTGJIIBLZIQPK-UHFFFAOYSA-N 0.000 description 1
- DWTKNKBWDQHROK-UHFFFAOYSA-N 3-[2-(2-methylprop-2-enoyloxy)ethyl]phthalic acid Chemical compound CC(=C)C(=O)OCCC1=CC=CC(C(O)=O)=C1C(O)=O DWTKNKBWDQHROK-UHFFFAOYSA-N 0.000 description 1
- HSPRVWPULGKMRC-UHFFFAOYSA-N 57526-50-8 Chemical compound C12CCCC2C2CC(CO)C1C2 HSPRVWPULGKMRC-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- JNDBLZYQVQNZKC-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.O=C1CCCCCO1 Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.O=C1CCCCCO1 JNDBLZYQVQNZKC-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- UXRNWUYCCQFHIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C UXRNWUYCCQFHIH-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000004700 cobalt complex Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005010 epoxy-amino resin Substances 0.000 description 1
- ZSBOTBREDQGUMM-UHFFFAOYSA-N ethane-1,2-diol;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCCO.CCC(CO)(CO)CO ZSBOTBREDQGUMM-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- ZNAOFAIBVOMLPV-UHFFFAOYSA-N hexadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C(C)=C ZNAOFAIBVOMLPV-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- LSWADWIFYOAQRZ-UHFFFAOYSA-N n-(ethoxymethyl)prop-2-enamide Chemical compound CCOCNC(=O)C=C LSWADWIFYOAQRZ-UHFFFAOYSA-N 0.000 description 1
- NYUSKIVSFXNJTN-UHFFFAOYSA-N n-(hydroxymethyl)prop-2-enamide;prop-2-enamide Chemical compound NC(=O)C=C.OCNC(=O)C=C NYUSKIVSFXNJTN-UHFFFAOYSA-N 0.000 description 1
- ULYOZOPEFCQZHH-UHFFFAOYSA-N n-(methoxymethyl)prop-2-enamide Chemical compound COCNC(=O)C=C ULYOZOPEFCQZHH-UHFFFAOYSA-N 0.000 description 1
- ADTJPOBHAXXXFS-UHFFFAOYSA-N n-[3-(dimethylamino)propyl]prop-2-enamide Chemical compound CN(C)CCCNC(=O)C=C ADTJPOBHAXXXFS-UHFFFAOYSA-N 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- YOTGRUGZMVCBLS-UHFFFAOYSA-N pentadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCOC(=O)C(C)=C YOTGRUGZMVCBLS-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- MILWSGRFEGYSGM-UHFFFAOYSA-N propane-1,2-diol;propane-1,2,3-triol Chemical compound CC(O)CO.OCC(O)CO MILWSGRFEGYSGM-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical group 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は熱線遮断性樹脂組成物及
びそれをコーティングしたフィルムに関し、特に透明感
が良好で且つ耐擦傷性に優れた熱線遮断性樹脂組成物及
びその層構成に関する。更に本発明によれば比較的安価
で加工性が優れ、且つ耐候性が優れた熱線吸収能の高い
フィルムが得られるという特徴がある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat ray-shielding resin composition and a film coated with the same, and more particularly to a heat ray-shielding resin composition having good transparency and excellent scratch resistance and a layer structure thereof. Further, according to the present invention, there is a characteristic that a film which is relatively inexpensive, has excellent workability, and has excellent weather resistance and high heat ray absorbing ability can be obtained.
【0002】[0002]
【従来の技術】熱線遮断性材料は、近年特に研究開発が
盛んに行われている材料であり、赤外領域の波長を有す
る半導体レーザー光等を光源とする感光材料、光ディス
ク用記録材料等の情報記録材料、赤外カットフィルター
あるいは熱線遮断フィルムとして建物の窓、車両の窓等
に利用することができる。2. Description of the Related Art Heat ray shielding materials have been actively researched and developed in recent years, and include photosensitive materials using a semiconductor laser beam having a wavelength in the infrared region as a light source, recording materials for optical disks, and the like. It can be used as an information recording material, an infrared cut filter or a heat ray shielding film for windows of buildings, windows of vehicles, and the like.
【0003】これらの用途に従来、近赤外線吸収性の光
線透過性材料としては、クロム、コバルト錯塩チオール
ニッケル錯体、アンスラキノン誘導体等が知られてい
る。またこの他にアルミニウム、銅などの金属を蒸着し
た熱線反射フィルムが知られている。かかる熱線反射フ
ィルムは可視光を透過するが、近赤外線−赤外線の熱線
を反射するので、ガラス窓等の開口部に適用すると、太
陽光線の熱線あるいは室内からの輻射熱を反射して日照
調整や断熱の効果をを持つ。このような特性を活かして
透明断熱フィルムは、建物の窓、冷凍・冷蔵のショーケ
ース、防熱面、車両用窓、等に利用され、住居環境の向
上や省エネルギーに役立つ。[0003] For these uses, chromium, cobalt complex thiol nickel complex, anthraquinone derivative and the like are conventionally known as a light-transmitting material capable of absorbing near infrared rays. In addition, a heat ray reflective film in which a metal such as aluminum or copper is deposited is known. Such a heat ray reflective film transmits visible light, but reflects near-infrared ray-infrared ray, so when applied to an opening such as a glass window, it reflects sunlight rays or radiant heat from a room to adjust sunlight and heat insulation. With the effect. Utilizing such characteristics, the transparent heat-insulating film is used for windows of buildings, freezer / refrigerated showcases, heat-insulating surfaces, vehicle windows, etc., and is useful for improving the living environment and saving energy.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、従来の
熱線遮断材料は、有機系のものは耐久性が劣り環境条件
の変化や時間の経過とともに初期の熱線遮断効果が劣化
していくという欠点があった。一方錯体系のものは耐久
性はあるが近赤外領域のみならず可視部にも吸収が大き
く、そのものが強く着色しているので用途が限られてし
まうという欠点があった。However, the conventional heat ray shielding material has a drawback that the organic one is inferior in durability and the initial heat ray shielding effect is degraded with changes in environmental conditions and time. Was. On the other hand, the complex type has durability, but has a large absorption not only in the near-infrared region but also in the visible region, and has a drawback that its use is limited because it is strongly colored.
【0005】また従来技術の金属を蒸着した熱線反射フ
ィルムは、熱線のみならず可視光線まで金属蒸着層で反
射するので、窓ガラス等に張り付けると採光性が損なわ
れ、室内が暗くなるという致命的な欠陥があり、また室
外からは反射光による眩しさが避けられないという欠点
もあった。ここにおいて高い可視光線透過率を持ちなが
ら一方で高い熱線を遮断する耐久性のある材料の開発が
望まれていた。[0005] In addition, since the conventional heat-reflective film on which a metal is vapor-deposited reflects not only heat rays but also visible light with a metal vapor-deposited layer, if it is attached to a window glass or the like, its lighting property is impaired and the interior becomes dark. There is also a drawback that there is a technical defect, and glare due to reflected light is unavoidable from outside. Here, it has been desired to develop a durable material having high visible light transmittance while blocking high heat rays.
【0006】さらに、従来技術では熱線吸収剤の皮膜を
形成するために、この熱線吸収剤を固定する樹脂とし
て、主にアクリル系樹脂、ポリエステル樹脂、アルキド
樹脂、ポリウレタン樹脂、エポキシ樹脂、アミノ樹脂、
ビニル樹脂等の熱可塑性樹脂が一般に使用される。しか
しながらこれらの樹脂は皮膜の硬度が弱く傷がつきやす
く耐擦傷性が劣っている。またこれらの樹脂への熱線吸
収剤の分散もしくは溶解作業、あるいはフィルムへの塗
工作業、成型作業は加熱下に行われるために、熱線吸収
剤本体の劣化や、性能劣化が起こり易い欠点を有してい
る。Further, in the prior art, in order to form a film of a heat ray absorbent, resins for fixing the heat ray absorbent are mainly acrylic resins, polyester resins, alkyd resins, polyurethane resins, epoxy resins, amino resins, and the like.
A thermoplastic resin such as a vinyl resin is generally used. However, these resins have low film hardness, are easily scratched, and have poor abrasion resistance. In addition, since the work of dispersing or dissolving the heat ray absorbent in these resins, or the work of coating and molding the film, is performed under heating, there is a disadvantage that the heat ray absorbent body is easily deteriorated and the performance is deteriorated. doing.
【0007】[0007]
【課題を解決するための手段】本発明者は、近赤−遠赤
外領域に吸収がみられ着色が少なくかつ耐久性に優れた
熱線遮断材料について鋭意検討を重ねた結果、一次粒子
径0.5μm以下の金属酸化物、特に無水アンチモン酸
亜鉛のゲル(例えばセルナックスCX−Z(ZnSb2
O6 )日産化学工業(株)製)を紫外線硬化性の樹脂中
に分散せしめたることによって紫外線硬化型の熱線遮断
性の樹脂組成物が得られることを見いだした。またこの
樹脂組成物をフィルム上に塗工した後、紫外線を照射す
ることによって硬化させることによって、容易に、透明
で且つ擦傷性の優れた熱線吸収型のフィルムを得ること
を発見し、本発明を完成した。The inventors of the present invention have conducted intensive studies on a heat ray shielding material which absorbs light in the near-red to far-infrared region, has little coloration, and is excellent in durability. A gel of a metal oxide having a particle size of 0.5 μm or less, particularly anhydrous zinc antimonate (for example, Celnax CX-Z (ZnSb 2
O 6 ) (Nissan Chemical Industry Co., Ltd.) was dispersed in an ultraviolet-curable resin to obtain an ultraviolet-curable heat ray-shielding resin composition. Further, after applying this resin composition on a film and curing it by irradiating ultraviolet rays, it has been found that a heat-absorbing film which is transparent and has excellent scratch resistance can be easily obtained. Was completed.
【0008】本特許で使用される赤外線吸収能のある金
属酸化物としては、無水アンチモン酸亜鉛のゲルが好適
である。無水アンチモン酸亜鉛は可視光部より波長の短
い紫外部にも吸収を持っているので、耐光性向上の効果
も期待できる。さらに無水アンチモン酸亜鉛は、五酸化
アンチモンに起因する難燃助剤としての機能を持ち、こ
れをコーティングすることによって得られるフィルムは
難燃性を有する。五酸化アンチモンの製造法としては例
えば公告特許公報平6−17234や公告特許公報平7
−29773に記載されており、また無水アンチモン酸
亜鉛の製造法は公開特許公報平6−219743に記載
されている方法によって得られる。この無無水アンチモ
ン酸亜鉛の微粒子は例えば、亜鉛化合物とコロイダル酸
化アンチモンを混合、乾燥した後高温で焼成することに
よって得ることができる。これらの金属酸化物は有機溶
媒に分散可能な形態に調整されているものが好ましい。
また可視光領域において吸収が少なく、かつ透明な金属
酸化物含有の皮膜を形成するためには、その一次粒子が
0.5μm以下好ましくは0.1μm以下の超微粒子の
粉末にする必要がある。本特許の樹脂組成物中の熱線遮
断性の金属酸化物の微粒子の含有量は要求される熱線遮
断能に応じて任意に選ぶことが出来るが、樹脂中でこの
粒子が凝集することなく安定に保たれねばならない。As the metal oxide having an infrared absorbing ability used in the present invention, a gel of anhydrous zinc antimonate is preferable. Since anhydrous zinc antimonate also has absorption in the ultraviolet region having a shorter wavelength than the visible light region, an effect of improving light resistance can be expected. Further, anhydrous zinc antimonate has a function as a flame retardant aid caused by antimony pentoxide, and a film obtained by coating it has flame retardancy. As a method for producing antimony pentoxide, for example, published patent publications 6-17234 and 7
And a method for producing anhydrous zinc antimonate can be obtained by the method described in JP-A-6-219743. The fine particles of anhydrous zinc antimonate can be obtained, for example, by mixing a zinc compound and colloidal antimony oxide, drying, and firing at a high temperature. It is preferable that these metal oxides are adjusted to a form that can be dispersed in an organic solvent.
Further, in order to form a transparent metal oxide-containing film with low absorption in the visible light region, it is necessary to form ultrafine powder having primary particles of 0.5 μm or less, preferably 0.1 μm or less. The content of the fine particles of the heat-ray-shielding metal oxide in the resin composition of the present invention can be arbitrarily selected according to the required heat-ray-shielding ability, but the particles are stable without agglomeration in the resin. Must be kept.
【0009】本発明に用いられる活性エネルギー線重合
型(メタ)アクリレ−トとしては、分子内に1個以上の
(メタ)アクリロイル基を有する紫外線もしくは電子線
硬化可能な(メタ)アクリレートから任意に選択でき、
単独もしくは混合して使用することができる。 この
(メタ)アクリレートの具体例としては、2−ヒドロキ
シエチル(メタ)アクリレート、2−ヒドロキシプロピ
ル(メタ)アクリレート、イソブチル(メタ)アクリレ
ート、t−ブチル(メタ)アクリレート、2−エチルヘ
キシル(メタ)アクリレート、ステアリルアクリレー
ト、2−エチルヘキシルカルビトールアクリレート、ω
−カルボキシポリカプロラクトンモノアクリレート、ア
クリロイルオキシエチル酸、アクリル酸ダイマー、ラウ
リル(メタ)アクリレート、2−メトキシエチルアクリ
レート、ブトキシエチルアクリレート、エトキシエトキ
シエチルアクリレート、メトキシトリエチレングリコー
ルアクリレート、メトキシポリエチレングリコールアク
リレート、ステアリル(メタ)アクリレート、シクロヘ
キシル(メタ)アクリレート、テトラヒドロフルフリル
(メタ)アクリレート、N−ビニル−2−ピロリドン、
イソボニル(メタ)アクリレート、ジシクロペンテニル
アクリレート、ベンジルアクリレート、フェニルグリシ
ジルエーテルエポキシアクリレート、フェノキシエチル
(メタ)アクリレート、フェノキシ(ポリ)エチレング
リコールアクリレート、ノニルフェノールエトキシ化ア
クリレート、アクリロイルオキシエチルフタル酸、トリ
ブロモフェニルアクリレート、トリブロモフェノールエ
トキシ化(メタ)アクリレート、メチルメタクリレー
ト、トリブロモフェニルメタクリレート、メタクリロイ
ルオキシエチル酸、メタクリロイルオキシエチルマレイ
ン酸、メタクリロイルオキシエチルヘキサヒドロフタル
酸、メタクリロイルオキシエチルフタル酸、ポリエチレ
ングリコール(メタ)アクリレート、ポリプロピレング
リコール(メタ)アクリレート、β−カルボキシエチル
アクリレート、N−メチロールアクリルアマイド、N−
メトキシメチルアクリルアマイド、N−エトキシメチル
アクリルアマイド、N−n−ブトキシメチルアクリルア
マイド、t−ブチルアクリルアミドスルホン酸、ステア
リル酸ビニル、N−メチルアクリルアミド、N−ジメチ
ルアクリルアミド、N−ジメチルアミノエチル(メタ)
アクリレート、N−ジメチルアミノプロピルアクリルア
ミド、アクリロイルモルホリン、グリシジルメタアクリ
レート、n−ブチルメタアクリレート、エチルメタアク
リレート、メタクリル酸アリル、セチルメタクリレー
ト、ペンタデシルメタアクリレート、メトキシポリエチ
レングリコール(メタ)アクリレート、ジエチルアミノ
エチル(メタ)アクリレート、メタクロイルオキシエチ
ル琥珀酸、ヘキサンジオールジアクリレート、ネオペン
チルグリコールジアクリレート、トリエチレングリコー
ルジアクリレート、ポリエチレングリコールジアクリレ
ート、ポリプロピレングリコーメルジアクリレート、ヒ
ドロキシピバリン酸エステルネオペンチル、ペンタエリ
スリトールジアクリレートモノステアレート、グリコー
ルジアクリレート、2−ヒドロキシエチルメタアクリロ
イルフォスフェート、ビスフェノールAエチレングリコ
ール付加物アクリレート、ビスフェノールFエチレング
リコール付加物アクリレート、トリシクロデカンメタノ
ールジアクリレート、トリスヒドロキシエチルイソシア
ヌレートジアクリレート、2−ヒドロキシ−1−アクリ
ロキシ−3−メタクリロキシプロパン、トリメチロール
プロパントリアクリレート、トリメチロールプロパンエ
チレングリコール付加物トリアクリレート、トリメチロ
ールプロパンプロピレングリコール付加物トリアクリレ
ート、ペンタエリスリトールトリアクリレート、トリス
アクリロイルオキシエチルフォスフェート、トリスヒド
ロキシエチルイソシアヌレートトリアクリレート、変性
ε−カプロラクトントリアクリレート、トリメチロール
プロパンエトキシトリアクリレート、グリセリンプロピ
レングリコール付加物トリアクリレート、ペンタエリス
リトールテトラアクリレート、ペンタエリスリトールエ
チレングリコール付加物テトラアクリレート、ジトリメ
チロールプロパンテトラアクリレート、ジペンタエリス
リトールヘキサ(ペンタ)アクリレート、ジペンタエリ
スリトールモノヒドロキシペンタアクリレート、ウレタ
ンアクリレート、エポキトアクリレート、ポリエステル
アクリレート、不飽和ポリエステルなどがあげられる
が、これらに限定されるものではない。これらのものは
単独もしくは任意に混合使用することができるが、好ま
しくは分子内に(メタ)アクリロイル基を2個以上含有
する多官能(メタ)アクリレートモノマーもしくはオリ
ゴマーが重合後の皮膜が硬く、耐擦傷性が良好で好適で
ある。これら活性エネルギー線重合型(メタ)アクリレ
ートの熱線遮断性樹脂組成物中の樹脂成分に対する割合
は、10重量%以上98重量%以下が良く、より好まし
くは30重量%以上80重量%以下が望ましい。The active energy ray-polymerizable (meth) acrylate used in the present invention may be any one of an ultraviolet ray or electron beam curable (meth) acrylate having at least one (meth) acryloyl group in a molecule. You can choose
They can be used alone or as a mixture. Specific examples of the (meth) acrylate include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate. , Stearyl acrylate, 2-ethylhexyl carbitol acrylate, ω
-Carboxypolycaprolactone monoacrylate, acryloyloxyethyl acid, acrylic acid dimer, lauryl (meth) acrylate, 2-methoxyethyl acrylate, butoxyethyl acrylate, ethoxyethoxyethyl acrylate, methoxytriethylene glycol acrylate, methoxypolyethylene glycol acrylate, stearyl ( (Meth) acrylate, cyclohexyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, N-vinyl-2-pyrrolidone,
Isobonyl (meth) acrylate, dicyclopentenyl acrylate, benzyl acrylate, phenylglycidyl ether epoxy acrylate, phenoxyethyl (meth) acrylate, phenoxy (poly) ethylene glycol acrylate, nonylphenol ethoxylated acrylate, acryloyloxyethyl phthalic acid, tribromophenyl acrylate , Tribromophenol ethoxylated (meth) acrylate, methyl methacrylate, tribromophenyl methacrylate, methacryloyloxyethyl acid, methacryloyloxyethyl maleic acid, methacryloyloxyethyl hexahydrophthalic acid, methacryloyloxyethyl phthalic acid, polyethylene glycol (meth) acrylate , Polypropylene glycol (meth) a Relate, beta-carboxyethyl acrylate, N- methylolacrylamide acrylamide, N-
Methoxymethylacrylamide, N-ethoxymethylacrylamide, Nn-butoxymethylacrylamide, t-butylacrylamide sulfonic acid, vinyl stearylate, N-methylacrylamide, N-dimethylacrylamide, N-dimethylaminoethyl (meth)
Acrylate, N-dimethylaminopropylacrylamide, acryloylmorpholine, glycidyl methacrylate, n-butyl methacrylate, ethyl methacrylate, allyl methacrylate, cetyl methacrylate, pentadecyl methacrylate, methoxypolyethylene glycol (meth) acrylate, diethylaminoethyl (meth) ) Acrylate, methacryloyloxyethyl succinic acid, hexanediol diacrylate, neopentyl glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol mer diacrylate, hydroxypivalate neopentyl, pentaerythritol diacrylate monostea Rate, glycol diacrylate, -Hydroxyethyl methacryloyl phosphate, bisphenol A ethylene glycol adduct acrylate, bisphenol F ethylene glycol adduct acrylate, tricyclodecane methanol diacrylate, trishydroxyethyl isocyanurate diacrylate, 2-hydroxy-1-acryloxy-3-methacrylic Roxypropane, trimethylolpropane triacrylate, trimethylolpropane ethylene glycol adduct triacrylate, trimethylolpropane propylene glycol adduct triacrylate, pentaerythritol triacrylate, trisacryloyloxyethyl phosphate, trishydroxyethyl isocyanurate triacrylate, modified ε-caprolactone triacrylate, Trimethylolpropane ethoxy triacrylate, glycerin propylene glycol adduct triacrylate, pentaerythritol tetraacrylate, pentaerythritol ethylene glycol adduct tetraacrylate, ditrimethylolpropane tetraacrylate, dipentaerythritol hexa (penta) acrylate, dipentaerythritol monohydroxypenta Examples include, but are not limited to, acrylates, urethane acrylates, epoxide acrylates, polyester acrylates, unsaturated polyesters, and the like. These can be used singly or arbitrarily as a mixture. Preferably, the polyfunctional (meth) acrylate monomer or oligomer containing two or more (meth) acryloyl groups in the molecule has a hard film after polymerization, and has an excellent resistance. The abrasion is good and suitable. The ratio of the active energy ray polymerizable (meth) acrylate to the resin component in the heat ray-shielding resin composition is preferably from 10% by weight to 98% by weight, more preferably from 30% by weight to 80% by weight.
【0010】又、樹脂成分として(メタ)アクリロイル
基を持つ活性エネルギ−線重合型(メタ)アクリレ−ト
の他にフィルムとの密着性、あるいは無機金属の微粒子
と活性エネルギー線重合型樹脂との相容性をよくする目
的で、アクリ樹脂、ポリエステル樹脂、ブチラ−ル樹
脂、ウレタン樹脂等のポリマ−を添加することができ
る。このポリマ−の組成物の樹脂成分に対する割合は、
2重量%以上50重量%以下、更に好ましくは20重量
%以下が好ましい。このポリマ−は含有量が多すぎると
得られる塗膜の耐擦傷性が低下し、とくに塗膜面を外側
にする使用方法には適さない。Also, in addition to active energy ray-polymerizable (meth) acrylate having a (meth) acryloyl group as a resin component, it has an adhesive property to a film, or an inorganic metal fine particle and an active energy ray-polymerizable resin. For the purpose of improving compatibility, a polymer such as an acrylic resin, a polyester resin, a butyral resin, or a urethane resin can be added. The ratio of the polymer composition to the resin component is as follows:
The content is preferably 2% by weight or more and 50% by weight or less, more preferably 20% by weight or less. If the content of this polymer is too large, the abrasion resistance of the coating film obtained is reduced, and it is not particularly suitable for the method of using the coating film surface outside.
【0011】この無機金属の超微粒子を紫外線硬化型樹
脂にうまく分散させるために、更に分散剤を必要に応じ
て添加することができる。その分散剤としては、種々の
界面活性剤が用いられ例えば界面活性剤としては高級脂
肪族アミンの4級塩、ポリエチレングリコールアルキル
アミン等のカチオン界面活性剤、高級脂肪酸ポリエチレ
ングリコ−ルエステル系等のノニオン界面活性剤、両性
界面活性剤、シリコン系界面活性剤、フッソ系界面活性
剤、アマイドエステル結合を有する高分子活性剤等があ
る。分散剤の添加量は、無機金属酸化物の総重量に対し
て0.1重量%以上15重量%以下が好ましい。In order to disperse the ultrafine particles of the inorganic metal in the ultraviolet-curable resin, a dispersant may be further added as required. As the dispersant, various surfactants are used. Examples of the surfactant include cationic surfactants such as quaternary salts of higher aliphatic amines, polyethylene glycol alkylamines, and nonionics such as higher fatty acid polyethylene glycol esters. Surfactants, amphoteric surfactants, silicon-based surfactants, fluorine-based surfactants, high-molecular-weight surfactants having an amide ester bond, and the like. The amount of the dispersant added is preferably from 0.1% by weight to 15% by weight based on the total weight of the inorganic metal oxide.
【0012】本発明の樹脂組成物は電子線もしくは紫外
線照射によって硬化させることができるが、紫外線で重
合硬化させる場合は光重合開始剤が使用され、その光重
合開始剤は予め樹脂組成物の中に溶解する。光重合開始
剤としては、特に制限はなく各種公知のものを使用する
ことができ、その使用量は樹脂組成物に対しで0.1−
15重量%、好ましくは、0.5−12重量%が良く、
少なすぎると硬化性が低下するので好ましくなく、多す
ぎると硬化被膜の強度が低下する。光重合開始剤の具体
例としては、イルガキュア−184、イルガキュア−6
51(チバガイギ−社製)、ダロキュア−1173(メ
ルク社製)、ベンゾフェノン、O-ベンゾイル安息香酸メ
チル、p−ジメチル安息香酸エステル、チオキサント
ン、アルキルチオキサントン、アミン類等が挙げられ
る。電子線を用いて重合硬化させる場合は特にこうした
重合開始剤を必要としない。The resin composition of the present invention can be cured by irradiation with an electron beam or ultraviolet rays. In the case of polymerizing and curing with ultraviolet rays, a photopolymerization initiator is used, and the photopolymerization initiator is previously contained in the resin composition. Dissolve in The photopolymerization initiator is not particularly limited, and various known ones can be used.
15% by weight, preferably 0.5-12% by weight,
If the amount is too small, the curability decreases, which is not preferable. If the amount is too large, the strength of the cured film decreases. Specific examples of the photopolymerization initiator include Irgacure-184 and Irgacure-6.
51 (manufactured by Ciba Geigy), Darocure-1173 (manufactured by Merck), benzophenone, methyl O-benzoylbenzoate, p-dimethylbenzoate, thioxanthone, alkylthioxanthone, amines and the like. When polymerizing and curing using an electron beam, such a polymerization initiator is not particularly required.
【0013】更に、塗膜の表面のスリップ性を向上させ
る目的で、種々のスリップ剤を添加することが可能で、
また組成物を塗工するときに発生する泡を制御する目的
で消泡剤を添加することもできる。更に必要に応じて各
種有機溶媒、例えばトルエン、キシレン、酢酸エチル、
アルコール、ケトン類などの芳香族、脂肪族の有機溶媒
を添加することができる。発明の実施の形態Further, various slip agents can be added for the purpose of improving the slip property of the surface of the coating film.
Further, an antifoaming agent can be added for the purpose of controlling foam generated when the composition is applied. Further various organic solvents as required, for example, toluene, xylene, ethyl acetate,
Aromatic or aliphatic organic solvents such as alcohols and ketones can be added. Embodiment of the Invention
【0014】本発明における熱線遮断性樹脂組成物の製
造方法及びこれをフィルムにコーティングする方法とし
ては、例えば次の方法があげられる。予め有機溶媒中に
0.5μm以下に微分散された金属酸化物の分散液に、
これに好ましくは分散剤とポリマー樹脂を少量添加して
微粒子の分散を安定化させる。しかる後に活性エネルギ
ー線を照射することによって重合可能な未硬化の(メ
タ)アクリレートモノマーもしくはオリゴマーを単独も
しくは2種類以上添加し、更に必要に応じて重合開始剤
を溶解させて目的の請求項1の熱線遮断性樹脂組成物を
得る。この時必要に応じて適量の溶媒や各種添加剤を添
加する事ができる。これらの各成分の混合方法はこの順
序に限らず、金属酸化物の微粒子の安定がはかられる方
法ならとくに限定されない。この組成物を透明フィルム
の基材に1層コーティングし、しかる後に活性エネルギ
ー線、例えば紫外線や電子線を照射することによって極
めて可視光線透過率の高い、耐擦傷性と熱線遮断性能に
優れた熱線遮蔽フィルムを得ることができる。この組成
物をフィルムにコーティングする方法としては例えば浸
漬法、グラビアコート法、ロールコート法、バーコート
法、噴霧法等の常法によって行われ、コートした後に熱
風で溶媒を揮散させ、続いて活性エネルギー線、例えば
電子線、もしくは紫外線を照射することによってフィル
ム表面上にコーテイングされた熱線遮断性組成物を瞬時
に重合硬化させる。コーティングする乾燥塗膜の厚みは
1〜50μm、好ましくは2〜10μmの厚みがカール
防止の観点から適当である。コーティングされるフィル
ム基材としてはポリエステル、ポリエチレン、ポリプロ
ピレン、ポリスチレン、ポリカーボネート、ポリ塩化ビ
ニル、ポリ(メタ)アクリル、ポリアミド、ポリウレタ
ンなどがあげられる。これらのフィルム基材は透明度の
高いものが好ましいが、所望に応じて着色したフィルム
基材を用いることもできる。The method for producing the heat ray-shielding resin composition of the present invention and the method for coating the film with a film include, for example, the following method. In a dispersion of a metal oxide finely dispersed to 0.5 μm or less in advance in an organic solvent,
Preferably, a small amount of a dispersant and a polymer resin are added to stabilize the dispersion of the fine particles. Thereafter, an uncured (meth) acrylate monomer or oligomer which can be polymerized by irradiation with an active energy ray is added alone or in combination of two or more, and further, if necessary, a polymerization initiator is dissolved to obtain a desired polymer. A heat ray blocking resin composition is obtained. At this time, an appropriate amount of a solvent or various additives can be added as needed. The method of mixing these components is not limited to this order, and is not particularly limited as long as the method can stabilize the fine particles of the metal oxide. This composition is coated on a transparent film substrate in a single layer and then irradiated with an active energy ray, for example, an ultraviolet ray or an electron beam, so that the visible ray transmittance is extremely high, and the heat ray is excellent in abrasion resistance and heat ray blocking performance. A shielding film can be obtained. As a method of coating this composition on a film, for example, a dipping method, a gravure coating method, a roll coating method, a bar coating method, a spraying method and the like are performed by a conventional method, and after coating, the solvent is volatilized with hot air, followed by activation. By irradiating an energy ray, for example, an electron beam or an ultraviolet ray, the heat ray-blocking composition coated on the film surface is instantaneously polymerized and cured. The thickness of the dried coating film to be coated is 1 to 50 μm, preferably 2 to 10 μm, from the viewpoint of curling prevention. Examples of the film substrate to be coated include polyester, polyethylene, polypropylene, polystyrene, polycarbonate, polyvinyl chloride, poly (meth) acryl, polyamide, and polyurethane. These film bases preferably have high transparency, but a colored film base may be used as desired.
【0015】組成物の調整方法Preparation of the composition
【実施例】次に、実施例を揚げて本発明樹脂組成物の調
整方法について詳細を述べるが、例文中の添加割合はす
べて重量%で示す。EXAMPLES Next, the method of preparing the resin composition of the present invention will be described in detail with reference to examples, but all the addition ratios in the examples are shown by weight%.
【0016】実施例1 (A)液の調整 撹はん器を備えた容器に、粒径0.1μm以下の無水ア
ンチモン亜鉛(ZnSb2 O6 )のゾルを40%含有す
るメタノール溶液を50部取り、これに分散剤プルロニ
ックTR−702(旭電化工業(株)製)3.5部をよ
く撹はんしながら添加する。 (B)液の調整 紫外線硬化性樹脂ジペンタエリスリト−ルヘキサアクリ
レ−ト(KAYARADDPHA 日本化薬(株)製)
64部にトルエンを30部を撹はんしながら添加し、続
いて光重合開始剤イルガキュア−184を0.6部とス
リップ剤SH−29PA(サンノプコ製)0.05部を
加えて、光開始剤が完全に溶解するまで撹はんする。
(A)液の中によく良く撹拌しながら(B)液30部を
徐々に加えて、紫外線硬化型の熱線遮断製樹脂組成物
(1)を得る。Example 1 Preparation of (A) Solution In a vessel equipped with a stirrer, 50 parts of a methanol solution containing 40% of a sol of anhydrous antimony zinc (ZnSb 2 O 6 ) having a particle size of 0.1 μm or less was used. Then, 3.5 parts of a dispersing agent Pluronic TR-702 (manufactured by Asahi Denka Kogyo KK) is added thereto with good stirring. (B) Preparation of liquid UV-curable resin dipentaerythritol hexaacrylate (KAYARADDPHA manufactured by Nippon Kayaku Co., Ltd.)
To 64 parts, 30 parts of toluene was added while stirring, and then 0.6 parts of a photopolymerization initiator Irgacure-184 and 0.05 parts of a slipping agent SH-29PA (manufactured by San Nopco) were added, followed by photoinitiation. Stir until the agent is completely dissolved.
30 parts of the liquid (B) are gradually added to the liquid (A) with good stirring, thereby obtaining an ultraviolet-curable resin composition (1) for blocking heat rays.
【0017】実施例2 分散剤剤としてアデカコールCC−42(旭電化工業
(株)製)を使用する以外は実施例1と同様にして樹脂
組成物(2)を得た。Example 2 A resin composition (2) was obtained in the same manner as in Example 1 except that Adecacol CC-42 (manufactured by Asahi Denka Kogyo KK) was used as a dispersant.
【0018】実施例3 (B)液を40部を使用する以
外は実施例1と同様にして樹脂組成物(3)を得た。Example 3 A resin composition (3) was obtained in the same manner as in Example 1 except that 40 parts of the liquid (B) was used.
【0019】比較例1 トルエン中に0.1μm以下に分散された無水アンチモ
ン亜鉛のゾルを40%含むメタノール溶液50部に分散
剤としてプルロニックTR−702を3.5部加えてよ
く撹拌する。その中にバインダ−としてブチラール樹脂
のエスレックBX−L(セキスイ化学工業(株)製)の
30%メタノール溶液30部を加えて樹脂組成物(4)
を得た。Comparative Example 1 3.5 parts of Pluronic TR-702 as a dispersant was added to 50 parts of a methanol solution containing 40% of a sol of anhydrous antimony zinc dispersed in toluene to 0.1 μm or less and stirred well. 30 parts of a 30% methanol solution of butyral resin S-LEC BX-L (manufactured by Sekisui Chemical Industry Co., Ltd.) was added as a binder to the resin composition (4).
I got
【0020】コ−ティングフィルムの作成 (1)膜厚50ミクロンの透明ポリエステルフィルムに
実施例1−3および比較例1で得られた樹脂組成物を、
コ−ティングバ−で固形分の厚さ4.1μmにコ−ティ
ングし溶剤を熱風で乾燥した後、樹脂組成物(1)から
樹脂組成物(3)については80Wの高圧水銀ランプを
コンベア−スピ−ド20m/分のスピ−ドで照射し、硬
化させて、目的のコ−ティングフィルムを得た。樹脂組
成物(4)については熱風乾燥して被膜化させたものを
コ−ティングフィルムのサンプルとした。Preparation of Coating Film (1) A resin composition obtained in Example 1-3 and Comparative Example 1 was applied to a transparent polyester film having a thickness of 50 μm by applying
After coating the solid content with a coating bar to a thickness of 4.1 μm and drying the solvent with hot air, the resin composition (1) to the resin composition (3) were conveyed by a high-pressure mercury lamp of 80 W on a conveyor spinner. Irradiation was carried out at a speed of 20 m / min. And a curing was performed to obtain a target coating film. With respect to the resin composition (4), a coating film was obtained by drying with hot air to form a film.
【0021】更に参考対象とするために、何もコーティ
ングしていない膜厚50ミクロンの透明ポリエステルフ
ィルムを試験に供した。得られたフィルムの特性を表1
に、また分光特性図を図1に示す。For further reference, a 50 micron thick transparent polyester film without any coating was subjected to the test. Table 1 shows the properties of the obtained film.
FIG. 1 shows a spectral characteristic diagram.
【0022】[0022]
【表1】 可視光線透過率はJIS A 5759に準拠して測定。 日射吸収率はJIS R 3106に準拠して測定。 (日射吸収率は数値の大きいほど、熱線遮断性能に優れる)[Table 1] Visible light transmittance was measured according to JIS A 5759. The solar absorptivity was measured according to JIS R 3106. (The higher the numerical value of the solar absorptivity, the better the heat ray shielding performance)
【0023】[0023]
【発明の効果】本発明の紫外線硬化型の熱線遮弊性樹脂
組成物の塗膜は、可視光領域の透過性が高く透明で耐擦
傷性に優れた熱線遮断能のある塗膜を紫外線を照射する
ことによって容易に形成するので、熱線遮断フィルムと
して建物の窓、車両の窓等への応用に最適である。According to the present invention, the coating film of the ultraviolet ray-curable heat ray shielding resin composition of the present invention can be applied to a coating film having a high transparency in the visible light region, a transparent coating film having excellent abrasion resistance and a heat ray shielding ability. Since it is easily formed by irradiation, it is most suitable for application to a window of a building, a window of a vehicle, and the like as a heat ray shielding film.
【図1】実施例1のフィルムと透明ポリエステルフィル
ムの分光特性図FIG. 1 is a diagram showing spectral characteristics of a film of Example 1 and a transparent polyester film.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C08K 3/22 C08K 3/22 C09D 4/02 PDR C09D 4/02 PDR PDS PDS // C09K 3/00 105 C09K 3/00 105 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location C08K 3/22 C08K 3/22 C09D 4/02 PDR C09D 4/02 PDR PDS PDS // C09K 3 / 00 105 C09K 3/00 105
Claims (4)
μm以下の金属酸化物の微粒子とそのバインダ−として
(メタ)アクリロイル基を持つ活性エネルギ−線重合型
(メタ)アクリレ−トとからなる紫外線で硬化し、耐擦
傷性を有する熱線遮断性樹脂組成物及びそれをコ−ティ
ングしたフィルム。1. A primary particle size of 0.5 having an infrared absorbing ability.
A heat ray-shielding resin composition which is hardened by ultraviolet rays comprising fine particles of a metal oxide having a size of not more than μm and active energy ray-polymerizable (meth) acrylate having a (meth) acryloyl group as a binder and has scratch resistance. Objects and films coated with them.
鉛のゲルである請求項1の樹脂組成物及びそれをコ−テ
ィングしたフィルム。2. The resin composition according to claim 1, wherein the fine particles of the metal oxide are a gel of anhydrous zinc antimonate, and a film obtained by coating the resin composition.
脂、ポリエステル樹脂、ブチラ−ル樹脂等のポリマ−を
含有する請求項1の樹脂組成物及びそれをコ−ティング
したフィルム。3. The resin composition according to claim 1, which contains a polymer such as an acrylic resin, a polyester resin, or a butyral resin as a component of the binder, and a film coated with the resin composition.
せる為に、カチオン系、ノニオン系、あるいは両性イオ
ンの分散剤を使用した請求項1の樹脂組成物及びそれを
コ−ティングしたフィルム。4. The resin composition according to claim 1, wherein a cationic, nonionic or amphoteric ion dispersant is used to disperse the metal oxide fine particles in the binder, and a film coated with the resin composition.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8214022A JPH1036415A (en) | 1996-07-26 | 1996-07-26 | Ultraviolet-curing heat-ray-shielding resin composition and film coated with the composition |
| TW85111822A TW426710B (en) | 1995-10-17 | 1996-09-26 | Activated infrared ray curing and thermal radiation shielding resin formulation and its coating film |
| PCT/JP1996/002827 WO1997011975A1 (en) | 1995-09-29 | 1996-09-27 | Actinic radiation-curable and heat ray-shielding resin composition and film coated with the same |
| US08/836,992 US6107360A (en) | 1995-09-29 | 1996-09-27 | Active radiation ray curable, solar radiation blocking resin compositions and films coated therewith |
| DE69614502T DE69614502D1 (en) | 1995-09-29 | 1996-09-27 | Actinic radiation-curable and heat-repellent resin composition and film coated with it |
| EP96932036A EP0795565B1 (en) | 1995-09-29 | 1996-09-27 | Actinic radiation-curable and heat ray-shielding resin composition and film coated with the same |
| CA002206256A CA2206256A1 (en) | 1995-09-29 | 1996-09-27 | Active radiation ray curable, solar radiation blocking resin compositions and films coated therewith |
| KR1019970703610A KR980700343A (en) | 1995-09-29 | 1996-09-27 | ACTIVE RADIATION RAY CURABLE, SOLAR RADIATION BLOCKING RESIN COMPOSITIONS AND FILMS COATED THEREWITH |
| KR19977003610A KR987000343A (en) | 1995-09-29 | 1997-05-29 | Active radiation ray curable, solar radiation blocking resin compositions and films coated therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8214022A JPH1036415A (en) | 1996-07-26 | 1996-07-26 | Ultraviolet-curing heat-ray-shielding resin composition and film coated with the composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1036415A true JPH1036415A (en) | 1998-02-10 |
Family
ID=16648985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8214022A Pending JPH1036415A (en) | 1995-09-29 | 1996-07-26 | Ultraviolet-curing heat-ray-shielding resin composition and film coated with the composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1036415A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6723423B1 (en) | 1998-02-17 | 2004-04-20 | Nippon Kayaku Kabushiki Kaisha | Transparent sheet or film |
| JP2012246344A (en) * | 2011-05-25 | 2012-12-13 | Fujikura Kasei Co Ltd | Aqueous coating composition |
-
1996
- 1996-07-26 JP JP8214022A patent/JPH1036415A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6723423B1 (en) | 1998-02-17 | 2004-04-20 | Nippon Kayaku Kabushiki Kaisha | Transparent sheet or film |
| JP2012246344A (en) * | 2011-05-25 | 2012-12-13 | Fujikura Kasei Co Ltd | Aqueous coating composition |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0795565B1 (en) | Actinic radiation-curable and heat ray-shielding resin composition and film coated with the same | |
| KR100383303B1 (en) | Polymeric articles with improved hydrophilicity and methods of making them | |
| JP5616329B2 (en) | Surface protection film | |
| JP2000190430A (en) | Infrared cutoff film | |
| US6191884B1 (en) | Infrared-blocking transparent film | |
| CN101616800A (en) | Near infrared shielding film | |
| JPH08281860A (en) | Heat ray shielding film | |
| TWI387790B (en) | Infrared ray absorbing film | |
| JP3894590B2 (en) | Heat ray blocking resin composition and coating film | |
| JP4359356B2 (en) | Antifouling infrared shielding film and method for producing the same | |
| JP2008018543A (en) | Hard coat film, antireflection film and antireflection near-infrared shielding film using the same | |
| JP4190657B2 (en) | Infrared shielding film | |
| JPH09316363A (en) | Heat-ray-shielding resin composition or coating film | |
| JP3654609B2 (en) | Heat ray blocking resin composition and coating film | |
| JPH09151203A (en) | Ultra violet-curing and heat ray shielding resin composition and film coated therewith | |
| JPH09108621A (en) | Ultraviolet curing heat ray cut-off resin composition and film coated with the same | |
| JP2001179887A (en) | Heat ray reflective film for window application | |
| JPH1036415A (en) | Ultraviolet-curing heat-ray-shielding resin composition and film coated with the composition | |
| JP2000167999A (en) | Film having hardened film layer of radiation curable resin composition | |
| JP2007127823A (en) | Optical film and its manufacturing method | |
| JPH10128899A (en) | Film for preventing glass scattering having light diffusing function | |
| JP2002107503A (en) | Hard coat film and hard coat film with functional film | |
| JPH10100310A (en) | Heat-ray shading film | |
| JP3775384B2 (en) | Scratch-resistant resin plate and method for producing the same | |
| JP2000141534A (en) | Heat-shielding film |