JPH1051184A - Equipment for transporting electronic components with lead wires - Google Patents

Abstract

(57) [Problem] To provide an inexpensive apparatus for transferring electronic parts with lead wires, which can be transferred and transferred at high speed with a simple configuration. SOLUTION: A first transport unit comprising a transport chain 2 provided with a transport claw 15 as a transport body and a drive mechanism, and a pair of side guides 14 provided with grooves 4a at predetermined intervals around the periphery are mounted. Flexible transport drum 4 and side guide 14
A second transporting unit composed of a pair of guide plates 7 having an opening disposed near the outer periphery of the nozzle, and a nozzle 3 for transferring the electronic component 1 with the lead wire transported by the first transporting unit to the transporting drum 4 A free first transfer unit and a pusher 6 for transferring and returning the electronic component 1 rotated and transported by the second transport unit to a processing position.
The electronic component 1 can be moved and transported at high speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having lead wires, such as an axial type, which is taken out for processing or storage and transferred to another place, or an electronic part which has already been taken out from another place. The present invention relates to a device for transporting electronic components with lead wires, which is used when taking out and transporting again.

[0002]

2. Description of the Related Art Conventionally, this type of conventional device for transporting electronic parts with lead wires is mainly composed of a transport chain, a plurality of chucks and a drive mechanism thereof.
FIG. 1 is a front view of a main part of a conventional transport device for electronic components with lead wires.

In FIG. 7, a transport chain 22 for transporting a plurality of electronic components 21 having lead wires, and electronic components 21 mounted and transported on both ends of a drive arm 26 having a holding portion 25 at the center, respectively. Chuck 23 for holding
a, 23b (or a vacuum suction pad) and the holding unit 2 for vertically moving and rotating the chucks 23a, 23b.
5 is connected to the drive mechanism 24.

Next, the operation will be described. Electronic component 21a with lead wire transported by transport chain 22
Is held by the tip of a chuck 23a attached to one end of the drive arm 26 lowered by the drive mechanism 24. At the same time, the electronic component 21b with the lead wire, for which the processing operation such as grooving has been completed, is held by the tip of the chuck 23b attached to the other end of the drive arm 26 raised by the drive mechanism 24.

Thereafter, the chucks 23a and 23b are rotated by the drive mechanism 24, and the transported electronic component 21a is transferred to the processing position, and the electronic component 21b that has been processed is transferred to the transport chain 22. While the electronic component 21a transferred to the processing position is being processed, the transport chain 2
2 operates and moves, and the electronic component 21b which has completed the processing operation
Is configured to be transported to a predetermined location.

When the electronic component 21 is to be transferred from a transfer body composed of the transfer chain 22 to a processing position at a high speed, the chuck 23 is moved by increasing the number of tips of the drive arm 26 as shown in FIG. Serialization (for example, 4 or 8
Conventionally, there has been known a method of arranging them in a row and shortening the moving distance.

[0007]

However, in the above-described conventional configuration, the transfer speed can be increased by increasing the number of chucks 23, but the transfer apparatus becomes complicated and large due to the increase in the number of chucks 23. In addition, there is a problem that the cost increases due to an increase in the number of constituent parts.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide an inexpensive apparatus for transferring electronic parts with lead wires, which can be transferred at a high speed with a simple structure. is there.

[0009]

In order to solve the above-mentioned problems, the present invention provides a device for transporting electronic parts with lead wires, comprising: a transport chain provided with transport claws as a transport body; And a pair of side guides in which a plurality of grooves for temporarily storing and holding electronic components with lead wires are arranged on the periphery at a plurality of predetermined intervals, and a second conveyance drum which is attached to the periphery and is rotatable at a predetermined angle. Parts, a plurality of openings corresponding to the side guides, and a pair of guide plates having concentric shafts installed in the vicinity of the outer periphery, and a pair of guide plates having holes in the center, and electronic components transferred to the grooves from the first transport unit. A first transfer unit that can be moved up and down by a nozzle to be moved, and a second transfer unit that can be moved up and down by a pusher that transfers an electronic component from its groove to a processing position or returns the electronic component after processing is completed. is there.

According to the present invention, it is possible to hold, transfer, or convey an electronic component with a lead wire at a predetermined position at a low cost, with a simple configuration, and at a high speed.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to a first aspect of the present invention, there is provided a method for aligning and intermittently transporting electronic components with leads.
A transport section, a first transfer section provided below the first transport section so as to be able to move up and down to individually take out the electronic components transported by the first transport section, and the electronic components taken out by the first transfer section. A plurality of grooves for holding the lead wires of the electronic components are provided on the periphery at predetermined intervals, and are indexed and rotatable on the upper part of the first transfer unit so that the rotation axis intersects the conveyance direction of the first conveyance unit. An electronic component is taken out from a part of a path on which an electronic component having a lead wire held in a groove provided in the second transporting unit is rotatably conveyed, or an electronic component already taken out is taken out. A second transfer section is provided in the vicinity of the outer periphery of the second transfer section so as to be able to move up and down again to be transferred and held in the groove of the second transfer section. This has the effect that transfer and transport can be performed at high speed.

According to a second aspect of the present invention, in the first aspect of the present invention, the transport claw for transporting the electronic component with the leading end portion abutting on the lead wire of the electronic component is opposed to the transport claw in parallel with the transport direction. The first transport section is constituted by transport chains provided at intervals, and has an effect of holding or transporting electronic components in an aligned manner.

According to a third aspect of the present invention, in accordance with the first or second aspect of the present invention, the indexable rotatable transport drum and the grooves for fitting and holding the lead wires of the electronic components at the periphery thereof are provided at regular intervals. The second pair of ring-shaped side guides are mounted so as to face the peripheral edge of the transport drum.
The second transporting section is constituted by forming a transporting section, having holes slightly smaller than the outer diameter of the side guide, and having dimensions not contacting the electronic components held in the grooves of the side guides, and opening portions provided respectively on the upper and lower sides. A guide plate formed so as to cover is disposed such that the center of the hole is coaxial with the rotation center of the second transport unit, and the electronic components are aligned and held, transferred, or transported. Having.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1A is a partially cutaway front view of a device for transporting electronic components with lead wires according to the embodiment, FIG. 1B is a cross-sectional side view of the same, FIG. 2 is an enlarged front view of a main part of the second transporter, FIG. 3 is a timing chart showing the transfer operation, and FIG. 4 is a front view of a main part for explaining the transfer operation.

In FIGS. 1A and 1B, reference numeral 1 denotes an electronic component with a lead wire, such as an axial type such as a resistor, a capacitor, an inductor, and a diode. The transport chain is made of a resin material or the like, and transports the electronic component 1 while positioning the lead wire of the electronic component 1 by abutting the leading end of one side of the transport claw 15 which is attached at a plurality of predetermined intervals. And a first transport unit together with a drive mechanism (not shown) such as a motor for intermittently driving the transport chain 2.

Numeral 3 is a nozzle made of a metal material or an insulator constituting the first transfer portion, and is vertically moved through the body frame 16 (the drive mechanism is not shown).
Of the electronic component 1 which is attached to the tip of the
Is lifted up from the position in the transport chain 2 to be removed and taken out.

Reference numeral 4 denotes a transport drum, which is a main frame 16
The bearing 19 mounted on an angle 18 fixed to the main body 16 is inserted through the shaft 11 having one end fixed to the center of the transport drum 4 and rotated by the pulse motor 5 mounted on the angle 17 fixed to the main body frame 16. Driven.

Reference numeral 14 denotes a pair of ring-shaped side guides made of an elastic metal or resin material.
A plurality of them at predetermined intervals on the periphery (for example, equally divided into eight places)
The U-shaped grooves 4a to 4h are provided so as to oppose the peripheral edges of both surfaces of the transport drum 4 to regulate and store and hold the electronic component 1.
Together, they constitute the second transport section.

Reference numeral 7 denotes a pair of guide plates formed so as to cover the second transport section. The guide plates 7 have openings at upper and lower portions, are slightly smaller than the outer diameter of the side guide 14 attached to the transport drum 4, and are provided with electronic components. The part 1 inserts its lead wire into the groove 4a,
4b is provided with a hole having an inner diameter slightly larger than the maximum outer diameter when fitted and stored, and is installed concentrically near the outer periphery corresponding to the side guide 14, and is provided on the outer periphery of the side guide 14 attached to the transport drum 4. The main body of the electronic component 1 conveyed while being held on the line by the grooves 4a to 4h is regulated by the inner surface of the hole, and movement, scattering or dropping is prevented. A transport path is configured in combination with the configured second transport unit.

The electronic component 1 picked up and taken out by the nozzle 3 is transferred and regulated by the width of the pair of side guides 14 on the right and left sides of the main body, and the lead wires are connected to the grooves 4a to 4a. 4h, mounted and held at predetermined intervals, and the upper and lower positions are regulated by the inner surfaces of the holes of the pair of guide plates 7, and attached to the transport drum 4 while preventing movement, scattering or falling to the outer periphery. The side guide 14 is rotated and conveyed on a predetermined outer peripheral line.

Reference numeral 6 denotes a pusher made of a metal material or an insulator which constitutes the second transfer portion. The pusher 6 moves up and down through the insertion guide 10 mounted on the main body frame 16 (the drive mechanism is not shown). 13 is attached to the other end of the lever 12 having one end coupled to the tip of the lever 13 and is vertically movable;
The electronic component 1 held by the grooves 4a to 4h on the outer periphery of the side guide 14 attached to the transport drum 4 and rotated and transported.
Is transferred from the upper opening of the guide plate 7 to a processing position, an inspection position, a storage location, or the like, and is supplied.

Reference numeral 8 denotes a pair of positioning guides.
The electronic components 1 mounted on the main body frame 16 and conveyed by the conveying claws 15 of the conveying chain 2 are regulated and guided while being aligned.

The details of the tip of the nozzle 3 are shown in FIG.
As shown in the plan view of the tip of the nozzle in (a) and the partial cross-sectional side view in FIG. 5 (b), a hole 3b for air suction and the like is inserted in the center, and the electronic component 1 with lead wire is provided. The protrusion 3a which is in contact with the projection 3a has a rectangular shape, and has a structure in which the left side from the center is horizontally flat and the right side is inclined upward, and the electronic component 1 is rotated by the transport drum 4 without interference with the protrusion 3a. It can be rotated and transported.

The details of the tip of the pusher 6 are shown in FIG.
As shown in a plan view of the tip of the pusher in FIG. 6A, a partial cross-sectional side view of FIG. 6B, and a perspective view of the tip in FIG. Holes 6a, 6e, and 6c having different sizes and shapes are continuously inserted, and a tip 6b that comes into contact with the electronic component 1 is a U-shaped groove. I try not to wake up.

Next, the operation will be described with reference to FIGS. 1 (a) and 1 (b), FIGS. 2, 3 and 4 (a) to 4 (h).

In FIGS. 4A to 4H, the components and the configuration are simplified to only necessary parts in order to easily explain the operation.

FIG. 4A shows a fixed stop state before the operation is started, and the lead wire of the electronic component 1 with the lead wire is fitted around the side guide 14 attached to the transport drum 4 (not shown). Eight equally divided grooves 4a to 4h for storing, holding or transporting are provided, of which grooves 4c and 4e are respectively provided with electronic parts 1c and 1e with lead wires before processing, and grooves 4f and 4h. The guide plate 7 (not shown) prevents movement, scattering or dropping of the electronic components 1 f and 1 h with lead wires, which have been processed, and restricts the vertical position. , And the electronic component 1 a with the lead wire is placed at a predetermined position of the transport chain 2.

Next, the operation is started as shown in FIG. 4B, and the electronic component 1e is lifted to the processing position through the upper opening of the guide plate 7 (not shown) by the rise of the pusher 6, and is transferred. Is done. At the same time, the electronic component 1a is lifted up from the transport chain 2 by the rise of the nozzle 3 and is taken out.

Next, as shown in FIG.
After the electronic component 1e lifted and transferred by the electronic component 1e is delivered and transferred to and supplied to a processing preparation mechanism (not shown), the pusher 6 returns to the original home position, and the electronic component 1a is further raised by further raising the nozzle 3. Is the guide plate 7 from the transport chain 2
(Not shown) and is transferred to and housed in the groove 4a provided in the side guide 14 through the lower opening.

Thereafter, as shown in FIG. 4D, the conveying drum 4 (not shown) is rotated by 22.5 degrees (1/2 of an equal division) clockwise through the shaft 11 by the pulse motor 5. The electronic component 1a is conveyed while being regulated, stored and held as described above by the groove 4a provided in the side guide 14, the guide plate 7 (not shown), and the side guide 14. Thereafter, as shown in FIG. 4 (e), when the nozzle 3 returns to the home position, the transport drum 4 (not shown) again
The electronic component 1h which has been rotated by 2.5 degrees clockwise and has been processed and stored and held in the groove 4h provided in the side guide 14 is inserted into the lower opening of the guide plate 7 (not shown). And falls by its own weight at a predetermined location on the transport chain 2.

Processing operations such as grooving are performed between (c) and (f) of the transfer operation timing chart shown in FIG.
When the processing operation is completed, the pusher 6 is raised as shown in FIG.
Then, as shown in FIG. 4 (g), the pusher 6 descends and passes through the upper opening of the guide plate 7 (not shown) into the groove 4d provided in the side guide 14 so that the electronic component is placed. Transfer 1e. At the same time, the transport chain 2 moves rightward by one pitch between FIGS. 3E to 3G, and transports the electronic component 1h transferred to the transport chain 2.

Thereafter, as shown in FIG. 4 (h), the transport drum 4 (not shown) is rotated clockwise by 45 degrees (equally divided into eight) by the pulse motor 5. Thereafter, the above operation is repeated to convey the electronic component 1 with the lead wire.

In the present embodiment, the transport chain is described as the transport body in the first transport unit, but a timing belt, a belt conveyor, a pallet, a tray, or the like provided with transport projections or the like may be used. Needless to say.

[0034]

As described above, according to the present invention, the first transporting section, which is a transporting body such as a transporting chain for transporting electronic parts with lead wires, is temporarily moved from the first transporting section to the second transporting section by a transporting drum or the like. The first transfer unit transfers the data to a processing position and the like, and the second transfer unit transfers and returns to the processing position. This has the advantageous effect that the data can be transferred and transported at high speed and reliably.

[Brief description of the drawings]

FIG. 1 (a) is a partially cutaway front view of a transfer device for an electronic component with lead wires according to an embodiment of the present invention.

FIG. 2 is an enlarged front view of a main part of the second transport unit.

FIG. 3 is a timing chart showing the transfer operation.

FIG. 4 is a front view of a main part for explaining the transfer operation.

FIG. 5A is a plan view of the tip of the nozzle. FIG.

6A is a plan view of the tip of the pusher, FIG. 6B is a partial cross-sectional side view of the pusher, and FIG.

FIG. 7 is a front view of a main part of a conventional transport device for electronic components with lead wires.

FIG. 8 is a front view of a main part of the transfer device for electronic parts with lead wires in the multiple connection.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 1a, 1c, 1e, 1f, 1h, 1j Electronic component 2 Transport chain 3 Nozzle 3a Protrusion 3b Hole 4 Transport drum 4a-4h Groove 5 Pulse motor 6 Pusher 6a, 6c, 6e Hole 6b Tip 7 Guide plate 8 Positioning Guide 9 Hollow Shaft 10 Insertion Guide 11 Shaft 12 Lever 13 Shaft 14 Side Guide 15 Transport Claw 16 Body Frame 17 Angle 18 Angle 19 Bearing

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroyoshi Minato 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroyuki Saikawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A first transport unit for aligning and intermittently transporting electronic components with lead wires, and a vertically movable unit below the first transport unit for individually taking out the electronic components transported by the first transport unit. And a plurality of grooves for holding lead wires of the electronic components taken out by the first transfer portion are provided at predetermined intervals on a peripheral edge of the first transfer portion, and a rotation axis is transferred by the first transfer portion. A second transport unit rotatably indexed above the first transfer unit so as to intersect the direction, and an electronic component having lead wires held in a groove provided in the second transport unit is rotatably transported. The electronic component is taken out in a part of the path to be taken, or the electronic component already taken out is provided in the vicinity of the outer periphery of the second transport unit so as to be movable up and down so as to be transferred and held again in the groove of the second transport unit. A device for transporting electronic components with lead wires, comprising a second transfer unit. 2. A first transporting unit comprising a transport chain having a transporting claw for transporting an electronic component, the leading end of which abuts against a lead wire of the electronic component and is provided at a predetermined interval in parallel with the transport direction. Item 4. A transport device for electronic parts with lead wires according to Item 1. 3. A transport drum which can be indexed and rotated, and a pair of grooves which are provided at regular intervals with grooves for fitting and holding lead wires of electronic components on the peripheral edge and mounted in pairs so as to face the peripheral edge of the transport drum. The second conveying section is constituted by side guides, and holes slightly smaller than the outer diameter of the side guides and having dimensions not contacting the electronic components held in the grooves of the side guides, and openings are provided above and below, respectively. 3. The transport device for electronic parts with lead wires according to claim 1, wherein a guide plate formed so as to cover the second transport portion is disposed such that the center of the hole is coaxial with the rotation center of the second transport portion. .