JPH1056033A - Looping adjustment method for wire bonding equipment - Google Patents

Abstract

(57) [Summary] (with correction) [Problem] To provide a looping adjustment method of a wire bonding apparatus that can uniformly adjust a loop height without depending on the experience of an operator and can reduce the number of adjustment steps. I do. SOLUTION: The bonding apparatus stores data of a movement locus of a capillary moving from a first bonding point B1 toward a second bonding point B2 in a memory or the like of a controller as control data of the capillary. The change amount of the looping height H of the wire 3 with respect to the change amount of the horizontal movement distance T2 is stored in a memory of a controller or the like in advance as a data table, and the actual looping height H of the wire 3 when looping is performed is measured. Then, a deviation from the target loop height is calculated, and based on the deviation, the ascending height T1 and the horizontal movement distance T2 at which the target loop height can be obtained are retrieved from the data table to rewrite the trajectory data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a looping adjustment method for a wire bonding apparatus, and more particularly, to a looping adjustment method for changing a moving locus of a capillary to adjust a wire loop height.

[0002]

2. Description of the Related Art As shown in FIG. 2, a wire bonding apparatus performs looping so that a wire 3 is provided between a first bonding point B1 on a semiconductor chip 1 and a second bonding point B2 on a lead frame 2. To the predetermined loop height H
Connect with. During this looping, the capillary into which the wire has been inserted is driven three-dimensionally and moved along a predetermined trajectory.

Conventionally, the trajectory of the above-mentioned capillary is, as shown in FIG.
The first bonding point B1 is raised almost directly above the first bonding point B1 by a distance T1 to a first intermediate point M1 (vertically moving portion), and subsequently, a distance T2 in a direction opposite to the second bonding point B2.
Is moved substantially horizontally to the second intermediate point M2 (horizontal moving portion), and then moved from the second intermediate point M2 to a height corresponding to a target loop height, and then moved to the second bonding point B2. A moving part (a semicircular moving part) has been employed.

When the loop height H of the wire 3 is adjusted, first, the actual loop height H is measured. A task of selecting an appropriate parameter from among a large number of parameters (control factors) such as the wire tension or the moving speed of the capillary, adjusting the value, and then measuring and confirming the actual loop height H again. Had gone.

[0005]

However, in the above-described conventional adjustment of the loop height, it is difficult to make uniform adjustments because the selection of parameters, the amount of adjustment, and the like are dependent on the experience of the operator. In addition, when the actual loop height H is different from the target value even after the parameter is adjusted, the same operation must be repeatedly performed, and there is a problem that the number of adjustment operations is large. The present invention has been made in view of the above problems, and has as its object to provide a looping adjustment method for a wire bonding apparatus capable of uniformly adjusting a loop height and reducing the number of adjustment steps.

[0006]

In order to achieve the above object, a method of adjusting looping of a wire bonding apparatus according to the present invention is characterized in that a moving locus of a capillary moving from a first bonding point to a second bonding point is adjusted. A vertically moving portion ascending from the first bonding point to a position directly above the first bonding point, and a horizontally moving portion horizontally moving in a direction opposite to the second bonding point from the vertical moving portion. In a wire bonding apparatus including a moving part and a semicircular moving and descending part which moves substantially directly upward following the horizontal moving part and then heads toward the second bonding point, a change amount of a rising distance of the vertical moving part And creating a data table representing the relationship between the amount of change in the horizontal movement distance of the horizontal movement portion and the amount of change in the wire loop height. Then, an actual wire loop height is measured, a deviation between the measured actual wire loop height and a target wire loop height is calculated, and a rising distance and a horizontal moving distance are searched from the data table based on the deviation. Then, the rising distance of the vertical movement part and the horizontal movement distance of the horizontal movement part of the movement trajectory of the capillary are corrected based on the retrieved rising distance and the horizontal movement distance.

[0007]

According to the looping adjusting method of the wire bonding apparatus according to the present invention, the loop height is also affected by the rising distance of the vertical moving portion of the moving path of the capillary and the horizontal moving distance of the horizontal moving portion. Based on the finding that changing the horizontal movement distance also changes the loop height, a relationship between the rising distance and the change amount of the horizontal movement distance with respect to the change amount of the loop height is created as a data table. Then, as the initial setting of the loop height, the rising height of the above-described semicircular moving / falling portion is set according to the target loop height, etc., and bonding is performed under the set conditions to measure the actual loop height. The ascending distance and the horizontal moving distance are corrected according to the deviation between the measured actual loop height and the target loop height. For this reason, the loop height can be adjusted by a unified method, the target loop height can be obtained by one adjustment, and the number of adjustment steps can be reduced.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. One embodiment of the present invention is:
As shown in FIG. 2, the wire 3 is connected at a predetermined loop height H between the first bonding point B1 of the semiconductor chip 1 and the second bonding point B2 of the lead frame 2.

At the time of bonding (looping), first, control data of the XYZ robot for driving the capillary is input to the controller of the bonding apparatus and stored in a memory or the like of the controller. The control data includes data of the trajectory of the capillary and correction data.

The trajectory of the capillary is, as shown in FIG. 1 described above, the first bonding point B on the semiconductor chip 1.
A vertical movement portion that rises from the first intermediate point M1 to a first intermediate point M1 substantially directly above the first intermediate point M1, and a distance T2 from the first intermediate point M1 to the second intermediate point M2 in a direction opposite to the second bonding point B2. A horizontal movement portion that moves substantially horizontally, and a height T3 corresponding to the target loop height H from the second intermediate point M2.
And moving to the second bonding point B2 after moving up to the second bonding point B2.

The correction data includes the amount of change in the ascending distance T1 of the vertical moving portion and the horizontal moving distance T1 of the horizontal moving portion.
This is data representing the relationship between the amount of change in 2 and the amount of change in the loop height H of the wire 3, and is stored in a memory or the like of the controller in a data table format. This data table is
As shown in FIG. 3, a change amount ΔT1 of the ascending distance T1 and a change amount ΔT2 of the horizontal movement distance T2 can be specified based on the set value (target value) of the loop height H and the actually measured value. That is, in this data table, for each set value of the loop height H, a deviation from an actually measured value is used as an address.
The change amount ΔT1 of the ascent distance T1 and the change amount ΔT2 of the horizontal movement distance T2 are stored as data. Note that the correction data ΔT1 and ΔT2 use data obtained by experience or experiment.

[0012] To give a specific example, in this data table, the set value of the loop height H is 150 μm.
In, if the measured value is 170 [mu] m, A _n as a value ΔT1 to increase the elevating distance T1 is, B _n is specified as a value ΔT2 to increase the horizontal moving distance T2, the distance if a match is actually measured value and the set value T1 , T2 are set to 0 as the change amounts ΔT1 and ΔT2, and conversely, if the measured value is smaller than the set value, a value for decreasing the ascending distance T1 and a value for decreasing the horizontal moving distance T2 are specified.

Next, the wire 3 is connected to the semiconductor chip 1 and the lead frame 2 by performing looping, and the loop height H is set.
Is measured. When the measured loop height H is different from the target height, when the measured loop height H is input to the controller, the values ΔT1 and T2 to be changed for the distances T1 and T2 using the data table described above. Search for ΔT2. In other words, the controller calculates a deviation from the target loop height by the built-in program, and searches for the ascending distance T1 and the horizontal movement distance T2 to be set from the correction data using the deviation as an address. Then, the ascending distance T1 and the horizontal movement distance T2 of the trajectory data are rewritten to the retrieved values, that is, the values obtained by adding and subtracting the distances T1 and T2 with the change amounts ΔT1 and ΔT2 to obtain the target loop height. Therefore, after this, the target loop height can be obtained by performing looping based on the rewritten trajectory data.

Although the detailed description of the format of the above-mentioned correction data is omitted, a two-dimensional table of the ascending distance with respect to the deviation of the loop height and a horizontal movement with respect to the deviation of the loop height are provided. It is also possible to construct a two-dimensional table of distances, and it is also possible to construct a three-dimensional table showing the relationship of these three parties, and the format can be selected as appropriate.

In the above-described embodiment, the program is stored in the controller of the bonding apparatus.
By executing this program, that is, the measured loop height is input and the program is executed to automatically rewrite the trajectory data, but the operator himself can also rewrite the trajectory data, It is also possible to calculate and input the deviation to the controller.

Further, in the above-described embodiment, the trajectory from the first bonding point B1 to the second intermediate point M2 via the first intermediate point M1 is exemplified, but the trajectory shown by a solid line in FIG. That is, it goes without saying that the present invention can be applied to a locus where the points M1 and M2 do not clearly appear.

[0017]

As described above, according to the looping adjusting method of the wire bonding apparatus according to the present invention, the amount of change in the looping height of the wire with respect to the amount of change in the ascending height or the horizontal moving distance is used as a data table as a data table. Is stored in advance in a controller or the like, and the deviation from the target loop height is calculated by measuring the looping height of the wire when looping is performed. Based on this deviation, the climb height at which the target loop height is obtained from the data table Since the trajectory data is rewritten by searching for the pod horizontal movement distance, the loop height can be adjusted by a unified method without depending on the experience and feeling of the operator, and the target loop height can be obtained by one adjustment. Adjustment man-hours can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a locus of a capillary employed in a looping adjustment method of a wire bonding apparatus according to an embodiment of the present invention.

FIG. 2 shows bonding wires connected by the looping adjustment method.

FIG. 3 is a schematic diagram showing a data table used in the looping adjustment method.

FIG. 4 is a schematic view showing another trajectory of the capillary employed in the looping adjustment method.

[Explanation of symbols]

 Reference Signs List 1 semiconductor chip 2 lead frame 3 wire B1 first bonding point B2 second bonding point M1 first intermediate point M2 second intermediate point T1 ascending distance T2 horizontal moving distance

Claims (1)

[Claims] 1. A vertical moving portion in which a moving trajectory of a capillary moving from a first bonding point to a second bonding point rises from the first bonding point to a position directly above the first bonding point. And a horizontal moving portion that moves from the vertical moving portion horizontally in a direction opposite to the second bonding point, and the second bonding portion moves substantially directly upward following the horizontal moving portion. A wire-bonding apparatus including a semi-circular moving and descending portion toward a point, wherein the relationship between the amount of change in the ascending distance of the vertical moving portion and the amount of change in the horizontal moving distance of the horizontal moving portion and the amount of change in the wire loop height. A data table representing the actual wire loop height is measured, and the deviation between the measured actual wire loop height and the target wire loop height is measured. Is calculated from the data table on the basis of the deviation, and based on the retrieved ascending distance and horizontal moving distance, the ascending distance and horizontal moving distance of the vertical moving portion of the moving trajectory of the capillary are calculated. A looping adjustment method for a wire bonding apparatus, comprising correcting a horizontal movement distance of a moving part.