JPH1058872A - Ic card and its manufacture - Google Patents
Ic card and its manufactureInfo
- Publication number
- JPH1058872A JPH1058872A JP8221937A JP22193796A JPH1058872A JP H1058872 A JPH1058872 A JP H1058872A JP 8221937 A JP8221937 A JP 8221937A JP 22193796 A JP22193796 A JP 22193796A JP H1058872 A JPH1058872 A JP H1058872A
- Authority
- JP
- Japan
- Prior art keywords
- card
- thickness
- substrate
- thermoplastic material
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000155 melt Substances 0.000 claims abstract description 12
- 239000012815 thermoplastic material Substances 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 36
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- -1 polyethylene Polymers 0.000 description 18
- 239000000123 paper Substances 0.000 description 15
- 229920000139 polyethylene terephthalate Polymers 0.000 description 15
- 239000005020 polyethylene terephthalate Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000000465 moulding Methods 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 210000003491 skin Anatomy 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000011111 cardboard Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000013466 adhesive and sealant Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 210000002615 epidermis Anatomy 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＩＣチップを実装
し、カード状に成形されるＩＣカードとその製造方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card on which an IC chip is mounted and molded into a card, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】現在広く用いられているキャッシュカー
ド、クレジットカード等は、プラスチックカードに磁気
ストライプを塗布し、これに記録された情報を読取りで
きるようにしたものである。このような磁気記録方式の
ものでは、第三者によって情報が解読され易く、記録可
能な情報量が少ないといった欠点がある。そこで近年メ
モリ、ＣＰＵ等の機能を有するＩＣをカード状基体に実
装した、いわゆるＩＣカードが開発され、既に実用段階
に達しつつある。2. Description of the Related Art Cash cards, credit cards and the like which are widely used at present have a plastic stripe coated with a magnetic stripe so that information recorded on the magnetic stripe can be read. Such a magnetic recording method has a disadvantage that information can be easily read by a third party and the amount of recordable information is small. Therefore, in recent years, a so-called IC card in which an IC having functions such as a memory and a CPU is mounted on a card-like base has been developed, and is already at a practical stage.
【０００３】このようなＩＣカードの製造方法として
は、従来、プリント配線板の上にＩＣチップを搭載・実
装し、注型樹脂にはめ込んでカード状に成形するという
方法が一般にとられている。その後、カード表面に文
字、記号、絵柄等が印刷される。そのため、カード表面
形状は印刷性に大きく影響し、平滑にすることが必要で
ある。Conventionally, as a method of manufacturing such an IC card, a method of mounting and mounting an IC chip on a printed wiring board, fitting it into a casting resin, and molding it into a card shape has been generally adopted. Thereafter, characters, symbols, pictures, etc. are printed on the card surface. For this reason, the surface shape of the card greatly affects printability, and it is necessary to smooth the card.
【０００４】この平滑性を考慮したＩＣカードの部品構
成に関する技術が、以下のように提案されている。 （１）特開平６−１３９４２１号公報には、巻線コイル
アンテナ部を埋設内蔵する鋳型の凹部を形成した所定の
薄さのシート材料層が開示されている。 （２）特開平５−１２５１４号公報、特開平４−１５２
１９１号公報、特開平４−２９２９９８号公報、又は特
開昭６３−３５３９６号公報には、部品実装した基板を
上層基板と下層基板とで挟み込み、その上から樹脂で封
止し、さらにプラスチックパッケージで被覆する方法が
開示されている。 （３）特開平４−１４０１９３号公報、又は特開平６−
１２２２９７号公報には、ＩＣカード基板全体をシート
材を枠状に打抜いて成形された枠体の枠内に収納後、隙
間部分を充填し、表裏面に接着剤を介してシート部材を
貼付する方法が開示されている。 （４）特開平４−３３６２９９号公報には、ＩＣモジュ
ールの立体形状に合わせてコアシートを切削後、切削部
にＩＣモジュールを埋設してコアシート両面にオーバー
シートを重ね合わせて熱押圧する方法が開示されてい
る。 （５）特開平４−３６３３００号公報には、パッケージ
成形用金型のキャビティ内にカード基板を挿入し、キャ
ビティ内に樹脂を注入することによる一体成形方法が開
示されている。A technique relating to the component configuration of an IC card in consideration of the smoothness has been proposed as follows. (1) Japanese Patent Application Laid-Open No. 6-139421 discloses a sheet material layer of a predetermined thickness in which a concave portion of a mold having a coil coil antenna portion embedded therein is formed. (2) JP-A-5-12514, JP-A-4-152
No. 191, Japanese Unexamined Patent Application Publication No. 4-292998 or Japanese Unexamined Patent Application Publication No. 63-35396 discloses that a board on which components are mounted is sandwiched between an upper layer board and a lower layer board, and a plastic package is further formed thereon. Is disclosed. (3) JP-A-4-140193 or JP-A-6-140193
Japanese Patent Application Laid-Open No. 122297 discloses that an IC card substrate is entirely housed in a frame of a frame formed by punching a sheet material into a frame shape, then filling a gap portion and attaching a sheet member to the front and back surfaces with an adhesive. A method for doing so is disclosed. (4) Japanese Patent Application Laid-Open No. 4-336299 discloses a method of cutting a core sheet according to the three-dimensional shape of an IC module, embedding the IC module in a cut portion, superimposing an oversheet on both sides of the core sheet, and hot pressing. Is disclosed. (5) Japanese Patent Laying-Open No. 4-363300 discloses an integral molding method in which a card substrate is inserted into a cavity of a package molding die and a resin is injected into the cavity.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来技
術のうち特開平６−１３９４２１号公報に開示された、
巻線コイルアンテナ部を埋設内蔵する鋳型の凹部を形成
した所定の薄さのシート材料層は、サイズ及び厚さのバ
ラツキの大きい巻線コイルアンテナを埋設しても完全に
は埋まらず鋳型には多少凹部が残ってしまうので、その
上からオーバーシートを貼付しても優れた表面平滑性が
得られにくく、また、凹部に残存した気泡により、ＩＣ
カードの耐熱、耐湿特性における信頼性が低下するとい
う課題があった。However, of the prior art, Japanese Patent Laid-Open No. Hei 6-139421 discloses
The sheet material layer of a predetermined thickness, which forms the concave part of the mold that embeds and incorporates the coiled coil antenna part, is not completely buried even if the coiled coil antenna with large variation in size and thickness is embedded, Since some concave portions remain, it is difficult to obtain excellent surface smoothness even when an oversheet is attached thereon.
There is a problem that the reliability of the card in terms of heat resistance and humidity resistance is reduced.
【０００６】従来技術のうち、特開平５−１２５１４号
公報、特開平４−１５２１９１号公報、特開平４−２９
２９９８号公報、又は特開昭６３−３５３９６号公報に
開示された、部品実装した基板を上層基板と下層基板と
で挟み込み、その上から樹脂で封止し、さらにプラスチ
ックパッケージで被覆する方法は、封止樹脂に熱硬化系
樹脂を使用しており、ポットライフが短かく、作業の自
由度が低いという課題があった。[0006] Of the prior art, Japanese Patent Application Laid-Open Nos. 5-12514, 4-152191, 4-29
No. 2,998, or Japanese Unexamined Patent Publication No. 63-35396 discloses a method in which a component-mounted board is sandwiched between an upper board and a lower board, sealed with a resin from above, and further covered with a plastic package. Since a thermosetting resin is used as the sealing resin, there is a problem that the pot life is short and the degree of freedom of work is low.
【０００７】また、特開平４−１４０１９３号公報、又
は特開平６−１２２２９７号公報に開示された、ＩＣカ
ード基板全体を、シート材を枠状に打抜いて成形された
枠体の枠内に収納後、隙間部分を充填し、表裏面に接着
剤を介してシート部材を貼付する方法は、ＩＣカード基
板と枠体との隙間のみに充填し、部品凹凸部には充填し
ないため、部品実装面の平滑性が低いという課題があっ
た。Further, the entire IC card substrate disclosed in Japanese Patent Application Laid-Open No. 4-140193 or Japanese Patent Application Laid-Open No. 6-122297 is placed in a frame formed by punching a sheet material into a frame shape. After storing, the gap is filled, and the sheet member is attached to the front and back surfaces with an adhesive. The method is to fill only the gap between the IC card substrate and the frame, and not to fill the uneven part of the component. There was a problem that surface smoothness was low.
【０００８】特開平４−３３６２９９号公報に開示され
た、ＩＣモジュールの立体形状に合わせてコアシートを
切削後、切削部にＩＣモジュールを埋設してコアシート
両面にオーバーシートを重ね合わせて熱押圧する方法
は、（１）と同様に、埋設内蔵する鋳型の凹部に、ＩＣ
モジュールを埋設しても完全には埋まらず、ＩＣモジュ
ールとコアシートとの間に隙間を生じてしまうので、そ
の上からオーバーシートを貼付しても、隙間に残存した
気泡により、ＩＣカードの耐熱、耐湿特性における信頼
性が低下するという課題があった。[0008] After cutting a core sheet according to the three-dimensional shape of the IC module disclosed in Japanese Patent Application Laid-Open No. 4-336299, the IC module is embedded in the cut portion, and oversheets are superimposed on both sides of the core sheet and hot pressed. In the same manner as in (1), the IC is inserted into the recess of the mold
Even if the module is buried, it will not be completely buried, and a gap will be created between the IC module and the core sheet. However, there is a problem that the reliability in the moisture resistance property is reduced.
【０００９】特開平４−３６３３００号公報に開示され
た、パッケージ成形用金型のキャビティ内にカード基板
を挿入し、キャビティ内に樹脂を注入することによる一
体成形方法は、成形時、カード基板に溶融樹脂が接触す
るため、流動による応力で部品の接続不良または破損に
より、ＩＣカードの部品接続の特性における信頼性の低
下を招く可能性があるという課題があった。An integrated molding method disclosed in Japanese Patent Application Laid-Open No. 4-363300, in which a card substrate is inserted into a cavity of a package molding die and a resin is injected into the cavity, is used for molding the card substrate during molding. Since the molten resin comes into contact with the IC card, there is a problem that the reliability of the component connection characteristics of the IC card may be reduced due to poor connection or breakage of the component due to flow stress.
【００１０】[0010]
【課題を解決するための手段】本発明のＩＣカードは、
ＩＣチップ、コンデンサ等複数の部品を搭載したＩＣカ
ード基板と、少なくともそのＩＣカード基板の一方の表
面に、メルトフローレートが０．１ｇ／１０分以上の熱
可塑性材料による接着絶縁層と、保護のための表皮層を
有することを特徴とする。The IC card according to the present invention comprises:
An IC card substrate on which a plurality of components such as an IC chip and a capacitor are mounted, an adhesive insulating layer made of a thermoplastic material having a melt flow rate of 0.1 g / 10 min or more on at least one surface of the IC card substrate; Characterized by having a skin layer for
【００１１】このようなＩＣカードは、保護のための表
皮層とメルトフローレートが０．１ｇ／１０分以上の熱
可塑性材料による接着絶縁層とからなる多層フィルムの
接着絶縁層の面を、ＩＣカード基板の表面に接触させ、
加熱押着することによって製造することができる。In such an IC card, the surface of the adhesive insulating layer of the multilayer film composed of a protective skin layer and an adhesive insulating layer made of a thermoplastic material having a melt flow rate of 0.1 g / 10 min or more, Contact the surface of the card board,
It can be manufactured by heat pressing.
【００１２】[0012]
【発明の実施の形態】本発明に用いるメルトフローレー
トが０．１ｇ／１０分以上の熱可塑性材料としては、例
えばポリエチレン、ポリプロピレン、エチレン−酢酸ビ
ニル共重合体等のポリオレフィン又はオレフィンを主成
分とする共重合体もしくはこれらの混合物からなるフィ
ルムやポリビニルアルコール、ナイロン、塩化ビニル等
が挙げられる。ここで、メルトフローレートとは、ＪＩ
Ｓ Ｋ６７３０に規定されたメルトフローレートをい
う。BEST MODE FOR CARRYING OUT THE INVENTION As the thermoplastic material having a melt flow rate of 0.1 g / 10 min or more used in the present invention, for example, polyolefin or olefin such as polyethylene, polypropylene, ethylene-vinyl acetate copolymer or the like is used as a main component. And polyvinyl alcohol, nylon, vinyl chloride and the like. Here, the melt flow rate is defined as JI
It refers to the melt flow rate specified in SK6730.
【００１３】このように溶融粘度の低い熱可塑性材料を
用いると、加熱溶融、フローして部品の間の隙間を埋
め、その表面を平滑にでき、実装された部品への物理的
付加力がなく接続不良、破損等が生じることはない。さ
らに、熱可塑性材料が接着剤の役割をするので、接着剤
を使用する必要がなくなる。When a thermoplastic material having a low melt viscosity is used, the space between components can be filled by heating and melting and flowing, and the surface can be smoothed, and there is no physical additional force to the mounted components. No connection failure, breakage, etc. will occur. Furthermore, the use of an adhesive is eliminated because the thermoplastic material acts as the adhesive.
【００１４】保護のための表皮層の材質としては、特に
制限がなく、数種類の層を重ねて使用することもでき、
カード剛性を高めるためにポリエステル、ポリカーボネ
ート、ポリスチレン等が好適に用いられる。さらに、安
価なＩＣカードを得るために、紙、合成紙等も使用する
ことができる。The material of the skin layer for protection is not particularly limited, and several kinds of layers can be used in layers.
Polyester, polycarbonate, polystyrene and the like are preferably used to increase card rigidity. Further, paper, synthetic paper, and the like can be used to obtain an inexpensive IC card.
【００１５】この多層フィルム中の熱可塑性材料による
接着絶縁層の厚さは、ＩＣカード基板の最も厚い部品厚
さの１．１倍以上であることが必要である。１．１倍を
下回ると熱可塑性材料によって、ＩＣカード基板の部品
凹凸の平滑化が図れず、カード表面に凹凸を生じて印刷
不良、外観不良を招く。上限は、特に制限はないが、あ
まりに厚いと、加熱押着するときに、熱が伝達しないと
いう課題はあるが、使用するＩＣカードの種類によって
規定の厚さがあり、その範囲であれば特に問題はなく、
数ｍｍ以内と考えられる。The thickness of the adhesive insulating layer made of a thermoplastic material in the multilayer film must be at least 1.1 times the thickness of the thickest part of the IC card substrate. If the ratio is less than 1.1 times, the thermoplastic material cannot make the unevenness of the parts of the IC card substrate smooth, and the unevenness is generated on the card surface, resulting in poor printing and poor appearance. The upper limit is not particularly limited. However, if the thickness is too large, there is a problem that heat is not transferred when heat-bonding, but there is a specified thickness depending on the type of IC card to be used. No problem,
It is considered within several mm.
【００１６】この多層フィルムは、共押出し法、ドライ
ラミネート法あるいはプレス法等の一般的な製法により
得ることができ、また、この多層フィルムを使用してＩ
Ｃカードを製造すれば、スペーサ層の穴開け工程、スペ
ーサとＩＣカード基材との位置合わせ工程等の量産性を
損ねる工程がなく、安価で多量に生産することができ
る。The multilayer film can be obtained by a general production method such as a coextrusion method, a dry laminating method or a pressing method.
If the C card is manufactured, there is no step of impairing mass productivity such as a step of punching a spacer layer and a step of aligning the spacer and the IC card base material, and mass production can be performed at low cost.
【００１７】[0017]
【実施例】以下、本発明を実施例に基づいて説明する
が、本発明の範囲はこれら実施例によって何ら限定され
るものではない。EXAMPLES The present invention will be described below with reference to examples, but the scope of the present invention is not limited by these examples.
【００１８】実施例１ 図１に示すように、厚さ２５０μｍのポリエチレンテレ
フタレートフィルムを、ＩＣカード基板の基材１とし、
その上に、厚さ３０μｍの銀ペーストによる印刷回路３
を形成し、印刷回路３の一部に６０ターンのアンテナ回
路を形成し、厚さが１２０μｍで４×４ｍｍサイズのＩ
Ｃチップ２、及び厚さが１００μｍで１５×１０ｍｍサ
イズのペーパー電池４を搭載して、ＩＣカード基板とし
た。多層フィルムとして、厚さが１６０μｍでメルトフ
ローレートが１０ｇ／１０分のポリエチレンを接着絶縁
層５とし、厚さが１００μｍの白色紙を表皮層６とし
た、ポリエチレンラミネート紙を、ＩＣカード基板の表
裏両面に、１２０℃、１０ｋｇｆ／ｃｍ2、１０分の条
件でプレスを行い、総厚７７０μｍのＩＣカードを得
た。Example 1 As shown in FIG. 1, a polyethylene terephthalate film having a thickness of 250 μm was used as a substrate 1 of an IC card substrate.
On top of this, a printed circuit 3 made of silver paste having a thickness of 30 μm
Is formed, a 60-turn antenna circuit is formed in a part of the printed circuit 3, and the I × 4 × 4 mm size I is 120 μm thick.
A C chip 2 and a paper battery 4 having a thickness of 100 μm and a size of 15 × 10 mm were mounted thereon to form an IC card substrate. As a multilayer film, polyethylene laminated paper, in which polyethylene having a thickness of 160 μm and a melt flow rate of 10 g / 10 min was used as the adhesive insulating layer 5 and white paper having a thickness of 100 μm was used as the skin layer 6, was used as the front and back of the IC card substrate. Both surfaces were pressed at 120 ° C., 10 kgf / cm 2 for 10 minutes to obtain an IC card having a total thickness of 770 μm.
【００１９】実施例２ 図２に示すように、３８μｍ厚のポリエチレンテレフタ
レートフィルムをＩＣカード基板の基材１１とし、その
上に、厚さ２０μｍの銀ペーストによる印刷回路１３を
形成し、印刷回路１３の一部に６０ターンのアンテナ回
路を形成し、厚さ５０μｍで４×４ｍｍサイズのＩＣチ
ップ１２を搭載して、ＩＣカード基板とした。多層フィ
ルムとして、厚さが６０μｍでメルトフローレートが１
０ｇ／１０分のポリエチレンを接着絶縁層とし、厚さが
３０μｍの白色紙を表皮層１６とした、ポリエチレンラ
ミネート紙を、ＩＣカード基板の表裏両面に、実施例１
と同じ条件でプレスを行い、総厚２１８μｍのＩＣカー
ドを得た。Example 2 As shown in FIG. 2, a polyethylene terephthalate film having a thickness of 38 μm was used as a base material 11 of an IC card substrate, and a printed circuit 13 made of a 20 μm-thick silver paste was formed thereon. A 60-turn antenna circuit was formed on a part of the substrate, and an IC chip 12 having a thickness of 50 μm and a size of 4 × 4 mm was mounted thereon to obtain an IC card substrate. As a multilayer film, the thickness is 60 μm and the melt flow rate is 1
Example 1 A polyethylene laminated paper, in which polyethylene was used as an adhesive insulating layer and white paper having a thickness of 30 μm was used as a skin layer 16, on both front and back surfaces of an IC card substrate, was prepared.
Pressing was performed under the same conditions as in the above to obtain an IC card having a total thickness of 218 μm.
【００２０】実施例３ 図３に示すように、３５０μｍ厚のポリエチレンテレフ
タレートフィルムをＩＣカード基板の基材２１とし、そ
の上に、厚さ３０μｍの銀ペーストによる印刷回路２３
を形成し、印刷回路２３の一部に６０ターンのアンテナ
回路を形成し、厚さが１２０μｍで４×４ｍｍサイズの
ＩＣチップ２２、及び厚さ１００μｍで１５×１０ｍｍ
サイズのペーパー電池２４を搭載して、ＩＣカード基板
とした。多層フィルムとして、厚さが２００μｍでメル
トフローレートが１０ｇ／１０分のポリエチレンを接着
絶縁層２５とし、厚さが２００μｍの白色紙を表皮層２
６とした、ポリエチレンラミネート紙を、ＩＣカード基
板の、ＩＣチップを搭載した面に、１２０℃、１０ｋｇ
ｆ／ｃｍ2、１０分の条件でプレスを行い、総厚７５０
μｍのＩＣカードを得た。Example 3 As shown in FIG. 3, a polyethylene terephthalate film having a thickness of 350 μm is used as a base material 21 of an IC card substrate, and a printed circuit 23 made of silver paste having a thickness of 30 μm is formed thereon.
Is formed, a 60-turn antenna circuit is formed in a part of the printed circuit 23, an IC chip 22 having a thickness of 120 μm and a size of 4 × 4 mm, and an IC chip 22 having a thickness of 100 μm and 15 × 10 mm
An IC card substrate was mounted with a paper battery 24 of a size. As the multilayer film, polyethylene having a thickness of 200 μm and a melt flow rate of 10 g / 10 min is used as the adhesive insulating layer 25, and white paper having a thickness of 200 μm is used as the skin layer 2.
6 at 120 ° C. and 10 kg on a surface of the IC card substrate on which the IC chip is mounted.
f / cm 2 , press for 10 minutes, total thickness 750
A μm IC card was obtained.
【００２１】比較例１ 図４に示すように、厚さ５０μｍのポリエチレンテレフ
タレートフィルムを、ＩＣカード基板の基材３１とし
て、その上に、厚さが２５０μｍで５×５ｍｍサイズの
ＩＣチップ３２と、厚さが２５０μｍで１０×１０ｍｍ
サイズのペーパー電池３４を搭載して、ＩＣカード基板
とした。厚さが平均で３００μｍ（２８０〜３３０μ
ｍ）で３０×４０ｍｍサイズの楕円形の巻線コイルアン
テナ３３を、導電性接着剤ＬＳ−５０４Ｊ（株式会社ア
サヒ化学研究所製、商品名）を、シルクスクリーン印刷
法によって塗布して、搭載部品と接続した。巻線コイル
アンテナ部を埋設内蔵する鋳型の凹部を形成した薄いシ
ート材料層３７として、３３０μｍの凹部を持つ、厚さ
６００μｍの塩化ビニール樹脂製射出成形品を用い、ル
ーター加工して、その凹部に、巻線コイルアンテナ部及
び搭載部品を収納した。その表面に、厚さが１２５μｍ
のポリエチレンテレフタレートフィルム（125μmPET)
を、貼り合わせ、（特開平６−１３９４２１号公報に開
示されている）ＩＣカードを得た。COMPARATIVE EXAMPLE 1 As shown in FIG. 4, a polyethylene terephthalate film having a thickness of 50 μm was used as a base material 31 of an IC card substrate, and an IC chip 32 having a thickness of 250 μm and a size of 5 × 5 mm was formed thereon. 10 × 10mm with a thickness of 250μm
An IC card substrate was mounted with a paper battery 34 of a size. The average thickness is 300 μm (280-330 μ
m), a conductive adhesive LS-504J (trade name, manufactured by Asahi Chemical Laboratory Co., Ltd.) is applied to the elliptical wound coil antenna 33 of 30 × 40 mm size by a silk screen printing method, and the mounted components are mounted. Connected with. As a thin sheet material layer 37 having a concave portion of a mold in which a coiled coil antenna portion is embedded and built, an injection molded product made of a vinyl chloride resin having a concave portion of 330 μm and having a thickness of 600 μm is processed by a router, and the concave portion is formed in the concave portion. , The winding coil antenna part and the mounted parts were housed. The surface has a thickness of 125 μm
Polyethylene terephthalate film (125μm PET)
To obtain an IC card (disclosed in JP-A-6-139421).
【００２２】比較例２ 図５に示すように、厚さが５０μｍのポリエチレンテレ
フタレートフィルムをＩＣカード基板の基材４１とし、
その上に、厚さ３０μｍの銀ペーストによる印刷回路４
３を形成し、印刷回路４３の一部には６０ターンのアン
テナ回路を形成し、厚さが２５０μｍで５×５ｍｍサイ
ズのＩＣチップ４２、及び厚さが２００μｍで１０×１
０ｍｍサイズのペーパー電池４４を搭載し、さらに、部
品実装した基板を厚さが１００μｍのガラス布含浸エポ
キシ樹脂製の上層基板と厚さが１００μｍのガラス布含
浸エポキシ樹脂製の下層基板とで挟み込み、その隙間に
エポキシ樹脂で封止し、さらに両面に厚さが１００μｍ
のポリエチレンテレフタレータフィルム（100μmPET)で
被覆して、（特開平５−１２５１４号公報、特開平４−
１５２１９１号公報、特開平４−２９２９９８号公報、
又は特開昭６３−３５３９６号公報に開示されている）
ＩＣカードを得た。Comparative Example 2 As shown in FIG. 5, a polyethylene terephthalate film having a thickness of 50 μm was used as the base material 41 of the IC card substrate.
On top of this, a printed circuit 4 made of silver paste having a thickness of 30 μm
3 is formed, a 60-turn antenna circuit is formed on a part of the printed circuit 43, an IC chip 42 having a thickness of 250 μm and a size of 5 × 5 mm, and an IC chip 42 having a thickness of 200 μm and a size of 10 × 1.
A paper battery 44 having a size of 0 mm is mounted, and the board on which the components are mounted is sandwiched between an upper board made of a 100 μm thick glass cloth impregnated epoxy resin and a lower board made of a 100 μm thick glass cloth impregnated epoxy resin. The gap is sealed with epoxy resin, and both sides are 100 μm thick
Coated with a polyethylene terephthalator film (100 μm PET) of JP-A-5-12514 and JP-A-4-125.
No. 152191, JP-A-4-292998,
Or disclosed in JP-A-63-35396)
IC card was obtained.
【００２３】比較例３ 図６に示すように、厚さが５０μｍのポリエチレンテレ
フタレートフィルムをＩＣカード基板の基材５１とし、
その上に、厚さ３０μｍの銀ペーストによる印刷回路５
３を形成し、印刷回路５３の一部には６０ターンのアン
テナ回路を形成し、厚さが２５０μｍで５×５ｍｍサイ
ズのＩＣチップ５２、及び厚さが２００μｍで１０×１
０ｍｍサイズのペーパー電池５４を搭載し、ＩＣカード
基板全体を、厚さが３００μｍの塩化ビニル樹脂製のシ
ート材を枠状に打抜いて成形された枠体の枠内に収納
後、隙間部分を、熱硬化型エポキシ樹脂によって充填
し、接着剤を介して表裏面に、それぞれの厚さが２５０
μｍと１８８μｍの、シート部材であるポリエチレンテ
レフタレートフィルム（250μmPETと188μmPET）を貼付
して、（特開平４−１４０１９３号公報、又は特開平６
−１２２２９７号公報に開示されている）ＩＣカードを
得た。Comparative Example 3 As shown in FIG. 6, a polyethylene terephthalate film having a thickness of 50 μm was used as a substrate 51 of an IC card substrate.
On top of this, a printed circuit 5 made of 30 μm thick silver paste
3 is formed, a 60-turn antenna circuit is formed in a part of the printed circuit 53, an IC chip 52 having a thickness of 250 μm and a size of 5 × 5 mm, and a 10 × 1 IC chip 52 having a thickness of 200 μm.
A paper battery 54 having a size of 0 mm is mounted, and the entire IC card substrate is housed in a frame of a frame formed by punching a sheet material made of a vinyl chloride resin having a thickness of 300 μm into a frame shape. Is filled with a thermosetting epoxy resin, and the thickness of each is 250
A polyethylene terephthalate film (250 μm PET and 188 μm PET), which is a sheet member of μm and 188 μm, is adhered thereto (see JP-A-4-140193 or JP-A-6-140193).
An IC card (disclosed in JP-A-122297) was obtained.
【００２４】比較例４ 図７に示すように、プリント基板に、厚さが２５０μｍ
で５×５ｍｍサイズのＩＣチップ６２、及び厚さが２５
０μｍで１０×１０ｍｍサイズのペーパー電池６４を搭
載した。その後、エポキシ樹脂により部品を封止して、
ＩＣモジュール化した。ルーター加工して、ＩＣモジュ
ールと立体形状が同じになるように、厚さが５００μｍ
の塩化ビニル樹脂製シートの一部を切削して成形体を作
製し、その切削した部分にＩＣモジュールを収納した。
その両面に、接着剤を介して、厚さが１２５μｍのシー
ト部材であるポリエチレンテレフタレートフィルム（12
5μmPET）を貼付して、（特開平４−３３６２９９号公
報に開示されている）ＩＣカードを得た。COMPARATIVE EXAMPLE 4 As shown in FIG.
5 × 5 mm size IC chip 62 and thickness 25
A paper battery 64 of 0 μm and a size of 10 × 10 mm was mounted. After that, seal the parts with epoxy resin,
IC module. Router processing, thickness 500μm so that the three-dimensional shape is the same as the IC module
A part of the vinyl chloride resin sheet was cut to form a molded body, and the IC module was stored in the cut part.
On both surfaces thereof, a polyethylene terephthalate film (12
(5 μm PET) was attached to obtain an IC card (disclosed in JP-A-4-336299).
【００２５】比較例５ 図８に示すように、パッケージ成形用金型のキャビティ
内に、厚さが１００μｍのポリエチレンテレフタレート
フィルムをＩＣカード基板の基材７１とし、その上に、
厚さが３０μｍの銀ペーストによる印刷回路７３を形成
し、印刷回路７３の一部には６０ターンのアンテナ回路
を形成し、厚さが２５０μｍで５×５ｍｍサイズのＩＣ
チップ７２、及び厚さが２００μｍで１０×１０ｍｍサ
イズのペーパー電池７４を搭載したＩＣカード基板を挿
入し、キャビティ内にＡＢＳ樹脂を注入して、（特開平
４−３６３３００号公報に開示されている）ＩＣカード
を得た。Comparative Example 5 As shown in FIG. 8, a polyethylene terephthalate film having a thickness of 100 μm was used as a base material 71 of an IC card substrate in a cavity of a package molding die.
A printed circuit 73 made of silver paste having a thickness of 30 μm is formed, and a 60-turn antenna circuit is formed in a part of the printed circuit 73. An IC having a thickness of 250 μm and a size of 5 × 5 mm is formed.
A chip 72 and an IC card board on which a paper battery 74 having a thickness of 200 μm and a size of 10 × 10 mm are inserted, and ABS resin is injected into the cavity (disclosed in JP-A-4-363300). ) An IC card was obtained.
【００２６】このようにして作製したＩＣカードを、以
下に示す試験方法により試験を行い、その結果を表１に
示す。 ＜試験方法＞ ・ＩＣカードの耐熱、耐湿特性における信頼性（恒温恒
湿試験） ＩＣカードを８５℃、８５％ＲＨの恒温恒湿槽で５００
ｈ処理後取り出して、フィルムの膨れ、剥がれの有無を
肉眼観察した。膨れ、剥がれの無いものを〇、有ったも
のを×とした。 ・ＩＣカード表面の平滑性 部品真上のＩＣカード表面凹凸を、表面粗さ計にて測定
した。測定条件としては、測定長さ：２５ｍｍ、倍率：
１００００倍である。この結果、粗さが５μｍ未満のも
のを〇とし、５μｍ以上のものを×とした。 ・作業の自由度 作業の自由度を、使用した接着剤、封止剤の、初期粘度
に対する経時粘度が２０％を越えたものを使用できない
と判断した。このうち、室温にて保存して、使用できな
くなる経時時期が１ケ月以上のものを〇、１ケ月未満の
ものを×とした。 ・ＩＣカードの部品接続信頼性（実装部品へのダメー
ジ） 専用のリーダー／ライターにて通信可否を判定した。通
信のできたものを〇、できなかったものを×とした。通
信不能のＩＣカードについては、分解して不良モードを
推定した。比較例５においては、ＩＣチップが割れてし
まった。The IC card thus manufactured was tested by the following test methods, and the results are shown in Table 1. <Test method>-Reliability of IC card in heat resistance and humidity resistance (constant temperature / humidity test) IC card was placed in a constant temperature / humidity chamber of 85 ° C and 85% RH for 500 hours.
After the treatment, the film was taken out and visually inspected for swelling and peeling of the film. Those without swelling and peeling were rated as “〇”, and those with peeling were rated as “x”.・ Smoothness of IC card surface The irregularity of the IC card surface just above the component was measured with a surface roughness meter. As measurement conditions, measurement length: 25 mm, magnification:
It is 10,000 times. As a result, those having a roughness of less than 5 μm were rated as Δ, and those having a roughness of 5 μm or more were rated X. -Degree of work freedom The degree of work freedom was determined to be such that adhesives and sealants used whose viscosity over time with respect to the initial viscosity exceeded 20% could not be used. Among them, those that were stored at room temperature and were unusable for a lapse of time of one month or more were rated as Δ, and those less than one month were rated X. -IC card component connection reliability (damage to mounted components) Communication was determined by a dedicated reader / writer. Those that could communicate were marked with 〇 and those that couldn't be marked with x. About the IC card which cannot communicate, the disassembly was performed and the failure mode was estimated. In Comparative Example 5, the IC chip was broken.
【００２７】[0027]
【表１】 [Table 1]
【００２８】表１に示すように、従来例のうち、巻線コ
イルアンテナ部を埋設したＩＣカード（比較例１に相当
する。）と基板を枠状に打ち抜いた枠体に収納したＩＣ
カード（比較例３に相当する。）は、いずれもＩＣカー
ドの耐熱、耐湿特性における信頼性が低く、基板表面を
樹脂で封止したＩＣカード（比較例２に相当する。）
は、作業の自由度が低く、巻線コイルアンテナ部を埋設
したＩＣカード（比較例１に相当する。）と、基板を枠
状に打ち抜いた枠体に収納したＩＣカード（比較例３に
相当する。）と、コアシート内にＩＣモジュールを埋設
したＩＣカード（比較例４に相当する。）は、いずれも
ＩＣカード表面の平滑性劣り、樹脂によって一体成形し
たＩＣカード（比較例５に相当する。）は、ＩＣカード
の部品接続信頼性が低いことが分かった。As shown in Table 1, among the conventional examples, an IC card (corresponding to Comparative Example 1) in which a winding coil antenna portion is embedded and an IC in which a substrate is housed in a frame body punched in a frame shape.
Each of the cards (corresponding to Comparative Example 3) has low reliability in heat resistance and humidity resistance of the IC card, and the IC card whose substrate surface is sealed with resin (corresponding to Comparative Example 2).
Are low in the degree of freedom of operation and have an IC card in which a coiled coil antenna section is embedded (corresponding to Comparative Example 1) and an IC card in which a substrate is punched in a frame shape (corresponding to Comparative Example 3). And an IC card in which an IC module is embedded in a core sheet (corresponding to Comparative Example 4), the IC card surface of which is inferior in smoothness and which is integrally molded with resin (corresponding to Comparative Example 5). ) Was found to have low component connection reliability of the IC card.
【００２９】[0029]
【発明の効果】以上に説明したように、本発明によっ
て、その表面が平滑となり、優れた外観性、印刷性、並
びに優れた耐熱、耐湿特性における信頼性、及び優れた
ＩＣカードの部品接続信頼性を有するＩＣカードと、そ
のようなＩＣカードを効率良く製造する方法を提供する
ことができる。As described above, according to the present invention, the surface is smoothed, excellent appearance and printability, and excellent heat and humidity resistance, and excellent IC card component connection reliability. And a method for efficiently manufacturing such an IC card.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】本発明の他の実施例を示す断面図である。FIG. 2 is a sectional view showing another embodiment of the present invention.
【図３】本発明のさらに他の実施例を示す断面図であ
る。FIG. 3 is a sectional view showing still another embodiment of the present invention.
【図４】従来例を示す断面図である。FIG. 4 is a sectional view showing a conventional example.
【図５】他の従来例を示す断面図である。FIG. 5 is a sectional view showing another conventional example.
【図６】さらに他の従来例を示す断面図である。FIG. 6 is a sectional view showing still another conventional example.
【図７】さらに他の従来例を示す断面図である。FIG. 7 is a sectional view showing still another conventional example.
【図８】さらに他の従来例を示す断面図である。FIG. 8 is a sectional view showing still another conventional example.
１，１１，２１，３１，４１，５１，６１，７１．ＩＣ
カード基板の基材 ２，１２，２２，３２，４２，５２，６２，７２．ＩＣ
チップ ３，１３，２３，３３，４３，５３，６３，７３．印刷
回路 ４，１４，２４，３４，４４，５４，６４，７４．ペー
パー電池 ５，１５，２５．接着絶縁層 ６，１６，２６．表皮層1, 11, 21, 31, 41, 51, 61, 71. IC
Base material of card substrate 2, 12, 22, 32, 42, 52, 62, 72. IC
Chips 3,13,23,33,43,53,63,73. Printed circuit 4,14,24,34,44,54,64,74. Paper battery 5, 15, 25. Adhesive insulating layer 6,16,26. Epidermis layer
Claims (3)
載したＩＣカード基板と、少なくともそのＩＣカード基
板の一方の表面に、メルトフローレートが０．１ｇ／１
０分以上の熱可塑性材料による接着絶縁層と、保護のた
めの表皮層を有することを特徴とするＩＣカード。An IC card substrate on which a plurality of components such as an IC chip and a capacitor are mounted, and a melt flow rate of at least 0.1 g / 1 on at least one surface of the IC card substrate.
An IC card having an adhesive insulating layer made of a thermoplastic material for 0 minutes or more and a skin layer for protection.
ＩＣカード基板に搭載された最も厚い部品の厚さの１．
１倍以上であることを特徴とする請求項１に記載のＩＣ
カード。2. The adhesive insulating layer made of a thermoplastic material has a thickness of:
1. The thickness of the thickest part mounted on the IC card substrate
2. The IC according to claim 1, wherein the IC is at least one time.
card.
が０．１ｇ／１０分以上の熱可塑性材料による接着絶縁
層とからなる多層フィルムの接着絶縁層の面を、ＩＣカ
ード基板の表面に接触させ、加熱押着することを特徴と
するＩＣカードの製造方法。3. An adhesive insulating layer of a multilayer film comprising a protective skin layer and an adhesive insulating layer made of a thermoplastic material having a melt flow rate of 0.1 g / 10 min or more, is provided on the surface of the IC card substrate. A method for manufacturing an IC card, which comprises bringing into contact and heating and pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8221937A JPH1058872A (en) | 1996-08-23 | 1996-08-23 | Ic card and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8221937A JPH1058872A (en) | 1996-08-23 | 1996-08-23 | Ic card and its manufacture |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001343539A Division JP2002197436A (en) | 2001-11-08 | 2001-11-08 | Method for manufacturing ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1058872A true JPH1058872A (en) | 1998-03-03 |
Family
ID=16774503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8221937A Pending JPH1058872A (en) | 1996-08-23 | 1996-08-23 | Ic card and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1058872A (en) |
-
1996
- 1996-08-23 JP JP8221937A patent/JPH1058872A/en active Pending
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