JPH1069465A - Connection structure and connection method for data processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform connection while avoiding the crossing of connection cables without increasing the layer number of a substrate to which data processors are mounted and without enlarging an area in connecting the data processors of a plurality of columns with each other. SOLUTION: For a data processor group comprising the two columns of a first column whose elements are the (n) pieces of the data processors A1-An and a second column (B colunm in the figure) whose elements are the (m) pieces of the data processors B1-Bm, this structure connects the respective data processors A1-An of the first column to the data processors B1-Bm of the second column by using (n×m) connection means C (A1B1-AnBm) respectively provided with the connection of one or more lines. The data processors A1-An of the first column and the data processors B1-Bm of the second column are arranged on planes different from each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a connection structure and a connection method for a data processing device.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional connection structure of a data processing device. In this connection structure, a row A having elements of the first group of data processing devices A1 to An (n = 4) and a row B having elements of data processing devices B1 to B4 (m = 4) are arranged on a multilayer printed circuit board. Side by side, C (A1, B1) to C (An,
Bm) by means of n × m (n = m = 4) connection means using the multilayer wiring area of the multilayer printed circuit board.

[0003]

However, in such a conventional connection structure or method, when the number of data processing devices constituting the rows A and B is large,
Since each connection has an intersecting relationship, there is a problem that the connection becomes difficult unless the number of layers of the printed circuit board is increased according to the number of elements. Further, there are many technical problems in increasing the number of layers of the printed circuit board, and therefore, it has been difficult to increase the number of elements constituting the row A and the row B. Further, it is conceivable to increase the area of the printed circuit board in order to suppress the number of layers of the printed circuit board. However, in this case, there is a disadvantage that the connection length is increased because the distance between the elements is increased.

The present invention has been made in view of the above circumstances, and does not increase the number of printed circuit board layers or increases the area of the printed circuit board even when the number of elements in row A and row B is large. To realize connection between a number of elements without increasing the connection length.

[0005]

In order to achieve the above object, a connection structure according to the first aspect of the present invention comprises, as shown in FIG. 1, a first column having n data processing devices A1 to An as elements. A
Row) and a second row (column B in the figure) of m data processing apparatuses B1 to Bm as elements. (N = m =
Using the connection means C (A1B1 to AnBm) of 4), the first
A structure in which each of the column data processing devices A1 to An is connected to the second column data processing devices B1 to Bm;
The data processing devices A1 to An in the column and the data processing devices B1 to Bm in the second column are arranged on different planes. Here, the plane 1 including the data processing device in column A
And the plane 2 including the data processing devices in column B are arranged perpendicular to each other as shown in the figure, and each connecting means C (A1
B1 to AnBm) are arranged without intersecting each other.
The connection method according to claim 2 is characterized in that n data processing devices A1 to An
And m data processing devices B1 to Bm
A data processing device group consisting of two columns, a second column and an n × m connection means C (A1B1 to AnBm) each having one or more connections, is connected to the data processing device group in the first column. A1 to An are respectively used as the data processing devices B1 in the second column.
To the data processing devices A1 to An in the first column and the data processing devices B1 to Bm in the second column.
Are arranged on different planes from each other.
According to a third aspect of the present invention, in the connection structure according to the first aspect, the data processing apparatus includes a board on which the first row of data processing apparatuses A1 to An is mounted, and a second row of data processing apparatuses B1 to Bm. Is included in planes different from each other. In a connection method according to a fourth aspect, in the second aspect, the data processing device includes a substrate on which the first row of data processing devices A1 to An is mounted and a second row of the data processing devices B1 to Bm. The substrate and the substrate are arranged on different planes. According to a fifth aspect of the present invention, in the third aspect, the data processing devices A1 to An in the first column are provided.
Is mounted in a first space having a hexahedral shape as a whole, being superposed in a direction intersecting with the substrate,
Substrates on which the data processing devices B1 to Bm in the second row are mounted are superposed in a direction intersecting with the substrates and arranged in a second space having a hexahedral shape as a whole. The hexahedron formed by the space is characterized in that any one of the surfaces faces each other.

[0006]

FIG. 2 shows a first embodiment in which the three-dimensional connection structure or method of a data processing apparatus according to the present invention is applied to a large-scale data processing apparatus composed of a plurality of data processing apparatuses. It is shown. In this embodiment, each of the data processing devices A1 to An (n = 4 in the figure) has a field array which is a gate array whose circuit function can be changed at the gate level after the device is assembled.
Programmable gate arrays are mounted on double-sided printed boards PA1 to PAn, respectively, and connected by means such as soldering. Each data processing device B1
Bm (m = 4 in the figure) are field programmable interconnect devices which are switches capable of changing the connection function after assembling the device, and are mounted on the double-sided printed circuit boards PB1 to PBm, respectively. And are connected by means such as soldering.
Each of the data processing devices A1 to An and B1 to Bm is connected to a wiring cable C (A1, B1) to C (A
n, Bm).

In the example shown in FIG. 2, the data processing devices A1 to An are arranged in the horizontal direction, and the data processing devices B1 to Bm are arranged in the vertical direction. That is, the data processing devices A1 to An in column A and the data processing devices B1 to B in column B
Bm are arranged in directions different from each other.

With this arrangement, the data processing units A1 to An in row A and the data processing units B1 in row B can be used without increasing the area or the number of layers of the printed circuit board.
To Bm as a connection means.
1) Connection can be made at the shortest distance by using C (An, Bm).

FIG. 3 shows a second embodiment. In this embodiment, each of the data processing devices A1 to An and B1
Bm are double-sided printed circuit boards PA1 to PAn and PB1
PBm is mounted in plurals. The double-sided printed boards PB1 to PBm in the B row are arranged so as to overlap in a direction orthogonal to the plane, and the space including these double-sided printed boards PB1 to PBm has a hexahedral shape as shown. Similarly, the double-sided printed circuit boards PA1 to PAn in the row A are arranged so as to overlap in a direction orthogonal to the plane, and these double-sided printed circuit boards PA1 to PA4, PA5 to PA8, PA9 to PA12, PA1
The spaces including 3 to PA16 each have a hexahedral shape as illustrated.

Further, the double-sided printed circuit boards PA1 to PAn
Are formed on the surfaces (four side surfaces in the illustrated case) of the hexahedron formed by the space including the double-sided printed circuit boards B1 to Bm in the row B, which are not parallel to the double-sided printed circuit boards B1 to Bm. Row of double-sided printed circuit boards PA1 to PA
4, hexahedral spaces including PA5 to PA8, PA9 to PA12, and PA13 to PA16 are arranged respectively.

In such an arrangement, the data processing devices A1 to An in column A and the data processing devices B1 to Bm in column B are arranged in different directions from each other. The effect of can be obtained. If necessary, the double-sided printed circuit boards A1 to An in row A may be arranged only on a part of the four side surfaces of the hexahedron formed by the space including the double-sided printed boards B1 to Bm in row B. It is.

The number and arrangement direction of the data processing devices in each column are not limited to the embodiment. Further, each of the printed circuit boards PA1 to PAn and PB
Needless to say, the number of data processing devices mounted on each of 1 to PBm can be arbitrarily set.

[0013]

As is apparent from the above description, the present invention provides:
A data processing device group consisting of two columns, a first column having n data processing devices as elements and a second column having m data processing devices as elements, is provided by an nx having at least one connection.
A structure or a method of connecting through m connection means C. Since the data processing devices in the first row and the data processing apparatus in the second row are included in different planes, it is possible to increase the number of layers of the printed circuit board. Alternatively, it is possible to connect the printed circuit board on which the data processing device is mounted with the shortest distance via the connecting means without increasing the area. Further, the data processing device A in the first column
Substrates mounting 1 to An are stacked in a direction intersecting the substrate and arranged in a first space which is a hexahedral shape as a whole, and the substrates mounting the data processing devices B1 to Bm in the second row are referred to as the substrates. The second that forms a hexahedral shape as a whole by overlapping in the intersecting direction
The hexahedron formed by the first and second spaces is arranged such that any one of the surfaces faces each other, so that a large number of data processing devices are densely arranged in a limited space. In addition, there is an effect that the mutual connection is not crossed.

[Brief description of the drawings]

FIG. 1 is a layout diagram of the invention according to claim 1;

FIG. 2 is a layout diagram of the first embodiment.

FIG. 3 is a layout diagram of a second embodiment.

FIG. 4 is a layout diagram of a conventional example.

[Explanation of symbols]

A1 to An, B1 to Bm Data processing device PA1 to PAnP, PB1 to PBm Printed circuit board C (A1, B1) to C (An, Bm) Wiring cable (connection means)

Claims (5)

[Claims] 1. A data processing device group comprising two columns, a first column having n data processing devices A1 to An as elements and a second column having m data processing devices B1 to Bm as elements. , N × m connection means C (A1
B1 to AnBm), and the data processing device A1 of the first row is used.
To An are connected to the data processing devices B1 to Bm in the second column, and the data processing devices A in the first column are connected to each other.
A connection structure for data processing devices, wherein 1 to An and the data processing devices B1 to Bm in the second row are arranged on different planes. 2. A data processing device group consisting of two columns, a first column having n data processing devices A1 to An as elements and a second column having m data processing devices B1 to Bm as elements. , N × m connection means C (A1
B1 to AnBm), and the data processing device A1 of the first row is used.
To An to each of the data processing devices B1 to Bm in the second column, wherein the data processing devices A in the first column are connected to each other.
A method of connecting data processing devices, wherein 1 to An and the data processing devices B1 to Bm in the second row are arranged on different planes. 3. The data processing device is mounted on a substrate, and a substrate on which the first row of data processing devices A1 to An is mounted and a substrate on which the second row of data processing devices B1 to Bm are mounted. The connection structure of the data processing device according to claim 1, wherein the data processing devices are arranged on different planes. 4. The data processing device is mounted on a substrate,
The substrate on which the first row of data processing devices A1 to An is mounted and the substrate on which the second row of data processing devices B1 to Bm are mounted are arranged on different planes. 3. The method for connecting a data processing device according to item 2. 5. The substrate on which the data processing devices A1 to An in the first row are mounted is superimposed in a direction intersecting the substrate.
Substrates which are arranged in a first space having a hexahedral shape as a whole and on which the data processing devices B1 to Bm in the second row are mounted are stacked in a direction intersecting with the substrate to form a second hexahedral shape. And the first and second
The connection structure for a data processing device according to claim 3, wherein the hexahedrons defined by the spaces (1) and (2) are arranged with one of the surfaces facing each other.