JPH1060689A - Plating jig for electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating jig for electronic parts which has a long life and allows easy maintenance. SOLUTION: This plating jig has a metallic probe 16 which supports and electrically connects the electronic parts to be plated, holding members 13, 14 which freely attachably and detachably hold the probe 16 and conductive members 20 which are disposed at the holding members 13, 14 and feed electricity to the probe 16. The probe 16 is fixed to the holding members 13, 14 and the conductive members 20 by a conductive coating material. The top end 19 of the probe 16 is formed to a conical shape and the probe holds the electronic parts by retaining members 22, 24 facing its vertex.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating jig for electronic parts for plating the surface of an insulating substrate or other electronic parts.

[0002]

2. Description of the Related Art Conventionally, a plating jig for an electronic component, for example, when plating an insulating substrate, it is necessary to energize a portion to be plated. Therefore, a pair of rod-shaped frames are assembled with a ladder-like connecting member. The jig body thus provided was provided with a copper rod-shaped conductive member, and a wire-shaped probe was connected to the conductive member at each predetermined position. Then, a substrate is mounted on the probe, and the energized portion is connected to the probe to perform plating.

[0003]

In the case of the above-mentioned prior art, plating adheres to the probe portion, and it is necessary to immerse the probe portion in a strong acid or strong alkaline solution to peel off the plating or to replace the entire jig. was there. In the case of immersion in a strong acid solution, a large processing tank capable of immersing the entire jig is required. The processing also requires cost and time. further,
When immersed in such a strongly acidic liquid or the like, the conductive member coated with vinyl chloride deteriorates, and also shortens the service life.

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a plating jig for electronic parts which is hard to be plated and has a long life and is easy to maintain.

[0005]

SUMMARY OF THE INVENTION The present invention provides a metal probe for supporting and electrically connecting an electronic component to be plated, a holding member for detachably holding the probe, and a holding member. A conductive member provided to supply power to the probe, and a plating jig for an electronic component in which the probe is fixed to the holding member and the conductive member via a conductive paint. The upper end of the probe is formed in a conical shape, the electronic component is sandwiched by a pressing member facing the apex, and an external thread is formed at the base end of the probe. The probe is fixed, and a low-temperature curable conductive paint is applied and fixed between the holding member and the male screw portion.

With the plating jig for an electronic component of the present invention, even if plating is attached to the probe by plating of the electronic component, the probe can be easily removed by removing the probe. Since the male screw portion is fixed to the holding member, the male screw portion does not corrode with the plating solution and has a long life.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. The electronic component plating jig 10 of this embodiment is for the substrate 12 as an electronic component to be plated. The substrate 12 is, for example, a substrate from which a large number of chip components are taken, and is provided with plating at predetermined locations on its surface. The substrate 12 is mounted between the pair of rod-shaped holding members 13 and 14 of the plating jig 10.
Each of the holding probes 16 is provided at a predetermined position for each two pairs of the substrates 10. Holding member 13, 1
Reference numerals 4 are formed in a ladder shape by the connecting members 15.

The probe 16 has a male screw 17 of the probe 16 and the holding members 13, 1 with respect to the holding members 13, 14.
4 is provided detachably by a female screw portion 18. Each of the holding members 13 and 14 is provided with a thin plate-shaped conductive member 20 for supplying power to the probe 16, and has a through hole into which the male screw portion 17 of the probe 16 is fitted. Further, the male screw portion 17 of the probe 16 is fixed to the holding members 13 and 14 and the conductive member 20 via a conductive paint. The conductive paint is a low-temperature-curable Ag-resin-based conductive paint having a curing temperature of about 70 ° C. and does not adversely affect the holding members 13 and 14 due to heat. Further, the probe 16 has an upper end 19 formed in a conical shape, and supports the substrate 10 at its apex.

The holding members 13 and 14 include a holding plate 22 for holding the substrate 10 between the probe 16 and a holding member provided rotatably between a holding position of the substrate 10 and an open position. A piece 24 is provided. The conductive member 20 includes a copper connecting member 26 connected to one end of the holding members 13 and 14.
Connected to the power supply side.

A plating jig 10 for an electronic component according to this embodiment
Is to hold the substrate 10 between the pair of holding members 13 and 14 so that the holding plate 22 and the probe 1
6 and the other edge of the substrate 10 is placed on the probe on the holding member 14 side. Then, the presser piece 24 is rotated by 180 degrees so that the substrate 10 is
And the substrate 10 is mounted. Thereafter, the holding members 13 and 14 are immersed in the plating tank, and the current is supplied to the conductive member 20 via the connection member 26, so that the conductive portion of the substrate 10 is supplied with electricity through the probe 16, and the plating is applied to the current-carrying position. Will be applied.

A plating jig 10 for an electronic component according to this embodiment
Is the probe 1 after plating a certain number of times or more.
When the plating adheres around 6, the probe 16 can be removed from the holding members 13 and 14 and immersed in a predetermined strong acid or strong alkaline solution to peel off the plating.
In this case, since only the probe 16 is immersed, the processing tank may be small, and the amount of the processing liquid used is small. Thereafter, when reused, the conductive paint is again applied to the holding member 1.
The male screw part 17 of the probe 16 is screwed by applying to the female screw parts 18 of 3 and 14. This ensures conduction and prevents the plating solution from entering the screw portion.

A plating jig 10 for an electronic component according to this embodiment
The conductive member 20 may also be thin and thin, and can have a light structure as a whole, and the plating jig 10 can be easily transported. Further, the life of the jig is extended, and the running cost can be greatly reduced. The shape of the probe 16 can be changed as appropriate, and may be a spherical or pyramid-shaped upper end, a truncated cone or a truncated pyramid.

[0013]

According to the plating jig for electronic parts of the present invention, the life of the holding member can be extended, the plating of the probe can be peeled off by removing the probe, the cost is reduced, and the plating process is not performed. Is also easy.

[Brief description of the drawings]

FIG. 1 is a partial enlarged view (A) and a right side view showing an embodiment of a plating jig for an electronic component of the present invention.

FIG. 2 is a sectional view taken along line -A of FIG.

FIG. 3 is an exploded partial perspective view showing a use state of the embodiment of the electronic component plating jig of the present invention.

FIG. 4 is a partially broken left side view (A) and a front view (B) showing an embodiment of the electronic component plating jig of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Plating jig for electronic components 12 Substrate 13, 14 Holding member 16 Probe 17 Male screw part 18 Female screw part 20 Conductive member

Claims (2)

[Claims] 1. A probe for supporting and electrically connecting an electronic component to be plated, a holding member for detachably holding the probe, and a conductive member provided on the holding member for supplying power to the probe. A plating jig for an electronic component, comprising: the probe fixed to the holding member and the conductive member via a conductive paint. 2. The probe has an upper end portion formed in a conical shape, holds the electronic component between its vertex and an opposing pressing member, and has a male screw portion formed at a base end portion of the probe. 2. The electronic component plating according to claim 1, wherein the probe is fixed to the holding member by a portion, and the conductive paint is applied between the holding member and the conductive member and the male screw portion to fix the probe. jig.