JPH1036638A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH1036638A JPH1036638A JP19634096A JP19634096A JPH1036638A JP H1036638 A JPH1036638 A JP H1036638A JP 19634096 A JP19634096 A JP 19634096A JP 19634096 A JP19634096 A JP 19634096A JP H1036638 A JPH1036638 A JP H1036638A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- resin composition
- parts
- vibration damping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 46
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 46
- 239000000203 mixture Substances 0.000 title claims abstract description 30
- 238000013016 damping Methods 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000004844 aliphatic epoxy resin Substances 0.000 claims abstract description 10
- 229920001971 elastomer Polymers 0.000 claims abstract description 10
- 239000005060 rubber Substances 0.000 claims abstract description 10
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 6
- 239000002131 composite material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 35
- 238000000465 moulding Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000012783 reinforcing fiber Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- 229920000800 acrylic rubber Polymers 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000009787 hand lay-up Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229920000058 polyacrylate Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000013001 point bending Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical class OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003733 fiber-reinforced composite Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- -1 phenyleneethylene glycol Chemical compound 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- PWMWNFMRSKOCEY-UHFFFAOYSA-N 1-Phenyl-1,2-ethanediol Chemical compound OCC(O)C1=CC=CC=C1 PWMWNFMRSKOCEY-UHFFFAOYSA-N 0.000 description 1
- XZLLVYIKTBOLCC-UHFFFAOYSA-N 10-(10-hydroxydecoxy)decan-1-ol Chemical compound OCCCCCCCCCCOCCCCCCCCCCO XZLLVYIKTBOLCC-UHFFFAOYSA-N 0.000 description 1
- HGXVKAPCSIXGAK-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine;4,6-diethyl-2-methylbenzene-1,3-diamine Chemical compound CCC1=CC(CC)=C(N)C(C)=C1N.CCC1=CC(C)=C(N)C(CC)=C1N HGXVKAPCSIXGAK-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- UHMARZNHEMRXQH-UHFFFAOYSA-N 3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical class C1=CCCC2C(=O)OC(=O)C21 UHMARZNHEMRXQH-UHFFFAOYSA-N 0.000 description 1
- DOKSGDQKKRNJOK-UHFFFAOYSA-N 6-(6-hydroxyhexoxy)hexan-1-ol Chemical compound OCCCCCCOCCCCCCO DOKSGDQKKRNJOK-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 101001030172 Homo sapiens Myozenin-3 Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 102100038897 Myozenin-3 Human genes 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical class CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 150000001559 benzoic acids Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical class OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000539 dimer Chemical class 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical class C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical class OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical class OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(57)【要約】
【課題】 低粘度で硬化性に優れ、粘度の安定性にも優
れ、制振性能、機械的強度および耐熱性に優れる、複合
材料に適したエポキシ樹脂組成物を提供する。
【解決手段】 (A)ゴム粒子2〜15重量部、(B)
脂肪族エポキシ樹脂40〜90重量部、(C)脂肪族エ
ポキシ樹脂以外のエポキシ樹脂5〜70重量部、(D)
常温で液体の酸無水物からなり、かつ(A)ないし
(C)の樹脂成分に占める(B)の重量比が0.4〜
0.9であるエポキシ樹脂組成物である。PROBLEM TO BE SOLVED: To provide an epoxy resin composition suitable for composite materials, having low viscosity, excellent curability, excellent viscosity stability, excellent vibration damping performance, mechanical strength and heat resistance. . SOLUTION: (A) 2 to 15 parts by weight of rubber particles, (B)
40 to 90 parts by weight of an aliphatic epoxy resin, (C) 5 to 70 parts by weight of an epoxy resin other than the aliphatic epoxy resin, (D)
It is composed of an acid anhydride which is liquid at normal temperature, and the weight ratio of (B) to the resin components (A) to (C) is 0.4 to 0.4.
It is an epoxy resin composition of 0.9.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、低粘度で硬化性に
優れ、粘度の安定性にも優れた繊維強化複合材料(以下
FRPという。)用に適したエポキシ樹脂組成物に関
し、更に詳しくは、制振性能、機械的強度および耐熱性
に優れる、複合材料に適したエポキシ樹脂組成物に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition suitable for a fiber-reinforced composite material (hereinafter referred to as "FRP") having a low viscosity, excellent curability, and excellent viscosity stability. The present invention relates to an epoxy resin composition having excellent vibration damping performance, mechanical strength and heat resistance and suitable for composite materials.
【0002】[0002]
【従来の技術】マトリックス樹脂を強化繊維で補強した
FRPは軽量、高弾性、高強度のメリットを生かして、
航空機、船舶、自動車等の構造材料、あるいはロール等
の工業材料から釣りざお、ゴルフシャフト、テニスラケ
ット等のスポーツ用途まで、など様々な用途に広く使用
されている。2. Description of the Related Art An FRP in which a matrix resin is reinforced with reinforcing fibers takes advantage of light weight, high elasticity, and high strength.
It is widely used in various applications such as structural materials for aircraft, ships, automobiles and the like, or industrial materials such as rolls, and sports applications such as fishing rods, golf shafts and tennis rackets.
【0003】近年、FRPには、上述した軽量,高強度
および高弾性といった機械的特性向上以外に、スポーツ
の用途では打球時の振動吸収性能の向上、工業用途で
は、防音性能の向上、トルク伝達軸の低振動化などの振
動を抑制する特性(制振性能)が求められてきている。[0003] In recent years, in addition to the above-mentioned mechanical properties such as lightweight, high strength and high elasticity, FRP has been improved in vibration absorbing performance at the time of hitting for sports use, and has improved soundproofing performance and torque transmission in industrial use. There is a demand for characteristics (vibration suppression performance) for suppressing vibration such as low vibration of a shaft.
【0004】振動体の制振性能は、減衰正弦波形におけ
る隣接する振動の振幅をそれぞれX1、X2をしたとき、
次式(1)で示される対数減衰率△が大きいほど、優れ
た制振性能が得られることになる。[0004] The vibration damping performance of a vibrating body is expressed by the following formula: when the amplitudes of adjacent vibrations in a damped sine waveform are X 1 and X 2 , respectively.
The greater the logarithmic decrement △ represented by the following equation (1), the more excellent vibration damping performance can be obtained.
【0005】△=In(X1/X2) ・・・(1)△ = In (X 1 / X 2 ) (1)
【0006】そして、対数減衰率は損失係数ηを用いて
次式(2)で表される。The logarithmic decay rate is represented by the following equation (2) using the loss coefficient η.
【0007】 △=πη ・・・(2) したがって、損失係数ηの大きいものほど優れた制振性
能を有しているということができる。Δ = πη (2) Therefore, it can be said that the larger the loss coefficient η, the better the vibration damping performance.
【0008】振動を効率よく減衰できる制振材を形成す
るための制振材用組成物としては、従来ポリアミド系樹
脂または、ポリ塩化ビニル系樹脂等を主成分としたもの
が用いられてきた。As a vibration damping composition for forming a vibration damping material capable of efficiently attenuating vibrations, a composition containing a polyamide resin or a polyvinyl chloride resin as a main component has conventionally been used.
【0009】しかしながら、ポリアミド系樹脂を主成分
とした制振材用組成物から成形した制振材は耐水性、耐
薬品性の点で劣り、機械的強度も小さい。ポリ塩化ビニ
ル系樹脂を主成分とした制振材用組成物は複雑な形状の
制振材に成形するのが困難であり、さらに少量多他品種
の制振材を製造するにはコスト高になるという問題点が
あった。However, a vibration damping material molded from a composition for a vibration damping material containing a polyamide resin as a main component is inferior in water resistance and chemical resistance, and has low mechanical strength. It is difficult to form a damping material with a complex shape using a polyvinyl chloride-based resin as a main component. There was a problem of becoming.
【0010】FRPに制振性を付与する方法としては、
強化繊維の最適化や積層構成などの構造設計による方法
とマトリックス樹脂の改良による方法に大別できる。前
者の方法は、構造自体に制振性能を付与しようとするも
のであるが、一般に構造体になりうる剛性の高い材料は
制振性能が低く、逆に制振性能が高いものは剛性が低い
という矛盾を含んだものであり、後者の方法は、振動エ
ネルギーをマトリックス樹脂により熱エネルギーに変え
ることで制振性能の向上を図ろうとするものである。[0010] As a method of giving vibration damping properties to FRP,
The method can be broadly divided into a method based on structural design such as optimization of reinforcing fibers and a lamination structure, and a method based on improvement of a matrix resin. The former method is intended to impart damping performance to the structure itself, but generally, a material having high rigidity that can be a structure has low damping performance, and a material having high damping performance has low rigidity. The latter method is intended to improve vibration damping performance by changing vibration energy into heat energy using a matrix resin.
【0011】前者の方法としては、特開平3−2342
67号公報に強化繊維にアラミド繊維やポリアリレート
繊維を用いることにより制振性能を向上する方法が開示
されているが、この方法で得られたFRPは穴あけ加工
などの後加工が困難な点に問題がある。The former method is disclosed in Japanese Unexamined Patent Publication No.
No. 67 discloses a method of improving vibration damping performance by using aramid fiber or polyarylate fiber as a reinforcing fiber, but the FRP obtained by this method is difficult to perform post-processing such as drilling. There's a problem.
【0012】また、特開平3−274143号公報に
は、シート状の粘弾性材料にガラスクロスを積層して予
備成形した後、熱硬化樹脂を含浸成形する制振性能の優
れたFRPの成形方法が開示されている。しかし、この
成形方法は煩雑な2段階の成形が必要であり、コスト的
にスポーツ用途等の汎用品の成形には適用しにくい難点
がある。Japanese Patent Application Laid-Open No. 3-274143 discloses a method of forming an FRP having excellent vibration damping performance by laminating a glass cloth on a sheet-like viscoelastic material, preforming the same, and then impregnating with a thermosetting resin. Is disclosed. However, this molding method requires complicated two-stage molding, and is difficult to apply to molding general-purpose products such as sports applications in terms of cost.
【0013】そのほかにも、表面に弾性塗料を塗布する
ことにより制振性能を向上する方法、ラケットの形状や
構造を工夫し、衝撃が加わった際、異なる振動を共振さ
せることにより振動を吸収する方法が知られているが、
市場の要求に十分対応できるものはまだない。In addition, a method of improving vibration damping performance by applying an elastic paint to the surface, devising the shape and structure of the racket, and absorbing vibration by resonating different vibrations when an impact is applied. The method is known,
Nothing yet can meet the market demands.
【0014】後者のマトリックス樹脂の改良により制振
性能を向上する方法としては、特開平2−86615号
公報に開示された、多価アルコールとポリイソシアナー
ト化合物を強化繊維存在下で反応させ、FRPを得る技
術があるが、得られたFRPはスポーツ用途で要求され
る剛性が得られない場合がある。As a method for improving the vibration damping performance by improving the matrix resin, a polyhydric alcohol and a polyisocyanate compound are reacted in the presence of a reinforcing fiber as disclosed in JP-A-2-86615. However, the obtained FRP may not provide the rigidity required for sports applications.
【0015】また、マトリックス樹脂がガラス転移点付
近で損失係数ηが大きくなる性質を利用し、非晶質エポ
キシ樹脂とガラス転移温度の低い低分子量有機充填剤
(いわゆる可塑剤)を配合することも知られている。し
かし、この様なエポキシ樹脂系の制振材は、機械的強度
が高く、耐久性、成形性に優れたものを得ようとすると
制振性能に低下し、制振性能に優れたものを得ようとす
ると機械的強度が低く耐熱性、成形性も劣ってしまうと
いう問題点があった。Further, by utilizing the property that the matrix resin has a large loss coefficient η near the glass transition point, an amorphous epoxy resin and a low molecular weight organic filler having a low glass transition temperature (so-called plasticizer) may be blended. Are known. However, such epoxy resin-based damping materials have a high mechanical strength, and when trying to obtain a material with excellent durability and moldability, the vibration-damping performance decreases, and a material with excellent vibration-damping performance is obtained. In such a case, there is a problem that the mechanical strength is low and the heat resistance and the moldability are inferior.
【0016】ところで、FRPの成形方法としては、プ
リプレグと呼ばれるマトリックス樹脂を強化繊維に含浸
した中間材を使用する方法のほか、ハンドレイアップ
法、フィラメントワインディング(以下、FWとい
う。)法、レジントランスファーモールディング(以
下、RTMという。)法、インジェクション(RIM)
法等が挙げられ、プリプレグを経由しないFW法、RT
M法、RIM法は低コストの成型法として広く用いられ
ている。Incidentally, as a method of forming the FRP, in addition to a method of using an intermediate material in which a matrix resin called a prepreg is impregnated in a reinforcing fiber, a hand lay-up method, a filament winding (hereinafter, referred to as FW) method, a resin transfer method, and the like. Molding (hereinafter referred to as RTM) method, injection (RIM)
Method, FW method without prepreg, RT
The M method and the RIM method are widely used as low-cost molding methods.
【0017】これらの成形方法に適用できる樹脂特性
は、成形後の機械的特性に優れることはもちろんのこ
と、強化繊維が配置されている金型に注入可能な程度の
低粘度であること、硬化性に優れること、粘度の安定性
に優れることが要求されるが、これら成形のために要求
される種々の性能と硬化後の制振性能を両立した樹脂は
まだ知られていない。The resin properties applicable to these molding methods are not only excellent in mechanical properties after molding, but also low enough to be injected into a mold in which reinforcing fibers are arranged, and curing. It is required that the resin has excellent properties and the stability of the viscosity is excellent. However, a resin satisfying various performances required for molding and vibration damping performance after curing has not yet been known.
【0018】[0018]
【発明が解決しようとする課題】本発明は上記の現状を
解決するものであって、ハンドレイアップ成形法、FW
成形法、RTM成形法等に特に好適に用いることがで
き、比較的低い温度でしかも短時間で成形できるため生
産性向上効果も非常に高く、得られたFRPは制振性、
耐熱性、機械的強度に優れたエポキシ樹脂組成物および
繊維強化複合材料を提供することを課題とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has been made by a hand lay-up molding method.
It can be used particularly suitably for molding methods, RTM molding methods, etc., and can be molded at a relatively low temperature in a short time, so that the productivity improving effect is very high.
It is an object to provide an epoxy resin composition and a fiber-reinforced composite material having excellent heat resistance and mechanical strength.
【0019】[0019]
【課題を解決するための手段】本発明の要旨は、(A)
ゴム粒子2〜15重量部、(B)脂肪族エポキシ樹脂4
0〜90重量部、(C)脂肪族エポキシ樹脂以外のエポ
キシ樹脂5〜70重量部、(D)常温で液体の酸無水物
系硬化剤とからなり、かつ(A)ないし(C)の樹脂成
分に占める(B)の重量比が0.4〜0.9であるエポ
キシ樹脂組成物にある。The gist of the present invention is that (A)
2 to 15 parts by weight of rubber particles, (B) aliphatic epoxy resin 4
0 to 90 parts by weight, (C) 5 to 70 parts by weight of an epoxy resin other than the aliphatic epoxy resin, (D) an acid anhydride-based curing agent which is liquid at room temperature, and (A) to (C) An epoxy resin composition wherein the weight ratio of (B) to the components is 0.4 to 0.9.
【0020】[0020]
【発明の実施の形態】本発明に用いるゴム粒子(以下単
に(A)という。)とは、ゴム成分の内部に部分的に架
橋構造を有するゴムのことであり、ブタジエン系ゴム、
アクリル系ゴム等の粒子を例示することができるがこれ
に限定されるものではない。BEST MODE FOR CARRYING OUT THE INVENTION The rubber particles (hereinafter, simply referred to as (A)) used in the present invention are rubbers having a partially crosslinked structure inside a rubber component, and include butadiene rubber,
A particle such as an acrylic rubber can be exemplified, but is not limited thereto.
【0021】(A)として用いる少なくとも部分的に架橋
したゴム粒子は単独で樹脂組成物に混合しても構わない
が、後述する脂肪族エポキシ樹脂以外のエポキシ樹脂
(以下単に(C)という。)にあらかじめ分散混合もし
くは分散後エポキシ樹脂と一部分を反応させた架橋ゴム
変成エポキシ樹脂とした後に用いても構わない。The at least partially crosslinked rubber particles used as (A) may be singly mixed with the resin composition, but epoxy resins other than the aliphatic epoxy resins described below (hereinafter simply referred to as (C)). The epoxy resin may be used after it is dispersed and mixed or dispersed beforehand to partially react with the epoxy resin.
【0022】このように、(A)および(C)をあらかじ
め予備反応させて添加すると、制振性を向上させる面か
ら好ましい。この機構はまだ解明していないが、ゴム成
分の末端基とエポキシ樹脂が部分的に結合していること
が重要であると推察している。(A)と(C)とを反応
することによって得られるエポキシ樹脂は、(A)と
(C)の混合物を100℃〜180℃の温度で必要によ
り触媒を添加して反応させることにより容易に得ること
ができる。As described above, it is preferable to add (A) and (C) by preliminarily preliminarily reacting them from the viewpoint of improving vibration damping properties. Although this mechanism has not been elucidated yet, it is presumed that it is important that the terminal group of the rubber component and the epoxy resin are partially bonded. The epoxy resin obtained by reacting (A) and (C) can be easily prepared by reacting a mixture of (A) and (C) at a temperature of 100 ° C. to 180 ° C., optionally adding a catalyst. Obtainable.
【0023】(A)と(C)の反応物として市販あるい
はサンプルとして入手可能な架橋ゴム変性したエポキシ
樹脂としては大日本インキ化学工業(株)のエピクロン
TSR−960、TSR−601、日本触媒のCX−M
Nシリーズ、日本合成ゴム(株)の架橋ゴム変性エポキ
シ樹脂を例示することができるが、これに限定するもの
ではない。Examples of the crosslinked rubber-modified epoxy resin which is commercially available as a reactant of (A) and (C) or is available as a sample include Epicron TSR-960 and TSR-601 of Dainippon Ink and Chemicals, Nippon Shokubai. CX-M
Examples of the N series include crosslinked rubber-modified epoxy resins manufactured by Nippon Synthetic Rubber Co., Ltd., but are not limited thereto.
【0024】本発明に用いる(C)は、室温で液状で、
脂肪族でなければ特に制限はないが、ビスフェノールA
型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビ
スフェノールS型エポキシ樹脂、フェノールノボラック
型エポキシ樹脂、グリシジルアミン型エポキシ樹脂等の
市販のエポキシ樹脂が使用可能であり。目的に応じて適
宜使用できる。(C)として用いるエポキシ樹脂は1種
類でも構わないが、必要に応じて2種類以上のエポキシ
樹脂を混合して使用しても構わない。(C) used in the present invention is a liquid at room temperature,
There is no particular limitation unless it is aliphatic, but bisphenol A
A commercially available epoxy resin such as a type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a phenol novolak type epoxy resin, and a glycidylamine type epoxy resin can be used. It can be used appropriately according to the purpose. Although one type of epoxy resin may be used as (C), two or more types of epoxy resins may be mixed and used as needed.
【0025】(C)の粘度は、成形時の取扱い性等の問
題から好ましくは室温で200ポイズ以下、さらに好ま
しくは100ポイズ以下である。室温の粘度がこの範囲
上であると、ハンドレイアップ成型法、RTM成型法、
FW成型法で成形する場合、非常に取り扱いにくく、表
面性の良い成型物が得られない。The viscosity of (C) is preferably 200 poise or less at room temperature, more preferably 100 poise or less, due to problems such as handleability during molding. When the viscosity at room temperature is within this range, hand lay-up molding, RTM molding,
In the case of molding by the FW molding method, it is very difficult to handle and a molded product having good surface properties cannot be obtained.
【0026】また、(C)のエポキシ樹脂に反応希釈剤
等を混合し、上記粘度に調整して使用しても構わない。The epoxy resin (C) may be mixed with a reaction diluent or the like to adjust the viscosity to the above value before use.
【0027】本発明で用いる脂肪族エポキシ樹脂(以下
単に(B)という。)としては、エチレングリコール
類、プロピレングリコール類、ブチレングリコール類、
ネオペンチルグリコール類、1,6ヘキサンジオール
類、ジ(6−ヒドロキシヘキシル)エーテル、1,8−
オクタンジオール、ジ(8−ヒドロキシヘキシル)エー
テル、1,10−デカンジオール、ジ(10−ヒドロキ
シデシル)エーテル、フェニレンエチレングリコール、
ジ(フェニルエチレングリコール)などの炭素数2〜1
5のポリオールのグリシジルエーテル類、グリセロール
トリグリシジルエーテル、ポリグリセロールポリグリシ
ジルエーテル、トリメチロールプロパングリシジルエー
テルなど、トリメチロールプロパンのプロピレンオキサ
イド付加物のトリグリシジルエーテルなど、ペンタエリ
スリトールのプロピレンオキサイド付加物のトリグリシ
ジルエーテルなど、水添ビスフェノール類等をグリシジ
ル化したグリシジルエーテル型エポキシ樹脂、ヘキサヒ
ドロ無水フタル酸類、テトラヒドロ無水フタル酸類、ダ
イマー酸類、安息香酸類等をグリシジル化したグリシジ
ルエステル型エポキシ樹脂などが挙げることができる。The aliphatic epoxy resin (hereinafter simply referred to as (B)) used in the present invention includes ethylene glycols, propylene glycols, butylene glycols,
Neopentyl glycols, 1,6 hexanediols, di (6-hydroxyhexyl) ether, 1,8-
Octanediol, di (8-hydroxyhexyl) ether, 1,10-decanediol, di (10-hydroxydecyl) ether, phenyleneethylene glycol,
2-1 carbon atoms such as di (phenylethylene glycol)
Triglycidyl ethers of pentaerythritol, such as glycidyl ethers of polyols 5, glycerol triglycidyl ether, polyglycerol polyglycidyl ether, and trimethylolpropane glycidyl ether, such as triglycidyl ether of propylene oxide adduct of trimethylolpropane. Glycidyl ether-type epoxy resins obtained by glycidylation of hydrogenated bisphenols such as ether, glycidyl ester-type epoxy resins obtained by glycidylation of hexahydrophthalic anhydrides, tetrahydrophthalic anhydrides, dimer acids, benzoic acids, and the like can be given.
【0028】(B)は脂肪族エポキシ樹脂は低粘度の方
が好ましく、室温で25℃の時100ポイズ以下が好ま
しく、さらに好ましくは50ポイズ以下である。(B) The aliphatic epoxy resin preferably has a low viscosity, preferably 100 poise or less at room temperature and 25 ° C., more preferably 50 poise or less.
【0029】本発明のエポキシ樹脂組成物は上述の
(A)、(B)および(C)がそれぞれ2〜15重量
部、40〜90重量部および5〜70重量部の割合で混
合され、さらに(B)が(A)〜(C)の樹脂成分に占
める重量比が0.4〜0.9であることが必要である。
さらに好ましい(A)、(B)および(C)の重量比は
それぞれ2〜10重量部、50〜80重量部および10
〜50重量部である。In the epoxy resin composition of the present invention, the above-mentioned (A), (B) and (C) are mixed in proportions of 2 to 15 parts by weight, 40 to 90 parts by weight and 5 to 70 parts by weight, respectively. It is necessary that the weight ratio of (B) to the resin components of (A) to (C) is 0.4 to 0.9.
More preferred weight ratios of (A), (B) and (C) are 2 to 10 parts by weight, 50 to 80 parts by weight and 10
5050 parts by weight.
【0030】(A)成分が上記範囲より多い場合、マト
リックス樹脂は微細な粉体の(A)成分を多量に配合す
るために粘度が高くなり、FWやRTM等の成形方法に
適用することが困難となる。また、(B)が40重量部
未満であると十分な制振性がえられず、90重量部を超
えるとFRPとして使用するのに十分な機械的強度およ
び耐熱性が得られない。そして、(C)が上記範囲外で
あると、得られるFPRは十分な機械的強度および耐熱
性が得られない。When the amount of the component (A) is larger than the above range, the viscosity of the matrix resin becomes high because a large amount of the component (A) of the fine powder is blended, and the matrix resin can be applied to molding methods such as FW and RTM. It will be difficult. If (B) is less than 40 parts by weight, sufficient vibration damping properties cannot be obtained, and if it exceeds 90 parts by weight, sufficient mechanical strength and heat resistance for use as FRP cannot be obtained. If (C) is outside the above range, the obtained FPR cannot have sufficient mechanical strength and heat resistance.
【0031】さらに本発明においては、(A)、(B)
および(C)からなる樹脂成分中に(B)が占める重量
割合が、40〜90重量%であることが必要であり、6
0〜80重量%の範囲にあることがさらに好ましい。Further, in the present invention, (A) and (B)
It is necessary that the weight ratio of (B) in the resin component consisting of (C) and (C) is 40 to 90% by weight.
More preferably, it is in the range of 0 to 80% by weight.
【0032】本発明のエポキシ樹脂組成物は、(A)、
(B)および(C)を上記の割合で混合することによ
り、RTM法もしくはFW法などの成型方法に適用可能
な低粘度で、かつ十分な制振性能とFRPとしての機械
的強度および耐熱性をバランスよく有するFRPが得ら
れるのである。The epoxy resin composition of the present invention comprises (A)
By mixing (B) and (C) at the above ratio, low viscosity and sufficient vibration damping performance and mechanical strength and heat resistance as FRP applicable to molding methods such as RTM method or FW method. Is obtained in a well-balanced manner.
【0033】(D)の常温で液体の酸無水物系硬化剤と
しては特に制限はしないが、テトラヒドロ無水フタル
酸、メチルテトラヒドロ無水フタル酸、メチルヘキサヒ
ドロ無水フタル酸、無水メチルナジック酸、ドデシル無
水コハク酸が好適に用いられ、これらの中から選ばれる
1種類以上の酸無水物系の硬化剤を単独で、あるいは2
種類以上を混合して用いることが好ましい。添加量とし
てはエポキシ樹脂成分((A)と(B)を混合したも
の)の化学量論量の50〜120%であることが好まし
く、70〜100%であることが更に好ましい。The acid anhydride-based curing agent liquid (D) at room temperature is not particularly limited, but tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, dodecyl anhydride Succinic acid is preferably used, and one or more acid anhydride-based curing agents selected from these are used alone or in combination with two or more.
It is preferable to use a mixture of two or more kinds. The amount added is preferably 50 to 120%, more preferably 70 to 100% of the stoichiometric amount of the epoxy resin component (a mixture of (A) and (B)).
【0034】本発明のエポキシ樹脂組成物に更に硬化促
進剤を加えても構わない。ここで好適に使用できる硬化
促進剤は常温で液状、あるいは少しの加温で液化するも
の、もしくは融点が硬化温度以下であるもの、上記樹脂
組成物に溶解するものが好ましい。融点が60℃以下で
あると更に好ましい。また、化学構造的には、1位に活
性水素を有する方が得られた樹脂組成物の安定性と反応
性のバランスからは更に好ましい。[0034] A curing accelerator may be further added to the epoxy resin composition of the present invention. The curing accelerator that can be suitably used here is preferably a liquid at room temperature, or a liquid that liquefies with a slight heating, or a substance having a melting point lower than the curing temperature or a substance that dissolves in the resin composition. More preferably, the melting point is 60 ° C. or lower. In terms of chemical structure, it is more preferable to have active hydrogen at the 1-position from the balance between stability and reactivity of the obtained resin composition.
【0035】この様な硬化促進剤としては、イミダゾー
ル類が好適であり、2−エチル−4−メチルイミダゾー
ルが最も好適に用いられる。As such a curing accelerator, imidazoles are preferable, and 2-ethyl-4-methylimidazole is most preferably used.
【0036】硬化促進剤の添加量としては(A)、
(B)および(C)の樹脂成分100重量部に対して
0.5〜5重量部の範囲であることが好ましく、0.5
〜3重量部であることが更に好ましい。The amount of the curing accelerator to be added is (A)
It is preferably in the range of 0.5 to 5 parts by weight based on 100 parts by weight of the resin components of (B) and (C),
More preferably, it is 3 parts by weight.
【0037】本発明のエポキシ樹脂組成物は非常に低粘
度で含浸性に優れるため、ハンドレイアップ、FW、R
TMに適用するマトリックス樹脂として特に好適に用い
られ、また比較的低い温度でしかも短時間で成形できる
ため、生産性向上効果も非常に高く、得られたFRPは
耐熱性、機械的物性に優れる。Since the epoxy resin composition of the present invention has a very low viscosity and excellent impregnation properties, hand lay-up, FW, R
Since it is particularly suitably used as a matrix resin applied to TM and can be molded at a relatively low temperature in a short time, the effect of improving productivity is very high, and the obtained FRP has excellent heat resistance and mechanical properties.
【0038】本発明のエポキシ樹脂組成物においては、
120℃×1時間で硬化させた硬化樹脂の固有減衰能が
35%以上であることが好ましい。この固有減衰能が3
5%未満であると、FRPとしたときに十分な制振性が
得られない傾向にある。In the epoxy resin composition of the present invention,
The cured resin cured at 120 ° C. for one hour preferably has an intrinsic damping ability of 35% or more. This intrinsic damping capacity is 3
If it is less than 5%, sufficient vibration damping tends not to be obtained when FRP is used.
【0039】本発明において、固有減衰能は次のように
して測定したものをいう。硬化した樹脂板から150m
m長×12.5mm巾×0.9mm厚の試験片を切り出
し、一端より30mmを片持固定し、高さ50cmから
35gのおもりを先端部に落下打撃させて生じる振動減
衰挙動を同試験片の片持固定した一端から50mmのと
ころに取り付けた歪みゲージにより電気信号に変換し測
定する。得られた減衰波形より、下式に基づき固有減衰
能を求める。In the present invention, the intrinsic decay ability is measured as follows. 150m from cured resin plate
A test piece of m length x 12.5 mm width x 0.9 mm thickness was cut out, 30 mm cantilever was fixed from one end, and a 35 g weight from a height of 50 cm was dropped and impacted on the tip to measure the vibration damping behavior. Is converted into an electric signal by a strain gauge attached at a position 50 mm from one end fixed to the cantilever and measured. From the obtained attenuation waveform, the intrinsic attenuation power is obtained based on the following equation.
【0040】δ=1/n・In(A0/An) A0:衝撃直後の振幅の大きさ An:衝撃後のn番目の振幅の大きさ S.D.C.(%)=(1−δe-2)×100Δ = 1 / n · In (A 0 / A n ) A 0 : magnitude of amplitude immediately after impact A n : magnitude of n-th amplitude after impact D. C. (%) = (1−δe −2 ) × 100
【0041】[0041]
【実施例】以下の実施例により本発明を更に詳しく説明
する。実施例、比較例中の化合物の略語、および試験方
法は以下の通りである。The present invention will be described in more detail with reference to the following examples. Abbreviations of the compounds in the examples and comparative examples, and the test methods are as follows.
【0042】アクリルゴム粒子:粒径:0.2μm Ep828;エピコート828 ビスフェノールA型エ
ポキシ樹脂(油化シェルエポキシ株式会社製) EP807:エピコート807 ビスフェノールF型エ
ポキシ樹脂(油化シェルエポキシ株式会社製)Acrylic rubber particles: Particle size: 0.2 μm Ep828; Epicoat 828 Bisphenol A type epoxy resin (manufactured by Yuka Shell Epoxy) EP807: Epicoat 807 Bisphenol F type epoxy resin (manufactured by Yuka Shell Epoxy)
【0043】BPA328;架橋構造を有するアクリル
ゴムとビスフェノールA型液状エポキシ樹脂との反応
物。推定ゴム含有量=20%((株)日本触媒) PG−207:ポリプロピレングリコールジグリシジル
エーテル(東都化成株式会社製)BPA328: A reaction product of an acrylic rubber having a crosslinked structure and a bisphenol A type liquid epoxy resin. Estimated rubber content = 20% (Nippon Shokubai Co., Ltd.) PG-207: polypropylene glycol diglycidyl ether (manufactured by Toto Kasei Co., Ltd.)
【0044】PT−2PG:長鎖2塩基酸グリシジルエ
ステル(岡本製油株式会社製) YH−300:エポトートYH−300 三官能脂肪族
ポリグリシジルエーテル(東都化成株式会社製)PT-2PG: Long-chain dibasic acid glycidyl ester (manufactured by Okamoto Oil Co., Ltd.) YH-300: Epotote YH-300 trifunctional aliphatic polyglycidyl ether (manufactured by Toto Kasei Co., Ltd.)
【0045】THPE:テトラヒドロ無水フタル酸 ET−100:エタキュアー100(エチルコーポレー
ション)THPE: Tetrahydrophthalic anhydride ET-100: Ethacure 100 (Ethyl Corporation)
【0046】XN−1045:酸無水物系硬化剤(Ci
ba Geigy社製) 2E4MZ:2-エチル-4-メチルイミダゾール(四国
化成工業)XN-1045: acid anhydride curing agent (Ci
ba Geigy) 2E4MZ: 2-ethyl-4-methylimidazole (Shikoku Chemicals)
【0047】(TMA−Tg)各組成のエポキシ樹脂組
成物を120℃×1時間の条件で硬化して硬化樹脂板を
得た。この樹脂板から試験片を切り出し、TAインスツ
ルメント製 943TMAを用いて、エクスパンジョン
モード(荷重1g)、昇温速度10℃/分の条件でTM
A−Tgを測定した。(TMA-Tg) The epoxy resin composition of each composition was cured at 120 ° C. for 1 hour to obtain a cured resin plate. A test piece was cut out from the resin plate, and TM was used under the conditions of an expansion mode (load 1 g) and a temperature rising rate of 10 ° C./min using 943TMA manufactured by TA Instruments.
A-Tg was measured.
【0048】(RTM成形評価)あらかじめCFスリー
ブを配置した円筒系型を120℃に加熱した後、後述の
方法で調整したエポキシ樹脂組成物を注入した。1時間
後に成形物を取り出し、成形物の表面状態および炭素繊
維織布に直角に切断、研磨した断面を観察した。(RTM Molding Evaluation) After heating a cylindrical mold in which a CF sleeve was previously arranged to 120 ° C., an epoxy resin composition adjusted by a method described later was injected. After one hour, the molded product was taken out, and the surface state of the molded product and a cross section cut and polished at right angles to the carbon fiber woven fabric were observed.
【0049】良好:表面が平滑であり、断面の顕微鏡観
察において、アクリルゴムが均一に分散しており、層間
にボイドもクラックも見られない。Good: The surface is smooth, the acrylic rubber is uniformly dispersed in the cross-section by microscopic observation, and no voids or cracks are observed between the layers.
【0050】不良:表面にピンホールがあり、断面の顕
微鏡観察において、層間にボイドやクラックが観察され
る。Poor: There are pinholes on the surface, and voids and cracks are observed between layers in a microscopic observation of the cross section.
【0051】(制振性測定)固有減衰能(S.D.
C.)は次のようにして測定した。硬化した樹脂板から
150mm長×12.5mm巾×0.9mm厚の試験片
を切り出し、一端より30mmをつかんで片持固定し、
高さ50cmから35gのおもりを先端部に落下打撃さ
せて生じる振動減衰挙動を同試験片の片持固定した一端
から50mm(つかみ部から20mm)のところに長手
方向に取り付けた歪みゲージにより電気信号に変換し測
定した。得られた減衰波形より、下式にもとづき固有減
衰能を求めた。(Measurement of Vibration Suppression) Intrinsic damping capacity (SD
C. ) Was measured as follows. From the cured resin plate, cut out a test piece of 150 mm length x 12.5 mm width x 0.9 mm thickness, grabbed 30 mm from one end and fixed cantilevered,
Vibration damping behavior caused by dropping and hitting a weight having a height of 50 cm to 35 g at the tip is measured by an electric signal using a strain gauge attached in the longitudinal direction at 50 mm (20 mm from the grip) from the cantilevered end of the test piece. And measured. From the obtained attenuation waveform, the intrinsic attenuation ability was obtained based on the following equation.
【0052】δ=1/n・In(A0/An) A0:衝撃直後の振幅の大きさ An:衝撃後のn番目の振幅の大きさ S.D.C.(%)=(1−δe-2)×100Δ = 1 / n · In (A 0 / A n ) A 0 : magnitude of amplitude immediately after impact An : magnitude of n-th amplitude after impact D. C. (%) = (1−δe −2 ) × 100
【0053】(FRPの3点曲げ試験)各組成のエポキ
シ樹脂組成物を三菱レイヨン株式会社の炭素繊維TR−
40、フィラメント数3000本を経緯とも12.5本
/インチで製織した目付け200g/m2の炭素繊維織
布のクロスTR3110に含浸し、あらかじめ120℃
に加熱したプレス機で圧力:1kgf/cm2、時間:
1時間で硬化成形してFRP板(炭素繊維の体積含有率
40体積%)を得た。このFRP板から試験片を切り出
し、ASTM D790−81に準拠する3点曲げ試験
を行った。(FRP Three-Point Bending Test) Epoxy resin compositions of each composition were prepared using carbon fiber TR-
40, 3,000 filaments were impregnated into a cloth TR3110 of a carbon fiber woven fabric with a basis weight of 200 g / m 2 woven at 12.5 filaments / inch both in the course and at 120 ° C.
Pressure in a press machine heated to 1 kgf / cm 2 , time:
It was cured and molded in one hour to obtain an FRP plate (volume content of carbon fiber: 40% by volume). A test piece was cut out from the FRP plate and subjected to a three-point bending test according to ASTM D790-81.
【0054】(実施例1〜22、比較例1〜6)
(A)、(B)、(C)および(D)を表1に示した組
成でそれぞれ(A)と(C)を均一に混合したものに
(B)および(D)を加え均一に混合した。(Examples 1 to 22, Comparative Examples 1 to 6)
(A), (B), (C) and (D) were uniformly mixed with (A) and (C) according to the composition shown in Table 1, and then (B) and (D) were added and mixed uniformly. did.
【0055】こうして得たエポキシ樹脂組成物の30℃
における粘度、RTM成形性,S.D.C.、FRP3
点曲げの強度、弾性率およびTMA−Tgを評価し、表
1および2に示した。30 ° C. of the epoxy resin composition thus obtained
, RTM moldability, S.P. D. C. , FRP3
The point bending strength, elastic modulus and TMA-Tg were evaluated and are shown in Tables 1 and 2.
【0056】[0056]
【表1】 [Table 1]
【0057】[0057]
【表2】 [Table 2]
【0058】[0058]
【発明の効果】本発明のエポキシ樹脂組成物は、低粘度
で硬化性に優れ、粘度の安定性にも優れ、制振性能、機
械的強度および耐熱性に優れる、複合材料に適したエポ
キシ樹脂組成物である。The epoxy resin composition of the present invention has a low viscosity, has excellent curability, has excellent viscosity stability, and has excellent vibration damping performance, mechanical strength and heat resistance, and is suitable for composite materials. A composition.
Claims (3)
脂肪族エポキシ樹脂40〜90重量部、(C)脂肪族エ
ポキシ樹脂以外のエポキシ樹脂5〜70重量部、(D)
常温で液体の酸無水物系硬化からなり、かつ(A)ない
し(C)の樹脂成分に占める(B)の重量比が0.4〜
0.9であるるエポキシ樹脂組成物。(A) 2 to 15 parts by weight of rubber particles, (B)
40 to 90 parts by weight of an aliphatic epoxy resin, (C) 5 to 70 parts by weight of an epoxy resin other than the aliphatic epoxy resin, (D)
It is composed of an acid anhydride-based hardened liquid at normal temperature, and the weight ratio of (B) to the resin components (A) to (C) is 0.4 to 0.4.
An epoxy resin composition which is 0.9.
減衰能が35%以上である請求項1記載のエポキシ樹脂
組成物。2. The epoxy resin composition according to claim 1, wherein the resin cured at 120 ° C. for 1 hour has an intrinsic damping ability of 35% or more.
樹脂以外のエポキシ樹脂をあらかじめ予備反応した請求
項1または2記載のエポキシ樹脂組成物。3. The epoxy resin composition according to claim 1, wherein (A) the rubber particles and (C) an epoxy resin other than the aliphatic epoxy resin are preliminarily reacted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19634096A JP3810142B2 (en) | 1996-07-25 | 1996-07-25 | Epoxy resin composition for fiber reinforced composite materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19634096A JP3810142B2 (en) | 1996-07-25 | 1996-07-25 | Epoxy resin composition for fiber reinforced composite materials |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1036638A true JPH1036638A (en) | 1998-02-10 |
| JPH1036638A5 JPH1036638A5 (en) | 2004-07-29 |
| JP3810142B2 JP3810142B2 (en) | 2006-08-16 |
Family
ID=16356212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19634096A Expired - Fee Related JP3810142B2 (en) | 1996-07-25 | 1996-07-25 | Epoxy resin composition for fiber reinforced composite materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3810142B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6764414B2 (en) | 2001-08-31 | 2004-07-20 | Sumitomo Rubber Industries, Ltd. | Golf club shaft |
| US6935969B2 (en) | 2001-10-11 | 2005-08-30 | Sri Sports Limited | Golf club shaft |
| JP2019167429A (en) * | 2018-03-22 | 2019-10-03 | 帝人株式会社 | Epoxy resin composition, prepreg, carbon fiber reinforced composite material and method for producing the same |
-
1996
- 1996-07-25 JP JP19634096A patent/JP3810142B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6764414B2 (en) | 2001-08-31 | 2004-07-20 | Sumitomo Rubber Industries, Ltd. | Golf club shaft |
| US6935969B2 (en) | 2001-10-11 | 2005-08-30 | Sri Sports Limited | Golf club shaft |
| JP2019167429A (en) * | 2018-03-22 | 2019-10-03 | 帝人株式会社 | Epoxy resin composition, prepreg, carbon fiber reinforced composite material and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3810142B2 (en) | 2006-08-16 |
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