JPH10779A - Method of manufacturing inkjet head - Google Patents

Abstract

(57) [Problem] To connect a wiring pattern printed on the surface of a plate-like wiring material and a piezoelectric element on a line head substrate at a connection portion of an ink jet head in which a large number of contacts are arranged at high density.
Provided is a method for manufacturing an ink jet head by reliably connecting without applying high pressure or heat. SOLUTION: A jig provided with a magnet is brought into close contact with a surface of the plate-shaped wiring member and / or the line head substrate opposite to a surface on which the electrode or the piezoelectric element is formed, and the attraction force of the magnet is used. The plate-shaped wiring member and the line head substrate in a state in which a conductive magnetic material is adsorbed on the electrode or the piezoelectric element and the conductive magnetic material is sandwiched between the electrode and the piezoelectric element to conduct electricity. Inject the adhesive into the gap between and fix it. As a result, the connection of the ink jet head having a large number of contacts arranged at high density can be achieved without applying high pressure or heat, and thus without reducing the life of the piezoelectric element and without suppressing the vibration of the piezoelectric element.
It is possible to provide a method of manufacturing an ink jet head that can be reliably performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a head for an ink jet recording apparatus, and more particularly, to a method for connecting a wiring pattern printed on the surface of a plate-like wiring material to a piezoelectric element on a line head substrate. The present invention relates to a method for manufacturing an ink jet head.

[0002]

2. Description of the Related Art In a conventional method of manufacturing a head for an ink jet recording apparatus, a method of connecting an electrode conducting to a wiring pattern printed on the surface of a plate-like wiring member and a piezoelectric element on a line head substrate includes the following. For example, there is one shown in FIG. In this method, a piezoelectric element 33 provided on a line head substrate 34 and an electrode 3 provided on a
2 and the piezoelectric element 33 and the electrode 32 by continuously applying pressure.
Are electrically connected. The anisotropic conductive sheet 35 has a property that the portion has conductivity while pressure is applied, and this example utilizes this property. FIG. 5 shows one of the methods proposed in Japanese Patent Application Laid-Open No. 4-345858. In this method, an anisotropic conductive film 36 is used instead of the anisotropic conductive sheet 35 used in the above example, and the piezoelectric element 33 and the electrode 32 are electrically connected by applying pressure and heat for a certain time. , Are physically connected. The anisotropic conductive film 3
No. 6 has a property of being cured while having conductivity by applying pressure and heat for a certain period of time, and this example utilizes this property. FIG. 6 shows one of the methods proposed in Japanese Patent Application Laid-Open No. 7-32590. In this method, the elastic projection 37a of the dimple-processed plate-like wiring member 37 is brought into contact with the piezoelectric element 33 disposed on the line head substrate 34, and the elastic projection 37a is pressed from the back side of the elastic projection 37a. The piezoelectric element 33 and the plate-like wiring member 37 are electrically connected by pressing a rubber pad 38 having a projection 38a slightly larger than the diameter of the projection 37a.

[0003]

However, the above-mentioned prior art has the following problems. In the first example (shown in FIG. 4), it is necessary to always apply a relatively high pressure such that the anisotropic conductive sheet 35 exhibits conductivity. Therefore, there have been problems such as destruction of the piezoelectric element due to high pressure, deformation of the ink flow path, and suppression of vibration of the piezoelectric element.
In the example of Japanese Patent Application Laid-Open No. 4-345858 (shown in FIG. 5), when a high pressure is applied temporarily, problems such as breakage of the piezoelectric element and deformation of the ink flow path are caused as in the above example. At the same time, the above problem could be further expanded by applying heat. In the example of Japanese Patent Application Laid-Open No. 7-32590 (shown in FIG. 6), the elastic projections 3 formed by dimple processing are formed on the plate-like wiring member 37.
7a is required. However, the elastic projections 37a are inevitably large in size for the sake of processing, and are not suitable for a connection portion of an inkjet head in which a large number of contacts are arranged at high density. Accordingly, an object of the present invention is to provide a wiring pattern printed on the surface of a plate-like wiring material connected by the above-mentioned contacts, a piezoelectric element on a line head substrate, Is connected securely without applying high pressure or heat,
It is to provide a method for manufacturing an ink jet head.

[0004]

In order to achieve the above object, a first aspect of the present invention is to provide an electrode which conducts with a wiring pattern printed on the surface of a plate-like wiring member, and an electrode arranged along the plate-like wiring member. And a method for manufacturing an ink jet head by connecting to a piezoelectric element on a line head substrate used in an ink jet recording apparatus.
Alternatively, a jig disposing step in which a jig having a magnet disposed at a position corresponding to the piezoelectric element is closely arranged along a surface of the line head substrate opposite to a surface on which the electrodes and / or the piezoelectric element are formed. And a magnetic substance adsorption step of adsorbing a conductive magnetic substance on the electrode or the piezoelectric element of the plate-shaped wiring member or the line head substrate to which the jig is adhered, and the plate-shaped wiring member and the line head substrate. In a state where the electrodes on the plate-shaped wiring member and the piezoelectric element on the line head substrate are electrically connected via the magnetic material. A step of injecting an adhesive into a gap between the substrate and an adhesive to integrally fix the plate-shaped wiring member, the line head substrate, and the magnetic material. It is configured as a method of manufacturing.

[0005] A second aspect of the present invention is the above-described first aspect, wherein the configuration of the magnet and that of the magnetic body are interchanged.
An ink-jet head that connects an electrode that conducts with a wiring pattern printed on the surface of the plate-shaped wiring member and a piezoelectric element that is disposed along the plate-shaped wiring member and that is used on an ink-jet recording apparatus on a line head substrate; A method for manufacturing a magnetic head at a position corresponding to the piezoelectric element along a surface of the plate-shaped wiring member and / or the line head substrate opposite to a surface on which the electrode and / or the piezoelectric element is formed. A jig disposing step of disposing the jig on which the body is disposed in close contact, and a conductive magnetic material magnetized on the electrode or the piezoelectric element of the plate-shaped wiring member or the line head substrate to which the jig is adhered. A step of adsorbing a magnetic substance, and bringing the plate-shaped wiring member and the line head substrate close to each other while facing each other, and forming an electrode on the plate-shaped wiring member and the line head substrate. A conducting step of conducting the piezoelectric element through the conductive magnetic material, and injecting an adhesive into a gap between the plate-shaped wiring member and the line head substrate to form the plate-shaped wiring member and the line head substrate. And a step of injecting an adhesive for integrally fixing the conductive magnetic material. As the plate-shaped wiring member, an existing wiring member such as a so-called wiring board made of a plate-shaped hard board or a so-called FPC which is a flexible sheet material can be used. The conductive magnetic body can be formed in a pin shape so that a connection surface between the electrode and the piezoelectric element can be widened. The adhesion under a low pressure can be improved, and the spherical shape can make the magnetic substance adsorption step easier. Further, as a material having both the advantages of the above-described coil spring shape and the spherical shape, a magnetic material including a magnetic material or a magnet at the center of a rubber ball and having a conductive plating on the surface may be used.

[0006]

Embodiments of the present invention will be described below with reference to the drawings to provide an understanding of the present invention. It should be noted that the present embodiment and the examples that follow are specific examples of the embodiment of the present invention, and do not limit the technical scope of the present invention. FIG. 1 is a diagram showing a method of connecting an ink jet head according to an embodiment of the present invention, FIG. 2 is a diagram showing a method of connecting an ink jet head according to an example of the present invention, and FIG. 3 is an example of the present invention. FIG. 3 is a cross-sectional view illustrating an example of a conductive magnetic body according to the present invention. A method for connecting an inkjet head according to the present embodiment will be described with reference to FIG. As shown in FIG. 1A, an electrode 2 is provided on a wiring board 1 at a position corresponding to a piezoelectric element to be described later. Is adhered to the surface of the wiring board 1 opposite to the electrodes 2 so that the positions of the electrodes 2 and the magnets 6 are aligned (jig disposing step). Next, FIG.
As shown in (b), the conductive pin-shaped magnetic material 7 is attracted onto the electrode 2 by the magnetic force of the magnet 6 (magnetic material attracting step). Subsequently, as shown in FIG. 1 (c), the line head substrate 3 on which the piezoelectric element 4 is disposed and the wiring substrate 1 are opposed to each other while the wiring substrate 1 is opposed to each other. The end opposite to the electrode 2 is connected to the piezoelectric element 4.
In close contact. As a result, the electrode 2 and the piezoelectric element 4 are electrically connected via the pin-shaped magnetic body 7 (conductive step). Finally, as shown in FIG. 1 (d), an adhesive 8 is injected into the gap between the wiring board 1 and the line head board 3, and the wiring board 1, the line head board 3, and the pin-shaped The magnetic body 7 is integrally fixed (adhesive injection step). The jig 5 may be removed any time after the completion of the conduction step. According to this method, the wiring pattern on the surface of the wiring board 1 and the piezoelectric element 4 are electrically connected via the electrode 2 and the pin-shaped magnetic body 7, and the connection state is further changed by the adhesive 8. , The connection state is maintained permanently. As described above, in this embodiment, the conductive pin-shaped magnetic bodies 7 used for the conduction between the electrodes 2 and the piezoelectric elements 4 are arranged on the respective electrodes 2 by using the attraction force of the magnets 6 so as to stand accurately. Therefore, it is possible to easily connect an inkjet head in which many contacts are arranged at high density. Further, since the piezoelectric element is fixed by the adhesive 8, high pressure or heat is not used, and the problem of extending the life of the piezoelectric element and suppressing vibration does not occur.

[0007]

FIG. 2 shows a method of connecting an ink jet head according to this embodiment. In the above embodiment, the jig disposing step and the magnetic substance adsorbing step are performed on the wiring board 1 side on which the electrodes 2 are disposed. However, in the present embodiment, the jig disposing step and the magnetic substance adsorbing step are performed. Is performed on the side of the line head substrate 3 on which the piezoelectric element 4 is disposed. The jig 5 provided with the magnet 6 is arranged along the line head substrate 3 and the pin-shaped magnetic body 7 is disposed on the side of the piezoelectric element 4. (Fig. 2 (a)
And (b)). Conducting step and adhesive injection step (FIG. 2)
(C) and (d)) are the same as in the above embodiment,
The effect obtained by the present embodiment is the same as that of the above embodiment. Further, the jig 5 having the magnets 6 is arranged along both the wiring board 1 side and the line head board 3 side, and by utilizing the attraction force of the magnets 6 during the conducting step, the conductive property is improved. The pin-shaped magnetic body 7 can be more easily and reliably adhered to the electrode 2 and the piezoelectric element 4. In this case, in order to attract the conductive pin-shaped magnetic body 7 to both the electrode 2 and the piezoelectric element 4, magnets provided on the jig on the wiring board 1 side and the jig on the line head board 3 side Must be arranged so that the opposite pole sides face each other. Further, the conductive pin-shaped magnetic body 7 may be formed in a coil spring shape. Thus, the contact state of the conductive magnetic body (coil spring) with the electrode 2 and the piezoelectric element 4 in the conduction step can be further ensured. In this case, in the conduction step, pressure is applied to the electrode 2 and the piezoelectric element 4 by compressing the coil spring, but a high pressure is applied as in the first and second examples of the prior art. Does not require. Further, the conductive pin-shaped magnetic body 7 is
It can also be spherical. Thereby, the operation of adsorbing the magnetic substances one by one on the electrode 2 or the piezoelectric element 4 in the magnetic substance adsorption step can be performed more easily. Further, the conductive pin-shaped magnetic body 7 may be a magnetic sphere in which a conductive plating 13 is applied to the surface of a rubber ball 12 including a steel ball 11 at the center as shown in FIG. This is because the spherical magnetic material also has an elastic deformation function, and the conduction between the electrode 2 and the piezoelectric element 4 is further ensured, and the magnetic material adsorption step can be performed more easily. Further, a sheet-like wiring material such as an FPC can be used instead of the wiring substrate 1.

[0008]

As described above, according to the method proposed in the present invention, the wiring pattern printed on the surface of the plate-shaped wiring member and the line head can be used even at the connection portion of the ink jet head in which many contacts are arranged at high density. A method for manufacturing an ink jet head that can be reliably connected to a piezoelectric element on a substrate without applying high pressure or heat, and thus without reducing the life of the piezoelectric element and without suppressing vibration of the piezoelectric element. Can be provided.

[Brief description of the drawings]

FIG. 1 is a diagram showing a method for connecting an inkjet head according to an embodiment of the present invention.

FIG. 2 is a diagram showing a method of connecting an inkjet head according to an embodiment of the present invention.

FIG. 3 is a sectional view showing an example of a conductive magnetic body according to the embodiment of the present invention.

FIG. 4 is a diagram showing a connection example of a conventional inkjet head.

FIG. 5 is a diagram showing a connection example of a conventional inkjet head.

FIG. 6 is a diagram showing a connection example of a conventional inkjet head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... Electrode 3 ... Line head board 4 ... Piezoelectric element 5 ... Jig 6 ... Magnet 7 ... Conductive pin-shaped magnetic body 8 ... Adhesive 11 ... Steel ball 12 ... Rubber material 13 ... Conductive plating part 31 ... Plate-like wiring member 32 ... Electrode 33 ... Piezoelectric element 34 ... Line head substrate 35 ... Anisotropic conductive sheet 36 ... Anisotropic conductive film 37 ... Plate-like wiring member 38 ... Rubber pad

Claims (14)

[Claims] An electrode, which is electrically connected to a wiring pattern printed on a surface of a plate-shaped wiring member, and a piezoelectric element disposed along the plate-shaped wiring member and used on a line head substrate used in an ink jet recording apparatus. In the method for manufacturing an ink jet head by connecting, the plate-shaped wiring member and / or
Alternatively, a jig disposing step in which a jig having a magnet disposed at a position corresponding to the piezoelectric element is closely arranged along a surface of the line head substrate opposite to a surface on which the electrodes and / or the piezoelectric element are formed. And a magnetic substance adsorption step of adsorbing a conductive magnetic substance on the electrode or the piezoelectric element of the plate-shaped wiring member or the line head substrate to which the jig is adhered, and the plate-shaped wiring member and the line head substrate. In a state where the electrodes on the plate-shaped wiring member and the piezoelectric element on the line head substrate are electrically connected via the magnetic material. A step of injecting an adhesive into a gap between the substrate and an adhesive to integrally fix the plate-shaped wiring member, the line head substrate, and the magnetic material. The method of production. 2. The method according to claim 1, wherein the plate-shaped wiring member is a wiring substrate. 3. The method according to claim 1, wherein the plate-shaped wiring member is a sheet-shaped wiring member. 4. The magnetic body according to claim 1, wherein said magnetic body has a pin shape.
4. The method for manufacturing an ink jet head according to any one of claims 1 to 3. 5. The method for manufacturing an ink jet head according to claim 1, wherein said magnetic body is constituted by a coil spring. 6. The magnetic material according to claim 1, wherein the magnetic material has a spherical shape.
The method for manufacturing an inkjet head according to any one of the above. 7. A method for manufacturing an ink jet head, wherein the magnetic material is constituted by magnetic balls having conductive balls plated on the surfaces of rubber balls including steel balls at the center. 8. An electrode which conducts with a wiring pattern printed on the surface of a plate-shaped wiring member, and a piezoelectric element disposed along the plate-shaped wiring member and on a line head substrate used in an ink jet recording apparatus. In the method for manufacturing an ink jet head by connecting, the plate-shaped wiring member and / or
Alternatively, a jig provided in which a jig having a magnetic body disposed at a position corresponding to the piezoelectric element along the surface of the line head substrate opposite to the surface on which the electrode and / or the piezoelectric element is formed is closely arranged. A magnetic material adsorbing step of adsorbing a magnetized conductive magnetic material on the electrode or the piezoelectric element of a plate-shaped wiring member or a line head substrate to which the jig is adhered, and the plate-shaped wiring member A step of bringing the electrode on the plate-shaped wiring member and the piezoelectric element on the line head substrate into conduction via the conductive magnetic material; An adhesive injecting an adhesive into a gap between the plate-shaped wiring member and the line head substrate to integrally fix the plate-shaped wiring member, the line head substrate, and the conductive magnetic material. Features that become Method of manufacturing an ink jet head. 9. The method according to claim 8, wherein the plate-shaped wiring member is a wiring board. 10. The method according to claim 8, wherein the plate-shaped wiring member is a sheet-shaped wiring member. 11. The method according to claim 8, wherein the conductive magnetic material has a pin shape. 12. The method for manufacturing an ink jet head according to claim 8, wherein said conductive magnetic material is constituted by a coil spring. 13. The method for manufacturing an ink jet head according to claim 8, wherein the conductive magnetic material has a spherical shape. 14. A method for manufacturing an ink jet head, wherein said conductive magnetic material is constituted by magnetic spheres formed by applying conductive plating to the surface of a rubber sphere containing a spherical magnet at the center.