JPH105996A - Solder supply device and solder level displacement measurement method - Google Patents

Abstract

(57) [Problem] To provide a solder supply device and a solder liquid level displacement measuring method capable of measuring displacement of a liquid level of solder with high accuracy. A solder supply device (10) for supplying solder to a component.
, A storage means 20 for storing the solder liquid 200, and a liquid surface position measuring means 30 for measuring the position of the liquid level LS of the solder liquid 200 stored in the storage means 20; Reference numeral 30 includes an eddy current type displacement sensor 40 for detecting a liquid level position in a non-contact manner.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supply device for supplying solder to a component, for example, an electronic component, and a method for measuring a solder liquid level displacement.

[0002]

2. Description of the Related Art When soldering a terminal of an electronic component, a solder supply device is used. This solder supply device is provided with a solder tank for containing a solder liquid (solder solution).
The solder bath contains a solder liquid. Solder is supplied to the terminals of the electronic component by applying the solder to the solder bath in the solder bath. The supply or adhesion of such solder increases the solder supply position and the solder supply amount, which requires precise control of the solder supply position and the solder supply amount, in accordance with the miniaturization and higher precision of electronic components. In order to control the precision, it is necessary to measure the displacement of the liquid level of the solder liquid in the solder tank with high accuracy and maintain the liquid level.

[0003]

However, when the terminals of the electronic parts are immersed in the solder liquid, not only does the liquid surface fluctuate, but also when the solder liquid is replenished, the liquid surface fluctuates. Even if the surface quake has subsided, small tremors always occur on the solder liquid surface. As shown in FIG. 18, the pin-type contact sensor 3 measures the position Q of the liquid surface 2 of the soldering liquid 1 in the soldering liquid in which such slight shaking occurs.
However, since the contact sensor 3 of this type is directly applied to the liquid surface 2 of the solder liquid 1, the solder gradually adheres to the tip 3a of the contact sensor 3 and grows. Cannot be accurately measured. In addition, as described above, since the liquid surface 2 of the solder liquid 1 is always slightly shaken, the displacement of the position of the liquid surface 1 can be stabilized even if a high-resolution and high-precision contact-type sensor is used. There is a problem that measurement cannot be performed with high accuracy. SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and to provide a solder supply device and a solder liquid level displacement measuring method capable of measuring displacement of a liquid level of solder with high accuracy.

[0004]

According to the present invention, there is provided a solder supply apparatus for supplying solder to a component,
A storage unit that stores the solder liquid, and a liquid surface position measurement unit that measures the position of the liquid surface of the solder liquid stored in the storage unit,
Has a liquid level position measuring means, a solder supply device having an eddy current type displacement sensor for detecting the liquid level position in a non-contact manner,
Achieved.

[0005] In the present invention, the solder liquid is stored in the storage means, and the liquid surface position measuring means measures the position of the liquid surface of the solder liquid. In that case, the eddy current type displacement sensor of the liquid surface position measuring means detects the liquid surface position by contact. This eddy current displacement sensor has heat resistance to solder liquid that generates heat,
In addition, it is possible to generate a detection output corresponding to a change in the liquid level of the solder liquid. Since the eddy current displacement sensor is not in contact with the liquid surface, there is no trouble such as solder adhesion and growth that occurred in the past. Can be measured. Moreover, in the present invention, preferably, the calculating means of the liquid level measuring means calculates the liquid level by sampling and averaging the analog output relating to the liquid level detected by the eddy current displacement sensor a plurality of times. Even if the liquid level always has a slight fluctuation, the fluctuation can be canceled and the displacement of the liquid level can be detected with high accuracy.

In the present invention, preferably, the control unit operates the solder adding means based on the information on the liquid surface position provided by the arithmetic means, so that the position of the liquid level of the solder liquid in the storage means is substantially constant. Can be Therefore, when supplying the solder to the component, the supply amount can be made constant or the solder supply position can always be kept constant. In the present invention, preferably, the sensor moving means positions the eddy current type displacement sensor corresponding to the liquid level of the solder liquid in the housing means only when measuring the liquid level of the solder liquid. When the liquid level of the solder liquid is not measured, the eddy current displacement sensor can protect the heat of the solder liquid.

According to the present invention, there is provided a method for measuring a displacement of a solder liquid level when a solder is supplied to a component. The eddy current displacement sensor detects the position of the liquid level in a non-contact manner, samples the analog output related to the liquid surface position detected by the eddy current displacement sensor multiple times, and averages the sampled analog values. This is achieved by a solder liquid level displacement measuring method for obtaining a displacement of a surface position.

In the present invention, the position of the level of the solder liquid contained in the containing means is detected in a non-contact manner by the eddy current displacement sensor. By detecting the position of the liquid surface in a non-contact manner as described above, it is possible to prevent troubles such as growth due to solder adhesion in the eddy current displacement sensor. The analog output related to the liquid level detected by the eddy current displacement sensor is
By sampling a plurality of times and averaging the sampled analog values, the displacement of the liquid level position is obtained. In this way, even if the liquid surface position of the solder liquid has a slight fluctuation, the minute fluctuation can be canceled, and the displacement of the liquid surface position can be measured with high accuracy.

[0009]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 shows a preferred embodiment of the solder supply device of the present invention. This solder supply device is a device for supplying (adhering) a predetermined amount of solder to a terminal T of an electronic component PA at a predetermined position. FIG. 2 shows an enlarged example of the electronic component PA. The electronic component PA is one component that constitutes an optical pickup used in, for example, an optical disk device. The optical disc device reproduces information recorded on a compact disc (CD), for example,
This is a device for recording information on a magneto-optical disk and reproducing the recorded information.

The optical pickup has an objective lens. The objective lens focuses laser light generated from a laser light source and irradiates the laser light onto an information recording surface of the optical disk, and receives light returned from the information recording surface again. It has a role to send to the department side. Therefore, the objective lens includes a tracking coil for moving in the radial direction (tracking direction) of the optical disk, a focus coil for moving the objective lens closer to or away from the information recording surface side of the optical disk, and the like.

In FIG. 2, coils 5 and 5 used as a focus coil and a tracking coil for the frame 4 are shown.
6 are provided. The coil terminals of these coils 5 and 6 are wound around pins 7 respectively. This pin 7
The part 6b of the terminal 6a of the coil wound around
It is necessary to apply a predetermined amount of solder to this portion 6b to a predetermined position. Therefore, the component PA can be moved and positioned by the component supply means 300 of FIG.

In FIG. 1, this solder supply device 10
It has an accommodating unit 20, a liquid surface position measuring unit 30, a sensor moving unit 80, and the like. The storage means 20 includes a solder liquid 200.
The housing means 20 includes a solder adding means 21. The solder liquid 200 is, for example, Sn60P
It is a kind of solder such as b40A or Sn25Pb75A, which is melted at about 380 to 390 ° C. The solder adding means 21 stores the solder liquid 200 at a predetermined temperature in the housing means 2.
The necessary amount can be additionally supplied from the opening at the top of the zero. The housing means 20 is provided with a squeegee (not shown). The squeegee has a liquid surface LS of the solder liquid 200, for example, an oxide film of solder or an insulating film of a wire of a coil wound around the pin 7 melted out by heat. When floating, cleaning of the liquid level LS is performed.

Next, the liquid surface position measuring means 30 will be described. The liquid level position measuring means 30 is a measuring means for measuring the displacement of the position of the liquid level LS of the solder liquid 200 in the storage means 20 with high accuracy. The liquid surface position measuring means 30 has an eddy current displacement sensor 40, a calculating means 60, a control unit 70, and the like.

First, the eddy current displacement sensor 40 will be described. The eddy current type displacement sensor 40 detects the displacement of the position of the liquid level LS in the Z direction (vertical direction) without contact with the liquid level LS as shown in FIGS. As shown in FIGS. 1 and 5, the displacement sensor 40 includes a head 41 and a circuit unit 4.
2 is provided. The head 41 is connected to the circuit section 42, and the head 41 is arranged at a predetermined distance from the liquid level LS and is not in contact with the liquid level LS. The circuit section 42 includes a power supply 43, an oscillation section 44, and a detection section 4 as shown in FIG.
5, an amplification section 46, a linearizer 47, and an amplification section 48. The power supply 43 is supplied from the oscillation section 44 to the amplification section 48.
Are supplied with power.

The oscillating section 44 supplies a high-frequency current HFI as shown in FIG.
When the oscillator 44 supplies the high-frequency current HFI to the coil 41a of the head 41, high-frequency oscillation occurs in the head 41. Due to the high-frequency current, a high-frequency magnetic field HF is generated near the head 41. If the liquid level LS is present near the high-frequency magnetic field HF, the vortex as shown in FIG. The current I flows. When the eddy current I flows through the liquid surface LS of the solder, which is a metal, power is consumed. This is called eddy current loss.

FIG. 6 shows the magnitude of the oscillation amplitude of the high-frequency current when the liquid level LS approaches and separates from the head 41 and at the intermediate position. The eddy current type displacement sensor 40 shown in FIGS. 3 and 5 is an analog sensor that outputs an analog output. In the displacement sensor 40, as the eddy current loss increases, the oscillation method shown in FIG. Oscillation). That is, the head 41
Is closer to the liquid level LS, the oscillation amplitude decreases, and the liquid level LS
Gradually increases, the oscillation amplitude increases. The relationship between the distance D between the liquid surface LS and the head 41 and the oscillation amplitude W shows a curve almost in direct proportion as shown in FIG.

When the high-frequency current HFI shown in FIG. 3 is supplied from the oscillating section 44 to the coil 41a of the head 41 shown in FIG. 5, the oscillating section 44 obtains an oscillation amplitude as shown in the example of FIG. Detects the oscillation amplitude of FIG. That is, as shown in FIG. 8, when the obtained oscillation amplitude (high-frequency voltage) is detected by the detection unit 45, a DC voltage value corresponding to the amplitude of the high-frequency voltage can be obtained.

The amplifying section 46 in FIG. 5 amplifies the DC voltage value obtained by the detecting section 45 and sends it to the linearizer 47. As shown in FIG. 9, the linearizer 47 converts the detection output SD amplified by the amplifying unit 46 from the detecting unit 45 into a distance D (a distance between the liquid surface LS and the head 41) in FIG.
Straightening is performed so as to correspond to the broken line (straight line) BL in FIG.
That is, a detection output SD (output voltage) proportional to the distance D can be obtained. The detection output LSD obtained by the linearizer 47 is further amplified by the amplifying unit 48 in FIG. 5 to become a detection output signal ST corresponding to the liquid level of the liquid level LS. The detection output signal ST having this voltage value is sent to the voltage comparator 61 of the calculating means 60 in FIG. FIG.
The distance D between the head 41 and the liquid level LS is, for example, about 5 mm.

The above-mentioned non-contact eddy current displacement sensor 40
Is adopted for the following reason. As a sensor for accurately converting the value of the distance D in FIG. 6 into a voltage value, the following five detection methods are conceivable. That is, there are five types of sensors: an eddy current type, an optical type (triangular distance measurement type), an ultrasonic type, a contact type, and an optical type (laser focus type). However, among these five detection type sensors, the liquid level LS of the solder can be measured with a precision of 10 μm in a non-contact manner by an eddy current type, an optical type (triangular distance measuring type) and an optical type (laser focusing type). ). Of these three eddy current type, optical type (triangular distance measuring type) and optical type (laser focus type), the only sensor that can withstand the high temperature generated by the solder liquid is the eddy current type displacement sensor. is there.

Next, the operation means 60 of FIG. 1 will be described. The calculation means 60 includes the above-described voltage comparator 61 and a computer 62. The voltage comparator 61 detects a detection output signal (sensor output, voltage value) ST from the displacement sensor 40.
Is converted into three types of determination outputs as shown in FIG. The three types of determination outputs are the high determination output (High) SH
And the low judgment output (Low) SL and the good judgment output (O
K) SN. The high determination output SH, the low determination output SL, and the good determination output SN are obtained by setting a reference high set value BH and a low set value BL preset in the voltage comparator 61 as illustrated in FIG. Can be obtained by comparison with the detection output signal ST. For example, the detection output signal S
When T becomes higher than the high set value BH, the high judgment output SH is output, and when the detection output signal ST becomes lower than the low set value BL, the low judgment output SL is output. Otherwise, the detection output signal ST becomes high. When it is between the setting BH and the low setting value BL, a good judgment output SN can be output.

Such a high judgment output SH and a low judgment output S
L and the good judgment output SN are output from the voltage comparator 61 to the control unit 70.
Sent to Further, the detection output signal ST of FIG. 10 is sent from the voltage comparator 61 to the computer 62, and the liquid level L of FIG.
The output voltage value corresponding to the displacement amount of the position S is calculated, for example, for 4000 times (2000 times per second × 2 seconds) in the voltage comparator 61, and the position (height) of the liquid level LS in FIG. 1 is calculated.
Is calculated, then the amount of displacement is determined,
The determination data of the displacement amount is transmitted from the voltage comparator 61 to the computer 62, and the data is displayed on a display and recorded and stored in a storage medium such as a hard disk.

FIG. 11 shows an example of sampling of the detection output signal ST in the voltage comparator 61 of FIG.
In FIG. 11, the detection output signal ST vibrates minutely with respect to the accurate height of the liquid level LS, and it is not possible to measure the accurate height of the liquid level LS as it is. In order to prevent the displacement sensor 40 of FIG. 1 from outputting a height different from the actual height at each sampling timing (Tn) when the liquid level LS of the solder is shaking, Are smoothed by the voltage comparator 61 of FIG.

The voltage comparator 61 stores the height data of the liquid surface LS sampled at high speed in real time in a data buffer, and compares the data of the specified number M of past liquid surfaces LS from the present time P. It has a function to output on average. That is, the sampling data of the height of the liquid surface LS (the detection output signal ST of the displacement sensor 40) is moving-averaged. For example, as shown in FIG. 12, when the number M specified from the current point P is set to 3, the result is as shown in FIG. In the solder supply device 10 of FIG. 1, the displacement sensor 40 measured at a sampling interval sufficiently short with respect to the vibration cycle of the liquid surface is used.
Are averaged by a number corresponding to a time interval that is sufficiently long with respect to the vibration cycle, thereby averaging the influence of the liquid level vibration.

Next, the control unit 70 of FIG.
High judgment output S shown in FIG.
Based on H, the low judgment output SL, and the good judgment output SN, a solder addition supply signal AD is output to the solder addition means 21 of FIG. 1 as shown in FIG. This additional solder supply signal A
D represents a period from when the detection output signal ST in FIG. 10 falls below the low set value BN by a predetermined value V1 to when it rises linearly and reaches a substantially intermediate position between the high set value BH and the low set value BL. It is sent to the solder adding means 21. The solder adding means 21 compensates for a decrease in the position of the liquid level LS by adding the solder liquid 200 to the housing means 20 based on the solder additional supply signal AD.

The solder adding means 21 shown in FIG. 1 supplies an additional fixed amount every cycle of the solder supply operation. The supply of the fixed amount of solder is a supply for the purpose of supplementing the solder consumed in one cycle of the solder supply operation.
In addition, additional solder is further supplied based on the above-mentioned additional solder supply signal AD. This additional supply
As shown in FIG. 10, the detection is performed when the detection output signal (sensor output) ST of the eddy current type displacement sensor 40 for monitoring the height of the liquid level LS becomes lower than the low set value BL in FIG. The additional supply amount of the solder is set at the high set value B as described above.
The amount that reaches a liquid level approximately halfway between H and the low set value BL is used as a guide. The supply amount of the fixed amount, which is performed for each cycle of the solder supply operation, is adjusted slightly slightly so that the liquid level tends to decrease in a long term. In order to make the adjustment slightly smaller in this manner, if the position of the liquid level LS of the solder exceeds the high set value BH, it is necessary to manually suck out the solder liquid 200 of the storage means 20. This is very troublesome, and the work of supplying solder to the electronic component PA is interrupted.

Note that the additional solder supply signal AD in FIG.
In consideration of the instability of the detection output signal ST of the displacement sensor 40, it is desirable that the determination is performed when the low determination output SL occurs a plurality of times, for example, about three times consecutively. High judgment output SH
When the low determination output SL is output continuously for a predetermined number of times, for example, five times, the control unit 70 activates the error generation unit 71 to output the liquid level SL by voice or optical signal.
An error of an abnormal position (height) can be generated to notify the operator. The sensor moving means 80 in FIG. 1 positions the head 41 of the displacement sensor 40 at a predetermined distance above the liquid level LS of the solder liquid 200, or moves the liquid level LS
It is a device for evacuating from the outside. The sensor moving means 80 has a slider 81 and a slider 82. The head 41 is attached to the tip of the slider 82. The slider 82 is a guide shaft 83 of the slider 81.
When the feed screw 85 of the motor 84 rotates, the slider 82 moves up and down along the guide shaft 83 in the Z direction.

The slider 81 is set on a guide rail 86. When the motor 87 operates, the feed screw 88 rotates.
It can be positioned by moving in the direction.

Next, a method for measuring the liquid level displacement using the above-described solder supply device 10 will be described. When the component supply means 300 of FIG. 1 repeats the operation of attaching the terminals T of the electronic component PA to the liquid level LS and supplying the solder to the terminals T, the liquid level LS of the solder liquid 200 decreases and the liquid level LS decreases. LS always involves a slight swing. Therefore, the displacement of the position of the liquid level LS of the solder liquid 200 is measured using the displacement sensor 40. First, the slider 81 is moved in the X1 direction, and the slider 8 is moved.
2 in the Z1 direction. As a result, the head 41 is positioned above the liquid level LS. Then, move the slider 82 to Z
By lowering in the direction 2, the head 41 is accurately positioned at a distance D of, for example, about 5 mm with respect to the liquid surface LS.

The head 41 of the displacement sensor 40 has a liquid level LS
The detection output signal ST shown in FIG. The voltage comparison 61 uses the detection output signal ST
Then, the high determination output SH, the low determination output SL, and the good determination output SN of FIG. 10 are sent to the control unit 70 by comparing with the high set value BH and the low set value BL. As a result, the control unit 70 sets the additional solder supply signal A based on these three types of determination results.
D is sent to the solder adding means 21 as needed as shown in FIG. The solder adding means 21 supplies the additional solder corresponding to the additional solder addition signal AD into the accommodation means 20. Incidentally, the voltage comparator 61 outputs the detection output signal S from the displacement sensor 40.
T is sampled at a rate of 2000 times / second, for example, for 2 seconds, the average value is obtained, and the average value is used as a measured value of the displacement of the position of the liquid surface LS.
The displacement at a position of 1/100 mm of S can be measured. As a result, the liquid level LS of the solder liquid 200 can always maintain a constant position (height).

When the measurement of the liquid level LS is completed as described above, the displacement sensor 40 is heat-resistant, but it is more preferable to withdraw from the solder liquid 200 except for the measurement time. Therefore,
By operating the motor 84 to raise the slider 82 in the Z1 direction and operating the motor 87 to move the slider 81 in the X2 direction, the head 41
S can be moved out of the accommodation means 200. In this way, the effect of the heat of the head 41 is minimized to protect the head.

As described above, the displacement of the position of the liquid level S of the solder liquid 200 in the storage means 200 is set by setting the head 41 of the displacement sensor 40 at a predetermined distance D from the liquid level LS. Thus, the displacement of the position of the liquid surface LS can be measured with high accuracy by canceling the slight fluctuation of the liquid surface LS. Based on the measured displacement of the liquid level LS, the control unit 70
By issuing a command to the solder adding means 21, the solder adding means 21 can add the required amount of additional solder to the housing means 21.

Conventionally, in a line for supplying solder to an electronic component, for example, it is necessary for an operator to confirm the displacement of the liquid level LS twice within a certain time. Conventionally, such a task of confirming the displacement of the liquid level LS required about 10 minutes at a time, but the solder supply device of FIG. Can be done As described above, the eddy current type displacement sensor 40 is originally of a heat-resistant type, and it is not necessary to add heat-resistant means.

Further, in the above-described solder supply device, despite the fact that the liquid level LS of the solder liquid is always slightly swayed, the position of the liquid level LS is stabilized without the influence of the liquid level sway. A measurement result of the displacement can be obtained. Then, even when the liquid level LS of the storage means 20 decreases, the solder liquid can always be supplied, so that a constant liquid level can always be maintained with high accuracy.

FIG. 13 shows an example of the repetition stability of the displacement sensor 40 of FIG. The vertical axis of the graph in FIG. 13 indicates the voltage value of the detection output signal ST of the displacement sensor, and the horizontal axis indicates the repetition frequency. The broken line in the graph is 4096.
The moving average of data is shown, and the solid line shows the moving average of 1024 data. The measurement procedure is performed by using the eddy current type displacement sensor 40 in the apparatus shown in FIG.
Is repeatedly measured. By performing a squeegee operation at each measurement, the squeegee is created in a state close to actual use conditions. FIG. 14 shows the measurement frequency distribution result at the time of the 1024 data moving average measurement of FIG. 13, in which the vertical axis represents the appearance frequency, and the horizontal axis represents the detection output signal ST of the displacement sensor.
It is. FIG. 15 shows an example of the measurement result at the time of the moving average measurement of the 4096 data of FIG. 13, in which the vertical axis represents the appearance frequency and the horizontal axis represents the detection output signal ST of the displacement sensor.

Measurement results of FIGS. 14 and 15 (frequency distribution tables)
As is clear from FIG. 5, out of the 50 measurement data, more than half of the measurement data fall within the detection output signal ST0.065V. The management of the displacement of the position of the liquid level LS is set to 0.
Since it is considered sufficient if an accuracy of about 1 mm is obtained, the detection output signal ST of the displacement sensor becomes substantially 0.0%.
It is enough if the width is within 659.

FIG. 16 shows one measurement example of the liquid level change. FIG. 17 is an enlarged view of the vicinity of the portion A in FIG. 16 and shows an example of a liquid level change before and after the occurrence of the liquid level drop. The 4.3 V line of the detection output signal ST is the limit value of the decrease in the liquid level LS. The detection output signal ST exceeds the limit value 4.3V several times, but if the number of times exceeding 4.3V is less than, for example, five, the solder supply operation cycle in FIG. 1 does not need to be stopped. Time point t1 and time point t in FIG.
2, the value of the detection output signal ST is lower,
The fact that the signal ST has decreased means that the additional soldering signal 21 shown in FIG. 1 is supplied to the additional soldering means 21 and soldered. Shows the effect of adding.

In the above-described embodiment, an example is shown in which a device for supplying solder to an electronic component, in particular, a device for supplying solder to a terminal of an electronic component which is a component of an optical pickup. However, the present invention is not limited to this, and can be applied to an apparatus for supplying solder to other types of electronic components.

[0039]

As described above, according to the present invention,
The displacement of the position of the solder liquid level can be accurately measured.

[Brief description of the drawings]

FIG. 1 is an overall view showing a preferred embodiment of a solder supply device of the present invention.

FIG. 2 is a diagram illustrating an example of an electronic component to which solder is supplied.

FIG. 3 is a diagram showing a head and the like of an eddy current heat-resistant non-contact displacement sensor of the solder supply device.

FIG. 4 is a diagram showing a head and a liquid surface in FIG. 3;

FIG. 5 is a block diagram illustrating an example of a displacement sensor.

FIG. 6 is a diagram showing a relationship between a head of a displacement sensor and a liquid surface and a relationship between oscillation amplitudes.

FIG. 7 is a diagram showing a relationship between oscillation amplitude and distance.

FIG. 8 is a diagram showing an example of detection of oscillation amplitude obtained from a head.

FIG. 9 is a diagram showing a relationship between a detection output and a distance in FIG. 8;

FIG. 10 is a view showing three types of determination output based on a detection output signal.

FIG. 11 is a diagram illustrating an example of the height of the liquid level of the solder liquid that fluctuates slightly.

FIG. 12 is a diagram showing an example of liquid level sampling in FIG. 11;

FIG. 13 is a diagram showing an example of the repetition stability of the displacement sensor.

FIG. 14 is a view showing an example of a measurement result at the time of moving average measurement of the data in FIG. 13;

FIG. 15 is a view showing an example of a measurement result at the time of moving average measurement of another data in FIG. 13;

FIG. 16 is a diagram illustrating an example of a relationship between a detection output signal of a displacement sensor and a position of a liquid surface.

FIG. 17 is an enlarged view showing a part of an example of the measurement in FIG. 16;

FIG. 18 is a diagram showing a measurement example of a conventional sensor.

[Explanation of symbols]

10: solder supply device, 20: accommodation means, 21
..Solder adding means, 30 ... liquid level position measuring means, 40
... Eddy current displacement sensor, 60 ... Calculation means, 7
0: control unit, 200: solder liquid, LS: liquid level of solder liquid, PA: electronic component

Claims (5)

[Claims] 1. A solder supply device for supplying solder to a component, comprising: a housing means for housing a solder liquid; and a liquid surface position measuring means for measuring a liquid surface position of the solder liquid stored in the housing means. And a liquid level measuring means including an eddy current displacement sensor for detecting a liquid level position in a non-contact manner. 2. A liquid level position measuring means comprising a calculating means for calculating a liquid level position by sampling and averaging a plurality of analog outputs relating to a liquid level detected by an eddy current displacement sensor. 3. The solder supply device according to claim 1. 3. A solder addition means for adding a solder liquid to the accommodation means, and information on the liquid surface position obtained by the arithmetic means is given to the solder addition means, and the solder addition means is operated to receive the solder liquid. A control unit for making the position of the liquid level of the solder liquid in the means substantially constant;
The solder supply device according to claim 1, further comprising: 4. An eddy current displacement sensor is positioned in a non-contact manner in correspondence with the solder liquid level of the housing means when measuring the liquid level of the solder liquid. The solder supply device according to claim 1, further comprising a sensor moving unit that causes the current-type displacement sensor to retreat from the level of the solder liquid in the housing unit. 5. A solder liquid level displacement measuring method for measuring a displacement of a liquid level of a solder when supplying solder to a component, wherein the position of the liquid level of the solder liquid contained in the containing means is determined by an eddy current type. It is characterized in that the displacement of the liquid surface position is obtained by sampling the analog output related to the liquid surface position detected by the eddy current type displacement sensor multiple times and averaging the sampled analog values. Liquid level displacement measurement method.