JPH10500903A - レーザーによつて材料を加工する装置 - Google Patents
レーザーによつて材料を加工する装置Info
- Publication number
- JPH10500903A JPH10500903A JP8500602A JP50060296A JPH10500903A JP H10500903 A JPH10500903 A JP H10500903A JP 8500602 A JP8500602 A JP 8500602A JP 50060296 A JP50060296 A JP 50060296A JP H10500903 A JPH10500903 A JP H10500903A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- nozzle
- laser
- focus
- nozzle passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/032—Optical fibres with cladding with or without a coating with non solid core or cladding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1423—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the flow carrying an electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/06—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of fluids in transparent cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0591—Cutting by direct application of fluent pressure to work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/364—By fluid blast and/or suction
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1 レーザー(1)と、液体ビーム(12)を形成しかつフォーカスユニット( 21,25)によって収束したレーザービームをこれに結合する加工モジュール (7)とによって、材料を加工する装置において、十分に小さなビーム吸収係数 を有する液体が選択され、かつ/又はビーム経路内における液体流速が、ビーム 方向において結合場所まで、なるべくフォーカス円錐(56)の先端範囲におい て十分に高くあらかじめ与えられており、それによりフォーカス光学系と焦点と の間の液体範囲において、主要ビーム部分がノズル壁に当たらないところまで、 熱レンズの形成が抑圧可能であるようにすることを特徴とする、レーザーによっ て材料を加工する装置。 2 1つ又は複数の液体供給導管(35)が、ノズル通路(23)の範囲におけ るフォーカス円錐(56)の先端範囲において、ちょうどノズル通路(23)を 通る液体流が必要とするような大きさに構成されていることを特徴とする、請求 項1記載の装置。 3 1つ又は複数の液体供給導管(35)が、ノズル通路(23)に付属のフォ ーカス円錐先端範囲において、液体せき止め空間のないように構成されているこ とを特徴とする、請求項2記載の装置。 4 1つ又は複数の液体供給導管(35)の壁として、レーザービームに対して 透明なかつ液体流を変えないカバー(36)が、ノズル通路(23)のすぐ近く に設けられていることを特徴とする、請求項2又は3記載の装置。 5 少なくとも液体に結合されたノズル通路(23)の及びノズル開口(30) の範囲の表面、及び液体が、電気的に絶縁されており、かつノズル開口(30) 及びノズル通路(23)の範囲における液体の流速が、材料取り除き速度を高め るために液体ビームの帯電を行なうように、高く選ばれていることを特徴とする 、請求項1ないし4の1つに記載の装置。 6 ノズル通路(23)の液体入口縁(37)が、なるべく50μmより小さい 、とくに5μmより小さい半径を有する鋭い縁に構成されていることを特徴とす る、請求項1ないし5の1つに記載の装置。 7 ノズル出口開口(40)が、入口開口(30)に対して広げられており、か つノズル通路(23)の広がりが、なるべくその上側1/3のところにおいてす でに始まっていることを特徴とする、請求項1ないし6の1つに記載の装置。 8 なるべく空間的に離れたところにあるレーザー(1)からフォーカスユニッ ト(21,25)へレーザービームを供給するビームガイド(6)が設けられて いることを特徴とする、請求項1ないし7の1つに記載の装置。 9 フォーカスユニット(21,25)が、レーザービームを、ノズル通路(2 3)内に、なるべくノズル通路(23)のノズル軸線(31)の位置において入 口開口(30)の平面内に収束させることを特徴とする、請求項1ないし8の1 つに記載の装置。 10 液体が、とくにポリメチルシロキサンのグループからなるシリコンオイル であり、かつレーザービームが、0.25μmと2.1μmの間の波長範囲内に あることを特徴とする、請求項1ないし9の1つに記載の装置。 11 材料加工の際に加工片通口から通り抜けたかつ/又は加工片から流出した 液体を捕獲する捕獲槽(11)、及び捕獲槽(16)からポンプ吸出し可能な液 体を浄化してノズル通路(23)へ戻すことができるフィルタユニット(15) を有するポンプ(17)が設けられていることを特徴とする、請求項1ないし1 0の1つに記載の装置。 12 加工モジュール(7)を、空間的に可変の移動ユニット、とくに折れ曲が りアームロボット及び液体及び/又はビーム供給部に取付け可能な連結要素(6 6,50)が設けられていることを特徴とす る、請求項1ないし11の1つに記載の装置。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4418845.5 | 1994-05-30 | ||
| DE4418845A DE4418845C5 (de) | 1994-05-30 | 1994-05-30 | Verfahren und Vorrichtung zur Materialbearbeitung mit Hilfe eines Laserstrahls |
| PCT/IB1995/000390 WO1995032834A1 (de) | 1994-05-30 | 1995-05-22 | Vorrichtung zur materialbearbeitung mit einem laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10500903A true JPH10500903A (ja) | 1998-01-27 |
| JP3680864B2 JP3680864B2 (ja) | 2005-08-10 |
Family
ID=6519330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50060296A Expired - Lifetime JP3680864B2 (ja) | 1994-05-30 | 1995-05-22 | レーザーによつて材料を加工する装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5902499A (ja) |
| EP (1) | EP0762947B1 (ja) |
| JP (1) | JP3680864B2 (ja) |
| DE (3) | DE4418845C5 (ja) |
| WO (1) | WO1995032834A1 (ja) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317190A (ja) * | 2004-04-28 | 2005-11-10 | Sae Magnetics (Hk) Ltd | 従来の機械加工プロセスによりスライダの周囲における欠陥を除去する方法 |
| WO2006100798A1 (ja) | 2005-03-18 | 2006-09-28 | Shibuya Kogyo Co., Ltd. | ハイブリッドレーザ加工装置 |
| DE102008048697A1 (de) | 2007-09-28 | 2009-04-02 | Sugino Machine Ltd., Uozu | Vorrichtung zur Laserbearbeitung mit Hilfe eines in eine Flüssigkeitsstrahlsäule eingeleiteten Laserstrahls |
| JP2009095884A (ja) * | 2007-09-28 | 2009-05-07 | Sugino Mach Ltd | 噴流液柱内に導かれたレーザー光によるレーザー加工装置 |
| US7910856B2 (en) | 2005-08-25 | 2011-03-22 | Shibuya Kogyo Co., Ltd. | Hybrid laser processing apparatus |
| JP2012066269A (ja) * | 2010-09-22 | 2012-04-05 | Shibuya Kogyo Co Ltd | レーザ加工装置 |
| KR101289621B1 (ko) * | 2004-11-10 | 2013-07-30 | 시노바 에스.에이 | 레이저 가공을 위한 액체 분사방법과 분사장치 |
| JP2014205170A (ja) * | 2013-04-12 | 2014-10-30 | 株式会社東芝 | レーザ加工方法およびレーザ加工装置 |
| JP2016132015A (ja) * | 2015-01-21 | 2016-07-25 | 株式会社ディスコ | レーザー加工装置 |
| US9659808B2 (en) | 2013-10-15 | 2017-05-23 | Mitsubishi Electric Corporation | Semiconductor-element manufacturing method and wafer mounting device using a vacuum end-effector |
| KR102690774B1 (ko) * | 2019-01-22 | 2024-08-05 | 시노바 에스.에이 | 복합 유체 제트 가이드 레이저 빔을 사용하여 공작물을 컷팅하거나 어블레이팅하는 방법 및 장치 |
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|---|---|---|---|---|
| GB9715014D0 (en) * | 1997-07-18 | 1997-09-24 | Secr Defence | Two phase cutting device |
| DE19839930C1 (de) * | 1998-09-02 | 1999-09-09 | Jurca Optoelektronik Gmbh | Verfahren zur Überwachung der Funktionalität des transparenten Schutzelementes einer transparenten Laseroptik sowie Einrichtung zur Durchführung dieses Verfahrens |
| CN1134322C (zh) * | 1998-04-30 | 2004-01-14 | 辛诺瓦有限公司 | 采用并入液体射流中的激光束的材料加工装置及方法 |
| EP1132058A1 (en) * | 2000-03-06 | 2001-09-12 | Advanced Laser Applications Holding S.A. | Intravascular prothesis |
| DE60041632D1 (de) | 2000-03-30 | 2009-04-09 | Nitto Denko Corp | Wasserdurchlässiges Klebeband für die Verarbeitung von Halbleitern |
| US7163875B2 (en) | 2000-04-04 | 2007-01-16 | Synova S.A. | Method of cutting an object and of further processing the cut material, and carrier for holding the object and the cut material |
| JP3484396B2 (ja) * | 2000-05-09 | 2004-01-06 | 新光電気工業株式会社 | ウェハーの切断方法 |
| FR2810913A1 (fr) * | 2000-06-29 | 2002-01-04 | Air Liquide | Procede et installation de coupage laser des aciers faiblement allies sans formation d'oxydes sur les faces de coupe |
| US6787891B2 (en) * | 2000-12-06 | 2004-09-07 | Medtronic, Inc. | Freeform substrates and devices |
| US6765174B2 (en) * | 2001-02-05 | 2004-07-20 | Denso Corporation | Method for machining grooves by a laser and honeycomb structure forming die and method for producing the same die |
| US6563080B2 (en) * | 2001-02-15 | 2003-05-13 | Scimed Life Systems, Inc. | Laser cutting of stents and other medical devices |
| SG139508A1 (en) * | 2001-09-10 | 2008-02-29 | Micron Technology Inc | Wafer dicing device and method |
| US20030062126A1 (en) * | 2001-10-03 | 2003-04-03 | Scaggs Michael J. | Method and apparatus for assisting laser material processing |
| SG102639A1 (en) | 2001-10-08 | 2004-03-26 | Micron Technology Inc | Apparatus and method for packing circuits |
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| US20040004063A1 (en) * | 2002-07-08 | 2004-01-08 | Merdan Kenneth M. | Vertical stent cutting process |
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| JP2004193399A (ja) * | 2002-12-12 | 2004-07-08 | Denso Corp | 半導体装置およびその製造方法 |
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| US9080425B2 (en) | 2008-10-17 | 2015-07-14 | Foro Energy, Inc. | High power laser photo-conversion assemblies, apparatuses and methods of use |
| US9138786B2 (en) | 2008-10-17 | 2015-09-22 | Foro Energy, Inc. | High power laser pipeline tool and methods of use |
| US9267330B2 (en) | 2008-08-20 | 2016-02-23 | Foro Energy, Inc. | Long distance high power optical laser fiber break detection and continuity monitoring systems and methods |
| US9719302B2 (en) | 2008-08-20 | 2017-08-01 | Foro Energy, Inc. | High power laser perforating and laser fracturing tools and methods of use |
| US9669492B2 (en) | 2008-08-20 | 2017-06-06 | Foro Energy, Inc. | High power laser offshore decommissioning tool, system and methods of use |
| US9242309B2 (en) | 2012-03-01 | 2016-01-26 | Foro Energy Inc. | Total internal reflection laser tools and methods |
| US9664012B2 (en) | 2008-08-20 | 2017-05-30 | Foro Energy, Inc. | High power laser decomissioning of multistring and damaged wells |
| US9027668B2 (en) | 2008-08-20 | 2015-05-12 | Foro Energy, Inc. | Control system for high power laser drilling workover and completion unit |
| US8627901B1 (en) | 2009-10-01 | 2014-01-14 | Foro Energy, Inc. | Laser bottom hole assembly |
| US9347271B2 (en) | 2008-10-17 | 2016-05-24 | Foro Energy, Inc. | Optical fiber cable for transmission of high power laser energy over great distances |
| US20120074110A1 (en) * | 2008-08-20 | 2012-03-29 | Zediker Mark S | Fluid laser jets, cutting heads, tools and methods of use |
| US10301912B2 (en) * | 2008-08-20 | 2019-05-28 | Foro Energy, Inc. | High power laser flow assurance systems, tools and methods |
| US8535243B2 (en) | 2008-09-10 | 2013-09-17 | Boston Scientific Scimed, Inc. | Medical devices and tapered tubular members for use in medical devices |
| EP2189236B1 (en) | 2008-11-21 | 2012-06-20 | Synova S.A. | Method and apparatus for improving reliability of a machining process |
| US8795254B2 (en) | 2008-12-10 | 2014-08-05 | Boston Scientific Scimed, Inc. | Medical devices with a slotted tubular member having improved stress distribution |
| US8525074B2 (en) * | 2008-12-26 | 2013-09-03 | Denso Corporation | Machining method and machining system for micromachining a part in a machine component |
| EP2208568A1 (en) | 2009-01-20 | 2010-07-21 | Synova S.A. | Apparatus and method for processing material by means of laser |
| CN101823183A (zh) * | 2009-03-04 | 2010-09-08 | 鸿富锦精密工业(深圳)有限公司 | 水导激光装置 |
| US9848904B2 (en) | 2009-03-06 | 2017-12-26 | Procept Biorobotics Corporation | Tissue resection and treatment with shedding pulses |
| WO2013130895A1 (en) | 2012-02-29 | 2013-09-06 | Aquabeam, Llc | Automated image-guided tissue resection and treatment |
| US8783360B2 (en) | 2011-02-24 | 2014-07-22 | Foro Energy, Inc. | Laser assisted riser disconnect and method of use |
| US8720584B2 (en) | 2011-02-24 | 2014-05-13 | Foro Energy, Inc. | Laser assisted system for controlling deep water drilling emergency situations |
| US8783361B2 (en) | 2011-02-24 | 2014-07-22 | Foro Energy, Inc. | Laser assisted blowout preventer and methods of use |
| US8684088B2 (en) | 2011-02-24 | 2014-04-01 | Foro Energy, Inc. | Shear laser module and method of retrofitting and use |
| US8137293B2 (en) | 2009-11-17 | 2012-03-20 | Boston Scientific Scimed, Inc. | Guidewires including a porous nickel-titanium alloy |
| JP5071487B2 (ja) * | 2010-01-06 | 2012-11-14 | 株式会社デンソー | レーザー加工装置およびレーザー加工方法 |
| DE102010011580B4 (de) | 2010-03-16 | 2020-01-02 | Vollmer Werke Maschinenfabrik Gmbh | Vorrichtung und Verfahren zum Vermessen eines, insbesondere als Lichtleiter genutzten, Flüssigkeitsstrahls sowie Einrichtung zum Bearbeiten eines Werkstücks |
| US8551021B2 (en) | 2010-03-31 | 2013-10-08 | Boston Scientific Scimed, Inc. | Guidewire with an improved flexural rigidity profile |
| EP2606201A4 (en) | 2010-08-17 | 2018-03-07 | Foro Energy Inc. | Systems and conveyance structures for high power long distance laster transmission |
| EP2670470B1 (en) | 2011-02-04 | 2019-04-24 | Boston Scientific Scimed, Inc. | Guidewires |
| EP2490273B1 (en) | 2011-02-18 | 2013-05-01 | Bruker HTS GmbH | Method for manufacturing a HTS coated tape with laser beam cutting |
| EP2678512A4 (en) | 2011-02-24 | 2017-06-14 | Foro Energy Inc. | Method of high power laser-mechanical drilling |
| US9072874B2 (en) | 2011-05-13 | 2015-07-07 | Boston Scientific Scimed, Inc. | Medical devices with a heat transfer region and a heat sink region and methods for manufacturing medical devices |
| DE102011102166A1 (de) | 2011-05-20 | 2012-11-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zu Homogenisierung des Laserstrahlprofils bei Prozessen unter Einsatz eines flüssigkeitsstrahlgeführten Lasers und entsprechende Vorrichtung |
| JP5220914B2 (ja) | 2011-05-25 | 2013-06-26 | 株式会社スギノマシン | レーザー加工装置 |
| EP2715887A4 (en) | 2011-06-03 | 2016-11-23 | Foro Energy Inc | PASSIVELY COOLED HIGH ENERGY LASER FIBER ROBUST OPTICAL CONNECTORS AND METHODS OF USE |
| DE102011107982A1 (de) | 2011-07-20 | 2013-01-24 | Rena Gmbh | Werkzeugkopf (LCP-Kopf) |
| WO2013019959A2 (en) | 2011-08-02 | 2013-02-07 | Foro Energy Inc. | Laser systems and methods for the removal of structures |
| US9399269B2 (en) | 2012-08-02 | 2016-07-26 | Foro Energy, Inc. | Systems, tools and methods for high power laser surface decommissioning and downhole welding |
| DE102012003202A1 (de) | 2012-02-17 | 2013-08-22 | Vollmer Werke Maschinenfabrik Gmbh | Vorrichtung und Verfahren zum Bearbeiten von Werkstücken, insbesondere von Schneiden oder mit Schneiden versehenen Werkstücken, mit einem Nasslaser |
| WO2013136411A1 (ja) | 2012-03-12 | 2013-09-19 | 三菱電機株式会社 | 真空吸着ステージ、半導体ウエハのダイシング方法およびアニール方法 |
| WO2014036430A2 (en) | 2012-09-01 | 2014-03-06 | Foro Energy, Inc. | Reduced mechanical energy well control systems and methods of use |
| US8993923B2 (en) * | 2012-09-14 | 2015-03-31 | General Electric Company | System and method for manufacturing an airfoil |
| US8969760B2 (en) | 2012-09-14 | 2015-03-03 | General Electric Company | System and method for manufacturing an airfoil |
| WO2014078663A2 (en) | 2012-11-15 | 2014-05-22 | Foro Energy, Inc. | High power laser hydraulic fructuring, stimulation, tools systems and methods |
| DE102012111797B4 (de) | 2012-12-05 | 2017-04-20 | Reinhard Caliebe | Bearbeitungseinrichtung für ein Werkstück |
| DE102012111796B4 (de) | 2012-12-05 | 2017-04-20 | Reinhard Caliebe | Bearbeitungseinrichtung für ein Werkstück |
| CN103203543B (zh) * | 2013-02-04 | 2015-03-11 | 中国航空工业集团公司北京航空制造工程研究所 | 一种用于激光冲击强化叶片的水约束层的喷射方法和装置 |
| JP6403695B2 (ja) | 2013-02-14 | 2018-10-10 | プロセプト バイオロボティクス コーポレイション | アクアアブレーションアクアビーム眼科手術方法および装置 |
| FR3002363B1 (fr) * | 2013-02-21 | 2015-03-20 | Andra | Procede de decontamination de tubes de generateur de vapeur |
| WO2014204535A1 (en) | 2013-03-15 | 2014-12-24 | Foro Energy, Inc. | High power laser fluid jets and beam paths using deuterium oxide |
| CN103203545B (zh) * | 2013-04-11 | 2015-05-13 | 中国科学院宁波材料技术与工程研究所 | 一种水导激光光路耦合方法及装置 |
| JP6039492B2 (ja) * | 2013-04-23 | 2016-12-07 | 日立オートモティブシステムズ株式会社 | 燃料噴射弁及びその製造方法 |
| CN104174993A (zh) * | 2013-05-23 | 2014-12-03 | 深圳市通发激光设备有限公司 | 具有自动消除固体激光器热透镜效应装置的激光焊接机 |
| CN103358028A (zh) * | 2013-07-16 | 2013-10-23 | 桂林电子科技大学 | 水射流激光刻划脆性材料超薄片的方法及系统 |
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| US10307864B2 (en) * | 2013-12-13 | 2019-06-04 | Avonisys Ag | Methods and systems to keep a work piece surface free from liquid accumulation while performing liquid-jet guided laser based material processing |
| US9468991B2 (en) | 2014-01-27 | 2016-10-18 | General Electric Company | Method determining hole completion |
| US9676058B2 (en) | 2014-01-27 | 2017-06-13 | General Electric Company | Method and system for detecting drilling progress in laser drilling |
| US9662743B2 (en) | 2014-01-27 | 2017-05-30 | General Electric Company | Method for drilling a hole in an airfoil |
| DE102014209171B4 (de) * | 2014-05-15 | 2026-02-05 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Fokussieren eines aus einer Ausgabeöffnung einer Ausgabevorrichtung einer Jet-Vorrichtung ausgegebenen viskosen Mediums |
| US8859988B1 (en) * | 2014-05-30 | 2014-10-14 | Jens Guenter Gaebelein | Method for coupling a laser beam into a liquid-jet |
| US10092980B1 (en) * | 2014-05-30 | 2018-10-09 | Avonisys Ag | Method for coupling a laser beam into a liquid-jet |
| EP2957378A1 (de) * | 2014-06-16 | 2015-12-23 | Synova SA | Bearbeitungskopf zum Einkopplen eines Laserstrahles in einem Flüssigkeitsstrahl mit einer Flüssigkeitschnittstelle |
| EP2960006B1 (de) | 2014-06-23 | 2019-02-20 | Synova S.A. | Verfahren und Vorrichtung zum Bestimmen einer Lage eines Flüssigkeitsstrahls durch eine Änderung einer Konstellation |
| BR112016031037B1 (pt) | 2014-06-30 | 2023-02-07 | Procept Biorobotics Corporation | Aparelho para ablação de tecido vascular |
| EP4477143A3 (en) | 2014-09-05 | 2025-03-19 | PROCEPT BioRobotics Corporation | Physician controlled tissue resection integrated with treatment mapping of target organ images |
| US9643282B2 (en) | 2014-10-17 | 2017-05-09 | Kennametal Inc. | Micro end mill and method of manufacturing same |
| GB201419809D0 (en) | 2014-11-07 | 2014-12-24 | Element Six Technologies Ltd | A method of fabricating plates of super-hard material and cutting techniques suitable for such a method |
| CN104526160B (zh) * | 2014-11-13 | 2016-09-07 | 张立国 | 一种激光加工方法及激光加工系统 |
| US9770785B2 (en) | 2014-11-18 | 2017-09-26 | General Electric Company | System and method for forming a cooling hole in an airfoil |
| DE102014225247A1 (de) * | 2014-12-09 | 2016-06-09 | Robert Bosch Gmbh | Verfahren zum Flüssigkeitsstrahlschneiden |
| US9895755B2 (en) | 2014-12-09 | 2018-02-20 | Kennametal Inc. | Cutting insert with internal coolant passages and method of making same |
| US11292081B2 (en) | 2015-01-08 | 2022-04-05 | General Electric Company | Method and system for confined laser drilling |
| US10589385B2 (en) | 2015-01-08 | 2020-03-17 | General Electric Company | Method and system for confined laser drilling |
| US9776284B2 (en) | 2015-01-22 | 2017-10-03 | General Electric Company | System and method for cutting a passage in an airfoil |
| US9962792B2 (en) | 2015-02-20 | 2018-05-08 | General Electric Company | Component repair using confined laser drilling |
| EP3718676B1 (en) * | 2015-07-28 | 2023-11-15 | Synova SA | Device and process of treating a workpiece using a liquid jet guided laser beam |
| JP6602389B2 (ja) * | 2015-09-30 | 2019-11-06 | 株式会社牧野フライス製作所 | レーザ加工機のウォータジェットの傾き測定方法 |
| WO2017075567A1 (en) * | 2015-10-30 | 2017-05-04 | Hypertherm, Inc. | Thermal regulation device for a laser processing head for water cooling of laser components |
| US10221687B2 (en) | 2015-11-26 | 2019-03-05 | Merger Mines Corporation | Method of mining using a laser |
| DE102015224115B4 (de) * | 2015-12-02 | 2021-04-01 | Avonisys Ag | Laserstrahl-bearbeitungsvorrichtung mit einer einkoppelvorrichtung zum einkoppeln eines fokussierten laserstrahls in einen flüssigkeitsstrahl |
| US10335900B2 (en) | 2016-03-03 | 2019-07-02 | General Electric Company | Protective shield for liquid guided laser cutting tools |
| US10160059B2 (en) | 2016-03-03 | 2018-12-25 | General Electric Company | Decoupled liquid-jet guided laser nozzle cap |
| CN106216837A (zh) * | 2016-08-25 | 2016-12-14 | 南京先进激光技术研究院 | 一种激光分离oca光学胶贴合的多层材料的方法 |
| DE102016116512A1 (de) | 2016-09-03 | 2018-03-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Bearbeitung eines Werkstückes |
| EP3300833B1 (en) | 2016-10-03 | 2019-11-27 | Synova SA | Device for generating a jet of liquid |
| CN107876976A (zh) * | 2017-12-20 | 2018-04-06 | 华中科技大学 | 液膜射流导引激光加工装置 |
| EP3513898A1 (en) * | 2018-01-19 | 2019-07-24 | Synova S.A. | Apparatus for automatic jet angle adjustment |
| TWI834649B (zh) | 2018-03-29 | 2024-03-11 | 美商康寧公司 | 使用脈衝雷射光束焦線及流體膜來雷射處理粗糙透明加工件的方法 |
| RU2685306C1 (ru) * | 2018-06-09 | 2019-04-17 | Акционерное общество "Высокотехнологический научно-исследовательский институт неорганических материалов имени академика А.А. Бочвара" | Устройство для лазерной обработки материалов в жидкой среде |
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| RU2700340C1 (ru) * | 2018-12-24 | 2019-09-16 | Федеральное государственное автономное научное учреждение "Центральный научно-исследовательский и опытно-конструкторский институт робототехники и технической кибернетики" (ЦНИИ РТК) | Лазерно-струйное устройство |
| DE102019103659B4 (de) * | 2019-02-13 | 2023-11-30 | Bystronic Laser Ag | Gasführung, Laserschneidkopf und Laserschneidmaschine |
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| CN110142502A (zh) * | 2019-05-15 | 2019-08-20 | 哈尔滨工业大学 | 水导引激光发生装置、水导引激光加工系统及其加工方法 |
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| CN110883424B (zh) * | 2019-11-22 | 2023-09-26 | 桂林电子科技大学 | 水导激光柔性化微加工系统及方法 |
| EP4088855B1 (en) * | 2021-03-30 | 2024-01-31 | The Boeing Company | Laser module end effector for robotic device |
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Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3503804A (en) * | 1967-04-25 | 1970-03-31 | Hellmut Schneider | Method and apparatus for the production of sonic or ultrasonic waves on a surface |
| JPS56163090A (en) * | 1980-05-22 | 1981-12-15 | Toshiba Corp | Laser working equipment |
| JPS61245992A (ja) * | 1985-04-24 | 1986-11-01 | Mitsubishi Electric Corp | レ−ザビ−ム加工方法 |
| US4952771A (en) * | 1986-12-18 | 1990-08-28 | Aesculap Ag | Process for cutting a material by means of a laser beam |
| JPS63188489A (ja) * | 1987-01-30 | 1988-08-04 | Hitachi Ltd | レ−ザアシスト化学加工装置 |
| JPH01316200A (ja) * | 1988-06-14 | 1989-12-21 | Diesel Kiki Co Ltd | 液体噴流を利用した加工装置 |
| JPH03501948A (ja) * | 1988-09-01 | 1991-05-09 | インスティテュト フィジキ アカデミイ ナウク リトフスコイ エスエスエル | レーザー処理によるフィルターの製造法及びその装置 |
| JPH02303695A (ja) * | 1989-05-17 | 1990-12-17 | Fanuc Ltd | レーザビームによる切断加工方法 |
| US5057184A (en) * | 1990-04-06 | 1991-10-15 | International Business Machines Corporation | Laser etching of materials in liquids |
| FR2676913B1 (fr) * | 1991-05-28 | 1993-08-13 | Lasag Ag | Dispositif d'ablation de matiere, notamment pour la dentisterie. |
| US5356081A (en) * | 1993-02-24 | 1994-10-18 | Electric Power Research Institute, Inc. | Apparatus and process for employing synergistic destructive powers of a water stream and a laser beam |
-
1994
- 1994-05-30 DE DE4418845A patent/DE4418845C5/de not_active Expired - Lifetime
-
1995
- 1995-05-18 DE DE19518263A patent/DE19518263A1/de not_active Withdrawn
- 1995-05-22 DE DE59510608T patent/DE59510608D1/de not_active Expired - Lifetime
- 1995-05-22 JP JP50060296A patent/JP3680864B2/ja not_active Expired - Lifetime
- 1995-05-22 WO PCT/IB1995/000390 patent/WO1995032834A1/de not_active Ceased
- 1995-05-22 EP EP95917453A patent/EP0762947B1/de not_active Expired - Lifetime
- 1995-05-22 US US08/750,130 patent/US5902499A/en not_active Expired - Lifetime
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| US10016845B2 (en) | 2004-11-10 | 2018-07-10 | Synova Sa | Method and device for generating a jet of fluid for material processing and fluid nozzle for use in said device |
| KR101289621B1 (ko) * | 2004-11-10 | 2013-07-30 | 시노바 에스.에이 | 레이저 가공을 위한 액체 분사방법과 분사장치 |
| US7705266B2 (en) | 2005-03-18 | 2010-04-27 | Shibuya Kogyo Co., Ltd. | Hybrid laser processing apparatus |
| WO2006100798A1 (ja) | 2005-03-18 | 2006-09-28 | Shibuya Kogyo Co., Ltd. | ハイブリッドレーザ加工装置 |
| US7910856B2 (en) | 2005-08-25 | 2011-03-22 | Shibuya Kogyo Co., Ltd. | Hybrid laser processing apparatus |
| JP2009095884A (ja) * | 2007-09-28 | 2009-05-07 | Sugino Mach Ltd | 噴流液柱内に導かれたレーザー光によるレーザー加工装置 |
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| JP2012066269A (ja) * | 2010-09-22 | 2012-04-05 | Shibuya Kogyo Co Ltd | レーザ加工装置 |
| JP2014205170A (ja) * | 2013-04-12 | 2014-10-30 | 株式会社東芝 | レーザ加工方法およびレーザ加工装置 |
| US9659808B2 (en) | 2013-10-15 | 2017-05-23 | Mitsubishi Electric Corporation | Semiconductor-element manufacturing method and wafer mounting device using a vacuum end-effector |
| JP2016132015A (ja) * | 2015-01-21 | 2016-07-25 | 株式会社ディスコ | レーザー加工装置 |
| KR102690774B1 (ko) * | 2019-01-22 | 2024-08-05 | 시노바 에스.에이 | 복합 유체 제트 가이드 레이저 빔을 사용하여 공작물을 컷팅하거나 어블레이팅하는 방법 및 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19518263A1 (de) | 1995-12-07 |
| DE4418845C1 (de) | 1995-09-28 |
| DE59510608D1 (de) | 2003-04-30 |
| EP0762947B1 (de) | 2003-03-26 |
| EP0762947A1 (de) | 1997-03-19 |
| US5902499A (en) | 1999-05-11 |
| JP3680864B2 (ja) | 2005-08-10 |
| DE4418845C5 (de) | 2012-01-05 |
| WO1995032834A1 (de) | 1995-12-07 |
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