JPH1053856A - Spraying method on aluminum material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the adhesion of coating film by forming a soldering layer on an Al substrate by an ultrasonic soldering method, thereafter thermally spraying a thermal spraying material thereon and forming coating film. SOLUTION: An Al substrate 2 is immersed in a soldering bath in an ultrasonic soldering device. When ultrasonic waves are applied into the soldering bath in this state, cavitation caused by the ultrasonic waves destroys oxidized coating film on the surface of the Al substrate 2, and active metals and the solder are swiftly alloyed, e.g. to form a Zn soldering layer 3 on the surface of the Al substrate 2. After that, the surface of the soldering layer 3 is thermally sprayed with a thermal spraying material of metal or metallic oxide, e.g. by a plasma thermal spraying method to form sprayed coating film 4. At this time, in the case the thermal spraying is executed after preheating, the soldering layer is softened, by which its adhesion property can moreover be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sprayed coating (particularly, an alloy containing aluminum as a main component or ceramics containing aluminum as a main component) on a piston, a cylinder or other products made of aluminum material of an internal combustion engine. The present invention relates to a method for thermal spraying on an aluminum material, which is applied when forming (1).

[0002]

2. Description of the Related Art Conventionally, there have been proposed surface modification methods for forming a thermal sprayed coating of a hard layer on the surface of an aluminum material which is required to have wear resistance or the like by various thermal spraying methods. This thermal spray coating mainly secures the adhesion strength to the aluminum material by an anchor effect, and the aluminum material surface is roughened before thermal spraying to improve the adhesion strength of the thermal spray coating.

As a pretreatment for such thermal spraying, a treatment method for roughening the surface of an aluminum substrate by a blast treatment method or a chemical corrosion method is used. Among them, the blasting method roughens the surface of the aluminum base material 53 by spraying a blast material 52 onto the surface of the aluminum base material 53 with compressed air of a predetermined pressure from a blast nozzle 51 as shown in FIG. I have.

[0004] As shown in FIG. 13, after the surface of an aluminum base material 53 is roughened by a blast treatment method or a chemical corrosion method, a sprayed material is sprayed with a spray gun 54 to form a sprayed film 55. In this case, the adhesion strength is normally maximized when the thermal spraying frame 56 is sprayed so as to be perpendicular to the surface of the aluminum base material 53, and the adhesion strength decreases as the angle is increased. However, when the thermal spray coating 58 is formed on the cylinder sleeve 57 as shown in FIG. 14, a sufficient thermal spray distance cannot be obtained depending on the diameter of the cylinder, or the base material surface is directly hit by the thermal spray frame 60.
Although the heat input to the base material is excessively performed, the adhesion strength of the coating film is reduced. However, in the conventional thermal spraying method, the output is reduced, or the internal spraying gun 59 sprays at an angle θ. . In particular, when using aluminum alloy as the base material,
After the self-fluxing alloy was thermally sprayed on the iron-based substrate, there was no effective post-treatment for improving the adhesion strength by diffusion treatment.

[0005]

However, since an oxide film is formed on the surface layer of the aluminum material, strong adhesion due to a reaction or the like cannot be expected at the interface with the sprayed coating.
Only the adhesion strength due to the anchor effect was attained, and the thermal spray coating was easily peeled off from the substrate surface. On the other hand, when the thermal spray coating 55 is formed on the surface of the aluminum base material 53 roughened by the blasting method in FIG.
As shown in FIG.
Or the gap 61 is formed on the surface of the thermal spray coating 55, and the adhesion strength of the thermal spray coating 55 is reduced. The cylinder sleeve 5 shown in FIG.
In the case where the thermal spray coating 58 is formed on the base material 7, if the inner diameter thermal spray gun 59 to be used is sprayed with an angle θ or a low output, the force of the molten particles hitting the base material becomes weak. Of the thermal sprayed coating 58 was inferior in reliability.

The present invention has been made in view of such circumstances, and has as its object to improve the adhesion strength of a thermal spray coating to a substrate as compared with conventional processing methods, and to provide a highly reliable thermal spray coating. It is an object of the present invention to provide a method for thermal spraying on an aluminum material capable of obtaining a thermal spray.

[0007]

Means for Solving the Problems In order to solve the problems of the prior art, the gist of the present invention is to form a solder layer on the surface of an aluminum substrate by an ultrasonic soldering method, and thereafter, This is a method of spraying an aluminum material which forms a sprayed coating by spraying a sprayed material on the surface of the solder layer.

[0008] The gist of the invention of claim 2 is that a solder layer is formed on the surface of an aluminum substrate by an ultrasonic soldering method, and then the aluminum substrate on which the solder layer is formed is preheated. The present invention is directed to a method of spraying an aluminum material which forms a sprayed coating by spraying a sprayed material on the surface of a solder layer.

Further, the gist of the invention of claim 3 is that a solder layer is formed on the surface of an aluminum substrate by an ultrasonic soldering method, and then a spray material is sprayed on the surface of the solder layer to form a spray coating. Then, there is a method of thermal spraying on an aluminum material in which a heat treatment is performed on an aluminum substrate on which a solder layer and a thermal spray coating are formed.

The gist of the present invention is that the solder forming the solder layer is made of AH-Z95A (Zn-5w).
(t% Al). The method for thermal spraying on an aluminum material according to any one of claims 1 to 3, wherein

Further, the gist of the invention of claim 5 is the method of spraying aluminum material according to any one of claims 1 to 3, wherein the solder layer is formed to a thickness of 100 μm or less. .

The gist of the invention according to claim 6 is that the thermal spray coating is formed using an Al-Si system, an Al-Ag system, an Al-Cu system and a composite material thereof.
A method for thermal spraying on an aluminum material according to claim 3.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on illustrated embodiments.

FIG. 1 shows a method for spraying aluminum material according to an embodiment of the present invention. In the product 1 made of the aluminum material shown in FIG. 1, a Zn solder layer 3 is formed on the surface of an aluminum substrate 2 by an ultrasonic soldering method, and a spray coating 4 is formed on the surface of the Zn solder layer 3 by plasma spraying. It is a three-layer structure formed by a method (not limited to this thermal spraying method).

For the ultrasonic soldering method, an ultrasonic soldering device 5 as shown in FIG. 2 was used. The ultrasonic soldering device 5 is configured to transmit ultrasonic waves generated by the ultrasonic vibrator 6 to the solder 10 bath in the tank 9 via the ultrasonic horn 7 and the vibration plate 8 and apply the ultrasonic waves. Have been.

The thermal spray coating 4 is formed on the aluminum substrate 2 through the following steps. (1) First, an aluminum substrate 2 constituting the product 1 is prepared. Then, the aluminum substrate 2 is immersed in a solder 10 bath in a tank 9 of the ultrasonic soldering apparatus 5. In this state, the solder 10 is
When an ultrasonic wave is applied to the bath, the cavitation caused by the ultrasonic wave destroys the oxide film on the surface of the aluminum substrate 2 immersed in the solder 10 bath, and the active metal surface and the solder 10 Are rapidly alloyed to form a Zn solder layer 3 on the surface of the aluminum base 2. The Zn solder used was JIS solder AH-Z95A (Zn-5 wt% Al) according to JIS. In addition, Zn-Cd was used as aluminum solder.
System, Zn-Sn system, Cd-Sn system or the like may be used. In the ultrasonic soldering, a sample (described later) preheated to a temperature of 250 ° C. is immersed in a solder 10 bath maintained at a temperature of 410 ° C. and further preheated in the solder 10 bath for 30 seconds. Is 20 at 18.6 KHz
The measurement was performed under the condition that an ultrasonic wave of 0 W was applied for 5 seconds or more. When ultrasonic soldering was performed under these conditions, a Zn solder layer 3 having a thickness of 50 μm was formed on the surface of the aluminum substrate 2.

(2) Thereafter, a metal or metal oxide spray material was sprayed on the surface of the Zn solder layer 3 by a spray method to form a spray coating 4. Plasma spraying was used as the spraying method, and the spraying was performed under the conditions shown in Table 1 below. In plasma spraying, a supplied working gas is heated by a direct current arc between a cathode and a nozzle anode, and is jetted from a nozzle as a plasma jet. The powder particles of the thermal spray material are heated and accelerated by the plasma jet and sprayed on the substrate surface to form a coating. Further, in order to investigate the adhesion strength of the thermal spray coating 4, A
1-Si thermal spray coating is formed and Fe-C
An r sprayed film was formed. In addition, materials having high wear resistance, such as Ni-based, ceramics, and cermets, can be sprayed. In the thermal spraying method of the present embodiment, the thermal spraying is immediately performed on the aluminum base material 2 on which the Zn solder layer 3 is formed. However, if the thermal spraying is performed after preheating, the Zn solder layer 3 softens and adheres. Performance can be further improved.

[0018]

[Table 1]

In order to investigate the effect of the Zn solder layer 3 by the ultrasonic soldering, six kinds of samples were prepared. FIG.
5 and 7 are etched with hydrofluoric acid. Sample 1 (see FIGS. 3 and 4): AC4C substrate 2a
+ Zn solder layer 3a by ultrasonic soldering (ultrasonic application time is 5 seconds) + Al-Si thermal spray coating 4a Sample 2 (see FIGS. 5 and 6): AC4C substrate 2b
+ Zn solder layer 3b by ultrasonic soldering (ultrasonic application time is 10 seconds) + Al-Si thermal spray coating 4b Sample 3 (see FIGS. 7 and 8): AC4C substrate 2c
+ Zn solder layer 3c by ultrasonic soldering (ultrasonic application time is 15 seconds) + Al-Si thermal spray coating 4c Sample 4 (see FIGS. 15 and 16): AC4C base material 53 + blasting (# 46 alumina grid, 3 kg)
f / cm ² ) + Al-Si thermal spray coating 55 ・ Sample 5: AC4C base material + Z by ultrasonic soldering
n solder layer (ultrasonic wave application time is 10 seconds) + Fe-Cr
Thermal spray coating ・ Sample 6: AC4C base material + blast treatment (# 46 alumina grid, 3 kgf / cm ² ) + Fe-Cr thermal spray coating

The preferable ultrasonic application time varies depending on the ultrasonic output, the shape and size of the work, and other factors. Hereinafter, the difference in the coating property depending on the ultrasonic wave application time in the thermal spraying method of the present embodiment is shown by samples 1 to 3. The Zn solder layer 3a having an application time of 5 seconds shown in FIGS.
The oxide film on the surface of the AC4C substrate 2a was insufficiently broken, and part of the film was peeled off at the interface between the substrate 2a and the Zn solder layer 3a in the adhesion strength test. The Zn solder layers 3b and 3c with the application time of 10 seconds and 15 seconds shown in FIGS.
The oxide film on the surface of the 4C substrates 2b and 2c is destroyed, and AC4C
It penetrates deeply into the base materials 2b and 2c. In the adhesion strength test, the AC4C substrates 2b and 2c and the Zn solder layers 3b and 3c
Nothing peels off at the interface with the Zn solder layers 3b, 3b.
c and peeled off at the interface between the Al—Si sprayed coatings 4b and 4c. In Sample 1, even if the oxide film on the surface of the AC4C base material 2a was insufficiently broken by Zn solder, as can be seen from Table 2 below, the adhesion strength of the thermal spray coating 4a was higher than that of Sample 4. In order to improve the adhesion strength of the thermal spray coating 4, the ultrasonic wave application time t at the time of ultrasonic Zn soldering is t ≧
Five seconds is fine. However, from the viewpoint of the destruction state of the oxide layer on the surface of the aluminum substrate 2 and the result of the adhesion strength, it can be said that preferably t ≧ 10 seconds. Note that there is no particular upper limit on the ultrasonic wave application time, but it is necessary to consider economical efficiency since application of a long time does not necessarily improve the effect.

The thickness of the Zn solder layer 3 can be controlled by the speed at which the sample is drawn from the solder 10 bath. The thickness of the Zn solder layer 3 does not affect the adhesion strength between the aluminum base material 2 and the Zn solder layer 3 and the adhesion strength between the Zn solder layer 3 and the thermal spray coating 4, but the Zn solder layer 3 is not so strong. If the thickness is too large, the economy becomes worse and the overall strength is also reduced. The Zn solder layer 3 is formed with a thickness of at least several μm. When the thickness is from several μm to about ten and several μm, the adhesion strength of the thermal spray coating 4 or the like is sufficiently effective. That is, when the thickness of the Zn solder layer 3 is set to 100 μm or less, unnecessarily taking out the solder and heat treatment time can be suppressed, and the cost can be reduced.

Table 2 below shows the results of an examination of the adhesion strength of Samples 1 to 6. From Table 2, it can be seen that the Al-Si thermal spray coating provided with a Zn solder layer by ultrasonic soldering and Fe
It can be seen that the adhesion strength of Samples 1 to 3 and 5 of the Cr-sprayed coating are greatly improved with respect to Samples 4 and 6 of the Al-Si sprayed coating and the Fe-Cr-sprayed coating subjected to the blast treatment. . Among them, like Fe-Cr spray coating,
The effect was great for a material having a different coefficient of thermal expansion from the AC4C base material. Therefore, by subjecting the aluminum base material 2 having the thermal sprayed coating 4 to the surface thereof to a predetermined surface polishing or the like, a product 1 with improved wear resistance can be obtained.

[0023]

[Table 2]

FIG. 9 shows a method of spraying aluminum material according to another embodiment of the present invention. In the method of spraying aluminum material according to the present embodiment, the aluminum base material 2 on which the Zn solder layer 3 is formed is preheated to 150 ° C. or higher, and thereafter, the spraying frame 11 is moved from the spray gun 11 to the aluminum base material 2 and A point that the thermal spray coating 4 is formed by spraying the surface of the Zn solder layer 3 at a predetermined angle θ; and that the thermal spray coating 4 is made of an Al—Ag type besides an Al—Si type.
Except for using Al-Cu and its composite materials,
This is almost the same as the embodiment of the present invention, and the description is omitted.

As for the thermal spraying method, plasma spraying was performed under the conditions shown in Table 3 below, using plasma spraying, as in the above embodiment of the present invention.

[0026]

[Table 3]

Further, in order to investigate the adhesion strength of the thermal spray coating 4, the following samples having an Al—Si thermal spray coating formed thereon were prepared. Here, the angle between the surface of the base material 2 and the thermal spray frame 12 is defined as θ. Sample 1: AC4C substrate 2 + Zn solder layer 3 by ultrasonic soldering + preheating + Al-Si thermal spray coating 4 (θ = 4
Sample 2: AC4C base material 2 + Zn solder layer 3 by ultrasonic soldering + preheating + Al-Si spray coating 4 (θ = 4)
5 deg) + heat treatment Comparative Sample 3: AC4C base material + blast treatment (# 46)
Alumina grid, 3 kgf / cm ² ) + Al-Si thermal spray coating (θ = 45 deg) Comparative sample 4: AC4C substrate 2 + Zn solder layer 3 by ultrasonic soldering + Al-Si thermal spray coating 4 (θ = 90)
deg) Comparative sample 5: AC4C base material 2 + Zn solder layer 3 by ultrasonic soldering + preheating + Al-Si thermal spray coating 4 (θ
Comparative sample 6: AC4C base material + blast treatment (# 46)
Alumina grid, 3 kgf / cm ² ) + Al-Si thermal spray coating (θ = 90 deg)

In the above sample 1, the spray angle θ is 45 deg.
Therefore, without preheating, the molten particles were not driven into the Zn solder layer 3 and no thermal spray coating was formed. However, when the AC4C base material 2 was preheated to 150 ° C. or higher and sprayed, a sprayed coating 4 was formed. This is because Zn
This is because the solder was softened by the heat and the molten particles were easily driven. Comparative sample 4 has a spray angle θ of 90 de.
g, the heat conductivity to the AC4C base material 2 is good, and the molten particles are easily driven. Therefore, the thermal spray coating 4 could be sufficiently formed without preheating.

In Sample 2, after the thermal spray coating 4 was formed, a heat treatment was performed to promote the diffusion of solder toward the coating. In this heat treatment, air-cooling is performed after holding at 370 ° C. for 4 hours. The heat treatment conditions were selected by conducting preliminary experiments in advance. According to this preliminary experiment, when heat treatment is performed at a temperature equal to or higher than the melting point of solder, melting of the solder causes Z
Pores were generated in the n solder layer 3. The generation of pores is not preferable as a factor that causes a decrease in strength. Therefore, the heat treatment is performed at a temperature lower than the melting point, and in this experiment, Zn-5w
The test was performed at 370 ° C. which is lower than the melting point of 381 ° C. of t% Al solder. When performing the T6 treatment on the AC4C base material, it is necessary to perform the T6 treatment after the solder layer is diffused and eliminated by heat treatment in advance. This is because if the solder layer remains, pores are generated in the solder layer as described above. The heat treatment time is a factor that governs the degree of diffusion, but is determined by the required adhesion performance and the thickness of the solder layer. AC
When the T6 treatment is not performed on the 4C substrate, it is not necessary to diffuse all the solder layers, and a solder layer may be present in the film according to required performance.

Incidentally, the thickness of the Zn solder layer 3 is preferably 100 μm or less for the same reason as described in the embodiment of the present invention. Also, when it is desired to diffuse the entire Zn solder layer 3 by heat treatment, if the solder layer is thick, it is necessary to perform heat treatment for a long time, which is not preferable because the economic efficiency and productivity are lowered. Furthermore, in the present embodiment, the case where ultrasonic Zn soldering is performed on an aluminum alloy base material to form an Al—Si sprayed film has been described, but the types of solder other than Zn include Zn—Cd, Zn— Sn-based, Cd-S
An n-type or other aluminum solder may be used, and another solder layer may be selected depending on the base material and the film. Accordingly, preheating / heat treatment conditions and the like can be variously changed.

Table 4 below shows the results of an examination of the adhesion strength of the samples 1 to 6. Regarding the decrease in adhesion strength due to the spraying angle, comparing Comparative Sample 6 and Comparative Sample 3 from Table 4,
3.6 kgf / mm ² at 90 deg
It can be seen that at 5 deg, it is 1.5 kgf / mm ^{2, which} is a half or less. Regarding the effect of the solder layer, Sample 1
The adhesive strength was higher than that of Comparative Sample 3 and Comparative Sample 6 which were blasted, and the adhesive strength was about 1.5 times the adhesive strength of Comparative Sample 6 sprayed at 90 deg. Regarding the effect of the preheating, when the comparison sample 4 and the comparison sample 5 are compared, the adhesion strength is inferior to that of the comparison sample 5 to which the preheating is added, but it is equal to the comparison sample 4 without the preheating. Was found to be low. Comparing Sample 1 and Sample 2 with respect to the effect of the heat treatment, it can be seen that the adhesion strength is further improved by the heat treatment. At this time, in Sample 1, the peeling was at the interface between the Zn solder layer 3 and the thermal spray coating 4, but the heat treatment resulted in peeling within the thermal spray coating, so that the diffusion of the Zn solder layer 3 into the thermal spray coating 4 was observed. As a result, it can be seen that the adhesion strength at the interface between the Zn solder layer 3 and the thermal spray coating 4 was improved.

[0032]

[Table 4]

According to the present invention, if a substrate to which solder is attached is used,
Irrespective of the material of the thermal spray coating, it has the effect of improving the adhesion strength, but the Zn solder layer 3 is formed by ultrasonic soldering on the aluminum alloy base 2 as shown in the present embodiment, and thereafter If the thermal spray coating 4 containing aluminum as a main component is formed, the effect is enhanced. Further, in the present embodiment, the Al-based coating is formed on the aluminum base material. However, in many cases, a medium hardness of about 200 to 300 HV in Vickers hardness is used for members and parts used for wear resistance. That is, it is enough that the hardness is slightly higher than the hardness of practical aluminum such as JIS AC4C or AC8A,
In many cases, high hardness and high heat resistance of ceramics, intermetallic compounds, refractory metals, and the like are not necessarily required. In such a case, the surface of a practical aluminum such as JIS AC4C, AC8A, ADC material or the like is coated with an Al-Si-based
By forming a coating of Al-Cu type or Al-Cu type, it can be a member enduring practical use.

FIGS. 10 and 11 show a method of spraying aluminum material according to still another embodiment of the present invention. In the method of spraying an aluminum material according to the present embodiment, a spray coating 4 in which an alloy or ceramic containing aluminum as a main component is dispersed is formed on the surface of Zn solder layer 3, and after the spray coating 4 is formed, Except that the solder is also diffused to the thermal spray coating 4 side by performing the heat treatment, it is almost the same as the embodiment of the present invention, and the description is omitted. In FIG. 10, reference numeral 13a denotes a solder diffusion layer on the film side, and 13b denotes a solder diffusion layer on the base material side. In FIG. 11, K is a diffusion region where the solder layer has disappeared, K ₁ is a film-side diffusion region,
K ₂ denotes the substrate side diffusion region.

Next, the following samples were prepared in order to investigate the effect of the heat treatment. The thermal spray coating 4 formed an Al-Si thermal spray coating as an Al-based material under the conditions shown in Table 5 below. Other matters related to the thermal spray coating are the same as those of the embodiment of the invention shown in FIG. As the heat treatment, air cooling was performed after holding at 370 ° C. for 4 hours for the reason described above. As a result, the Zn solder layer 3 is
As shown in the solder diffusion layers 13b and 13a in the inside, all of them diffused to the substrate side and the coating side. -Sample 1: AC4C substrate 2 + Zn solder layer 3 by ultrasonic soldering + Al-Si thermal spray coating 4 + heat treatment-Sample 2: AC4C substrate 2 + Zn solder layer 3 + Al-Si thermal spray coating 4 by ultrasonic soldering-Comparative sample 3: AC4C base material + blast treatment (# 46
Alumina grid, 3kgf / cm ² ) + Al-Si thermal spray coating

[0036]

[Table 5]

In this heat treatment condition, the heat treatment is performed at a temperature lower than the melting point for the reason described above. However, if the heat treatment temperature is lowered, the time for diffusion becomes longer. Good. T6 on AC4C substrate
When performing the treatment, as shown in FIG. 11, it is necessary to perform the treatment after the solder layer is diffused and eliminated by heat treatment in advance. This is because if the solder layer remains, pores are generated in the solder layer as described above. The heat treatment time is a factor that governs the degree of diffusion, but is determined by the required adhesion performance and the thickness of the solder layer. There is no particular limitation. When the T6 treatment is not performed on the AC4C substrate,
It is not necessary to diffuse all of the solder layer, and a solder layer may be present in the film according to the required performance.

Table 6 below shows the results of examination of the adhesion strength of the above Samples 1 to 3. From Table 6, it can be seen that the adhesion strength of the Al—Si sprayed coating 4 of Sample 1 is higher than that of Samples 2 and 3. This is because the solder of the Zn solder layer 3 diffused to the film side by the heat treatment.

[0039]

[Table 6]

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made based on the technical concept of the present invention.

[0041]

As described above, in the method of spraying aluminum material according to the present invention, a solder layer is formed on the surface of an aluminum substrate by an ultrasonic soldering method, and then the sprayed material is coated on the surface of the solder layer. Because the thermal spray coating is formed by thermal spraying, higher adhesion strength of the coating to the aluminum substrate can be obtained than with the conventional blasted method, and the improvement of the adhesion strength improves the reliability of the thermal spray coating. Can be increased. For this reason, since the aluminum base material on which the thermal spray coating is formed by the thermal spraying method of the present invention has excellent wear resistance, it can be applied to engine parts such as cylinder sleeves.

In another method for spraying aluminum material according to the present invention, a solder layer is formed on the surface of an aluminum substrate by an ultrasonic soldering method, and then the aluminum substrate on which the solder layer is formed is preheated. After that, since the thermal spray material is sprayed on the surface of the solder layer to form a thermal spray coating, the adhesion strength of the thermal spray coating can be further improved, and the blasting is performed by the diameter and depth. Even in the case of an aluminum substrate having a cylindrical shape or the like, which is difficult to maintain and cannot maintain stable quality, it can be processed with good reproducibility by controlling the ultrasonic soldering process.

Further, in another method of spraying an aluminum material according to the present invention, a solder layer is formed on the surface of an aluminum substrate by an ultrasonic soldering method, and then the sprayed material is sprayed on the surface of the solder layer. The thermal spray is applied to the aluminum substrate on which the solder layer and the thermal spray coating are formed, so that the solder diffuses into the thermal spray coating to further improve the adhesion of the thermal spray coating to the aluminum substrate. Can be done.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a thermal spray coating formed on an aluminum substrate by a thermal spray method according to an embodiment of the present invention.

FIG. 2 is a schematic view showing an ultrasonic soldering apparatus for forming a Zn solder layer on the surface of the aluminum base.

FIG. 3 shows a thermal spraying method according to an embodiment of the present invention.
It is sectional drawing which shows the thermal spray coating formed on the aluminum base material in ultrasonic application time for 5 second.

FIG. 4 is a view 100 illustrating the state of the thermal spray coating in FIG.
It is a microscope photograph at the magnification.

FIG. 5 shows a thermal spraying method according to an embodiment of the present invention.
It is sectional drawing which shows the thermal spray coating formed on the aluminum base material in the ultrasonic application time of 10 seconds.

FIG. 6 is a view 100 illustrating the state of the thermal spray coating in FIG.
It is a microscope photograph at the magnification.

FIG. 7 shows a thermal spraying method according to an embodiment of the present invention.
It is sectional drawing which shows the thermal spray coating formed in the aluminum base material in 15 seconds of ultrasonic application time.

FIG. 8 is a view for explaining the state of the thermal spray coating in FIG.
It is a microscope photograph at the magnification.

FIG. 9 is a cross-sectional view showing a state where a thermal spraying method according to another embodiment of the present invention is spraying a thermal spray frame on an aluminum base material.

FIG. 10 is a cross-sectional view showing a sprayed coating formed on an aluminum base material by a spraying method according to still another embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a thermal spray coating formed on an aluminum substrate from which a solder layer has been eliminated in FIG.

FIG. 12 is a cross-sectional view showing a state in which the surface of an aluminum substrate is roughened by blasting in a conventional thermal spraying method.

FIG. 13 is a cross-sectional view showing a state where a thermal spraying frame is being thermally sprayed on the surface of an aluminum base material which has been roughened by a conventional thermal spraying method.

FIG. 14 is a cross-sectional view showing a state in which a thermal spraying frame is being sprayed onto an inner peripheral surface of a cylinder sleeve from an internal thermal spray gun in a conventional thermal spraying method.

FIG. 15 is a cross-sectional view showing a state in which a thermal spraying frame is sprayed on the surface of the roughened aluminum base material to form a thermal spray coating in FIG.

FIG. 16 is a view for explaining a state of the thermal spray coating in FIG.
It is a microscope photograph of 00 times.

[Explanation of symbols]

 2 Aluminum base material 3 Zn solder layer 4 Thermal spray coating 5 Ultrasonic soldering device 11 Thermal spray gun 12 Thermal spray frame 13a, 13b Solder diffusion layer

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Harunobu Suzuki 300 Takatsukacho, Hamamatsu-shi, Shizuoka Suzuki Co., Ltd. Takeshi Yotsuya 300 Takatsukacho, Hamamatsu-shi, Shizuoka Suzuki Co., Ltd.

Claims (6)

[Claims] 1. An aluminum material, wherein a solder layer is formed on the surface of an aluminum substrate by an ultrasonic soldering method, and thereafter, a sprayed material is sprayed on the surface of the solder layer to form a sprayed film. Spraying method. 2. A solder layer is formed on the surface of an aluminum base material by an ultrasonic soldering method, and then the aluminum base material on which the solder layer is formed is preheated, and then a spray material is sprayed on the surface of the solder layer. A method for thermal spraying on an aluminum material, comprising forming a thermal sprayed coating by spraying. 3. A solder layer is formed on the surface of an aluminum substrate by an ultrasonic soldering method, and then a thermal spray material is sprayed on the surface of the solder layer to form a thermal spray coating. Then, the solder layer and the thermal spray coating are formed. A thermal spraying method for an aluminum material, wherein a heat treatment is performed on the aluminum substrate on which the aluminum is formed. 4. The solder for forming the solder layer is made of AH
The method for spraying aluminum material according to any one of claims 1 to 3, wherein the method is -Z95A (Zn-5 wt% Al). 5. The method according to claim 1, wherein the solder layer is formed to a thickness of 100 μm or less. 6. The thermal spray coating according to claim 1, wherein the thermal spray coating is formed using an Al—Si, Al—Ag, Al—Cu or composite material thereof. A method for thermal spraying an aluminum material according to any one of claims 1 to 4.