JPH106332A - Method for resin impregnation - Google Patents

Method for resin impregnation

Info

Publication number
JPH106332A
JPH106332A JP16223296A JP16223296A JPH106332A JP H106332 A JPH106332 A JP H106332A JP 16223296 A JP16223296 A JP 16223296A JP 16223296 A JP16223296 A JP 16223296A JP H106332 A JPH106332 A JP H106332A
Authority
JP
Japan
Prior art keywords
resin varnish
resin
base material
varnish
impregnation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16223296A
Other languages
Japanese (ja)
Inventor
Hironobu Mori
裕信 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP16223296A priority Critical patent/JPH106332A/en
Publication of JPH106332A publication Critical patent/JPH106332A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/60Auxiliary means structurally associated with the switch for cleaning or lubricating contact-making surfaces

Landscapes

  • Reinforced Plastic Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To make an unimpregnated part hardly generate and to obtain a prepreg with excellent appearance by performing a method for feeding a resin varnish by feeding the resin varnish to a part surrounded with a base material of a part impregnated in the resin varnish and the liq. face of the varnish. SOLUTION: A inpregnation apparatus is constituted by providing a pipeline 20 with an opening part 21 to a part surrounded with a base material 14 of a part immersed in a resin varnish 12 and the liq. face of the resin varnish 12 and making the resin varnish in a resin receiving tank 13 flow from the opening part 21 by pressure by means of a pump p to feed the resin varnish 12 to the part between the base material and the liq. face. It is possible thereby to replace the amt. of the resin sticked on the base material 14 by feeding the resin varnish 12 with a viscosity adjusted to an appropriate value and the components becomes close to those of the resin varnish 12 whose viscosity is adjusted to be suitable for impregnation to the inside of the base material 14. Therefore, even when it is impregnated continuously, unimpregnated part is hardly generated to obtain a prepreg with excellent appearance.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、樹脂含浸方法に関
し、例えば電気・電子機器等に使用されるプリント配線
板の製造に用いられるプリプレグの製造方法に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for impregnating a resin, and more particularly to a method for producing a prepreg used for producing a printed wiring board used for electric / electronic equipment.

【0002】[0002]

【従来の技術】従来、プリント配線板の製造に用いられ
る積層板は、例えばガラスクロス等の基材にエポキシ樹
脂等の樹脂ワニスを含浸した後、乾燥して半硬化させる
ことによってプリプレグを製造し、このプリプレグを所
要枚数重ねるとともに、必要に応じて銅箔等の金属箔を
その片側又は両側に配して積層した後、加熱加圧して製
造されている。
2. Description of the Related Art Conventionally, a prepreg is manufactured by laminating a base material such as a glass cloth or the like with a resin varnish such as an epoxy resin and then drying and semi-curing the laminated board used for manufacturing a printed wiring board. A required number of such prepregs are stacked, and a metal foil such as a copper foil is arranged on one side or both sides of the prepreg as necessary, and then laminated, and then heated and pressed.

【0003】プリプレグを製造する際の樹脂ワニスを基
材に含浸する方法としては、例えば図5に示すように、
その内部に駆動された含浸ロール11を備え、上部を解
放系とした含浸槽10に、含浸ロール11が十分に浸漬
する程度まで樹脂ワニス12を満たした含浸装置を用い
て、その樹脂ワニス12に基材14を含浸槽10の上部
から供給して、連続的に浸入させて樹脂ワニス12に沈
めた後、含浸ロール11に巻きつけることにより方向を
転換させ、次いで基材14を含浸槽10の上部から引き
出して連続的に含浸する方法が行われている。
[0003] As a method of impregnating a base material with a resin varnish for producing a prepreg, for example, as shown in FIG.
An impregnating roll 11 driven inside the impregnating roll 11 is used, and the resin varnish 12 is filled in an impregnating tank 10 having an open system at an upper portion by using an impregnating device filled with the resin varnish 12 to such an extent that the impregnating roll 11 is sufficiently immersed. The base material 14 is supplied from the upper part of the impregnation tank 10, is continuously penetrated and submerged in the resin varnish 12, and then is wound around an impregnation roll 11 to change the direction. A method of pulling out from the upper portion and continuously impregnating the same has been performed.

【0004】上記樹脂含浸方法に用いる樹脂ワニス12
は、基材14内部にまで含浸するのに適する粘度にする
ため、及び基材14に付着する樹脂量を制御するために
溶剤を含有させて粘度調整することが一般に行われてい
るが、上記のように解放系の含浸槽10を用いた方法で
プリプレグを製造する場合、樹脂ワニス12の上側液面
から溶剤が蒸発して粘度が変わりやすく、樹脂の未含浸
の部分が発生したり、部分的に樹脂付着量の多い部分が
発生して、プリプレグの外観が低化する場合があった。
A resin varnish 12 used in the above resin impregnation method
It is generally performed to adjust the viscosity by including a solvent in order to make the viscosity suitable for impregnating the inside of the base material 14 and to control the amount of resin adhering to the base material 14, When a prepreg is manufactured by a method using an open impregnation tank 10 as described above, the solvent easily evaporates from the upper liquid surface of the resin varnish 12 to change the viscosity, and unimpregnated portions of the resin are generated. In some cases, a portion with a large amount of resin adhered was generated, and the appearance of the prepreg was sometimes reduced.

【0005】そのため、溶剤15を補充することにより
粘度調整した樹脂ワニス12を、含浸槽10の下部にポ
ンプで加圧して連続的又は間欠的に供給し、含浸槽10
の上部より粘度の高い樹脂ワニス12をオーバーフロー
させて取り除くことにより、基材14内部にまで含浸す
るのに適し、かつ、基材14に付着する樹脂量も適した
粘度に調整する方法が検討されている。
For this purpose, a resin varnish 12 whose viscosity has been adjusted by replenishing a solvent 15 is continuously or intermittently supplied to the lower part of the impregnation tank 10 by pressurizing with a pump.
By removing the resin varnish 12 having a higher viscosity than the upper part of the base material by overflowing, a method of adjusting the viscosity suitable for impregnating the inside of the base material 14 and the amount of the resin adhering to the base material 14 has been studied. ing.

【0006】しかし、粘度調整した樹脂ワニス12を含
浸槽10の下部より供給することにより含浸槽10の上
部より樹脂ワニス12をオーバーフローさせる方法で製
造した場合であっても未含浸の部分が発生したり、部分
的に樹脂付着量の多い部分が発生して、プリプレグの外
観が低化する場合があった。そのため、更に未含浸の部
分が発生しにくく、かつ、外観が優れたプリプレグが得
られる樹脂含浸方法が求められている。
However, even when the resin varnish 12 whose viscosity has been adjusted is supplied from the lower part of the impregnation tank 10 to overflow the resin varnish 12 from the upper part of the impregnation tank 10, an unimpregnated portion is generated. In some cases, a portion having a large amount of resin adhered occurs, and the appearance of the prepreg is reduced. Therefore, there is a need for a resin impregnating method that hardly generates a non-impregnated portion and that can provide a prepreg having an excellent appearance.

【0007】[0007]

【発明が解決しようとする課題】本発明は、上記問題点
を改善するために成されたもので、その目的とするとこ
ろは、上部を解放系とした含浸槽に、溶剤を含有する樹
脂ワニスを供給して満たし、その樹脂ワニスに基材を連
続的に浸入させて樹脂ワニスに沈めつつ、連続的に引き
出して含浸する樹脂含浸方法であって、未含浸の部分が
発生しにくく、かつ、外観が優れたプリプレグが得られ
る樹脂含浸方法を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a resin varnish containing a solvent in an impregnation tank having an open top. Is supplied and filled, while the resin varnish is continuously infiltrated with the base material and submerged in the resin varnish, and continuously withdrawn and impregnated, the unimpregnated portion hardly occurs, and An object of the present invention is to provide a resin impregnation method capable of obtaining a prepreg having an excellent appearance.

【0008】[0008]

【課題を解決するための手段】本発明の請求項1に係る
樹脂含浸方法は、上部を解放系とした含浸槽に、溶剤を
含有する樹脂ワニスを供給して満たし、その樹脂ワニス
に基材を連続的に浸入させて樹脂ワニスに沈めつつ、連
続的に引き出して含浸する樹脂含浸方法において、樹脂
ワニスを供給する方法が、樹脂ワニスに沈む部分の基材
及び樹脂ワニスの液面により囲まれた部分(以下基材液
面間部分と記す)に、樹脂ワニスを供給する方法である
ことを特徴とする。
According to a first aspect of the present invention, there is provided a resin impregnating method, wherein a resin varnish containing a solvent is supplied to and filled in an impregnation tank having an open system at an upper portion, and the resin varnish is filled with a base material. In the resin impregnation method in which the resin varnish is continuously drawn out and immersed in the resin varnish, and continuously withdrawn and impregnated, the method of supplying the resin varnish is surrounded by the base material and the liquid level of the resin varnish sinking into the resin varnish. The method is characterized in that a resin varnish is supplied to a portion (hereinafter referred to as a portion between the liquid surfaces of the base material).

【0009】本発明の請求項2に係る樹脂含浸方法は、
請求項1記載の樹脂含浸方法において、基材液面間部分
に樹脂ワニスを供給する方法が、基材液面間部分に開口
部を有する配管を設け、その開口部から樹脂ワニスを流
出することにより供給する方法であることを特徴とす
る。
[0009] The resin impregnation method according to claim 2 of the present invention comprises:
2. The resin impregnating method according to claim 1, wherein the method of supplying the resin varnish to the portion between the liquid surfaces of the base material includes providing a pipe having an opening in the portion between the liquid surfaces of the base material, and flowing the resin varnish from the opening portion. The method is characterized in that it is a method of supplying by means of:

【0010】本発明の請求項3に係る樹脂含浸方法は、
請求項1記載の樹脂含浸方法において、基材液面間部分
に樹脂ワニスを供給する方法が、基材液面間部分内では
基材の幅方向に流れるように樹脂ワニスを吹き出す吹き
出し口を含浸槽内に設け、その樹脂ワニスの吹き出しに
より供給する方法であることを特徴とする。
[0010] The resin impregnation method according to claim 3 of the present invention comprises:
2. The resin impregnating method according to claim 1, wherein the method of supplying the resin varnish to the portion between the liquid surfaces of the base material impregnates the outlet for blowing the resin varnish so as to flow in the width direction of the base material within the portion between the liquid surfaces of the base material. The method is provided in a tank and supplied by blowing resin varnish.

【0011】本発明の請求項4に係る樹脂含浸方法は、
請求項1から請求項3のいずれかに記載の樹脂含浸方法
において、含浸槽内の樹脂ワニスのうち基材液面間部分
の樹脂ワニスと、含浸槽内の樹脂ワニスのうち基材液面
間部分を除く部分の樹脂ワニスの粘度の差が0〜150
センチポイズとなるよう、基材液面間部分に樹脂ワニス
を供給することを特徴とする。
[0011] The resin impregnation method according to claim 4 of the present invention comprises:
The resin impregnation method according to any one of claims 1 to 3, wherein the resin varnish in the resin varnish in the impregnation tank has a portion between the liquid surfaces of the base material and the resin varnish in the impregnation tank has a liquid surface between the base material and the liquid varnish. The difference in the viscosity of the resin varnish in the portion excluding the portion is 0 to 150
It is characterized in that a resin varnish is supplied to a portion between the liquid surfaces of the base material so as to have a centipoise.

【0012】本発明の請求項5に係る樹脂含浸方法は、
請求項1から請求項4のいずれかに記載の樹脂含浸方法
において、樹脂ワニスに含有する溶剤が、メタノール、
エタノール、メチルエチルケトン、アセトン、ベンゼ
ン、トルエンからなる群の中から選ばれた少なくとも1
種の溶剤を含有することを特徴とする。
[0012] The resin impregnation method according to claim 5 of the present invention comprises:
In the resin impregnation method according to any one of claims 1 to 4, the solvent contained in the resin varnish is methanol,
At least one selected from the group consisting of ethanol, methyl ethyl ketone, acetone, benzene, and toluene
It is characterized by containing a kind of solvent.

【0013】基材液面間部分の樹脂ワニスは、含浸槽内
の樹脂ワニスのうち基材液面間部分を除く部分の樹脂ワ
ニスと比較して、液面から溶剤成分が蒸発して粘度が高
くなったり、基材により持ち込まれた空気が液中に浮遊
してその空気が含浸の妨げとなって含浸性が低下した樹
脂ワニスとなりやすい。しかし本発明によると、基材内
部にまで含浸するのに適し、かつ、基材に付着する樹脂
量も適した粘度に調整された樹脂ワニスや、溶剤成分が
蒸発しにくい含浸槽内の樹脂ワニスのうち基材液面間部
分を除く部分の樹脂ワニス等を基材液面間部分に供給し
て置き換えることができるため、従来の含浸槽の下部か
ら供給する場合と比較して、基材液面間部分の樹脂ワニ
スは、溶剤成分が蒸発して粘度が高くなったり、空気が
液中に浮遊して含浸性が低下した樹脂ワニスが減って、
樹脂ワニス基材内部にまで含浸するのに適し、かつ、基
材に付着する樹脂量も適した粘度に調整された樹脂ワニ
スや、含浸槽内の樹脂ワニスのうち基材液面間部分を除
く部分の樹脂ワニス等に成分が近くなり、連続的に含浸
しても未含浸の部分が発生しにくく、かつ、外観が優れ
たプリプレグが得られる。
The resin varnish in the portion between the liquid surfaces of the base material has a lower viscosity than the resin varnish in the portion of the resin varnish in the impregnation tank except for the portion between the liquid surfaces of the base material because the solvent component evaporates from the liquid surface. The resin varnish tends to be high or the resin varnish having reduced impregnating property because air introduced by the base material floats in the liquid and impedes the impregnation. However, according to the present invention, a resin varnish suitable for impregnating the inside of the base material and having a viscosity adjusted so that the amount of resin adhering to the base material is also suitable, and a resin varnish in an impregnation tank in which a solvent component hardly evaporates. Because the resin varnish and the like in the portion excluding the portion between the liquid surfaces of the base material can be supplied to the portion between the liquid surfaces of the base material and can be replaced, compared with the case where the resin varnish is supplied from the lower part of the conventional impregnation tank, The resin varnish in the inter-plane portion has a higher viscosity due to the evaporation of the solvent component, and the resin varnish having reduced impregnation due to air floating in the liquid is reduced,
Resin varnish is suitable for impregnating the inside of the base material, and the amount of resin adhering to the base material is adjusted to a suitable viscosity. The components become close to the resin varnish and the like in the portion, and even if impregnated continuously, a non-impregnated portion hardly occurs and a prepreg excellent in appearance can be obtained.

【0014】[0014]

【発明の実施の形態】本発明に係る樹脂含浸方法を図面
に基づいて説明する。図1は本発明に係る樹脂含浸方法
の第一の実施の形態を説明する一部を破断して示した正
面図であり、図2は本発明に係る樹脂含浸方法の第一の
実施の形態を説明する一部を破断して示した側面図であ
り、図3は本発明に係る樹脂含浸方法の第二の実施の形
態を説明する一部を破断して示した正面図であり、図4
は本発明に係る樹脂含浸方法の第二の実施の形態を説明
する一部を破断して示した側面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin impregnation method according to the present invention will be described with reference to the drawings. FIG. 1 is a partially cutaway front view illustrating a first embodiment of a resin impregnation method according to the present invention, and FIG. 2 is a first embodiment of a resin impregnation method according to the present invention. FIG. 3 is a partially cutaway front view illustrating a second embodiment of the resin impregnation method according to the present invention, and FIG. 4
FIG. 4 is a partially cutaway side view illustrating a resin impregnation method according to a second embodiment of the present invention.

【0015】本発明の第一の実施の形態の樹脂含浸方法
は、図1及び図2に示すように、その内部に駆動された
含浸ロール11を備え、上部を解放系とした含浸槽10
に、含浸ロール11が十分に浸漬する程度まで樹脂ワニ
ス12を満たし、含浸槽10の下にオーバーフローした
樹脂ワニス12を受ける樹脂受け槽13を備えた含浸装
置を用いて、その樹脂ワニス12に基材14を含浸槽1
0の上部から供給して、連続的に浸入させて樹脂ワニス
12に沈めた後、含浸ロール11に巻きつけることによ
り方向を転換させ、次いで基材14を含浸槽10の上部
から引き出して含浸を行う。
As shown in FIGS. 1 and 2, the resin impregnating method according to the first embodiment of the present invention includes an impregnating roll 11 driven inside thereof and an impregnating tank 10 having an open upper portion.
The resin varnish 12 is filled with the resin varnish 12 until the impregnation roll 11 is sufficiently immersed, and the resin varnish 12 is filled with the resin varnish 12 under the impregnation tank 10. Impregnation tank 1 with material 14
After being supplied from the upper portion of the impregnating tank 10 and continuously penetrating and submerging in the resin varnish 12, the direction is changed by winding it around the impregnating roll 11, and then the base material 14 is pulled out from the upper portion of the impregnating tank 10 to perform impregnation. Do.

【0016】そしてこの含浸装置は、基材液面間部分A
(樹脂ワニス12に沈む部分の基材14及び樹脂ワニス
12の液面により囲まれた部分)に開口部21を有する
配管20が設けられており、その開口部21から樹脂受
け槽13の樹脂ワニス12をポンプで加圧して流出させ
ることにより、基材液面間部分Aに樹脂ワニス12を供
給するようになっている。
The impregnating apparatus includes a portion A between the liquid surfaces of the base material.
A pipe 20 having an opening 21 is provided in a portion of the resin varnish 12 surrounded by the base material 14 and the liquid surface of the resin varnish 12, and the resin varnish of the resin receiving tank 13 is provided from the opening 21. The resin varnish 12 is supplied to the portion A between the liquid surfaces of the base material by pressurizing the pump 12 with the pump to flow out.

【0017】なおこの含浸装置は、樹脂受け槽13内の
樹脂ワニス12の粘度を分析しながら溶剤15を補充し
て粘度を調整するようになっており、含浸槽10の上部
よりオーバーフローした比較的粘度の高い樹脂ワニス1
2が加わっても、基材14内部にまで含浸するのに適
し、かつ、基材14に付着する樹脂量も適した粘度にな
るよう調整されている。なお、この樹脂受け槽13に
は、図示しないが、基材14に含浸して持ち出されるこ
とにより減少する樹脂ワニス12の分が補充されるよう
になっており、連続的に含浸しても、含浸槽10の上部
まで樹脂ワニス12を満たすようになっている。
The impregnating apparatus is designed to adjust the viscosity by replenishing the solvent 15 while analyzing the viscosity of the resin varnish 12 in the resin receiving tank 13. High viscosity resin varnish 1
Even if 2 is added, it is adjusted so as to be suitable for impregnating the inside of the base material 14 and also to adjust the amount of resin adhering to the base material 14 to a suitable viscosity. Although not shown, the resin receiving tank 13 is replenished with a portion of the resin varnish 12 that is reduced by being taken out by being impregnated into the base material 14. The resin varnish 12 is filled up to the upper part of the impregnation tank 10.

【0018】基材液面間部分Aの樹脂ワニス12は、含
浸槽10内の樹脂ワニス12のうち基材液面間部分Aを
除く部分Bの樹脂ワニス12と比較して、液面から溶剤
成分が蒸発して粘度が高くなったり、基材14により持
ち込まれた空気が液中に浮遊してその空気が含浸の妨げ
となって含浸性が低下した樹脂ワニス12となりやす
い。しかし本発明によると、基材14内部にまで含浸す
るのに適し、かつ、基材14に付着する樹脂量も適した
粘度に調整された樹脂ワニス12を基材液面間部分Aに
供給して置き換えることができるため、従来の含浸槽1
0の下部から供給する場合と比較して、基材液面間部分
Aの樹脂ワニス12は、溶剤成分が蒸発して粘度が高く
なったり、空気が液中に浮遊して含浸性が低下した樹脂
ワニス12が減って、基材14内部にまで含浸するのに
適し、かつ、基材14に付着する樹脂量も適した粘度に
調整された樹脂ワニス12に成分が近くなり、連続的に
含浸しても未含浸の部分が発生しにくく、かつ、外観が
優れたプリプレグが得られる。
The resin varnish 12 in the portion A between the liquid surfaces of the base material has a lower solvent level than the resin varnish 12 in the portion B of the resin varnish 12 in the impregnation tank 10 except the portion A between the liquid surfaces of the base material. Ingredients evaporate to increase the viscosity, or air introduced by the base material 14 floats in the liquid, and the air hinders impregnation, which tends to result in a resin varnish 12 having reduced impregnation. However, according to the present invention, the resin varnish 12 that is suitable for impregnating the inside of the substrate 14 and the amount of resin adhering to the substrate 14 is adjusted to a suitable viscosity is supplied to the substrate liquid level portion A. Can be replaced by the conventional impregnation tank 1
Compared with the case where the resin varnish 12 is supplied from the lower part of the base material 0, the resin varnish 12 in the portion A between the liquid surfaces of the base material has a higher viscosity due to the evaporation of the solvent component, or the air has floated in the liquid and the impregnation property has been reduced. The amount of the resin varnish 12 decreases, and the components are close to the resin varnish 12 which is suitable for impregnating the inside of the base material 14 and the amount of the resin adhering to the base material 14 is adjusted to a suitable viscosity, and is continuously impregnated. However, a prepreg which does not easily generate an unimpregnated portion and has an excellent appearance can be obtained.

【0019】基材液面間部分Aに樹脂ワニス12を供給
する量としては、含浸槽10内の樹脂ワニス12のうち
基材液面間部分Aの樹脂ワニス12と、含浸槽10内の
樹脂ワニス12のうち基材液面間部分Aを除く部分Bの
樹脂ワニス12の粘度の差が0〜150センチポイズと
なるように供給すると好ましい。粘度の差が150セン
チポイズを越えると、未含浸の部分が発生したり、外観
が低下する場合がある。
The amount of the resin varnish 12 to be supplied to the portion A between the liquid surfaces of the base material is such that the resin varnish 12 of the portion A between the liquid surfaces of the base material among the resin varnish 12 in the impregnation bath 10 It is preferable to supply the resin varnish 12 so that the difference in viscosity of the resin varnish 12 in the portion B of the varnish 12 excluding the portion A between the liquid surfaces of the base material is 0 to 150 centipoise. If the difference in viscosity exceeds 150 centipoise, an unimpregnated portion may be generated or the appearance may be deteriorated.

【0020】なお図示しないが、含浸槽10内の樹脂ワ
ニス12のうち基材液面間部分Aを除く部分Bの樹脂ワ
ニス12の部分にも樹脂受け槽13内の樹脂ワニス12
を供給する配管を設け、樹脂ワニス12を供給するよう
になっていてもよい。また、樹脂ワニス12を含浸した
基材14を含浸槽10の上部から引き出した後、ロール
に挟んで絞って含浸した樹脂ワニス12の量を調整する
ようになっていてもよい。
Although not shown, the resin varnish 12 in the resin receiving tank 13 also covers the resin varnish 12 in the portion B of the resin varnish 12 in the impregnation tank 10 except for the portion A between the liquid surfaces of the base material.
May be provided to supply the resin varnish 12. Alternatively, the amount of the resin varnish 12 impregnated with the resin varnish 12 may be adjusted by drawing out the base material 14 impregnated with the resin varnish 12 from the upper part of the impregnation tank 10 and squeezing the base material between rolls.

【0021】なお、本発明の方法は、樹脂受け槽13内
の樹脂ワニス12の粘度を分析しながら溶剤15を補充
して粘度を調整するものに限定するものではなく、溶剤
15を補充しない場合であっても、基材液面間部分Aに
樹脂ワニス12を供給して、その部分の樹脂ワニス12
を置き換えるため、従来の含浸槽10の下部から供給す
る場合と比較して、空気が液中に浮遊して含浸性が低下
した樹脂ワニス12が減って、基材液面間部分Aの樹脂
ワニス12と、含浸槽10内の樹脂ワニス12のうち基
材液面間部分Aを除く部分Bの樹脂ワニス12との粘度
差が小さくなり、連続的に含浸しても未含浸の部分が発
生しにくく、かつ、外観が優れたプリプレグが得られる
効果が得られる。
The method of the present invention is not limited to the method of adjusting the viscosity by replenishing the solvent 15 while analyzing the viscosity of the resin varnish 12 in the resin receiving tank 13. However, the resin varnish 12 is supplied to the portion A between the liquid surfaces of the base material, and the resin varnish 12
In order to replace the resin varnish, the resin varnish 12 in which air floats in the liquid and the impregnation property is reduced is reduced as compared with the case where the resin varnish is supplied from the lower part of the conventional impregnation tank 10, and the resin varnish in the portion A between the liquid surfaces of the base material is reduced. 12 and the resin varnish 12 in the portion B of the resin varnish 12 in the impregnation tank 10 except for the portion A between the liquid surfaces of the base material, the viscosity difference between the resin varnish 12 and the resin varnish 12 becomes small. The effect of obtaining a prepreg which is difficult and excellent in appearance is obtained.

【0022】本発明の第二の実施の形態の樹脂含浸方法
は、図3及び図4に示すように、その内部に駆動された
含浸ロール11を備え、上部を解放系とした含浸槽10
に、含浸ロール11が十分に浸漬する程度まで樹脂ワニ
ス12を満たし、含浸槽10の下にオーバーフローした
樹脂ワニス12を受ける樹脂受け槽13を備えた含浸装
置を用いて、その樹脂ワニス12に基材14を含浸槽1
0の上部から供給して、連続的に浸入させて樹脂ワニス
12に沈めた後、含浸ロール11に巻きつけることによ
り方向を転換させ、次いで基材14を含浸槽10の上部
から引き出して含浸を行う。
The resin impregnating method according to the second embodiment of the present invention, as shown in FIGS. 3 and 4, includes an impregnating roll 11 driven inside thereof, and an impregnating tank 10 having an open upper portion.
The resin varnish 12 is filled with the resin varnish 12 until the impregnation roll 11 is sufficiently immersed, and the resin varnish 12 is filled with the resin varnish 12 under the impregnation tank 10. Impregnation tank 1 with material 14
After being supplied from the upper portion of the impregnating tank 10 and continuously penetrating and submerging in the resin varnish 12, the direction is changed by winding it around the impregnating roll 11, and then the base material 14 is pulled out from the upper portion of the impregnating tank 10 to perform impregnation. Do.

【0023】そしてこの含浸装置は、基材液面間部分A
内では基材14の幅方向に流れるように樹脂ワニス12
を吹き出す吹き出し口22が含浸槽10内に設けられて
おり、その吹き出し口22から粘度調整された樹脂受け
槽13の樹脂ワニス12をポンプで加圧して吹き出すこ
とにより、基材液面間部分Aに樹脂ワニス12を供給す
るようになっている。
The impregnating device is provided with a portion A between the liquid surfaces of the base material.
Inside, the resin varnish 12 flows in the width direction of the base material 14.
Is provided in the impregnation tank 10, and the resin varnish 12 of the resin receiving tank 13 whose viscosity has been adjusted is pressurized and blown out from the blow-out port 22 by a pump, whereby a portion A between the liquid surfaces of the base material is discharged. Is supplied with a resin varnish 12.

【0024】このように、樹脂ワニス12が基材液面間
部分Aに供給されて置き換えるようになっているため、
従来の含浸槽10の下部から供給する場合と比較して、
基材液面間部分Aの樹脂ワニス12は、溶剤成分が蒸発
して粘度が高くなったり、空気が液中に浮遊して含浸性
が低下した樹脂ワニス12が減って、基材14内部にま
で含浸するのに適し、かつ、基材14に付着する樹脂量
も適した粘度に調整された樹脂ワニス12に成分が近く
なり、連続的に含浸しても未含浸の部分が発生しにく
く、かつ、外観が優れたプリプレグが得られる。
As described above, since the resin varnish 12 is supplied to the portion A between the liquid surfaces of the base material to be replaced,
Compared to the case of supplying from the lower part of the conventional impregnation tank 10,
The resin varnish 12 in the portion A between the liquid surfaces of the base material is reduced in the amount of the resin varnish 12 in which the viscosity is increased due to evaporation of the solvent component and the air is suspended in the liquid and the impregnating property is reduced. The components are close to the resin varnish 12 that is suitable for impregnating up to the resin varnish 12 and the amount of the resin adhering to the base material 14 is also adjusted to a suitable viscosity. In addition, a prepreg having an excellent appearance can be obtained.

【0025】なお、吹き出し口22から吹き出す樹脂ワ
ニス12は、樹脂受け槽13の樹脂ワニス12に限定す
るものではなく、溶剤成分が蒸発しにくい含浸槽10内
の樹脂ワニス12のうち基材液面間部分Aを除く部分B
の樹脂ワニス12を吸引し、吹き出し口22から吹き出
すようになっていてもよい。この場合も、従来の含浸槽
10の下部から供給する場合と比較して、基材液面間部
分Aの樹脂ワニス12と、含浸槽10内の樹脂ワニス1
2のうち基材液面間部分Aを除く部分Bの樹脂ワニス1
2との粘度差が小さくなり、連続的に含浸しても未含浸
の部分が発生しにくく、かつ、外観が優れたプリプレグ
が得られる効果が得られる。
The resin varnish 12 blown out from the blowout port 22 is not limited to the resin varnish 12 in the resin receiving tank 13, and the resin varnish 12 in the impregnating tank 10 in which the solvent component hardly evaporates is used. Part B excluding the intervening part A
The resin varnish 12 may be sucked and blown out from the outlet 22. Also in this case, the resin varnish 12 in the portion A between the liquid surfaces of the base material and the resin varnish 1 in the impregnation tank 10 are different from the case where the resin varnish is supplied from the lower part of the conventional impregnation tank 10.
Resin varnish 1 of portion B of portion 2 excluding portion A between base liquid levels
The effect of obtaining a prepreg having an excellent appearance is obtained, since the difference in viscosity from that of No. 2 is reduced, and even if the material is continuously impregnated, an unimpregnated portion hardly occurs.

【0026】本発明に用いられる基材としては、ガラス
等の無機質繊維やポリエステル、ポリアミド、ポリアク
リル、ポリイミド等の有機質繊維や、木綿等の天然繊維
の織布、不織布、紙等を用いることができる。なお、ガ
ラス繊維製の織布(ガラスクロス)を用いると、得られ
る積層板の耐熱性及び耐湿性が優れ好ましい。
As the base material used in the present invention, woven fabric, non-woven fabric, paper and the like of inorganic fibers such as glass, organic fibers such as polyester, polyamide, polyacryl and polyimide, and natural fibers such as cotton can be used. it can. Note that the use of a glass fiber woven fabric (glass cloth) is preferable because the resulting laminate has excellent heat resistance and moisture resistance.

【0027】また、本発明に用いられる樹脂ワニスとし
ては、エポキシ樹脂系、フェノール樹脂系、ポリイミド
樹脂系、不飽和ポリエステル樹脂系、ポリフェニレンエ
ーテル樹脂系等の単独、変性物、混合物のように、熱硬
化性樹脂組成物全般を用いることができる。
The resin varnish used in the present invention may be, for example, an epoxy resin, a phenol resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene ether resin, or the like, alone, modified, or mixed. All curable resin compositions can be used.

【0028】この樹脂ワニス中には、熱硬化性樹脂及び
溶剤を必須として含有し、必要に応じてその熱硬化性樹
脂の硬化剤、硬化促進剤及び無機充填材等を含有するこ
とができる。なおエポキシ樹脂等のように自己硬化性の
低い熱硬化性樹脂は、その樹脂を硬化するための硬化剤
等も含有することが必要である。
The resin varnish contains a thermosetting resin and a solvent as essential components, and may contain a curing agent, a curing accelerator, an inorganic filler and the like for the thermosetting resin as required. Note that a thermosetting resin having a low self-curing property, such as an epoxy resin, must also contain a curing agent for curing the resin.

【0029】樹脂ワニスに含有する溶剤としては、N,
N−ジメチルホルムアミド等のアミド類、エチレングリ
コールモノメチルエーテル等のエーテル類、アセトン、
メチルエチルケトン等のケトン類、メタノール、エタノ
ール等のアルコール類、ベンゼン、トルエン等の芳香族
炭化水素類等が挙げられる。なお、メタノール、エタノ
ール、メチルエチルケトン、アセトン、ベンゼン、トル
エンからなる群の中から選ばれた少なくとも1種の溶剤
の場合、得られるプリプレグ中の溶剤の残留が少なくな
り好ましい。
As the solvent contained in the resin varnish, N,
Amides such as N-dimethylformamide, ethers such as ethylene glycol monomethyl ether, acetone,
Examples include ketones such as methyl ethyl ketone, alcohols such as methanol and ethanol, and aromatic hydrocarbons such as benzene and toluene. In the case of at least one solvent selected from the group consisting of methanol, ethanol, methyl ethyl ketone, acetone, benzene, and toluene, the amount of the solvent remaining in the obtained prepreg is reduced, which is preferable.

【0030】なお、熱硬化性樹脂がエポキシ樹脂系の場
合、電気特性及び接着性のバランスが良好であり好まし
い。エポキシ樹脂系の樹脂ワニスに含有するエポキシ樹
脂としては、例えばビスフェノールA型エポキシ樹脂、
ビスフェノールF型エポキシ樹脂、ビスフェノールS型
エポキシ樹脂、フェノールノボラック型エポキシ樹脂、
ビスフェノールAノボラック型エポキシ樹脂、ビスフェ
ノールFノボラック型エポキシ樹脂、クレゾールノボラ
ック型エポキシ樹脂、ジアミノジフェニルメタン型エポ
キシ樹脂、及びこれらのエポキシ樹脂構造体中の水素原
子の一部をハロゲン化することにより難燃化したエポキ
シ樹脂等が挙げられる。また、このエポキシ樹脂系の樹
脂ワニスに含有する硬化剤としては、例えばジシアンジ
アミド、脂肪族ポリアミド等のアミド系硬化剤や、アン
モニア、トリエチルアミン、ジエチルアミン等のアミン
系硬化剤や、フェノールノボラック樹脂、クレゾールノ
ボラック樹脂、p−キシレン−ノボラック樹脂等のフェ
ノール系硬化剤や、酸無水物類等が挙げられる。
When the thermosetting resin is an epoxy resin, the balance between the electrical properties and the adhesiveness is good, which is preferable. As the epoxy resin contained in the epoxy resin-based resin varnish, for example, bisphenol A type epoxy resin,
Bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolak epoxy resin,
Bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, cresol novolak type epoxy resin, diaminodiphenylmethane type epoxy resin, and flame retardant by partially halogenating hydrogen atoms in these epoxy resin structures Epoxy resins and the like can be mentioned. Examples of the curing agent contained in the epoxy resin-based resin varnish include amide-based curing agents such as dicyandiamide and aliphatic polyamide, amine-based curing agents such as ammonia, triethylamine and diethylamine, phenol novolak resin, and cresol novolak. Resins, phenolic curing agents such as p-xylene-novolak resin, acid anhydrides, and the like.

【0031】また、樹脂ワニスに含有することができる
無機充填材としては、シリカ、炭酸カルシウム、水酸化
アルミニウム、タルク等の無機質粉末充填材や、ガラス
繊維、パルプ繊維、合成繊維、セラミック繊維等の繊維
質充填材が挙げられる。
Examples of the inorganic filler that can be contained in the resin varnish include inorganic powder fillers such as silica, calcium carbonate, aluminum hydroxide, and talc; and glass fibers, pulp fibers, synthetic fibers, and ceramic fibers. Fibrous fillers.

【0032】樹脂ワニスを基材に含浸した後、乾燥して
プリプレグを得る。乾燥する条件としては特に限定する
ものではなく、用いた溶剤が蒸発したり、用いた熱硬化
性樹脂が半硬化する条件で乾燥を行う。
After impregnating the substrate with the resin varnish, it is dried to obtain a prepreg. The conditions for drying are not particularly limited, and the drying is performed under the condition that the used solvent evaporates or the used thermosetting resin is semi-cured.

【0033】なお、乾燥した後のプリプレグの樹脂量
は、プリプレグの重量100重量部に対し、40〜70
重量部であると好ましい。40重量部未満の場合は、得
られる積層板中に気泡が残留し、電気的特性が低下する
場合があり、70重量部を超える場合は、得られる積層
板の板厚のばらつきが大きくなる場合がある。
The resin content of the prepreg after drying is 40 to 70 parts by weight per 100 parts by weight of the prepreg.
It is preferred that the amount be parts by weight. If the amount is less than 40 parts by weight, air bubbles may remain in the obtained laminate, and the electrical characteristics may deteriorate. If the amount exceeds 70 parts by weight, the thickness of the obtained laminate may vary greatly. There is.

【0034】[0034]

【実施例】【Example】

(実施例1)粘度調整前の一次ワニスとして、下記のエ
ポキシ樹脂2種類、硬化剤、硬化促進剤及び溶剤を配合
した一次ワニスを使用した。 ・エポキシ樹脂1:エポキシ当量が500であるテトラ
ブロモビスフェノールA型エポキシ樹脂[東都化成社
製、商品名YDB−500]を固形分として、94重量
部 ・エポキシ樹脂2:エポキシ当量が220であるクレゾ
ールノボラック型エポキシ樹脂[東都化成社製、商品名
YDCN−220]を固形分として、13重量部 ・硬化剤:ジシアンジアミドを2.8重量部 ・硬化促進剤:2−エチル−4−メチルイミダゾールを
0.1重量部 ・溶剤:N,N−ジメチルホルムアミドを25重量部。
(Example 1) As a primary varnish before viscosity adjustment, a primary varnish containing the following two types of epoxy resins, a curing agent, a curing accelerator and a solvent was used. -Epoxy resin 1: 94 parts by weight of a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 500 [YDB-500, manufactured by Toto Kasei Co., Ltd.] as a solid content-Epoxy resin 2: Cresol having an epoxy equivalent of 220 13 parts by weight of novolak type epoxy resin [YDCN-220, manufactured by Toto Kasei Co., Ltd.] as a solid content.-Curing agent: 2.8 parts by weight of dicyandiamide-Curing accelerator: 0 of 2-ethyl-4-methylimidazole Solvent: 25 parts by weight of N, N-dimethylformamide.

【0035】また、基材として厚さ0.19mmのガラ
スクロス[日東紡績株式会社製、品名 18W]を使用
した。
A glass cloth having a thickness of 0.19 mm [manufactured by Nitto Boseki Co., Ltd., product name: 18W] was used as a base material.

【0036】また、含浸装置としては、上部を解放系と
し、基材液面間部分に樹脂ワニスを供給する開口部を有
する配管を設け、その開口部から溶剤で粘度調整した樹
脂ワニスを供給するように形成し、かつ、同じ粘度調整
した樹脂ワニスを含浸槽内の基材液面間部分を除く部分
にも供給するように形成した含浸装置を用いて、含浸槽
に樹脂ワニスをその両方から供給して満たし、その樹脂
ワニスに基材を連続的に浸入させて樹脂ワニスに沈めつ
つ、連続的に引き出して含浸する方法により基材に樹脂
ワニスを含浸した後、ロールに挟んで絞って含浸した樹
脂ワニスの量を調整し、次いで最高温度180℃で加熱
乾燥して、乾燥後の樹脂量が52重量%のプリプレグを
作製した。
In addition, as the impregnating device, a pipe having an opening for supplying a resin varnish is provided between the liquid surfaces of the base material, and a resin varnish whose viscosity has been adjusted with a solvent is supplied from the opening. And, using an impregnating device formed so that the same viscosity adjusted resin varnish is also supplied to the portion of the impregnation tank except for the portion between the liquid surfaces of the base material, the resin varnish into the impregnation tank from both. Supply and fill, while the substrate is continuously infiltrated into the resin varnish and submerged in the resin varnish, the substrate is impregnated with the resin varnish by the method of continuous drawing and impregnation, then squeezed by being sandwiched between rolls and impregnated The amount of the resin varnish thus prepared was adjusted, and then heated and dried at a maximum temperature of 180 ° C. to prepare a prepreg having a dried resin amount of 52% by weight.

【0037】なお、スタート時含浸槽に満たした樹脂ワ
ニス、及び粘度調整して供給した樹脂ワニスは、上記一
次ワニスにメチエチルケトンを追加したり、オーバーフ
ローした樹脂ワニスにメチエチルケトンを追加して粘度
が300センチポイズになるよう調整して用いた。
The resin varnish filled in the impregnation tank at the start and the resin varnish supplied after adjusting the viscosity were prepared by adding methyl ethyl ketone to the primary varnish or adding methyl ethyl ketone to the overflowed resin varnish. The viscosity was adjusted to 300 centipoise before use.

【0038】(実施例2)含浸装置として、上部を解放
系とし、基材液面間部分内では基材の幅方向に流れるよ
うに樹脂ワニスを吹き出す吹き出し口を含浸槽内に設
け、その吹き出し口から溶剤で粘度調整した樹脂ワニス
を吹き出して供給するよう形成し、かつ、同じ粘度調整
した樹脂ワニスを含浸槽内の基材液面間部分を除く部分
にも供給するように形成した含浸装置を用いてその両方
から供給したこと以外は実施例1と同様にしてプリプレ
グを得た。
(Example 2) As an impregnating device, an opening is provided at the upper part, and in the portion between the liquid surfaces of the base material, an outlet for blowing a resin varnish so as to flow in the width direction of the base material is provided in the impregnation tank. An impregnating device formed so that the resin varnish whose viscosity has been adjusted with a solvent is blown out from the mouth and supplied, and the resin varnish whose viscosity has been adjusted is also supplied to a portion of the impregnation tank except for the portion between the liquid surfaces of the base material. A prepreg was obtained in the same manner as in Example 1 except that the prepreg was supplied from both.

【0039】(実施例3)含浸装置として、上部を解放
系とし、溶剤で粘度調整した樹脂ワニスを含浸槽内の基
材液面間部分を除く部分に供給するようにし、かつ、基
材液面間部分内では基材の幅方向に流れるように樹脂ワ
ニスを吹き出す吹き出し口を含浸槽内に設け、その吹き
出し口から含浸槽内の樹脂ワニスのうち基材液面間部分
を除く部分の樹脂ワニスを吸引して吹き出すよう形成し
た含浸装置を用いたこと以外は実施例1と同様にしてプ
リプレグを得た。
(Example 3) As an impregnating device, a resin varnish whose viscosity was adjusted with a solvent was supplied to a portion of the impregnation tank except for the portion between the liquid surfaces of the substrate, and the base liquid was used. An outlet for blowing resin varnish is provided in the impregnation tank so that the resin varnish flows in the width direction of the base material in the inter-surface portion, and a portion of the resin varnish in the impregnation bath except the inter-substrate liquid surface portion is provided from the outlet. A prepreg was obtained in the same manner as in Example 1, except that an impregnation device formed so as to suck and blow out varnish was used.

【0040】(比較例1)含浸装置として、上部を解放
系とし、溶剤で粘度調整した樹脂ワニスを含浸槽内の基
材液面間部分を除く部分に供給するようにした含浸装置
を用いたこと以外は実施例1と同様にしてプリプレグを
得た。
(Comparative Example 1) As an impregnating apparatus, an impregnating apparatus was used in which the upper part was an open system and a resin varnish whose viscosity had been adjusted with a solvent was supplied to a part of the impregnation tank except for a part between liquid surfaces of the base material. Except for this, a prepreg was obtained in the same manner as in Example 1.

【0041】(評価、結果)実施例1〜3及び比較例1
の方法で1時間連続して含浸し、5分後、30分後、6
0分後の、基材液面間部分内の樹脂ワニス、及び含浸槽
内の基材液面間部分を除く部分の樹脂ワニスをサンプリ
ングして粘度を評価した。また、5分後及び60分後に
得られたプリプレグについて、含浸性及び外観を評価し
た。
(Evaluation and Results) Examples 1 to 3 and Comparative Example 1
Impregnated continuously for 1 hour by the method described above, and after 5 minutes, 30 minutes,
After 0 minute, the viscosity was evaluated by sampling the resin varnish in the portion between the liquid surfaces of the base material and the resin varnish in the portion excluding the portion between the liquid surfaces of the base material in the impregnation tank. The prepregs obtained after 5 minutes and 60 minutes were evaluated for impregnation and appearance.

【0042】樹脂ワニスの粘度は、E型粘度計を用いて
25℃で測定した。含浸性は、プリプレグを10×10
cmに切断した後、163℃の電気炉内で15分間吊し
て加熱し、次いで冷却した後、ガラスクロスの糸と糸の
隙間で樹脂が浸入していない部分の有無を10倍の拡大
鏡で評価し、樹脂が浸入していない部分がないものを○
とし、樹脂が浸入していない部分があるものを×とし
た。外観は、樹脂付着量の多い部分や少ない部分が発生
して外観が低下した部分の有無を目視で評価し、外観が
低下した部分がないものを○とし、外観が低下した部分
があるものを×とした。
The viscosity of the resin varnish was measured at 25 ° C. using an E-type viscometer. For impregnation, prepreg is 10 × 10
cm, then heat it by suspending it in an electric furnace at 163 ° C. for 15 minutes and then cool it. If there is no part where resin has not penetrated,
And those having a portion where the resin did not penetrate were evaluated as x. The appearance was visually evaluated for the presence or absence of a portion where the resin adhesion amount was large or a portion where the appearance was reduced due to the occurrence of a portion with a small amount of resin adhesion. X.

【0043】結果は表1に示した通り、実施例1〜3は
比較例1と比べ、基材液面間部分内の樹脂ワニスの粘度
と、基材液面間部分を除く部分の樹脂ワニスの粘度の差
が小さく、かつ、基材液面間部分内の樹脂ワニスの粘度
は、連続に含浸しても、含浸開始時の粘度と差が小さい
ことが確認された。また、実施例1〜3は比較例1と比
べ、得られたプリプレグの含浸性及び外観が優れること
が確認された。
The results are shown in Table 1. In Examples 1 to 3, the viscosity of the resin varnish in the portion between the liquid surfaces of the base material and the resin varnish in the portion excluding the portion between the liquid surfaces of the base material were different from those in Comparative Example 1. Was small, and the viscosity of the resin varnish in the portion between the liquid surfaces of the base material was confirmed to be little different from the viscosity at the start of the impregnation even after continuous impregnation. Further, it was confirmed that Examples 1 to 3 were superior to Comparative Example 1 in the impregnating property and appearance of the obtained prepreg.

【0044】[0044]

【表1】 [Table 1]

【0045】[0045]

【発明の効果】本発明の樹脂含浸方法は、樹脂ワニスを
含浸槽に供給する方法が、基材液面間部分(樹脂ワニス
に沈む部分の基材及び樹脂ワニスの液面により囲まれた
部分)に、樹脂ワニスを供給する方法であるため、基材
液面間部分の樹脂ワニスを置き換えることができ、溶剤
成分が蒸発して粘度が高くなったり空気が液中に浮遊し
て含浸性が低下した樹脂ワニスが基材液面間部分から減
って、含浸槽内の樹脂ワニスのうち基材液面間部分を除
く部分の樹脂ワニス等に成分が近くなる。そのため、本
発明に係る樹脂含浸方法によると、連続的に含浸しても
未含浸の部分が発生しにくく、かつ、外観が優れたプリ
プレグが得られる。
According to the resin impregnating method of the present invention, the method of supplying the resin varnish to the impregnation tank is performed by the method comprising the steps of: ), The resin varnish is supplied, so that the resin varnish at the liquid surface portion of the base material can be replaced, and the solvent component evaporates to increase the viscosity or the air floats in the liquid to improve the impregnation. The reduced resin varnish decreases from the portion between the liquid surfaces of the base material, and the components become closer to the resin varnish and the like in the portion of the resin varnish in the impregnation tank except the portion between the liquid surfaces of the base material. Therefore, according to the resin impregnation method according to the present invention, a prepreg excellent in appearance and having less impregnated portions even when continuously impregnated is obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る樹脂含浸方法の第一の実施の形態
を説明する一部を破断して示した正面図である。
FIG. 1 is a partially cutaway front view for explaining a first embodiment of a resin impregnation method according to the present invention.

【図2】本発明に係る樹脂含浸方法の第一の実施の形態
を説明する一部を破断して示した側面図である。
FIG. 2 is a partially cutaway side view for explaining the first embodiment of the resin impregnation method according to the present invention.

【図3】本発明に係る樹脂含浸方法の第二の実施の形態
を説明する一部を破断して示した正面図である。
FIG. 3 is a partially broken front view illustrating a second embodiment of the resin impregnation method according to the present invention.

【図4】本発明に係る樹脂含浸方法の第二の実施の形態
を説明する一部を破断して示した側面図である。
FIG. 4 is a partially cutaway side view illustrating a resin impregnation method according to a second embodiment of the present invention.

【図5】従来の樹脂含浸方法を説明する一部を破断して
示した側面図である。
FIG. 5 is a partially cutaway side view illustrating a conventional resin impregnation method.

【符号の説明】[Explanation of symbols]

10 含浸槽 11 含浸ロール 12 樹脂ワニス 13 樹脂受け槽 14 基材 15 溶剤 20 配管 21 開口部 22 吹き出し口 A 基材液面間部分(樹脂ワニスに沈む部分の基材及び
樹脂ワニスの液面により囲まれた部分)
DESCRIPTION OF SYMBOLS 10 Impregnation tank 11 Impregnation roll 12 Resin varnish 13 Resin receiving tank 14 Substrate 15 Solvent 20 Pipe 21 Opening 22 Outlet A Section between substrate liquid levels (surrounded by liquid level of base material and resin varnish sinking into resin varnish) Part)

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 上部を解放系とした含浸槽に、溶剤を含
有する樹脂ワニスを供給して満たし、その樹脂ワニスに
基材を連続的に浸入させて樹脂ワニスに沈めつつ、連続
的に引き出して含浸する樹脂含浸方法において、樹脂ワ
ニスを供給する方法が、樹脂ワニスに沈む部分の基材及
び樹脂ワニスの液面により囲まれた部分に、樹脂ワニス
を供給する方法であることを特徴とする樹脂含浸方法。
1. A resin varnish containing a solvent is supplied to and filled in an impregnation tank having an open system at an upper part, and a base material is continuously penetrated into the resin varnish and continuously drawn out while being immersed in the resin varnish. In the resin impregnation method of impregnating the resin varnish, the method of supplying the resin varnish is a method of supplying the resin varnish to a portion of the substrate immersed in the resin varnish and a portion surrounded by the liquid surface of the resin varnish. Resin impregnation method.
【請求項2】 樹脂ワニスに沈む部分の基材及び樹脂ワ
ニスの液面により囲まれた部分に樹脂ワニスを供給する
方法が、樹脂ワニスに沈む部分の基材及び樹脂ワニスの
液面により囲まれた部分に開口部を有する配管を設け、
その開口部から樹脂ワニスを流出することにより供給す
る方法であることを特徴とする請求項1記載の樹脂含浸
方法。
2. A method of supplying a resin varnish to a portion of a substrate sinking in a resin varnish and a portion surrounded by a liquid level of the resin varnish, wherein the method comprises supplying the resin varnish to a portion of the substrate sinking in the resin varnish. Pipe with an opening in the
The resin impregnation method according to claim 1, wherein the resin varnish is supplied by flowing out from the opening.
【請求項3】 樹脂ワニスに沈む部分の基材及び樹脂ワ
ニスの液面により囲まれた部分に樹脂ワニスを供給する
方法が、樹脂ワニスに沈む部分の基材及び樹脂ワニスの
液面により囲まれた部分内では基材の幅方向に流れるよ
うに樹脂ワニスを吹き出す吹き出し口を含浸槽内に設
け、その樹脂ワニスの吹き出しにより供給する方法であ
ることを特徴とする請求項1記載の樹脂含浸方法。
3. A method of supplying a resin varnish to a portion of a resin varnish submerged by a base material and a liquid surface of a resin varnish. The resin impregnating method according to claim 1, wherein a blow-out port for blowing the resin varnish is provided in the impregnation tank so as to flow in the width direction of the base material within the portion, and the resin varnish is supplied by blowing the resin varnish. .
【請求項4】 含浸槽内の樹脂ワニスのうち樹脂ワニス
に沈む部分の基材及び樹脂ワニスの液面により囲まれた
部分の樹脂ワニスと、含浸槽内の樹脂ワニスのうち樹脂
ワニスに沈む部分の基材及び樹脂ワニスの液面により囲
まれた部分を除く部分の樹脂ワニスの粘度の差が0〜1
50センチポイズとなるよう、樹脂ワニスに沈む部分の
基材及び樹脂ワニスの液面により囲まれた部分に樹脂ワ
ニスを供給することを特徴とする請求項1から請求項3
のいずれかに記載の樹脂含浸方法。
4. A resin varnish in a portion of the resin varnish in the impregnation tank that sinks into the resin varnish and a portion of the resin varnish surrounded by the liquid surface of the resin varnish and a portion of the resin varnish in the impregnation tank that sinks in the resin varnish. The difference in viscosity of the resin varnish in the portion excluding the portion surrounded by the liquid surface of the base material and the resin varnish is 0 to 1
4. The resin varnish is supplied to a portion of the resin varnish submerged in the resin varnish and a portion surrounded by the liquid surface of the resin varnish so as to have a volume of 50 centipoise.
The resin impregnation method according to any one of the above.
【請求項5】 樹脂ワニスに含有する溶剤が、メタノー
ル、エタノール、メチルエチルケトン、アセトン、ベン
ゼン、トルエンからなる群の中から選ばれた少なくとも
1種の溶剤を含有することを特徴とする請求項1から請
求項4のいずれかに記載の樹脂含浸方法。
5. The method according to claim 1, wherein the solvent contained in the resin varnish contains at least one solvent selected from the group consisting of methanol, ethanol, methyl ethyl ketone, acetone, benzene and toluene. The resin impregnation method according to claim 4.
JP16223296A 1996-06-21 1996-06-21 Method for resin impregnation Pending JPH106332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16223296A JPH106332A (en) 1996-06-21 1996-06-21 Method for resin impregnation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16223296A JPH106332A (en) 1996-06-21 1996-06-21 Method for resin impregnation

Publications (1)

Publication Number Publication Date
JPH106332A true JPH106332A (en) 1998-01-13

Family

ID=15750489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16223296A Pending JPH106332A (en) 1996-06-21 1996-06-21 Method for resin impregnation

Country Status (1)

Country Link
JP (1) JPH106332A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008222546A (en) * 2007-03-08 2008-09-25 Special Coating Lab Internatl Device for regulating concentration of component in liquid, especially device for regulating concentration of alcohol contained in varnish composition accommodated in varnish tank for optical glass or other substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008222546A (en) * 2007-03-08 2008-09-25 Special Coating Lab Internatl Device for regulating concentration of component in liquid, especially device for regulating concentration of alcohol contained in varnish composition accommodated in varnish tank for optical glass or other substrate

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