JPH1064982A - Substrate support mechanism and substrate treatment unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the substrate support mechanism having provision for a thin profile of a substrate and a large sized substrate with less affect on a lower middle part of the substrate and the substrate treatment unit that improves the uniform treatment performance of the substrate, the reliability of substrate carrying and the yield of devices by having provision for a thin profile of the substrate and the large sized substrate and preventing lateral skid, a damage and falling down of the substrate and the broken substrate or the like. SOLUTION: Substrate support pins 2a placed at a peripheral part supporting the peripheral part of a substrate 1 and a center substrate support pin 2b supporting the center of the substrate 1 are penetrated through a treatment plate 3 and fixed to a pin base 4. The height of a tip (substrate contact part) of the center substrate support pin 2b is selected lower than the height of tips (substrate contact part) of the substrate support pins 2a placed at the peripheral part of the substrate 1. The pin base 4 is guided by a guide member in the vertical direction and moved vertically by the drive of a cylinder 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor substrate, an LCD, and the like.
(Liquid Crystal Display) or PDP (Plasma Display Panel)
1) The present invention relates to a substrate holding mechanism for holding a substrate (hereinafter, simply referred to as a “substrate”) such as a glass substrate for use, and a substrate processing apparatus for performing processing on these substrates.

[0002]

2. Description of the Related Art A substrate holding mechanism is mainly used when a substrate is transferred between two or more transfer robots for transferring a substrate, for example, a substrate mounting table on which a substrate is mounted or a heat source. The substrate is placed on the upper surface of a flat metal processing plate (hot plate) on which is disposed, and a hot plate type heat treatment apparatus for performing a heat treatment on the substrate or a cooling water channel is formed inside. A substrate is placed on the upper surface of a flat metal processing plate (cool plate), and a cool plate type cooling processing apparatus for performing a cooling process on the substrate, and further, a processing liquid is supplied to the substrate, and the substrate is rotated to rotate the substrate. It is used for a spin-type processing device or the like that performs a chemical solution treatment or a cleaning treatment on a substrate.

Here, in particular, in the above-mentioned hot plate type heat treatment apparatus and cool plate type cooling processing apparatus (hereinafter collectively referred to as "plate type substrate processing apparatus"), a rectangular glass substrate for LCD is used as a substrate. An example will be described below.

FIG. 11 is a perspective view for explaining the structure of a conventional substrate processing apparatus (plate type substrate processing apparatus).
FIGS. 12 to 14 show a series of operations of a conventional substrate processing apparatus (plate-type substrate processing apparatus) from loading and unloading of a substrate. It is a flowchart.

[0005] The structures of the two types of plate-type substrate processing apparatuses described above are both as shown in FIG. 11, and whether the processing plate 103 in the figure is the hot plate or the cool plate described above. Only differ.

In this conventional plate type substrate processing apparatus, a peripheral substrate holding pin 102a for holding a peripheral portion of the substrate 101 and a central substrate holding pin 102b for holding a central portion of the substrate (hereinafter, these two are collectively referred to as "the two"). Are referred to as “substrate holding pins 102 a and 102 b”).
3, is fixed to the pin base 104, and moves up and down together with the pin base 104 by the cylinder 105.
Here, the tips (substrate contact portions) of the substrate holding pins 102a and 102b are all at the same height, and the pin base 104 is guided by a vertical guide member (not shown). or,
The substrate 101 is a transfer arm 1 of a transfer robot that transfers the substrate 101 between substrate processing apparatuses that process the substrate 101.
06, the peripheral portions of two opposing sides are held.

[0007] A series of operations of the plate type substrate processing apparatus from substrate loading to unloading will be briefly described with reference to FIGS.

First, as shown in FIG. 12A, a pin base 104 and a substrate holding pin 10 are
2a and 102b rise, and the transfer arm 106
1 is carried in above the processing plate 103 from a direction in front of the plane of FIG. Next, FIGS.
As shown in (c), the transfer arm 106 descends to a height lower than the tip of the substrate holding pins 102a and 102b,
The substrate 101 is placed on the substrate holding pins 102a and 102b. Next, as shown in FIG.
6 retreats toward the front of the page. Next, FIG.
As shown in (e), the substrate holding pins 102a, 102b
However, it descends until its tip is lower than the processing surface on the upper surface of the processing plate 103. As a result, the substrate 101 is placed on the processing surface of the processing plate 103, and the substrate 101 is subjected to a heating or cooling process. When the processing is completed, as shown in FIG.
102b rises, and the substrate 10
1 apart. Next, as shown in FIG. 14 (g), the transfer arm 106 is inserted above the processing plate 103 from the front side with respect to the paper surface at a height between the substrate 101 and the processing plate 103. Then, FIG.
As shown in FIG. 14 (i), the transfer arm 106 moves up, separates the substrate 101 from the substrate holding pins 102a, 102b, and moves the substrate 101 toward the near side with respect to the paper surface to carry it out.

[0009] Among the two types of plate-type substrate processing apparatuses described above, in the cool-plate type cooling processing apparatus, in order to efficiently cool the substrate 101, a processing plate 103 having a large number of vacuum suction holes is used. Substrate 10
In many cases, the process is performed while holding 1 by suction.

The above is the description of the conventional plate type substrate processing apparatus. The substrate holding chuck of the spin type processing apparatus described above corresponds to a configuration in which the processing plate 103 is configured to hold and rotate the substrate 101 and rotate. In a conventional plate-type substrate processing apparatus, the processing plate 103 and the cylinder 105 are removed, and the substrate holding pins 102a and 102b are fixed so as not to move up and down.

[0011]

In the above-mentioned conventional substrate holding mechanism, the substrate 101 is held at a plurality of substrate holding points at the same height, but as shown in FIG. Is located in the effective area (a necessary range for commercializing the substrate) A, and there is a problem that the lower surface center of the effective area A of the substrate 101 is damaged.

This will be described in detail with reference to FIG.
Since the substrate 101 is bent downward in a concave shape during the lowering of the substrate 101 in FIGS. 12A to 12C, the substrate 101 first contacts the central substrate holding pins 102b in FIG. ), Until the substrate 101 contacts all the substrate holding pins 102a and 102b.
Only the central substrate holding pins 102b are in contact with the substrate 101. In this case, since the direction in which the transfer arm 106 descends is not completely vertical, the substrate 101 descends while rubbing against the central substrate holding pins 102b in the horizontal direction, and damages the central portion of the lower surface of the substrate 101. There was a problem. In addition, since the substrate 101 descends at a certain speed, as shown in FIG. 12B, an impact is applied to the central portion of the lower surface of the substrate 101 at the moment when the substrate 101 first comes into contact with the central substrate holding pins 102b. For this reason, there is a problem that the central portion of the lower surface of the substrate 101 is damaged.

In FIGS. 14 (g) to 14 (i), the operation is the reverse of the operation described above, but the substrate 101 rises while rubbing in the horizontal direction. There was a problem of causing damage.

In the substrate holding mechanism of the conventional plate type substrate processing apparatus, the substrate 101 descends at a certain speed in the state shown in FIGS. Since they are placed in a substantially parallel state, an air layer is instantaneously formed between the substrate 101 and the processing plate 103, and the substrate 101
He skids on 03. For this reason, since the position where the substrate 101 is placed on the processing plate 103 changes for each substrate, there is a problem that the processing for each substrate becomes non-uniform. Further, as shown in FIG. 14 (g) to FIG. 14 (i), the substrate 101 is lifted after the process is completed, and
At the time of unloading at step 06, there is also a problem that the transfer arm 106 cannot receive the substrate 101 because the position of the substrate 101 is different from that at the time of loading.

Also, in the state shown in FIGS. 13E to 13F, the substrate 101 rises at a certain speed.
Since the space between the substrate 101 and the processing plate 103 is instantaneously close to vacuum, the space between the substrate 101 and the processing plate 103 is instantaneously approximated. For this reason, the substrate 101
Acts downward to hinder the operation of separating the substrate 101 from the processing plate 103. As a result, the substrate 101 receives an irregular force during the ascent, causing side slip to be damaged, or the substrate holding pins 102a, 102a,
There is a problem of dropping from the wafer 102b, and the yield of the entire apparatus has been reduced.

In particular, in a cool plate type cooling processing apparatus or the like, when the processing plate 103 is the above-described vacuum suction type processing plate, the space between the substrate 101 and the processing plate 103 is instantaneously further vacuumed. And the force pressing the substrate 101 downward is further increased. For this reason, the substrate 101 is stuck to the processing plate 103, and in this state, the substrate holding pins 102a, 102b
As the substrate rises, the substrate 101 may be cracked, which reduces the yield of the entire device.

If the substrate 101 becomes thinner and larger,
Since the deflection of the substrate 101 increases and the strength of the substrate 101 decreases, it goes without saying that each of the above-mentioned problems is further increased.

Accordingly, the present invention has been made in view of the above-described problems. First, the present invention has been made to cope with a reduction in thickness and size of a substrate, and has a small influence on a central portion of a lower surface of the substrate. The purpose is to provide a mechanism. Second,
In response to the thinning and large size of the board, side slip, damage,
It is an object of the present invention to provide a substrate processing apparatus capable of improving the uniformity of processing for each substrate, the reliability of substrate transfer, and the yield of the apparatus by preventing dropping and breakage.

[0019]

According to a first aspect of the present invention, there is provided an apparatus for holding a substrate for transferring a substrate to a transfer arm for transferring the substrate while holding a peripheral portion of the substrate. A substrate holding mechanism, comprising: at least three peripheral holding members that hold a peripheral portion of the substrate; and at least one central holding member that holds a central portion of the substrate, wherein the central holding member is provided with the substrate. A height position of a substrate contact portion contacting the substrate is lower than a height position of a substrate contact portion where the peripheral holding member contacts the substrate.

According to the first aspect of the present invention, since the central holding member has a substrate contact portion lower than the peripheral holding member, the substrate is placed on the central holding member and the peripheral holding member. In the case where the substrate is placed on the substrate, or when the substrate is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be reduced.

According to a second aspect of the present invention, there is provided a substrate holding mechanism for holding a substrate in order to transfer the substrate to a transfer arm for holding and transferring the substrate while holding the peripheral portion of the substrate. At least three peripheral holding members, and at least one central holding member that holds a central portion of the substrate, wherein the central holding member is rotatable on a substrate contact portion that contacts the substrate. Is a substrate holding mechanism.

According to the second aspect of the present invention, since the rotatable spherical body is provided at the substrate contact portion of the central holding member, the substrate is placed on the central holding member and the peripheral holding member. In the case where the substrate is placed on the substrate, or when the substrate is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be reduced.

According to a third aspect of the present invention, in the substrate holding mechanism according to any one of the first and second aspects, the substrate has a rectangular shape, and the transfer arm has a rectangular shape. The periphery holding member is a substrate holding mechanism that holds the periphery of the sides and holds the periphery of the two sides.

According to the third aspect of the present invention, the peripheral holding member holds the peripheral portions of the two sides held by the transfer arm, and the central holding member has a lower substrate contact portion than the peripheral holding member. Therefore, even when the rectangular substrate is transferred to the substrate holding mechanism while holding the peripheral portions of two sides facing each other, the substrate is placed on the central holding member and the peripheral holding member. In the case where the substrate is placed on the substrate, or when the substrate is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be reduced.

According to a fourth aspect of the present invention, in the substrate holding mechanism according to any one of the first to third aspects, the substrate contact portion of the central holding member is formed of a resin or rubber material. .

According to the fourth aspect of the present invention, since the substrate contact portion of the central holding member is formed of resin or rubber, the substrate is placed on the central holding member and the peripheral holding member. When the substrate is placed or when it is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be further reduced. In particular, in the case of a rubber material, the coefficient of friction of the surface is large, so that it is possible to prevent the substrate from skidding, thereby improving the reliability of transportation and the yield of the entire apparatus.

According to a fifth aspect of the present invention, there is provided a substrate processing table having a planar processing surface for processing a substrate mounted thereon, and at least three peripheral portion holding members for holding a peripheral portion of the substrate. At least one central holding member that holds a central portion of the substrate, and the peripheral holding member and the central holding member are positioned at an upper position to place or separate the substrate from the substrate processing table. An overall drive means for moving up and down between the lower position and a substrate contact position at which the peripheral portion holding member contacts the substrate at a height position of a substrate contact portion at which the central portion holding member contacts the substrate. The substrate processing apparatus is characterized in that the substrate processing apparatus is lower than the height of the section.

According to the fifth aspect of the present invention, the first
Since the central holding member has a substrate contact portion lower than the peripheral holding member, when the substrate is placed on the central holding member and the peripheral holding member, or when the central holding member is And when separated from the peripheral holding member,
Damage to the center of the lower surface of the substrate can be reduced. Second, since the central holding member has a lower substrate contact portion than the peripheral holding member, the substrate is placed in a concave downwardly bent state with respect to the processing surface of the substrate processing table,
An air layer is not formed between the substrate and the substrate processing table unlike the related art, and the substrate does not skid on the substrate processing table. Therefore, the processing for each substrate becomes uniform, and the reliability of the transfer when the transfer arm unloads the substrate from the substrate processing apparatus is improved. Third, since the central holding member has a substrate contact portion lower than the peripheral holding member, when the substrate is separated from the substrate processing table, the substrate is sequentially moved from the peripheral portion to the central portion of the substrate. The space between the substrate and the substrate processing table is gradually separated to the atmospheric pressure state. For this reason, the operation of separating the substrate from the substrate processing table is performed smoothly, so that the substrate does not slide or be damaged or falls off as in the conventional case, and the reliability of transport and the overall yield of the apparatus are reduced. Can be improved.

According to a sixth aspect of the present invention, in the substrate processing apparatus of the fifth aspect, the substrate has a rectangular shape, and the peripheral holding member has two sides of the rectangular substrate facing each other. This is a substrate processing apparatus that holds a peripheral portion.

According to the sixth aspect of the invention, the peripheral holding member holds the peripheral portions of the two sides held by the transfer arm, and the central holding member forms the substrate contact portion lower than the peripheral holding member. Therefore, even when the rectangular substrate is transferred to the substrate processing apparatus while holding the peripheral portions of the two sides facing each other, the substrate is placed on the central holding member and the peripheral holding member. In the case of mounting, or in the case of separating from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be reduced.

According to a seventh aspect of the present invention, in the substrate processing apparatus according to the fifth or sixth aspect, the substrate processing table is provided with a suction means for sucking a substrate on the processing surface.

According to the seventh aspect of the present invention, a substrate processing apparatus having an adsorption means for adsorbing a substrate to a substrate processing table, such as a vacuum suction type cool plate type cooling processing apparatus, is also used. Since the operation of separating from the processing table is performed smoothly, the substrate is not broken, the generation of static electricity is reduced, and the reliability of transportation and the yield of the entire apparatus can be improved.

According to an eighth aspect of the present invention, in the substrate processing apparatus according to any one of the fifth to seventh aspects, the center holding member is vertically movably supported by an elastic body.

According to the eighth aspect of the present invention, since the center holding member is supported by the elastic body so as to be able to move up and down, the impact at the moment when the substrate comes into contact with the substrate contact portion of the center holding member is reduced. Can be eased. Although the amount of deflection of the substrate changes depending on the size, thickness, material, state, and the like of the substrate, the height of the central holding member can be changed in accordance with the change in the amount of deflection. In particular, when the substrate is placed on the substrate processing table or separated from the substrate processing table, it can cope with a sudden change in the amount of deflection of the substrate, and the operation can be performed reliably and smoothly. The overall yield can be improved.

According to a ninth aspect of the present invention, in the substrate processing apparatus according to any one of the fifth to eighth aspects, the substrate contact portion of the central holding member is formed of a resin or rubber material. .

According to the ninth aspect of the present invention, since the substrate contact portion of the central holding member is formed of a resin or rubber material, the substrate is placed on the central holding member and the peripheral holding member. When the substrate is placed or when it is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be further reduced. Particularly, in the case of a rubber material, since the coefficient of friction of the surface is large, side slip of the substrate can be prevented, so that the reliability of transportation and the yield of the entire apparatus can be improved.

The invention according to claim 10 is the invention according to claim 5 or 6.
In the substrate processing apparatus according to any one of the first to fourth aspects, a heat source for heating the substrate and a part for moving one of the peripheral part holding member and the central part holding member up and down with respect to the other may be provided on the substrate processing table. Driving means, wherein the overall driving means holds the peripheral portion at an intermediate position between the upper position and the lower position so that a distance between a substrate and an upper surface of the substrate processing table is a predetermined distance. This is a substrate processing apparatus that stops a member and a central holding member.

According to the tenth aspect of the present invention, there is provided a hot plate type heat treatment apparatus for placing a substrate on an upper surface of a planar substrate processing table provided with a heat source and heating the substrate. Since the preheating treatment for gently heating the substrate can be performed in a state where the distance between the substrate and the upper surface of the substrate processing table is a predetermined distance, the substrate is heated by the heat when the substrate is placed on the substrate processing table. Warpage can be suppressed and the uniformity of the heat treatment of the substrate can be improved. Further, since the substrate and the upper surface of the substrate processing table at the time of the preheating process are kept substantially parallel, the uniformity of the preheating process can be improved.

[0039]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 shows an LC according to the first embodiment of the present invention.
It is a perspective view for explaining composition of a substrate processing device (plate type substrate processing device) for processing a glass substrate for D. FIGS. 2 to 4 illustrate a series of operations from substrate loading to unloading of a substrate processing apparatus (plate type substrate processing apparatus) for processing an LCD glass substrate according to the first embodiment of the present invention. FIG. 4 is a flow chart of the substrate processing apparatus conceptually represented by a vertical cross section for ease.

In the plate-type substrate processing apparatus according to the first embodiment, a peripheral substrate holding pin 2a for holding the peripheral portion of the substrate 1 and a central substrate holding pin 2b for holding the central portion of the substrate (hereinafter, these two are referred to as the two) "Board holding pin 2
a, 2b ") penetrate the processing plate 3 and are fixed to the pin base 4. The pin base 4 is guided by a vertical guide member (not shown), and is vertically moved by a cylinder 5. Here, the central substrate holding pin 2
The tip of b (substrate contact portion) is lower than the tip of the peripheral substrate holding pin 2a (substrate contact portion). Also, substrate 1
The peripheral portions of two opposing sides are held by a transfer arm 6 supported by a transfer robot that transfers the substrate 1 between the substrate processing apparatuses that process the substrate 1. The effective area A is, for example, a range separated from the outer periphery of the substrate 1 by 10 mm or more.

That is, the first embodiment differs from the conventional substrate processing apparatus (FIG. 11) in that the central substrate holding pins 10
2b is lower than the peripheral substrate holding pins 102a.

With reference to FIGS. 2 to 4, a series of operations from the loading of the substrate to the unloading of the first embodiment will be described. First, FIG.
(A) As shown in FIG.
Then, the substrate holding pins 2a and 2b are raised, and the transfer arm 6 carries the substrate 1 above the processing plate 3 from a direction nearer to the plane of FIG. Next, FIG. 2 (b) to FIG. 2 (c)
As shown in FIG. 7, the transfer arm 6 is connected to the peripheral substrate holding pin 2a.
Of the substrate holding pins 2a,
The substrate 1 is placed on 2b. Next, as shown in FIG. 3D, the transfer arm 6 is retracted in a direction closer to the paper surface. Next, as shown in FIG. 3E, the substrate holding pins 2a,
2 b descends until its tip is lower than the upper surface of the processing plate 3. As a result, the substrate 1 is placed on the upper surface of the processing plate 3, and the substrate 1 is subjected to a heating or cooling process. When the processing is completed, the substrate holding pins 2a and 2b rise as shown in FIG. 3 (f) to separate the substrate 1 from the processing plate 3. Next, as shown in FIG. 4 (g), the transfer arm 6 is inserted above the processing plate 3 from a direction in front of the paper surface at a height between the substrate 1 and the processing plate 3. 4 (h) to FIG.
As shown in (i), the transfer arm 6 moves up, separates the substrate 1 from the substrate holding pins 2a, 2b, and moves the substrate 1 toward the near side with respect to the paper surface to carry it out.

According to the first embodiment, FIGS.
During the lowering of the substrate 1 shown in FIG. 2C, the substrate 1 is bent downward in a concave shape.
b is lower than the tip of the peripheral board holding pin 2a, so that the substrate 1 is descending while abutting on the central board holding pin 2b, that is, the board 1 is in a horizontal direction with respect to the central board holding pin 2b. The time of falling while rubbing is shorter than before. Therefore, damage to the central portion of the lower surface of the substrate 1 is reduced.

Here, the height of the tip of the central substrate holding pin 2b is optimized for the deflection of the substrate 1 held by the transfer arm 6, and all the substrate holding pins 2b are moved when the substrate 1 is lowered.
Ideally, the adjustment is performed so that the substrate 1 abuts on a and 2b at the same time. However, since the amount of deflection differs depending on the substrate 1, it is difficult to perform such adjustment. However, if the tip of the central substrate holding pin 2b is made lower than the tip of the peripheral substrate holding pin 2a, at least the damage to the central portion of the lower surface of the substrate 1 will be prevented if the tip of the central substrate holding pin 2b is It is reduced as compared with the case where the height is the same as the tip of the holding pin 2a.

Further, while the substrate is being lifted as shown in FIGS. 4 (g) to 4 (i), the above-described FIGS. 2 (a) to 2 (c)
The lowering operation of the substrate 1 is performed in reverse, but the tip of the central substrate holding pin 2b is lower than the distal end of the peripheral substrate holding pin 2a. Therefore, for the same reason, damage to the center of the lower surface of the substrate 1 is reduced. Is done.

When the substrate 1 shown in FIGS. 3 (d) to 3 (e) is placed on the processing plate 3, the substrate 1 descends at a certain speed. The substrate 1 does not skid on the processing plate 3 because it is placed in a bent state and no air layer is formed between the substrate 1 and the processing plate 3. Therefore, the position where the substrate 1 is placed on the processing plate 3 does not change for each substrate processing, and the processing for each substrate is performed uniformly. Further, when the substrate 1 is lifted and carried out by the transfer arm 6 after the processing of FIGS. 4 (g) to 4 (i) is completed, since the position of the substrate 1 is the same as that at the time of loading, the transfer arm 6 is There is no possibility that the substrate 1 cannot be received. Therefore, the transfer between the substrate 1 and the transfer arm 6 can be reliably performed, and the reliability of the substrate transfer is improved.

Further, the substrate 1 shown in FIGS.
When the substrate 1 is separated from the processing plate 3, the substrate 1 rises at a certain speed, but is separated from the peripheral portion of the substrate 1 to the central portion with respect to the processing plate 3. In the space between, the air flows in from the space outside and gradually becomes atmospheric pressure. Therefore, the substrate 1
No force is exerted on the substrate 1 downward, and the operation of separating the substrate 1 from the processing plate 3 becomes smooth. As a result, the substrate 1 will not be damaged due to side slip, and will not fall off from the substrate holding pins 2a and 2b, so that the reliability of substrate transfer and the yield of the entire apparatus are improved.

This embodiment is particularly effective when the processing plate 3 is the above-mentioned vacuum suction type processing plate particularly in a cool plate type cooling processing apparatus or the like. Since it does not break, the yield of the entire device is improved. When the substrate 1 is separated from the processing plate 3, at least peeling charging is performed, and the substrate 1 is charged. However, in the present embodiment, the charge amount is smaller than that in the related art. For this reason, static electricity flies between the substrate 1 and the surrounding metal parts, and the circuit on the substrate 1 does not short-circuit.
The transfer robot (not shown) that supports and moves the transfer arm 6 does not stop. Therefore, the yield of the entire device is further improved. However, "vacuum" here
The term does not mean absolute vacuum, but means "negative pressure" lower than the surrounding atmospheric pressure.

Here, by changing the processing plate 3 to a substrate holding chuck that holds and rotates the substrate 1, the present invention can be applied to the above-described spin-type processing apparatus. In the type substrate processing apparatus, by removing the processing plate 3 and the cylinder 5 and preventing the substrate holding pins 2a and 2b from moving up and down, the present invention can be applied to the above-described substrate mounting table.

If the tip of the center substrate holding pin 2b is formed of a resin or rubber material, the substrate can be mounted on the substrate holding pins 2a, 2a.
In the case of placing on the substrate b or separating from the substrate holding pins 2a and 2b, damage to the center of the lower surface of the substrate can be further reduced. In particular, when formed of a rubber material, since the surface has a large coefficient of friction, side slip of the substrate can be prevented.

In FIG. 1, the central substrate holding pin 2b is located at one center of the substrate. However, the position may be off the center for reasons such as the structure of the apparatus. Further, in order to reduce the load per one of the central substrate holding pins 2b and to reduce the damage to the central portion of the lower surface of the substrate, the number of the central substrate holding pins 2b may be plural. Further, in FIG. 1, in order to improve the reliability of holding the substrate, two board holding pins having tips at the same height as the tips of the center board holding pins 2b near the midpoint of the two short sides of the board. It may be added.

It should be noted that at least three peripheral board holding pins 2a need to be provided so that they can support the board 1 alone.

Further, if the height of the central substrate holding pin 2b is adjusted by a screw or the like, even if the deflection of the substrate 1 is largely changed due to a change in the thickness of the substrate 1, the central substrate holding pin 2b is not moved. The partial board holding pins 2b can have an appropriate height corresponding to the deflection of the board 1.

Further, it is more preferable to employ a motor drive mechanism capable of speed control using a gear or a ball screw instead of the cylinder 5 for moving the substrate holding pins 2a and 2b up and down. For example, when the substrate 1 is placed on the processing plate 3 and the descent speed of the substrate 1 is reduced only at that moment, the side slip of the substrate 1 can be further reduced. Similarly, when the substrate 1 is separated from the processing plate 3,
If the rising speed of the substrate 1 is reduced only at that moment,
Side slipping, falling off, cracking, etc. can be further reduced.

Finally, the first embodiment can be applied to a PDP glass substrate having the same rectangular shape as the LCD glass substrate.

FIG. 5 is a plan view for explaining the configuration of a substrate processing apparatus (plate type substrate processing apparatus) for a semiconductor substrate according to the first embodiment of the present invention. In FIG. 5, the same reference numerals are used for the same functional parts as in FIG.

The first embodiment can be applied to a circular substrate such as a semiconductor substrate. In this case, the transfer arm 6 holds the peripheral portion of the outer periphery of the substrate 1 and the substrate holding pins 2a, 2
For example, as shown in FIG. 5, b is held at a total of four points including three points at the peripheral part and one point at the center part of the substrate 1. At this time, since the tip of the central substrate holding pin 2b is lower than the tip of the peripheral substrate holding pin 2a, the substrate 1 is held in a mortar-like state where the center is most depressed.

FIG. 6 is a longitudinal sectional view of a substrate processing apparatus (plate type substrate processing apparatus) according to a second embodiment of the present invention, conceptually showing the structure of the substrate processing apparatus. 6, the same reference numerals are used for the same functional parts as in FIG.

In the substrate processing apparatus according to the second embodiment, the center substrate holding pin 2b is connected to the pin base 4 via the metal spring 10, and the center substrate holding pin 2b is connected to the center. It is guided vertically by a cylinder 11 surrounding the lower part of the substrate holding pin 2b and the metal spring 10. Further, the tip of the central substrate holding pin 2b can move up and down in a direction lower than the height of the tip of the peripheral substrate holding pin 2a. The other configuration is the same as that of the first embodiment.

When the substrate 1 is placed on the substrate holding pins 2a and 2b, the central substrate holding pins 2b move downward due to the weight of the substrate 1, and when the substrate 1 is held, the substrate 1 moves downward in the concave shape. It becomes a bent shape.

As described above, according to the second embodiment, in addition to the effects of the first embodiment, the substrate 1
When the substrate 1 is placed on the substrate holding pins 2a and 2b, the substrate 1
Can be absorbed and mitigated at the moment of contact with the tip of the central substrate holding pin 2b. Although the amount of deflection of the substrate 1 changes depending on the size, thickness, material, state, etc. of the substrate 1, it is possible to change the height of the tip of the central substrate holding pin 2b in accordance with the change in the amount of deflection. it can. In particular, when the substrate 1 is placed on the processing plate 3 or separated from the processing plate 3, it can cope with a sudden change in the amount of deflection of the substrate 1, and the operation can be performed reliably and smoothly. Accordingly, damage to the central portion of the lower surface of the substrate 1 can be reduced, and the substrate 1 can be held more reliably regardless of the size, thickness, material, state, and the like of the substrate 1.

The metal spring 10 is a gas spring, a rubber material,
An elastic body such as a soft resin can be used instead.

If the tip of the center substrate holding pin 2b is formed of a resin or rubber material, the substrate can be mounted on the substrate holding pins 2a, 2a.
In the case of mounting on the substrate b or separating from the substrate holding pins 2a and 2b, damage to the center of the lower surface of the substrate can be further reduced. In particular, when formed of a rubber material, since the surface has a large coefficient of friction, side slip of the substrate can be prevented.

FIGS. 7 and 8 are conceptual longitudinal sectional views conceptually showing a configuration of a substrate processing apparatus (plate type substrate processing apparatus) according to a third embodiment of the present invention and a series of operations for processing the substrate 1. It is a flowchart of a substrate processing apparatus. 7 and 8, the same reference numerals are used for the same functional parts as those in FIG.

In the substrate processing apparatus according to the third embodiment, the peripheral substrate holding pins 2a pass through the processing plate 3 in which the heating heater 20 is embedded, and are fixed to the pin base 4, while the central substrate holding pins 2a are fixed. The holding pin 2 b penetrates the processing plate 3, and the first cylinder 2 fixed to the pin base 4.
Connected to 1. That is, the central substrate holding pin 2
b moves up and down with respect to the peripheral board holding pin 2a.

Further, the pin base 4 is moved up and down by the second cylinder 22 and the third cylinder 23. Also, the second
The cylinder 22 is connected to the third cylinder 2 via a bracket 24.
3 is connected. Therefore, if the cylinder rods of both the second cylinder 22 and the third cylinder 23 are extended, the pin base 4 is at the upper limit position, and if both cylinder rods are contracted, the pin base 4 is at the lower limit position. When the cylinder rod of the second cylinder 22 is extended and the cylinder rod of the third cylinder 23 is contracted, the pin base 4 is located at an intermediate position between the upper limit position and the lower limit position.

The other structure is the same as that of the first embodiment.

Here, the purpose of stopping the pin base 4 at the above-described intermediate position will be described. The substrate processing apparatus according to the third embodiment is the above-described hot plate type heat processing apparatus, which aims to heat the substrate 1. However, when the substrate 1 close to room temperature is heated to about 100 degrees, for example. When placed immediately on plate 3 (hot plate),
Since the temperature difference between the upper and lower surfaces of the substrate 1 instantaneously increases, the substrate 1 warps in a concave shape, and only the central portion of the substrate 1 comes into contact with the processing plate 3. Therefore, the temperature distribution of the substrate 1 is not uniform (the temperature at the center of the substrate 1 is the highest,
(The temperature decreases toward the periphery), and the heat treatment on the substrate 1 becomes non-uniform.

In order to solve this problem, the substrate 1 is gently and preliminarily heated with the substrate 1 and the processing plate 3 separated from each other by a predetermined distance (hereinafter, this heat treatment is referred to as "preliminary heat treatment"). ), If the substrate 1 is placed on the processing plate 3 and subjected to heat treatment, the temperature difference between the upper and lower surfaces of the substrate 1 is reduced, and the substrate 1 is suppressed from warping into a concave shape. Therefore, the heat treatment for the substrate 1 becomes uniform.

That is, in order to keep the substrate 1 at a predetermined distance from the processing plate 3 during the preheating process,
It is necessary to stop the pin base 4 on which the substrate holding pins 2a and 2b are mounted at the intermediate position.

A series of operations for processing a substrate in the third embodiment will be described with reference to FIGS.

First, as shown in FIG. 7A, the cylinder rods of the second cylinder 22 and the third cylinder 23 are both extended in advance, and the cylinder rod of the first cylinder 21 is contracted. In this state, the pin base 4 stops at the upper limit position, and the tip of the central board holding pin 2b is lower than the tip of the peripheral board holding pin 2a.
Are mounted on the substrate holding pins 2a and 2b. At this time, the substrate 1 is concavely bent downward.

Next, as shown in FIG. 7 (b), the center substrate holding pin 2b is raised by the first cylinder 21 until its tip becomes the same height as the tip of the peripheral board holding pin 2a. The substrate 1 is substantially parallel to the upper surface of the processing plate 3.

Further, as shown in FIG. 7 (c), the cylinder rod of the third cylinder 23 contracts, the pin base 4 moves to the above-mentioned intermediate position, and the space between the substrate 1 and the upper surface of the processing plate 3 becomes a predetermined value. (Several mm), and the preliminary heat treatment is performed for several seconds to several minutes. At this time, the substrate 1 is held substantially parallel to the upper surface of the processing plate 3.

After the completion of the preheating treatment, as shown in FIG. 8D, the central substrate holding pins 2b are lowered by the first cylinder 21, and the substrate 1 is in a concavely bent state.

Immediately thereafter, as shown in FIG. 8 (e), the cylinder rod of the second cylinder 22 shrinks, the pin base 4 reaches the lower limit position, the substrate 1 descends, is placed on the processing plate 3, and is heated. Processing is performed.

After the completion of the heat treatment, as shown in FIG. 8F, the cylinder rods of the second cylinder 22 and the third cylinder 23 are both extended, and the pin base 4 is at the upper limit position.
The substrate 1 rises and is separated from the processing plate 3.

As described above, according to the third embodiment, in addition to the effects of the first embodiment, FIG.
Since the preliminary heat treatment can be performed in the state shown in (c), the substrate 1 is heated gently, there is no warpage due to heat, and the heat treatment on the processing plate 3 can be performed uniformly. Also, during the preheating process, the substrate 1
The substrate is held at a predetermined interval substantially parallel to the upper surface of the processing plate 3, so that the temperature distribution of the substrate 1 becomes uniform, and the substrate 1 can be preheated uniformly.

FIG. 9 is a longitudinal sectional view of a substrate processing apparatus conceptually showing a configuration of a substrate processing apparatus (plate type substrate processing apparatus) according to a fourth embodiment of the present invention. FIG. 10 is an enlarged view of the tip (substrate contact portion) of the central substrate holding pin 2b in FIG. 9 and 10, the same reference numerals are used for the same functional parts as in FIG.

In the substrate processing apparatus according to the fourth embodiment, the tip of the peripheral substrate holding pin 2a for holding the peripheral portion of the substrate 1 and the tip of the central substrate holding pin 2b for holding the central portion of the substrate 1 A rotatable ball 30 is embedded at the tip of the central substrate holding pin 2b at the same height.

According to the fourth embodiment, while the substrate 1 is lowered and is placed on the substrate holding pins 2a and 2b, even if the substrate 1 is bent downward in a concave shape, the center substrate holding pin A rotatable spherical ball 30 is provided at the tip of 2b.
Is embedded, so that the substrate 1 is
When the ball 30 is rubbed in the horizontal direction, the ball 30 rotates and the rub does not occur. Therefore, damage to the central portion of the lower surface of the substrate 1 is reduced.

Further, while the substrate 1 is being lifted, the operation is reverse to the above-described lowering operation of the substrate 1, but since the rotatable ball 30 is embedded at the tip of the center substrate holding pin 2b, As described above, damage to the center of the lower surface of the substrate 1 is reduced.

Further, as in the first embodiment, if the tip of the center board holding pin 2b is made lower than the tip of the center board holding pin 2a, damage to the center of the lower surface of the board 1 is further reduced.

The ball 30 can be made of metal, resin, rubber or the like. However, when the ball 30 is made of resin or rubber, damage to the center of the lower surface of the substrate 1 is further reduced.

As described above, in the first to fourth embodiments, the peripheral substrate holding pin 2a and the central substrate holding pin 2b correspond to the peripheral holding member and the central holding member, respectively.
Instead of the pin shape as in the above-described embodiment, a ball shape, a cone or a pyramid shape may be used. That is, any shape that can hold the substrate 1 may be used.

Although the cylinder 5, the second cylinder 22, and the third cylinder 23 correspond to the entire driving means, a motor or the like may be used as described in the first embodiment.

Further, the first cylinder 21 corresponds to a partial driving means, but a motor or the like may be used similarly.

The tips of the substrate holding pins 2a and 2b correspond to the substrate contact portion and are configured to contact the substrate 1 at one point, but are configured to contact at a plurality of points or surfaces. May be.

[0090]

As described above, according to the first aspect of the present invention, since the central holding member has a substrate contact portion lower than the peripheral holding member, the substrate can be connected to the central holding member and the central holding member. When placed on the peripheral holding member, or when separated from the central holding member and the peripheral holding member,
Damage to the center of the lower surface of the substrate can be reduced.

According to the second aspect of the present invention, since the center holding member has a rotatable spherical body at the substrate contacting portion, the substrate is placed on the center holding member and the peripheral holding member. In the case where the substrate is placed on the substrate, or when the substrate is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be reduced.

According to the third aspect of the present invention, the peripheral holding member holds the peripheral portions of the two sides held by the transfer arm, and the central holding member is lower than the peripheral holding member. Therefore, even when the rectangular substrate is transferred to the substrate holding mechanism while holding the peripheral portions on two sides facing each other, the substrate is placed on the central holding member and the peripheral holding member. In the case where the substrate is placed on the substrate, or when the substrate is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be reduced.

According to the fourth aspect of the present invention, since the substrate contact portion of the central holding member is formed of resin or rubber, the substrate is placed on the central holding member and the peripheral holding member. When the substrate is placed or when it is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be further reduced. Particularly, in the case of a rubber material, the coefficient of friction of the surface is large, so that the substrate can be prevented from skidding.

According to the fifth aspect of the present invention, the first
Since the central holding member has a substrate contact portion lower than the peripheral holding member, when the substrate is placed on the central holding member and the peripheral holding member, or when the central holding member is And when separated from the peripheral holding member,
Damage to the center of the lower surface of the substrate can be reduced. Second, since the central holding member has a lower substrate contact portion than the peripheral holding member, the substrate is placed in a concave downwardly bent state with respect to the processing surface of the substrate processing table,
An air layer is not formed between the substrate and the substrate processing table unlike the related art, and the substrate does not skid on the substrate processing table. Therefore, the processing for each substrate becomes uniform, and the reliability of the transfer when the transfer arm receives the substrate is improved. Third, since the central holding member has a substrate contact portion lower than the peripheral holding member, when the substrate is separated from the processing plate, it is sequentially separated from the peripheral portion of the substrate to the central portion. Then, the space between the substrate and the substrate processing table gradually becomes an atmospheric pressure state. For this reason, the operation of separating the substrate from the substrate processing table is performed smoothly, so that the substrate is not damaged or dropped due to side slip unlike the related art, and the yield of the entire apparatus can be improved.

According to the sixth aspect of the present invention, the peripheral holding member holds the peripheral portions of the two sides held by the transfer arm, and the central holding member is lower than the peripheral holding member. Therefore, even when the rectangular substrate is delivered to the substrate processing apparatus while holding the peripheral portions of two sides facing each other, the substrate is placed on the central holding member and the peripheral holding member. In the case where the substrate is placed on the substrate, or when the substrate is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be reduced.

According to the seventh aspect of the present invention, a substrate processing apparatus having a suction means for suctioning a substrate to a substrate processing table, such as a vacuum suction type cool plate type cooling processing apparatus, is also used. Since the operation of separating from the substrate processing table is performed smoothly, the substrate does not break, the generation of static electricity is reduced, and the yield of the entire apparatus can be improved.

According to the eighth aspect of the present invention, since the center holding member is supported by the elastic body so as to be able to move up and down, the shock at the moment when the substrate comes into contact with the substrate contact portion of the center holding member. Can be alleviated. Although the amount of deflection of the substrate changes depending on the size, thickness, material, state, and the like of the substrate, the height of the central holding member can be changed in accordance with the change in the amount of deflection. In particular, when the substrate is placed on the substrate processing table or separated from the substrate processing table, it can cope with a sudden change in the amount of deflection of the substrate, and the operation can be performed reliably and smoothly. The overall yield can be improved.

According to the ninth aspect of the present invention, since the substrate contact portion of the central holding member is formed of a resin or rubber material, the substrate is placed on the central holding member and the peripheral holding member. When the substrate is placed or when it is separated from the central holding member and the peripheral holding member, damage to the central portion of the lower surface of the substrate can be further reduced. Particularly, in the case of a rubber material, since the coefficient of friction of the surface is large, side slip of the substrate can be prevented, so that the reliability of transportation and the yield of the entire apparatus can be improved.

According to the tenth aspect of the present invention, there is provided a hot plate type heat treatment apparatus for placing a substrate on the upper surface of a planar substrate processing table provided with a heat source and performing heat treatment on the substrate. Since the preliminary heating process for gently heating the substrate can be performed in a state where the distance between the substrate and the upper surface of the substrate processing table is a predetermined distance, the heat generated when the substrate is placed on the substrate processing table can be obtained. The warpage of the substrate can be suppressed, and the uniformity of the heat treatment of the substrate can be improved. Further, since the substrate and the upper surface of the substrate processing table at the time of the preheating process are kept substantially parallel, the uniformity of the preheating process can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a substrate processing apparatus for processing an LCD glass substrate according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing an operation of the substrate processing apparatus for processing an LCD glass substrate according to the first embodiment of the present invention.

FIG. 3 is a flowchart showing an operation of the substrate processing apparatus for processing an LCD glass substrate according to the first embodiment of the present invention.

FIG. 4 is a flowchart showing an operation of the substrate processing apparatus for processing an LCD glass substrate according to the first embodiment of the present invention.

FIG. 5 is a plan view of a substrate processing apparatus for processing a semiconductor substrate according to the first embodiment of the present invention.

FIG. 6 is a longitudinal sectional view of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 7 is a flowchart showing an operation of the substrate processing apparatus according to the third embodiment of the present invention.

FIG. 8 is a flowchart illustrating an operation of the substrate processing apparatus according to the third embodiment of the present invention.

FIG. 9 is a longitudinal sectional view of a substrate processing apparatus according to a fourth embodiment of the present invention.

FIG. 10 shows a central substrate holding pin 2 according to a fourth embodiment.
It is an enlarged view of the tip part of b.

FIG. 11 is a perspective view of a conventional substrate processing apparatus.

FIG. 12 is a flowchart showing the operation of a conventional substrate processing apparatus.

FIG. 13 is a flowchart showing the operation of the conventional substrate processing apparatus.

FIG. 14 is a flowchart showing the operation of a conventional substrate processing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 101 Board 2a, 102a Peripheral board holding pin 2b, 102b Central board holding pin 3, 103 Processing plate 4, 104 Pin base 5, 105 cylinder 6, 106 Transfer arm 20 Heating heater 21 First cylinder 22 Second cylinder 23 3rd cylinder 30 balls

Claims (10)

[Claims] 1. A substrate holding mechanism for holding a substrate in order to transfer the substrate to a transfer arm for holding and transferring the substrate while holding the peripheral portion of the substrate, wherein at least three peripheral portions for holding the peripheral portion of the substrate A holding member, and at least one center holding member for holding a center portion of the substrate, wherein the peripheral portion holding member sets a height position of a substrate contact portion where the center holding member contacts the substrate. A substrate holding mechanism, wherein the height is lower than a height position of a substrate contact portion that contacts the substrate. 2. A substrate holding mechanism for holding a substrate in order to transfer the substrate to a transfer arm for holding the peripheral portion of the substrate and transferring the substrate, wherein at least three peripheral portions for holding the peripheral portion of the substrate A holding member, and at least one center holding member for holding a center portion of the substrate, wherein the center holding member is provided with a rotatable spherical body at a substrate contact portion in contact with the substrate. Characteristic substrate holding mechanism. 3. The substrate holding mechanism according to claim 1, wherein the substrate has a rectangular shape, and the transfer arm holds peripheral portions of two sides of the rectangular substrate facing each other. The peripheral holding member holds the peripheral portions of the two sides. 4. The substrate holding mechanism according to claim 1, wherein the substrate contact portion of the center holding member is formed of a resin or a rubber material. 5. A substrate processing table having a flat processing surface for processing a substrate mounted thereon, at least three peripheral holding members for holding a peripheral portion of the substrate, and a central portion of the substrate. At least one central holding member, and the peripheral holding member and the central holding member are moved between an upper position and a lower position in order to place or separate the substrate from the substrate processing table. An overall driving means for moving the substrate up and down, wherein a height position of the substrate contact portion where the center holding member contacts the substrate is higher than a height position of the substrate contact portion where the peripheral portion holding member contacts the substrate. A substrate processing apparatus characterized by being lowered. 6. The substrate processing apparatus according to claim 5, wherein the substrate has a rectangular shape, and the peripheral holding member holds peripheral portions of two sides of the rectangular substrate facing each other. Processing equipment. 7. The substrate processing apparatus according to claim 5, wherein the substrate processing table includes an adsorption unit that adsorbs the substrate to the processing surface. 8. The substrate processing apparatus according to claim 5, wherein the center holding member is vertically movably supported by an elastic body. 9. The substrate processing apparatus according to claim 5, wherein the substrate contact portion of the center holding member is formed of a resin or a rubber material. 10. The substrate processing apparatus according to claim 5, wherein a heat source disposed on the substrate processing table and heating the substrate, and one of the peripheral holding member and the central holding member. Partial driving means for vertically moving one with respect to the other, wherein the overall driving means is configured to move the upper position and the lower position so that the distance between the substrate and the upper surface of the substrate processing table is a predetermined distance. A substrate processing apparatus for stopping the peripheral holding member and the central holding member at an intermediate position therebetween.