JPH1084206A - Support structure for dielectric resonator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the thermal distortion that is caused by the difference of coefficients of thermal expansion between a casing and every support stand and to prevent the breakage, crack, etc., of the support stand by setting the coefficient of thermal expansion of the support stands at the value larger than that of a dielectric resonator and smaller than that of the casing. SOLUTION: A dielectric resonator 1 is mechanically connected to a casing 5 via a support stands 2 and 3. If the coefficient of the resonator 1 is smaller than that of the easing 5, the coefficient of thermal expansion of the casing 5 is larger than that of the stand 3 and the coefficient of thermal expansion of the stand 3 is larger than that of the stand 2 respectively. The stand 2 connected to the resonator 1 uses an alumina material (coefficient of thermal expansion: 7×10<-6> ), and the stand 3 uses a crystal material (coefficient of thermal expansion: 12.2×10<-6> ). Another support stand 4, if needed, uses a brass material (coefficient of thermal expansion: 17.5×10<-6> ). Since the difference of coefficients of thermal expansion is reduced among the parts which connects together the resonator 1, the stands 2 to 4 and the easing 5 respectively, the breakage, crack, etc., can be reduced at each connection points of these parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a support structure for a dielectric resonator, and more particularly to a support structure for a dielectric resonator that is not easily affected by heat.

[0002]

2. Description of the Related Art Conventionally, in a dielectric resonator supporting structure of this type, a dielectric resonator and a housing are connected via a support to obtain resonance characteristics of the dielectric resonator. For example, Japanese Patent Application Laid-Open No. 4-284706 discloses a dielectric resonator connected to a housing by a support using a material having a low dielectric constant (for example, quartz glass).

Further, Japanese Utility Model Laid-Open No. 5-4607 discloses a structure in which a dielectric resonator and a housing are connected by using a support made of porous alumina.

[0004]

In the prior art described above, the support base is damaged by heat. The reason for this is that since a metal housing is used, thermal strain is applied to the support due to the difference between the coefficient of thermal expansion of the metal and the coefficient of thermal expansion of the support.

For example, the support (quartz glass) disclosed in Japanese Patent Laid-Open No. 4-284706 has a coefficient of thermal expansion of 8 × 10 −6, the dielectric resonator has a coefficient of thermal expansion of 4 × 10 −6, and the housing is made of aluminum. Then, the thermal expansion coefficient becomes 23 × 10 −6. Since the difference in thermal expansion coefficient between the dielectric resonator and the support is small, the strain generated between them is small.However, the difference in thermal expansion coefficient between the support and the housing is large, and the strain generated between them is large. Occurs, leading to damage. FIG. 5 is a cross-sectional view showing a conventional dielectric resonator support structure. Dielectric resonator 1 and housing 5
Are connected via the support 2. FIG. 6 is a graph showing the difference in thermal expansion between each connection depending on the temperature in the support structure of FIG. It can be seen that the difference in thermal expansion between the dielectric resonator 1 and the support 2 is small, but the difference in thermal expansion between the support 2 and the housing 5 is large.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned disadvantages, reduce the thermal strain caused by the difference in the thermal expansion coefficient between the housing and the support, and eliminate the damage and cracks of the support and improve the reliability. An object of the present invention is to provide a dielectric resonator.

[0007]

In order to solve the above-mentioned problems, a supporting structure for a dielectric resonator according to the present invention comprises a support for supporting the dielectric resonator 1 made of a material having two or more different thermal expansion coefficients. And a dielectric resonator 1, a support 2,
3. The relationship between the coefficients of thermal expansion of the housing 5 is set such that dielectric resonator 1 <support 2 <support 3 <casing 4.

In such a configuration, since the difference in the coefficient of thermal expansion between the components connecting each of the dielectric resonator, the plurality of support bases, and the housing is made small, it occurs at each connection point. Thermal strain is reduced. Therefore, breakage, cracks, and the like that occur at connection points due to thermal strain are reduced.

[0009]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of the present invention. Referring to FIG. 1, a dielectric resonator 1 includes a support 2
And mechanically connected to the housing 5 via the support 3.
When the relationship between the thermal expansion coefficients of the dielectric resonator 1 and the housing 5 is dielectric resonator <the case, the relationship between the thermal expansion coefficients of the supporting tables 2 and 3 is as follows: dielectric resonator <supporting table <supporting table < It is a housing.

Next, an embodiment of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, dielectric resonator 1
Is usually made of a ceramic material, and has a very low coefficient of thermal expansion, for example, 4.times.10@-6. The housing 5 for housing the dielectric resonator 1 is usually made of aluminum and has a thermal expansion coefficient of 23.
The value is about 10-6, which is smaller than that of the dielectric resonator 1.
The support 2 connected to the dielectric resonator 1 for buffering the thermal expansion difference between the dielectric resonator 1 and the housing 5 is made of, for example, a quartz material and has a thermal expansion coefficient of 12.2 × 10 −6. When the support 3 is made of, for example, brass, the thermal expansion coefficient is 17.5.times.10@-6, and the thermal strain generated at each connection portion is small.

FIG. 2 is a graph showing a difference in thermal expansion between connection portions in the support structure of the dielectric resonator shown in FIG. Since the difference in the coefficient of thermal expansion between the connections is reduced, the slope of the thermal expansion is gentler than in the conventional example (FIG. 6).

Next, a second embodiment of the present invention will be described with reference to FIGS.

In FIG. 3, two supports are connected, a support 2 connecting the dielectric resonator 1 is alumina (coefficient of thermal expansion 7 × 10 −6), and a support 3 is quartz (coefficient of thermal expansion). 1
2.2.times.10@-6).

In FIG. 4, three supports are connected, the support 2 uses alumina, the support 3 uses quartz, and the support 4 uses brass.

[0016]

As described above, according to the present invention, in order to buffer the difference in thermal expansion coefficient between the dielectric resonator and the housing, the support base has a larger thermal expansion coefficient than the dielectric resonator, and has a higher thermal expansion coefficient than the dielectric resonator. Because it is small, thermal strain due to temperature can be reduced,
This has the effect that damage to the support can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a support structure of a dielectric resonator according to the present invention.

FIG. 2 is a graph showing a difference in thermal expansion between each connection in the support structure of FIG. 1;

FIG. 3 is a cross-sectional view showing another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a conventional dielectric resonator support structure.

FIG. 6 is a graph showing a difference in thermal expansion between connections in a conventional dielectric resonator support structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Dielectric resonator 2-4 Support stand 5 Case

Claims (3)

[Claims] 1. A dielectric resonator device comprising a dielectric resonator, a support for supporting the dielectric resonator, and a housing containing the same, the support having two or more different thermal expansion coefficients. A support structure for a dielectric resonator, wherein the support structure is made of a material having the same. 2. The relationship between the coefficient of thermal expansion of the dielectric resonator, the support, and the housing is as follows: dielectric resonator <first support <... <n
2. The support structure for a dielectric resonator according to claim 1, wherein the first support stand <the housing. 3. The support structure for a dielectric resonator according to claim 2, wherein said at least two supports are made of quartz and brass.