JPH104109A - Semiconductor device manufacturing method and cutting device used for manufacturing the same - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent the occurrence of a product defect, a production defect, or the like due to a dropped resin. After sealing a predetermined area of a lead frame having a plurality of leads with a resin to form a sealing body, a tie bar connecting the leads and a resin burr between the leads protruding from the sealing area are cut. Removing the lead, then cutting the lead, and then molding the lead, wherein the air vent portion resin is formed in an air vent region extending from a sealing region of the lead frame. Is cut and removed together with the cutting of the lead frame portion, and then the tie bars and the resin burrs between the leads are cut and removed. Before cutting the resin of the air vent portion resin, a high pressure gas is blown onto a lead frame having a sealing body to remove a resin block which is likely to fall off.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device and a cutting apparatus used for the manufacturing method, and more particularly, to a mold air vent when a predetermined region of a lead frame is sealed (molded) with a resin (resin). The present invention relates to a technique which is effective when applied to a technique for effectively removing a resin (air vent resin) which has flowed into and cured.

[0002]

2. Description of the Related Art In a semiconductor device such as an IC (integrated circuit device), a sealing structure using a resin is known as a sealing structure for sealing a semiconductor chip or the like.

[0003] A resin-sealed (resin package) type semiconductor device is manufactured using a lead frame. A predetermined area of the lead frame on which the fixing of the semiconductor chip and the wire bonding are completed is molded by a transfer molding apparatus. Then, after removing resin burrs protruding from the sealing region, a desired semiconductor device is manufactured by cutting and removing tie bars (dams) connecting leads, cutting leads, and forming leads.

[0004] The resin burr is a thin resin burr (resin flash) that oozes out from the mating surface of the mold and adheres to the front and back surfaces of the lead, and a resin burr formed in a region surrounded by the leads and dams and having a thickness substantially equal to the thickness of the lead frame. There is a thick resin burr (a resin burr between leads or a resin burr in a dam, hereinafter referred to as a resin burr between leads).

[0005] "VLSI Packaging Technology (Lower)" published by Nikkei BP, published on May 15, 1993, pages P41 to P43, describes deburring. According to the document, after molding, after removing burrs between leads and the surface of the leads (deburring step), exterior treatment such as solder plating, solder dip, tin plating, etc. is performed, and then lead molding (trimming and forming) ) Is described.
The deburring is performed by a high-pressure water method or a liquid honing method.

[0006] Further, the document describes that if the burrs are not removed, the burrs are peeled off after the exterior treatment, and the base material of the lead frame is exposed, so that the solder wettability and corrosion resistance of the outer leads are impaired. ing.

[0007]

SUMMARY OF THE INVENTION In the present applicant,
Instead of using the deburring work by the high-pressure water method or the liquid honing method as described in the above-mentioned document, the thick resin burrs (resin burrs between leads) generated between the leads after the completion of molding are cut and the leads are shortened to shorten the process. The tie bars (dams) connecting the dies are cut, and then the leads are cut. The cutting and removal of the resin burrs between the leads, the tie bar cutting, and the lead cutting are performed by a cutting device.

In addition, the semiconductor device which has been cut off from the lead frame and becomes a single product is set on a molding apparatus to form leads protruding from the package.

[0009] It is known that detachment due to cracking of resin burrs causes product production defects such as defective cutting, defective molding and transport problems as described below.

That is, when resin burrs fall off from the lead frame and adhere to the lead frame (lead) or package, the cutting die generates a step due to the presence of the resin adhered when the lead frame is clamped, and the package at the base of the lead is formed. A large force acts on the portion to cause cracking, chipping, and the like in the package. FIG. 16 shows a state in which cracks 3 have occurred in a sealing body (package) 2 partially formed in the lead frame 1, and FIG. 17 shows a state in which chips 4 have occurred in the package 2. FIG.
In FIG. 6 and FIG. 17, 5 is a lead, 8 is a tie bar,
Reference numeral 12 denotes a flow cavity resin.

Further, the stress extends to the inside of the package, and cracks and cracks may occur in the semiconductor chip. These phenomena cause product defects.

The adhesion of resin burrs on a molding die is as follows:
This leads to deformation of the leads and poor adhesion of resin burrs, which may cause product manufacturing defects. FIG. 18 shows the semiconductor device 7 in which the lead 5 is bent (bent lead 6: poor lead bending).
FIG. 19 shows the semiconductor device 7 in which the falling resin (foreign matter) 9 adheres to the lead 5. Note that the semiconductor device 7 is an SOJ (Smal
l Outline J Leaded) structure.

Further, if the detached resin adheres to the transfer rail in the mold and the transfer rail of the apparatus, the transfer failure is caused, and the mold and the lead frame (semiconductor device) are damaged. Causes manufacturing defects.

Further, when looking at other post-processes, the adhesion of the resin mass causes poor contact between the socket and the lead in the screening process.

Therefore, in the present applicant, an operator manually blows air (air blow) on a lead frame to blow off resin burrs that are easy to fall off, and then starts cutting and molding. This means that the deburring work by the high-pressure water method or the liquid honing method must be a single step, but the resin burr removal work by air blow at the cutting device installation location does not have to be an independent step, The manufacturing process of the semiconductor device can be shortened, and the manufacturing cost of the semiconductor device can be reduced.

[0016] However, the resin portion which is easy to fall off may not be removed by the air blow.

The present inventor has analyzed and examined the generation state of the dropped resin and found the following facts.

The lead frame is 0.15 to 0.2 mm
The one having the above thickness is used. Therefore, thick resin burrs (resin burrs between leads) surrounded by the leads and dams and connected to the package are difficult to peel off unless a large force such as bending is applied to the lead frame.

On the other hand, resin burrs (also referred to as resin flash) which ooze out from the mating surface of the mold and are formed on the front and back surfaces of the leads have a large amount of resin and are extremely thin, so that they are difficult to peel off from the leads.

On the other hand, the mold is provided with an air vent to allow air in the cavity to escape to the outside. Therefore, the resin flowing into the air vent is also cured.
Since the depth (height) of the air vent resin cured in the air vent is as thin as about 30 to 40 μm, the thickness is small and the mechanical strength is small. Therefore, cracks and chips easily occur and fall off.

Therefore, the inventor of the present invention first cuts and removes the easily detachable air vent portion resin in a series of cutting operations to prevent a defective product production due to the detachment of the air vent portion resin during subsequent cutting. The present invention was made with this in mind.

An object of the present invention is to provide a method of manufacturing a semiconductor device and a cutting apparatus used for manufacturing the semiconductor device, which can prevent the occurrence of a product defect, a manufacturing defect, or the like due to a falling resin.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0024]

The following is a brief description of an outline of typical inventions disclosed in the present application.

(1) After sealing a predetermined area of a lead frame having a plurality of leads with a resin to form a sealing body, a tie bar connecting the leads and a resin burr between the leads protruding from the sealing area. Cutting the lead, thereafter cutting the lead, and then molding the lead, wherein an air vent formed in an air vent region extending from a sealing region of the lead frame. After the partial resin is cut and removed together with the cutting of the lead frame portion, the tie bars and the resin burrs between the leads are cut and removed. Before cutting the resin of the air vent portion resin, a high pressure gas is blown onto a lead frame having a sealing body to remove a resin block which is likely to fall off.

(2) In the method of manufacturing the semiconductor device according to the means (1), a flow cavity resin is formed on the lead frame. The lead frame is cut and removed at the same time.

(3) In the configuration of the means (2), transfer molding is performed so that the air vent resin is connected to the flow cavity resin. The resin of the air vent portion resin is formed to have a thickness of about several 100 μm.

(4) The resin bur between the leads of the lead frame whose predetermined portions are sealed by transfer molding and the tie bars connecting the leads and the like are cut and removed by a single cutting mechanism or a separate cutting mechanism. A cutting device for separating the lead frame from the lead frame,
An air vent resin cutting and removing mechanism for first cutting and removing a region including the air vent resin of the lead frame is provided. The air vent resin cutting and removing mechanism is configured to simultaneously cut the air vent resin and the flow cavity resin formed on the lead frame. Each punch of each cutting mechanism such as the air vent resin cutting / removing mechanism is configured to be simultaneously operated by a single hydraulic cylinder or pneumatic cylinder.

According to the above-mentioned means (1), after the resin at the air vent portion which is easy to fall off is first cut and removed, the resin burrs and tie bars between the leads are cut and removed, and the leads are cut. Since there is no air vent resin in the lead frame at the time of removing resin burrs and tie bars, and at the time of cutting leads, there is no scattering of resin blocks, and it is possible to suppress the occurrence of product manufacturing defects caused by falling resin.

Further, since the air vent portion resin is cut and removed while sticking to the lead frame portion, it does not become a small lump and is not widely scattered, and does not contaminate the product and the periphery of the cut portion.

Further, since high-pressure gas is blown onto the entire lead frame before cutting the resin at the air vent portion, the resin lump that easily falls off is removed, and the fallen resin does not adhere to the lead frame or the like or the cutting device, and the resin is further dropped. Product manufacturing defects caused by the resin can be prevented.

According to the means (2), since the flow cavity portion resin and the air vent portion resin are cut and removed at the same time, the cutting and removal can be efficiently performed.

According to the means (3), the air vent resin and the flow cavity resin are connected,
In addition, since the thickness of the resin at the air vent portion is as large as about several hundreds of micrometers, cracks are less likely to occur and fall off, and the rate of occurrence of the falling resin is further reduced, so that the resin can be cut and removed from the lead frame.

According to the means (4), the cutting and removal of the air vent portion resin is performed first before cutting such as tie bar cutting and resin-burr cutting between leads.
At the time of subsequent cutting, the air vent portion resin does not exist on the lead frame, so that the resin lump does not scatter and the occurrence of product manufacturing defects due to the dropped resin can be suppressed.

[0035]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and their repeated description will be omitted.

(Embodiment 1) FIGS. 1 to 12 are views relating to the manufacture of a semiconductor device according to an embodiment (Embodiment 1) of the present invention, and FIG. 1 shows a cut and removed state of an air vent resin. FIG. 2 is a perspective view of a lead frame shown in FIG. 2, FIG. 2 is a flowchart showing a cutting process in the manufacture of a semiconductor device, and FIG.
Is a perspective view showing a lead frame used in the manufacture of a semiconductor device, FIG. 4 is a perspective view showing a part of the lead frame, FIG. 5 is a perspective view showing a part of the lead frame after transfer molding, and FIG. FIG. 7 is a perspective view of the lead frame showing a state in which the air vent resin is cut and removed.

FIG. 8 is a schematic diagram showing the appearance of the cutting device, FIG. 9 is a schematic diagram showing a resin cutting and removing mechanism of an air vent portion of the cutting device, and FIG. 10 is a schematic cross section showing a resin cutting and removing mechanism of the air vent portion. FIG. 11 and FIG. 11 are perspective views of the lead frame from which the flow cavity resin and the resin burrs between the leads have been cut and removed, and FIG. 12 is a perspective view showing a cutting die for cutting and removing the flow cavity resin and the resin burs between the leads.

In the first embodiment, as shown in FIG.
An example in which the present invention is applied to an OJ type semiconductor device will be described.

In manufacturing a semiconductor device, first, FIG.
A lead frame 1 as shown in FIG. The lead frame 1 is formed by etching or patterning an iron-nickel alloy plate, a copper plate, a copper alloy plate, or the like having a thickness of about 0.15 to 0.2 mm by etching or precision press.

The lead frame 1 includes a pair of outer frames 16 extending in parallel, and an inner frame 17 orthogonal to the pair of outer frames 16 and connecting the pair of outer frames 16. A rectangular support plate (tab) is provided at the center of a frame formed by the pair of outer frames 16 and two adjacent inner frames 17.
19 are located. This support plate 19 is connected to the outer frame 16.
Is supported by a support lead 20 extending from the inside.
The support lead 20 is bifurcated on the way, and the bifurcated side is fixed to the outer frame 16. Further, as shown in FIG. 4, a V-shaped groove (notch) 21 is provided on the back surface of the support lead 20 along the dividing direction to facilitate the division.

The central portion of the outer frame 16 where the support lead 20 extends is wide. One wide portion 22 is provided with a rectangular hole 23 for forming a flow cavity resin. The flow cavity resin formed by transfer molding has the hole 2
3 is formed inside. A support lead 24 is provided along the center of the hole 23 to support the flow cavity resin. Although not shown, a V-shaped groove is also provided at the base of the support lead 24 along the dividing direction to facilitate division. This groove is provided on the back surface of the lead frame 1.

On the other hand, a plurality of leads 5 extend from the inside of the inner frame 17 toward the inside of the frame. These leads 5 are parallel to the outer frame 16. The lead 5 is supported by a tie bar 8 in the middle. One end of the outermost tie bar 8 is connected to the wide portion 22 of the outer frame 16.

Further, some of the leads 5 are bent closer to the center of the frame than the tie bars 8, and the leading ends thereof face the vicinity of the support plate 19.

On the other hand, a guide hole 27 is provided in the outer frame 16 of the lead frame 1. This guide hole 27
Is used as a guide for transferring and positioning the lead frame 1. Note that the lead frame 1 is plated at desired locations as needed.

Next, a method of manufacturing an SOJ type semiconductor device using such a lead frame 1 will be described.

As shown in FIG. 3, the semiconductor chip 30 is fixed on the support plate 19 of the lead frame 1. After that, the electrode (not shown) of the semiconductor chip 30 and the tip of the lead 5 are connected by a conductive wire 31.

Next, a sealing body (package) 2 is formed on a predetermined portion of the lead frame 1 by a conventional transfer molding apparatus. As shown in FIG. 5 and FIG.
Introductory resin 35, air vent resin 1
1. The flow cavity introduction path resin 36 is formed.
The package 2, the flow cavity resin 12, and the air vent resin 11 are provided on both the front and back surfaces of the lead frame 1. The introduction path resin 35 and the flow cavity introduction path resin 36 are provided on the back surface (lower surface) of the lead frame 1. Is provided. The thickness of the air vent resin 11 is about 30 to 40 μm.

The introduction path resin 35 is a resin cured inside a resin introduction path such as a runner or a gate for guiding a resin melted in a cavity of a mold for forming the package 2. The flow cavity introduction path resin 36 is a resin cured in the resin introduction path that connects the cavity and the flow cavity.

As shown by dotted lines in FIG.
The resin burrs 10 are formed between the leads 5 and between the leads 5 and between the leads 5 and the support leads 20.

Next, such a lead frame 1 is cut. For example, as shown in the flowchart of FIG. 2, after the start of the work, the cutting of the air vent portion resin (Step 101), the cutting of the unnecessary resin portion (Step 102), and the cutting of the tie bar (Step 10)
3), lead cutting (step 104) and the operation are completed. In the present embodiment, the unnecessary resin portion cutting in step 102 is simultaneous cutting and removal of the flow cavity portion resin 12 and the resin burr 10 between the leads.

FIG. 8 is a schematic diagram showing the outline of the cutting device 40. The air vent portion resin cutting and removing mechanism 41, the unnecessary resin portion cutting mechanism 42, the tie bar cutting mechanism 43, and the lead cutting mechanism 44 are sequentially arranged from left to right. It is arranged.
Although not shown, the lead frame 1 is configured to be sequentially loaded from the left side of the cutting device 40, to perform a predetermined cutting process at each processing station of each mechanism, and to be unloaded from the right side.

Each of the mechanisms has a die 41a, 42a, 4
3a, 44a and punches 41b, 42b, 43b, 4
4b is provided. The punches 41b, 42b, 4
3b and 44b are fixed to the lower surface of the single movable roof 45. The movable roof 45 is provided with a hydraulic cylinder 48 mounted on an upper platen 47 disposed above a column 46.
Is fixed to the tip of the piston 49. Accordingly, the punches 41b, 42b, 43b, 44b are lowered by one downward and upward operation of the hydraulic cylinder 48, and one cutting operation is completed. The hydraulic cylinder may be a pneumatic cylinder.

FIG. 9 is a schematic exploded perspective view showing a part of a resin cutting / removing mechanism 41 for cutting the lead frame 1 firstly. The punch 41b which descends relatively to the die 41a is a punch guide 41.
The lead frame 1 is cut by being guided by c. As shown in FIG. 1, the punch 41 b has a structure in which two air vent resin portions 11 formed on the surface of the lead frame 1 are cut off while cutting a part of the lead frame 1. In FIG. 1, a hatched rectangular portion is a cut removal area 50. That is, in the resin cutting and removing mechanism 41 of the air vent portion, as shown in FIG. 10, the cutting and removing area 50 (see FIG. 1) of the lead frame 1 placed on the die 41a is punched by the punch 41b. The punched-out piece 51 is removed to a predetermined position by a vacuum vacuum mechanism (not shown). In the punching, as shown in FIG. 7, the lead frame 1 is cut so as to lack the wide portion 22 and the tie bar 8 is divided.

This air vent resin cutting and removing mechanism 4
1, the lead frame 1 is provided with a die 41a and a punch 41b.
Before releasing the clamp, the lead frame portion surrounding the air vent resin 11 is punched out.
Therefore, even if a force is applied to the lead frame 1 by the clamp and a crack occurs in the air vent portion resin 11, the air vent portion resin 11 is pushed together with the punched pieces 51 into the closed space by the punch 41 b. In addition, since the resin mass is removed at a predetermined location by the vacuum vacuum, the resin mass does not adhere to the lead frame 1 or the package 2.

In the cutting of the lead frame portion by the air vent resin cutting / removing mechanism 41,
Since the cut removal area 50 extends into the hole 23 of the lead frame 1, the lead frame portion 52 between the flow cavity resin 12 and the package 2 has a structure supported only by the support leads 24.

Next, the flow cavity resin 12 and the air vent resin 11 are cut and removed by the unnecessary resin cutting mechanism 42 (see FIG. 11). At this time, since the air vent resin 11 has already been removed,
There is no contamination of the dropped resin caused by cracking and chipping of the air vent resin 11.

The flow cavity resin 12 is formed in the hole 23 of the lead frame 1 and has a structure supported only by support leads 24 provided across the hole 23. Further, as described above, the lead frame portion 52 between the flow cavity resin 12 and the package 2 is formed.
Are supported only by the support leads 20. At the root of the package 2 of the support lead 20, as shown in FIG. 12, a groove 21 is provided along the dividing direction so as to cause stress concentration, and although not shown, the support lead 24 is also provided. A groove is provided at the base of the wide portion 22 so as to cause stress concentration along the dividing direction.

Therefore, as shown in FIG. 12, the cutting portion (die 42a and punch 42) of the unnecessary resin portion cutting mechanism 42 is used.
In b), the structure is such that the flow cavity resin 12 and the lead frame portion 52 are dropped off. That is, the die 42 a has a support portion 53 that supports the package 2 and a support portion 54 that supports the wide portion 22 of the lead frame 1. The punch 42b is provided between the flow cavity resin 12 and the lead frame portion 5.
It has a drop-off portion 54 for dropping 2.

The unnecessary resin portion cutting mechanism 42 cuts and removes the resin burr 10 between leads simultaneously with cutting and removing the flow cavity portion resin 12. Therefore, although not shown, the die 42a is provided with a support portion for supporting each lead, and the punch 42b is provided with a cutting blade 55 for cutting and removing the resin burr 10 between the leads.

The dropped flow cavity resin 12 and the like are removed to a predetermined location by a vacuum vacuum mechanism.

In the cutting and removing of the resin in the air vent portion, since the detached resin caused by the resin in the air vent portion 11 does not adhere to the lead frame 1 or the package 2, the lead frame is not cut in the unnecessary resin portion. When 1 is clamped, no defective clamping due to the adhesion of the falling resin does not occur, and no package crack or semiconductor chip crack occurs, and a highly reliable semiconductor device can be manufactured with a high yield. Further, since the falling resin does not adhere to the surface of the package 2, it is possible to prevent the occurrence of indentations and cracks on the package surface due to the adhesion of the falling resin.

Next, the tie bar 8 supporting the lead 5 is cut and removed by the tie bar cutting mechanism 43. The portion of the tie bar 8 that has been cut and removed is removed to a predetermined location by a vacuum vacuum mechanism. At this time, the air vent resin 11
Has already been removed, there is no contamination of the lead frame of the dropped resin caused by cracking and chipping of the air vent portion resin 11. In this tie-bar cutting, since the falling resin is not attached to the lead frame 1 or the package 2, no clamping failure occurs when the lead frame 1 is clamped, and an impression of the lead occurs due to the presence of the falling resin. No bending occurs.

Next, each lead 5 is cut at a predetermined position by the lead cutting mechanism 44. At this time, since the air vent resin 11 has already been removed, there is no contamination of the lead frame of the dropped resin caused by cracking and chipping of the air vent resin 11. In this lead cutting, since the falling resin does not adhere to the lead frame 1 or the package 2, no clamping failure occurs when the lead frame 1 is clamped, and the lead resin causes dents on the lead due to the presence of the falling resin. No bending occurs.

In the cutting device 40, the lead frame 1, the package 2, the cutting / molding die, the transport mechanism, etc.
Since the detached resin does not adhere due to the air vent resin 11, no product failure such as semiconductor chip breakage or package breakage occurs. Further, breakage of the cutting / molding die due to the adhesion of the falling resin does not occur. In addition, since the detachable resin does not adhere to the drive portion of the lead frame transport mechanism, defective transport of the lead frame does not occur, and the operating rate of the cutting / forming apparatus does not decrease. As a result, it is possible to achieve a reduction in product cost from an improvement in manufacturing yield and an improvement in productivity.

On the other hand, a semiconductor device having leads 5 extending straight is manufactured by cutting the leads. Therefore, the individualized semiconductor device is mounted on a molding device (not shown), and the lead is molded into a desired shape. In the case of the first embodiment, the lead is formed into a J-lead structure.
At this time, since the detached resin does not adhere to the leads or the package, lead deformation and resin bur adhesion failure do not occur.

According to the first embodiment, in cutting / molding after transfer molding, resin lumps which are easy to fall off by air blow before cutting / forming start. Further, at the time of cutting and molding, since the air vent resin which is liable to fall off resin is firstly cut and removed, it is possible to prevent a product defect due to the adhesion of the falling resin and to improve the operability of the cutting and molding apparatus.

Further, in the manufactured semiconductor device, since the detached resin does not adhere to the leads, the contact state between the socket and the leads is improved in the selection step, and a stable selection measurement test can be achieved.

In this embodiment, the inter-lead resin burr 10 is cut and removed at the same time as the flow cavity resin 12. However, the inter-lead resin burr 10 may be cut at the same time as the tie bar 8.

(Embodiment 2) FIG. 13 is a plan view of a lead frame showing a cut-off region in manufacturing a semiconductor device according to another embodiment (Embodiment 2) of the present invention.

In the second embodiment, as shown in FIG.
A region including the air vent portion resin 11 and the flow cavity portion resin 12 is cut and removed as a cut and removed region 50. In the second embodiment, in addition to the effects of the first embodiment, there is an effect that the cut-removed area is increased, and the cut-removed pieces are reliably discarded and collected.

(Embodiment 3) FIG. 14 is a perspective view showing a transfer-molded lead frame in the manufacture of a semiconductor device according to another embodiment (Embodiment 3) of the present invention, and FIG. It is a top view of the lead frame which shows the cutting removal area | region in manufacture of an apparatus.

In the third embodiment, the air vent resin 1
1 is made thicker. Although not shown, in order to make the air vent portion resin 11 thicker, the mold has a structure in which an air vent communicates with the flow cavity. That is, the depth (height) of the air vent is
10 times the thickness of the first embodiment, that is, 400 times
５００500 μm, and the thickness of the air vent resin 11 is 400-500 μm. As a result, the mechanical strength of the air vent resin 11 is improved, cracks and chipping do not occur, and the air vent resin 11 can be reliably cut and removed together with the flow cavity resin 12 while sticking to the lead frame.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

[0074]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) In cutting / molding after transfer molding, since the air vent resin which is likely to fall off at the beginning of cutting is cut and removed, cracking or chipping of the package due to the adhesion of the falling resin can be prevented. The yield can be improved and the reliability of the semiconductor device can be improved.

(2) In the cutting / molding after transfer molding, since the air vent resin which is likely to fall off at the beginning of cutting is cut and removed, it is possible to prevent breakage of the cutting / molding mold due to the adhesion of the falling resin. Can be. In particular, since the punched piece is dropped into a closed space and removed at a predetermined position by vacuum vacuum, breakage of the cutting die can be prevented.

(3) In cutting / molding after transfer molding, since the air vent resin which tends to fall off at the beginning of cutting is cut and removed, driving of a cutting / molding device such as a transport mechanism caused by the adhesion of the falling resin. Since the occurrence of system troubles can be prevented, it is possible to improve the productivity by improving the operation rate of the apparatus.

(4) In cutting and molding after transfer molding, air blowing and cutting and molding are performed before supply of the lead frame to the cutting device, so that an independent resin deburring step as in the conventional case is not required. From
The reduction in the number of steps can reduce the manufacturing cost of the semiconductor device.

(5) In the manufactured semiconductor device, since the detached resin does not adhere to the lead, the contact state between the socket and the lead is improved in the selection process, and a stable selection measurement test can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a lead frame showing a cut and removed state of an air vent resin in manufacturing a semiconductor device according to an embodiment (Embodiment 1) of the present invention;

FIG. 2 is a flowchart showing a cutting step in manufacturing the semiconductor device of the first embodiment.

FIG. 3 is a perspective view showing a lead frame used in manufacturing the semiconductor device of the first embodiment.

FIG. 4 is a perspective view showing a part of a lead frame used in the first embodiment.

FIG. 5 is a perspective view showing a part of the lead frame after transfer molding in manufacturing the semiconductor device of the first embodiment.

FIG. 6 is a front view showing a part of the lead frame after transfer molding in manufacturing the semiconductor device of the first embodiment.

FIG. 7 is a perspective view of the lead frame showing a state where the air vent resin is cut and removed in the manufacture of the semiconductor device of the first embodiment.

FIG. 8 is a schematic diagram illustrating an appearance of the cutting device according to the first embodiment.

FIG. 9 is a schematic view showing an air vent portion resin cutting and removing mechanism of the cutting device of the first embodiment.

FIG. 10 is a schematic cross-sectional view illustrating a resin cutting and removing mechanism of an air vent portion of the cutting device according to the first embodiment.

FIG. 11 is a perspective view of the lead frame from which the flow cavity resin and the resin burrs between the leads have been cut and removed in the manufacture of the semiconductor device of the first embodiment.

FIG. 12 is a perspective view showing a cutting die for cutting and removing the resin in the flow cavity portion and the resin burr between the leads in manufacturing the semiconductor device of the first embodiment.

FIG. 13 is a plan view of a lead frame showing a cut removal region in the manufacture of a semiconductor device according to another embodiment (Embodiment 2) of the present invention.

FIG. 14 is a perspective view showing a transfer-molded lead frame in manufacturing a semiconductor device according to another embodiment (Embodiment 3) of the present invention.

FIG. 15 is a plan view of the lead frame showing a cutting removal region in the manufacture of the semiconductor device of the third embodiment.

FIG. 16 is a perspective view showing a state in which cracks have occurred in the package.

FIG. 17 is a perspective view showing a state in which chipping has occurred in the package.

FIG. 18 is a perspective view showing a semiconductor device in which a lead bending defect has occurred.

FIG. 19 is a perspective view showing a semiconductor device in which resin burrs adhere to leads.

[Explanation of symbols]

1 ... lead frame, 2 ... sealed body (package), 3 ...
Crack, 4 ... chipping, 5 ... lead, 6 ... bending lead,
7 ... Semiconductor device, 8 ... Tie bar, 9 ... Removed resin, 10
... Resin burrs between leads, 11 ... Air vent resin
12: Flow cavity resin, 16: Outer frame, 17 ...
Inner frame, 20: support lead, 21: groove, 22: wide part, 2
3 ... Hole, 24 ... Support lead, 27 ... Guide hole, 30 ... Semiconductor chip, 31 ... Wire, 35 ... Introduction path resin, 36
... Flow cavity introduction path resin, 40 ... Cutting device, 4
1. Air vent portion resin cutting and removing mechanism, 41a, 42
a, 43a, 44a ... die, 41b, 42b, 43b,
44b: punch, 41c: punch guide, 45: movable roof, 46: column, 47: upper platen, 50: cutting and removing area, 51: punched piece, 52: lead frame part,
54 ... drop-off part, 55 ... cutting blade.

Claims (8)

[Claims] After sealing a predetermined area of a lead frame having a plurality of leads with a resin to form a sealing body, a tie bar connecting the leads and a resin burr between the leads protruding from the sealing area are removed. A method for manufacturing a semiconductor device, comprising cutting and removing, then cutting the lead, and then molding the lead, wherein an air vent portion is formed in an air vent region extending from a sealing region of the lead frame. A method of manufacturing a semiconductor device, comprising cutting and removing a resin together with cutting of a lead frame portion, and then cutting and removing the tie bar and the resin burr between leads. 2. A method for manufacturing a semiconductor device, comprising forming a flow cavity portion resin on the lead frame, wherein the flow cavity portion resin and the air vent portion resin are simultaneously removed by cutting the lead frame. The method for manufacturing a semiconductor device according to claim 1, wherein: 3. The method of manufacturing a semiconductor device according to claim 2, wherein transfer molding is performed such that the air vent resin is connected to the flow cavity resin. 4. The thickness of the resin in the air vent portion is expressed by Formula 1.
4. The method according to claim 3, wherein the semiconductor device is formed to a thickness of about 00 [mu] m. 5. The resin frame according to claim 1, wherein high pressure gas is blown onto a lead frame having a sealing body before cutting the resin at the air vent portion to remove resin blocks which are easy to fall off.
A method for manufacturing a semiconductor device according to claim 4. 6. A resin mold between leads of a lead frame whose predetermined portion is sealed by transfer molding and a tie bar connecting the leads and the like are cut and removed by a single cutting mechanism or a separate cutting mechanism, and then the leads are removed. A cutting device for separating from a lead frame, wherein an air vent portion resin cutting and removing mechanism for first cutting and removing a region including an air vent portion resin of the lead frame is provided. 7. The air vent resin cutting / removing mechanism is configured to simultaneously cut the air vent resin and the flow cavity resin formed on the lead frame.
The cutting device as described. 8. The apparatus according to claim 1, wherein each punch of each cutting mechanism including the air vent portion resin cutting and removing mechanism is configured to be simultaneously operated by a single hydraulic cylinder or a pneumatic cylinder. 8. The cutting device according to 7.