JPH1045921A - Prepreg - Google Patents
PrepregInfo
- Publication number
- JPH1045921A JPH1045921A JP21688596A JP21688596A JPH1045921A JP H1045921 A JPH1045921 A JP H1045921A JP 21688596 A JP21688596 A JP 21688596A JP 21688596 A JP21688596 A JP 21688596A JP H1045921 A JPH1045921 A JP H1045921A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- glass cloth
- prepreg
- filaments
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 62
- 239000004744 fabric Substances 0.000 claims abstract description 53
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000002966 varnish Substances 0.000 claims abstract description 16
- 230000004913 activation Effects 0.000 claims abstract description 11
- 239000011356 non-aqueous organic solvent Substances 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000000470 constituent Substances 0.000 claims abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 3
- 239000012756 surface treatment agent Substances 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 13
- 238000003851 corona treatment Methods 0.000 abstract description 11
- 238000005470 impregnation Methods 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 230000008595 infiltration Effects 0.000 abstract 2
- 238000001764 infiltration Methods 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 208000028659 discharge Diseases 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DVYQJQWTQFEJTD-UHFFFAOYSA-N 2-(benzhydrylamino)ethyl-(3-trimethoxysilylpropyl)azanium chloride Chemical compound CO[Si](CCC[NH2+]CCNC(C1=CC=CC=C1)C2=CC=CC=C2)(OC)OC.[Cl-] DVYQJQWTQFEJTD-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- JMTRBTMJIYBHIV-UHFFFAOYSA-N 3-[dimethoxy(2-phenylethoxy)silyl]-n-ethenylpropan-1-amine Chemical compound C=CNCCC[Si](OC)(OC)OCCC1=CC=CC=C1 JMTRBTMJIYBHIV-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- HBFCKUCCFLNUHJ-UHFFFAOYSA-N 3-dimethoxysilylpropane-1-thiol Chemical compound CO[SiH](OC)CCCS HBFCKUCCFLNUHJ-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- OSSMYOQKNHMTIP-UHFFFAOYSA-N 5-[dimethoxy(methyl)silyl]pentane-1,3-diamine Chemical compound CO[Si](C)(OC)CCC(N)CCN OSSMYOQKNHMTIP-UHFFFAOYSA-N 0.000 description 1
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- FJXCBWXNRQPKNI-UHFFFAOYSA-N NCCCOCCCCOCCCC(CC[Si](OC)(OC)OC)N Chemical compound NCCCOCCCCOCCCC(CC[Si](OC)(OC)OC)N FJXCBWXNRQPKNI-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- NFCHYERDRQUCGJ-UHFFFAOYSA-N dimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[SiH](OC)CCCOCC1CO1 NFCHYERDRQUCGJ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000004335 litholrubine BK Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- CLYWMXVFAMGARU-UHFFFAOYSA-N n-benzyl-3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCNCC1=CC=CC=C1 CLYWMXVFAMGARU-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- -1 polyphenylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ガラスクロス補強
樹脂積層板用に使用される、ガラスクロス樹脂含浸プリ
プレグの改良に関する。特に、本発明は、高度な機械的
強度、電気特性、耐熱性が要求されるプリント配線基板
に有効に利用できるガラスクロス樹脂含浸プリプレグに
関する。The present invention relates to an improvement of a glass cloth resin impregnated prepreg used for a glass cloth reinforced resin laminate. In particular, the present invention relates to a glass cloth resin-impregnated prepreg that can be effectively used for a printed wiring board that requires high mechanical strength, electrical characteristics, and heat resistance.
【0002】[0002]
【従来の技術】従来から、プリント配線基板等に加工さ
れるガラスクロス補強樹脂積層板は、常温では高粘度
で、又は固形のエポキシ樹脂組成物等を有機溶剤に溶解
させて低粘度化した樹脂溶液(以下樹脂ワニスと称す
る)をガラスクロスに含浸させ、その有機溶媒を乾燥
し、樹脂を半硬化(Bステージ)状態にしたガラスクロ
ス樹脂含浸プリプレグ(以下プリプレグと称する)を製
造するプリプレグ製造工程、そのプリプレグを積層し、
加熱、加圧成形を行い、樹脂を硬化させてガラスクロス
強化樹脂積層板(以下積層板と称する)を得る積層板成
形工程で製造されている。2. Description of the Related Art Conventionally, a glass cloth reinforced resin laminate processed into a printed wiring board or the like has a high viscosity at room temperature or a resin having a low viscosity obtained by dissolving a solid epoxy resin composition or the like in an organic solvent. A prepreg manufacturing process in which a glass cloth is impregnated with a solution (hereinafter, referred to as a resin varnish), the organic solvent is dried, and a resin is impregnated into a semi-cured (B-stage) glass prepreg (hereinafter, referred to as a prepreg). , Laminating the prepreg,
It is manufactured by a laminate forming process of performing heat and pressure molding and curing the resin to obtain a glass cloth reinforced resin laminate (hereinafter referred to as a laminate).
【0003】しかし、近年、ガラスクロス強化プリント
配線基板において、高生産性、性能と品質向上などの面
から、製造条件は高速化、低圧成形の採用など厳しくな
る一方で、品質、性能は従来以上に高度な要求がなされ
るようになってきている。従って、製造方法及び原料、
すなわちガラスクロスや、マトリックス樹脂に要求され
る課題も非常に多い。[0003] However, in recent years, in terms of high productivity, performance and quality improvement, production conditions for glass cloth reinforced printed wiring boards have become more stringent, such as higher speeds and adoption of low-pressure molding, but the quality and performance have been higher than before. Are becoming increasingly demanding. Therefore, the production method and raw materials,
That is, there are many problems required for glass cloth and matrix resin.
【0004】例えば、プリント配線基板製造工程におい
ては、生産性向上のためプリプレグの製造スピ−ドを限
度一杯まで上げていることによる樹脂未含浸部分の発
生、またプレス成型時、寸法精度改良のための低圧成形
法の採用による樹脂未含浸部残留などの課題がある。さ
らに、近年、地球環境保護、作業環境の改善の面から、
従来の有機溶剤で溶解希釈した樹脂から、低溶剤または
無溶剤樹脂へのプリプレグ製造用樹脂の改良が試みられ
ているが、樹脂の粘度が高いことによるプリプレグの樹
脂未含浸部分の発生という同様の改良要求がある。For example, in the manufacturing process of a printed wiring board, the production speed of the prepreg is increased to the maximum for the purpose of improving the productivity, so that a resin-impregnated portion is generated. However, there is a problem that a resin-unimpregnated portion remains due to adoption of the low-pressure molding method. Furthermore, in recent years, from the aspect of global environmental protection and work environment improvement,
From a resin dissolved and diluted with a conventional organic solvent, an attempt has been made to improve the resin for prepreg production to a low-solvent or solventless resin, but the occurrence of a resin-impregnated portion of the prepreg due to the high viscosity of the resin has been attempted. There is a request for improvement.
【0005】これらの課題に対する解決方法として、ガ
ラスクロスに開繊加工を施したり、シランカップリング
剤とマトリックス樹脂との反応性を遅くする方法(特開
平4−178432号公報)などが提案されている。[0005] As a solution to these problems, there has been proposed a method of subjecting a glass cloth to fiber opening processing or a method of slowing down the reactivity between a silane coupling agent and a matrix resin (Japanese Patent Laid-Open No. 4-178432). I have.
【0006】[0006]
【発明が解決しようとする課題】本発明の目的は、ガラ
スクロスのフィラメント間への樹脂の含浸性を改善し、
積層板中のガラスクロスのフィラメント間にボイドがな
るべく残留することがないプリプレグを提供することで
ある。SUMMARY OF THE INVENTION An object of the present invention is to improve the resin impregnation between filaments of glass cloth,
An object of the present invention is to provide a prepreg in which voids do not remain as much as possible between filaments of glass cloth in a laminate.
【0007】[0007]
【課題を解決するための手段】本発明者は、上記課題を
解決するために鋭意検討を重ねた結果、表面を活性化処
理したガラスクロスを用いることにより、プリプレグ製
造時に樹脂未含浸部が発生しないことを見い出し、本発
明を完成するに至った。すなわち、本発明は: ガラスクロスに熱硬化性樹脂を含浸させてなるプリ
プレグにおいて、該樹脂ワニスの構成溶剤が非水系の有
機溶剤で、且つ表面を活性化処理したガラスクロスを用
いる、プリプレグを提供する。また、 表面の活性化処理がコロナ放電加工である点にも特
徴を有する。 活性化処理は、ガラスクロスが表面処理剤で化学処
理された後に行う点にも特徴を有する。Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventor has found that the use of a glass cloth whose surface has been subjected to an activation treatment results in the generation of a resin-unimpregnated portion during the production of a prepreg. They have found that they do not, and have completed the present invention. That is, the present invention provides: a prepreg obtained by impregnating a thermosetting resin into a glass cloth, wherein the constituent solvent of the resin varnish is a non-aqueous organic solvent and the glass cloth whose surface has been activated is used. I do. Another feature is that the surface activation treatment is corona discharge machining. The activation treatment is also characterized in that it is performed after the glass cloth has been chemically treated with a surface treatment agent.
【0008】以下、本発明を詳細に説明する。本発明に
おける活性化処理は、ガラス表面を活性化し、樹脂ワニ
スのガラスクロスの糸束内部への浸透を改善する目的で
行われる。活性化することにより、ガラスクロス表面に
はフリーラジカルがかなり長時間にわたって安定に存在
し続け、この表面が空気中の酸素と反応して、最終的に
は、水酸基やカルボキシル基、或いはアミノ基の酸化で
得られるニトロ基が形成されて、これによって濡れ性も
改善される。また、放電加工等の活性化処理中に生じる
紫外線による有機化合物の分解又は架橋反応も濡れ性の
改善に寄与していると考えられる。Hereinafter, the present invention will be described in detail. The activation treatment in the present invention is performed for the purpose of activating the glass surface and improving the penetration of the resin varnish into the inside of the yarn bundle of the glass cloth. By the activation, free radicals are stably present on the glass cloth surface for a considerably long time, and this surface reacts with oxygen in the air to eventually form hydroxyl groups, carboxyl groups, or amino groups. The nitro groups resulting from the oxidation are formed, which also improves the wettability. In addition, it is considered that the decomposition or cross-linking reaction of the organic compound due to ultraviolet rays generated during the activation treatment such as electric discharge machining also contributes to the improvement of wettability.
【0009】該活性化処理は、ガラスクロスが表面処理
剤で化学処理された後、樹脂ワニスを塗布する前にコロ
ナ放電処理、プラズマ放電処理等の方法で行われる。好
ましくはコロナ放電処理であって、加工条件は印荷電力
が0.1kW〜40.0kW、好ましくは0.3kW〜
20.0kW;周波数が1kHz〜120kHz、好ま
しくは5kHz〜50kHz;処理時間は少なくとも、
0.05秒〜5秒、好ましくは0.1秒〜3秒、であ
る。The activation treatment is performed by a method such as a corona discharge treatment or a plasma discharge treatment after the glass cloth is chemically treated with a surface treatment agent and before the resin varnish is applied. Preferably, it is a corona discharge treatment, and the processing condition is that the imprint power is 0.1 kW to 40.0 kW, preferably 0.3 kW to
20.0 kW; frequency is 1 kHz to 120 kHz, preferably 5 kHz to 50 kHz;
It is 0.05 seconds to 5 seconds, preferably 0.1 seconds to 3 seconds.
【0010】本発明で用いられるガラスクロスは予め表
面処理剤で化学処理されていることが好ましい。表面処
理剤として通常シランカップリング剤が好適に用いられ
る。シランカップリング剤は、ガラスクロスとマトリッ
クス樹脂とに結合乃至相溶して互いの接着性を改善する
目的で用いられる。従って、用いられるマトリックス樹
脂に対して最も適切なものの中から選択されることが好
ましい。It is preferable that the glass cloth used in the present invention has been chemically treated with a surface treating agent in advance. Usually, a silane coupling agent is suitably used as the surface treatment agent. The silane coupling agent is used for the purpose of bonding or dissolving to the glass cloth and the matrix resin to improve the mutual adhesion. Therefore, it is preferable to select from the most suitable ones for the matrix resin used.
【0011】該シランカップリング剤として以下の化合
物或いは組成物が例示される。即ち、γ−(2−アミノ
エチル)アミノプロピルトリメトキシシラン、γ−(2
−アミノエチル)アミノプロピルメチルジメトキシシラ
ン、γ−メタクリロキシプロピルトリメトキシシラン、
γ−グリシドキシプロピルトリメトキシシラン、N−β
−(N−ビニルベンジルアミノエチル)−γ−アミノプ
ロピルトリメトキシシラン塩酸塩、N−β−(N−ベン
ジルアミノエチル)−γ−アミノプロピルトリメトキシ
シラン塩酸塩、The following compounds or compositions are exemplified as the silane coupling agent. That is, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ- (2
-Aminoethyl) aminopropylmethyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane,
γ-glycidoxypropyltrimethoxysilane, N-β
-(N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane hydrochloride, N-β- (N-benzylaminoethyl) -γ-aminopropyltrimethoxysilane hydrochloride,
【0012】γ−メルカプトプロピルトリメトキシシラ
ン、ビニルトリアセトキシシラン、γ−クロロプロピル
トリメトキシシラン、γ−アニリノプロピルトリメトキ
シシラン、ビニルトリメトキシシラン、γ−クロロプロ
ピルメチルジメトキシシラン、γ−メルカプトプロピル
ジメトキシシラン、γ−グリシドキシプロピルジメトキ
シシラン、γ−ウレイドプロピルトリメトキシシラン、
γ−メタクリロキシプロピルメチルジメトキシシラン、Γ-mercaptopropyltrimethoxysilane, vinyltriacetoxysilane, γ-chloropropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, vinyltrimethoxysilane, γ-chloropropylmethyldimethoxysilane, γ-mercaptopropyl Dimethoxysilane, γ-glycidoxypropyldimethoxysilane, γ-ureidopropyltrimethoxysilane,
γ-methacryloxypropylmethyldimethoxysilane,
【0013】β−(3,4−エポキシシクロヘキシル)
エチルトリメトキシシラン、γ−(4−(3−アミノプ
ロポキシ)ブトキシプロピル)アミノプロピルトリメト
キシシラン、N−β−(N−ベンジルアミノエチル)−
N−ビニルベンジル−γ−アミノプロピルトリメトキシ
シラン塩酸塩、N−β−(N−ビニルベンジルアミノエ
チル)−N−ビニルベンジル−γ−アミノプロピルトリ
メトキシシラン塩酸塩、N−β−(N−ベンズヒドリル
アミノエチル)−γ−アミノプロピルトリメトキシシラ
ン塩酸塩、N−ビニルベンジル−γ−アミノプロピルト
リメトキシシラン、N−ベンジル−γ−アミノプロピル
トリメトキシシランなどである。Β- (3,4-epoxycyclohexyl)
Ethyltrimethoxysilane, γ- (4- (3-aminopropoxy) butoxypropyl) aminopropyltrimethoxysilane, N-β- (N-benzylaminoethyl)-
N-vinylbenzyl-γ-aminopropyltrimethoxysilane hydrochloride, N-β- (N-vinylbenzylaminoethyl) -N-vinylbenzyl-γ-aminopropyltrimethoxysilane hydrochloride, N-β- (N- (Benzhydrylaminoethyl) -γ-aminopropyltrimethoxysilane hydrochloride, N-vinylbenzyl-γ-aminopropyltrimethoxysilane, N-benzyl-γ-aminopropyltrimethoxysilane and the like.
【0014】これらは単独で用いても良いし、2種類以
上組み合わせて用いても良い。また、本発明では、表面
処理剤としてチタネートカップリング剤も有効に用いら
れる。すなわち、ガラスクロスのフィラメント表面がチ
タネートカップリング剤で被覆されることで、フィラメ
ント間の融着が解除され、また、樹脂との親和性が改善
されることから、樹脂のガラスクロスへの含浸性が改善
される。好適に用いられるチタネートカップリング剤と
して、イソプロピルトリドデシルベンゼンスルホニルチ
タネートが例示される。チタネートカップリング剤とシ
ランカップリング剤の混合使用または併用使用でも構わ
ない。These may be used alone or in combination of two or more. In the present invention, a titanate coupling agent is also effectively used as a surface treatment agent. That is, since the filament surface of the glass cloth is coated with the titanate coupling agent, the fusion between the filaments is released, and the affinity with the resin is improved. Is improved. As a titanate coupling agent suitably used, isopropyl tridodecylbenzenesulfonyl titanate is exemplified. A mixed use or a combined use of a titanate coupling agent and a silane coupling agent may be used.
【0015】ガラスクロスへの表面処理剤の適用は、表
面処理剤の水溶液又は有機溶媒の溶液、或いは水とこれ
ら有機溶媒との混合溶媒の溶液を、室温に近い温度で、
常圧下、ガラスクロスに付着させた後、乾燥させること
により行うことができる。このときの処理剤の成分量の
濃度は、0.01〜5重量%、好ましくは0.2〜2重
量%であることが望ましい。該表面処理剤の濃度が0.
01重量%未満ではガラスクロス全表面への被覆が不十
分で耐熱性が十分に発揮されないので好ましくないし、
また5重量%を越えると含浸改良効果が不十分になるの
で好ましくない。該カップリング剤の溶液をガラスクロ
スに付着させるには、浸漬法、スプレー法、コーター法
等を適用することができる。複数の種類の処理剤を用い
るときは、個々に処理しても良いし同一の処理液で処理
しても良い。[0015] The application of the surface treatment agent to the glass cloth is performed by applying an aqueous solution of the surface treatment agent, a solution of an organic solvent, or a solution of a mixed solvent of water and the organic solvent at a temperature close to room temperature.
It can be performed by adhering to a glass cloth under normal pressure and then drying. At this time, the concentration of the component of the treating agent is desirably 0.01 to 5 wt%, preferably 0.2 to 2 wt%. When the concentration of the surface treatment agent is 0.
If it is less than 01% by weight, it is not preferable because the coating on the entire surface of the glass cloth is insufficient and heat resistance is not sufficiently exhibited,
On the other hand, if it exceeds 5% by weight, the effect of improving impregnation becomes insufficient, which is not preferable. To attach the solution of the coupling agent to the glass cloth, an immersion method, a spray method, a coater method, or the like can be applied. When a plurality of types of processing agents are used, they may be processed individually or with the same processing liquid.
【0016】本発明のプリプレグに適用される樹脂は、
例えば、エポキシ基を有する化合物、アミノ基を有する
化合物、イソシアネ−ト基を有する化合物、フェノ−ル
基を有する化合物、イミダゾ−ル基を有する化合物、ジ
シアンジアミド、ヒドラジド基を有する化合物、酸無水
物、カルボキシル基を有する化合物等で硬化させるエポ
キシ樹脂、エポキシアクリレ−トや不飽和ポリエステル
を;熱重合及び/又はベンゾイルパ−オキサイド等の過
酸化物で硬化させる樹脂;水酸基及び/又はアミノ基を
有する化合物をイソシアネ−ト基を有する化合物により
硬化させるウレタン樹脂、メラミン樹脂、シリコ−ン樹
脂、ポリカ−ボネ−ト樹脂、ポリイミド樹脂、芳香族ポ
リアミド樹脂、ポリスチレン樹脂、ポリフェニレン樹
脂、ポリスルホン樹脂、ポリフェニレンオキシド樹脂等
が挙げられる。The resin applied to the prepreg of the present invention includes:
For example, a compound having an epoxy group, a compound having an amino group, a compound having an isocyanate group, a compound having a phenol group, a compound having an imidazole group, dicyandiamide, a compound having a hydrazide group, an acid anhydride, Epoxy resins, epoxy acrylates and unsaturated polyesters cured with compounds having carboxyl groups, etc .; Resins cured with peroxides such as thermal polymerization and / or benzoyl peroxide; Compounds having hydroxyl and / or amino groups Resin, a melamine resin, a silicone resin, a polycarbonate resin, a polyimide resin, an aromatic polyamide resin, a polystyrene resin, a polyphenylene resin, a polysulfone resin, a polyphenylene oxide resin, etc. Is mentioned.
【0017】また、樹脂の脆さを補ったり、ガラス繊維
織物の取扱性を良くするために、ガラス転移温度が10
0℃以下の樹脂又は熱可塑性樹脂を混合しても良い。本
発明に用いられるガラスクロスのガラス組成としては特
に制限はないが、例えばガラス繊維強化樹脂積層板の強
化材として使用されているEガラス、Cガラス、Sガラ
ス、Dガラス、高誘電率ガラスとして知られるHガラ
ス、クオーツ等のガラスを挙げることができる。また、
ガラスクロスの織構成としては、織り密度は10〜20
0本/25mm、好ましくは15〜100本/25mmであ
り、質量(目付け)は5〜400g/m2 、好ましくは
10〜300g/m2 であり、織り方は平織り、朱子織
り、綾織り、ななこ織り等が使用できる。また、双方又
は一方がテクスチャ−ド加工を施されたガラス繊維で製
織されたガラスクロスであっても良い。Further, in order to compensate for the brittleness of the resin and to improve the handleability of the glass fiber fabric, the glass transition temperature is set at 10%.
A resin at 0 ° C. or lower or a thermoplastic resin may be mixed. Although the glass composition of the glass cloth used in the present invention is not particularly limited, for example, as E glass, C glass, S glass, D glass, and high dielectric constant glass used as a reinforcing material of a glass fiber reinforced resin laminate. Known glass such as H glass and quartz can be used. Also,
The weaving density of the glass cloth is 10 to 20.
0/25 mm, preferably 15 to 100/25 mm, the mass (basis weight) is 5 to 400 g / m 2 , preferably 10 to 300 g / m 2 , and the weave is plain weave, satin weave, twill weave, Nanako weave can be used. Further, both or one of them may be a glass cloth woven with a textured glass fiber.
【0018】該ガラスクロスを用いてプリプレグを作成
するには、常法に従えば良く、例えば浸漬法、スプレー
法等などでエポキシ樹脂、ポリイミド樹脂、サイアネー
ト樹脂、熱可塑性樹脂等の非水系の有機溶剤中の樹脂成
分濃度20〜90重量%の樹脂ワニスを本発明のガラス
クロスに含浸させた後、100℃〜200℃で乾燥、半
硬化させることによって得られる。該非水系の有機溶剤
としては特に制限されないが、例えばメチルセロソル
ブ、メチルカルビトール、ジエチレングリコールジエチ
ルエーテル、酢酸メチル、酢酸エチル、酢酸ブチル、メ
チルセロソルブアセテート、n−ブチルセロソルブアセ
テート、ジメチルカーボネート、アセトン、メチルエチ
ルケトン、メチルイソブチルケトン、シクロヘキサノ
ン、アセトフェノン、クロロホルム、クロロベンゼン、
トルエン、キシレン、N−メチルピロリドン、ジメチル
ホルムアミド、ホルムアミド等を挙げることができる。The prepreg can be prepared by using the glass cloth according to a conventional method. For example, a non-aqueous organic resin such as an epoxy resin, a polyimide resin, a sianate resin, a thermoplastic resin, etc. may be formed by a dipping method, a spray method or the like. It is obtained by impregnating the glass cloth of the present invention with a resin varnish having a resin component concentration of 20 to 90% by weight in a solvent, followed by drying and semi-curing at 100 ° C to 200 ° C. The non-aqueous organic solvent is not particularly limited. Isobutyl ketone, cyclohexanone, acetophenone, chloroform, chlorobenzene,
Examples thereof include toluene, xylene, N-methylpyrrolidone, dimethylformamide, and formamide.
【0019】さらに、乾燥前及び/または乾燥中に樹脂
ワニスをプレスロ−ルやキスロールにより加圧しながら
塗工しても良く、減圧装置内で脱泡するような強制含浸
を行っても良い。また、樹脂ワニスを塗工する前に予め
非水系有機溶剤をプレ含浸させても良い。積層板の作成
も常法に従えば良いが、例えば上記のプリプレグを所定
枚数積層しプレス機を用いて加熱加圧して成形すること
で作成される。該積層板は、片面または両面に銅などの
導電性金属層を有していても良い。また、多層板のよう
に内層に導電性金属層を有していても良い。Further, before and / or during drying, the resin varnish may be applied while being pressed by a press roll or a kiss roll, or may be subjected to forced impregnation such as defoaming in a decompression device. Further, a non-aqueous organic solvent may be pre-impregnated before applying the resin varnish. The laminate may be prepared according to a conventional method. For example, the laminate is prepared by laminating a predetermined number of the above-described prepregs and molding them under heat and pressure using a press machine. The laminate may have a conductive metal layer such as copper on one or both sides. Further, a conductive metal layer may be provided as an inner layer like a multilayer board.
【0020】[0020]
【実施例】以下、実施例及び比較例により本発明を具体
的に説明するが、これらによって本発明の範囲を制限さ
れるものではない。なお、各物性値は以下のように求め
た。 (1)プリプレグの含浸性 実施例1で記載した樹脂ワニスを含浸し、キュアーさせ
てBステージ状態としたプリプレグを目視および光学顕
微鏡で観察して、含浸性を評価した。 ◎:極めて良好、○:良好、△:普通、×:悪い。 (2)積層板の含浸性 実施例1で記載した方法で作成した0.8mm厚の両面
銅張積層板から銅をエッチングによって除去し、目視で
観察して、含浸性を評価した。 ◎:極めて良好、○:良好、△:普通、×:悪い。EXAMPLES Hereinafter, the present invention will be described specifically with reference to Examples and Comparative Examples, but these are not intended to limit the scope of the present invention. In addition, each physical property value was calculated | required as follows. (1) Impregnating property of prepreg The prepreg impregnated with the resin varnish described in Example 1 and cured to be in the B-stage state was visually observed and observed with an optical microscope to evaluate the impregnating property. ◎: extremely good, :: good, Δ: normal, ×: bad. (2) Impregnating property of laminate The copper was removed from the 0.8 mm thick double-sided copper-clad laminate prepared by the method described in Example 1 by etching and visually observed to evaluate the impregnating property. ◎: extremely good, :: good, Δ: normal, ×: bad.
【0021】(3)吸湿ハンダ耐熱性 実施例1で記載した方法で作成した0.8mm厚の両面
銅張積層板から銅をエッチングによって除去し、5cm
角の試験片に裁断後、吸湿ハンダ耐熱試験を実施した。
エポキシ樹脂積層板では試験片を260℃のハンダ浴に
20秒間浸漬し、ふくれの有無を調べた。なお、表中の
PCT−n/121は、121℃の飽和プレッシャーク
ッカー中で試験片をn時間暴露し吸湿させたことを示し
ている。ポリイミド樹脂積層板の場合は、PCT−5/
121の吸湿処理後、300〜360℃のハンダ浴中に
浸漬してふくれの有無を調べた。評価結果は表1及び表
2に示す。(3) Moisture Absorbing Solder Heat Resistance Copper was removed from the 0.8 mm thick double-sided copper-clad laminate prepared by the method described in Example 1 by etching to remove the copper by 5 cm.
After cutting the corner test pieces, a moisture absorption solder heat test was performed.
For the epoxy resin laminate, the test piece was immersed in a 260 ° C. solder bath for 20 seconds to check for blisters. PCT-n / 121 in the table indicates that the test piece was exposed to moisture in a saturated pressure cooker at 121 ° C. for n hours. In the case of a polyimide resin laminate, PCT-5 /
After the moisture absorption treatment of No. 121, it was immersed in a solder bath at 300 to 360 ° C. to check for blisters. The evaluation results are shown in Tables 1 and 2.
【0022】(実施例1)処理液として、N−β−(N
−ビニルベンジルアミノエチル)−γ−アミノプロピル
トリメトキシシラン塩酸塩(東レダウコーニングシリコ
ーン(株)製SZ6032)の0.5重量%(成分)水
溶液を調製し、酢酸を加えてpHを4に調整した。上記
処理液に、予めヒートクリーニングにより脱油した厚さ
0.19mmのガラスクロス(旭シュエーベル(株)製
スタイル7628)を浸漬し、次いでガラスクロスに対
し約30重量%の処理液保持率になるように絞液した
後、120℃の熱風によって乾燥した。Example 1 N-β- (N
-Vinylbenzylaminoethyl)-. Gamma.-aminopropyltrimethoxysilane hydrochloride (SZ6032, manufactured by Toray Dow Corning Silicone Co., Ltd.) was prepared in 0.5% by weight (component) aqueous solution, and the pH was adjusted to 4 by adding acetic acid. did. A 0.19-mm-thick glass cloth (style 7628, manufactured by Asahi Schwebel KK), which has been deoiled by heat cleaning in advance, is immersed in the above-mentioned processing liquid, and then the processing liquid retention rate is about 30% by weight based on the glass cloth. And then dried with hot air at 120 ° C.
【0023】該処理ガラスクロスに、コロナ表面処理装
置(ワイヤ−電極2本タイプ、春日電機(株)製)を用
いて、印荷電力1.5kW、周波数40kHz、処理時
間1.0秒の条件でコロナ放電処理を施した。次に、臭
素化ビスフェノールA型エポキシ樹脂E5046(油化
シェルエポキシ(株)製)85重量部(固形)、クレゾ
ールノボラック型エポキシ樹脂E180(同)15重量
部(固形)、N,N’−ジメチルホルムアミド10重量
部、メトキシエタノール10重量部、ジシアンジアミド
2.4重量部、2エチル4メチルイミダゾール0.2重
量部を配合してエポキシ樹脂ワニスを調合した。The treated glass cloth was treated with a corona surface treatment device (two wire-electrode type, manufactured by Kasuga Electric Co., Ltd.) under the conditions of an imprint power of 1.5 kW, a frequency of 40 kHz and a treatment time of 1.0 second. For corona discharge treatment. Next, 85 parts by weight (solid) of brominated bisphenol A type epoxy resin E5046 (manufactured by Yuka Shell Epoxy), 15 parts by weight (solid) of cresol novolak type epoxy resin E180 (same as above), N, N′-dimethyl An epoxy resin varnish was prepared by blending 10 parts by weight of formamide, 10 parts by weight of methoxyethanol, 2.4 parts by weight of dicyandiamide, and 0.2 parts by weight of 2 ethyl 4-methylimidazole.
【0024】該樹脂ワニスを前記処理したガラスクロス
に含浸し、乾燥して、樹脂分42重量%のプリプレグを
作成した。このプリプレグについて透明性、残留ボイド
の大きさを顕微鏡観察した。次に、該プリプレグを4枚
重ね、その両表層に厚さ18μmの銅箔を重ねて、真空
プレスを用いて10torrに減圧下120℃で30
分、次いで常圧下175℃で60分間、35Kg/cm2の条
件で加熱加圧して一体に成形し、厚さ0.8mmの銅張
り積層板を得た。さらに、エッチング液で銅箔を全面エ
ッチアウトした後、水洗し、風乾して物性試験用積層板
とした。The treated glass cloth was impregnated with the resin varnish and dried to prepare a prepreg having a resin content of 42% by weight. The prepreg was observed under a microscope for transparency and the size of residual voids. Next, four prepregs were stacked, and a copper foil having a thickness of 18 μm was stacked on both surface layers of the prepregs.
Then, the mixture was heated and pressed at 175 ° C. under normal pressure for 60 minutes at 35 kg / cm 2 to form a copper-clad laminate having a thickness of 0.8 mm. Further, the copper foil was entirely etched out with an etching solution, washed with water, and air-dried to obtain a laminate for a physical property test.
【0025】(実施例2)実施例1のコロナ放電処理に
おいて、コロナ表面処理装置〔ワイヤ−電極2本タイ
プ、春日電機(株)製〕を用いて、印荷電力1.0k
W、周波数40kHz、処理時間1.0秒の条件でコロ
ナ放電処理を施した他は実施例1と同様に行った。 (実施例3)実施例1で、コロナ放電処理を施したガラ
スクロスを室温20℃、湿度60%の室内に1カ月放置
した後、実施例1と同様に評価を実施した。(Embodiment 2) In the corona discharge treatment of Embodiment 1, an imprinting power of 1.0 k was applied by using a corona surface treatment apparatus (two wire-electrodes type, manufactured by Kasuga Electric Co., Ltd.).
The operation was performed in the same manner as in Example 1 except that the corona discharge treatment was performed under the conditions of W, a frequency of 40 kHz, and a treatment time of 1.0 second. Example 3 In Example 1, the glass cloth subjected to the corona discharge treatment was allowed to stand in a room at a room temperature of 20 ° C. and a humidity of 60% for one month, and was evaluated in the same manner as in Example 1.
【0026】(実施例4)実施例1で、エポキシ樹脂ワ
ニスとして、ビスフェノールA型ノボラックエポキシ樹
脂E157(油化シェルエポキシ(株)社製)35重量
部(固形)、ハイブロム型エポキシ樹脂E5050(同
上)28重量部(固形)、ビスフェノールA型エポキシ
樹脂E828(同上)6重量部(固形)、DPP型フェ
ノール樹脂YLH129(同上)31重量部(固形)、
2−エチル−4−メチルイミダゾール0.1重量部及び
メトキシエタノールを配合して樹脂含量67重量%のフ
ェノール硬化エポキシ樹脂ワニスを調合し用いた他は、
実施例1と同様に評価を実施した。Example 4 In Example 1, as epoxy resin varnish, 35 parts by weight (solid) of bisphenol A type novolak epoxy resin E157 (manufactured by Yuka Shell Epoxy Co., Ltd.), and Hybromo type epoxy resin E5050 (same as above) ) 28 parts by weight (solid), bisphenol A type epoxy resin E828 (same as above) 6 parts by weight (solid), DPP type phenol resin YLH129 (same as above) 31 parts by weight (solid),
Except that 0.1 part by weight of 2-ethyl-4-methylimidazole and methoxyethanol were blended to prepare and use a phenol-cured epoxy resin varnish having a resin content of 67% by weight,
Evaluation was performed in the same manner as in Example 1.
【0027】(実施例5)処理液として、N−β−(N
−ビニルベンジルアミノエチル)−γ−アミノプロピル
トリメトキシシラン塩酸塩〔東レダウコーニングシリコ
ーン(株)製SZ6032〕の0.5重量%(成分)水
溶液を調整し、酢酸を加えてpHを4に調整した。上記
処理液に、予めヒートクリーニングにより脱油した厚さ
0.19mmのガラスクロス〔旭シュエーベル(株)製
スタイル7628〕を浸漬し、ついでガラスクロスに対
し約30重量%の処理液保持率になるように絞液した
後、120℃の熱風によって乾燥した。Example 5 N-β- (N
-Vinylbenzylaminoethyl)-. Gamma.-aminopropyltrimethoxysilane hydrochloride (SZ6032, manufactured by Toray Dow Corning Silicone Co., Ltd.) was adjusted to a 0.5% by weight (component) aqueous solution, and acetic acid was added to adjust the pH to 4. did. A 0.19-mm-thick glass cloth (style 7628, manufactured by Asahi Schwebel KK), which has been deoiled by heat cleaning in advance, is immersed in the above-mentioned processing liquid, and the processing liquid retention rate becomes about 30% by weight with respect to the glass cloth. And then dried with hot air at 120 ° C.
【0028】該処理ガラスクロスに、コロナ表面処理装
置〔ワイヤ−電極2本タイプ、春日電機(株)製〕を用
いて、印荷電力1.5kW、周波数40kHz、処理時
間1.0秒の条件でコロナ放電処理を施した。次に、樹
脂ワニスとしてケルイミドB601(日本チバガイギー
(株)製)50重量部、n−メチルピロリドン50重量
部を調合し用いた。該樹脂ワニスを前記処理したガラス
クロスに含浸し、乾燥して、樹脂分42重量%のプリプ
レグを作成した。このプリプレグについて透明性、残留
ボイドの大きさを顕微鏡観察した。The treated glass cloth was treated with a corona surface treatment device (two wire-electrode type, manufactured by Kasuga Electric Co., Ltd.) under the conditions of an imprinting power of 1.5 kW, a frequency of 40 kHz and a processing time of 1.0 second. For corona discharge treatment. Next, as a resin varnish, 50 parts by weight of Kelimide B601 (manufactured by Nippon Ciba Geigy) and 50 parts by weight of n-methylpyrrolidone were used. The resin varnish was impregnated into the treated glass cloth and dried to prepare a prepreg having a resin content of 42% by weight. The prepreg was observed under a microscope for transparency and the size of residual voids.
【0029】(比較例1)実施例1におけるコロナ放電
処理を行わない以外は実施例1と同様に実施し、比較に
供した。 (比較例2)実施例4におけるコロナ放電処理を行わな
い以外は実施例4と同様に実施し、比較に供した。 (比較例3)実施例5におけるコロナ放電処理を行わな
い以外は実施例5と同様に実施し、比較に供した。(Comparative Example 1) A comparative example was carried out in the same manner as in Example 1 except that the corona discharge treatment was not performed. (Comparative Example 2) A comparative example was carried out in the same manner as in Example 4 except that the corona discharge treatment was not performed. (Comparative Example 3) The same operation as in Example 5 was performed except that the corona discharge treatment was not performed, and the result was provided for comparison.
【0030】[0030]
【表1】 [Table 1]
【0031】[0031]
【表2】 [Table 2]
【0032】[0032]
【発明の効果】以上に説明したとおり、本発明では、表
面を活性化処理したガラスクロスを用いることにより、
プリプレグ製造時に樹脂未含浸部が発生しないため、ガ
ラスクロスのフィラメント間への樹脂の含浸性を改善
し、積層板中のガラスクロスのフィラメント間にボイド
がなるべく残留することがないプリプレグが得られる効
果がある。As described above, in the present invention, by using a glass cloth whose surface is activated,
Since no resin-impregnated portion is generated during prepreg production, the effect of improving resin impregnation between filaments of glass cloth and obtaining a prepreg in which voids do not remain as much as possible between filaments of glass cloth in a laminated board can be obtained. There is.
Claims (3)
てなるプリプレグにおいて、該樹脂ワニスの構成溶剤が
非水系の有機溶剤であり、且つ表面を活性化処理したガ
ラスクロスを用いることを特徴とするプリプレグ。1. A prepreg obtained by impregnating a thermosetting resin into a glass cloth, wherein a constituent solvent of the resin varnish is a non-aqueous organic solvent, and a glass cloth whose surface is activated is used. Prepreg to do.
ることを特徴とする請求項1記載のプリプレグ。2. The prepreg according to claim 1, wherein the surface activation treatment is corona discharge machining.
剤で化学処理された後に行うことを特徴とする請求項1
又は2記載のプリプレグ。3. The activation treatment according to claim 1, wherein the activation treatment is performed after the glass cloth is chemically treated with a surface treatment agent.
Or the prepreg according to 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21688596A JPH1045921A (en) | 1996-07-31 | 1996-07-31 | Prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21688596A JPH1045921A (en) | 1996-07-31 | 1996-07-31 | Prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1045921A true JPH1045921A (en) | 1998-02-17 |
Family
ID=16695443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21688596A Pending JPH1045921A (en) | 1996-07-31 | 1996-07-31 | Prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1045921A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294675A (en) * | 2000-04-14 | 2001-10-23 | Mitsubishi Gas Chem Co Inc | Pre-preg and metal foil-clad laminate |
-
1996
- 1996-07-31 JP JP21688596A patent/JPH1045921A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294675A (en) * | 2000-04-14 | 2001-10-23 | Mitsubishi Gas Chem Co Inc | Pre-preg and metal foil-clad laminate |
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