JPH1089820A - Sealed case for heating element storage - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the permissible range of the degree of integration of electronic equipment and electronic components by securing the sealing, moisture-proof and dust-proof properties, obtaining the drip-proof property of the inner wall of the case, and improving the heat dissipation. To increase versatility. SOLUTION: An upper cover is provided above a case main body for housing a heat generating element in a sealed state and forming a cooling air flow passage over the case main body, and heat exchange for exchanging heat with external air in the cooling air flow passage. Parts are arranged, and an external fan and an internal fan are arranged in the heat exchange part and the inside of the case body,
Forced circulation of air is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealed case for accommodating a heating element, and more particularly to a technique for improving dustproofness, moistureproofness, dripproofness and heat dissipation.

[0002]

2. Description of the Related Art Aircraft and various industrial electronic devices and electronic components are used in various environments, and a case accommodating the electronic devices and electronic components has a function suitable for each environment. It has been demanded.

[0003] Conventionally, as a storage case for an electronic device or the like, a case that is made of metal and has a sealing property against an external environment is used.

[0004]

However, the amount of heat generated by electronic devices and electronic components increases with the integration of the devices. In addition to heat dissipation, temperature changes between when the electronic device and the like are operating and when they are not operating. And new problems such as water droplets adhering to the inner wall of the case based on the temperature difference from the external environment occur, and it is required to consider them comprehensively.

[0005] The present invention has been made in view of these problems, and aims to achieve the following objects. Sealing, moisture proofing and dust proofing should be ensured by isolation from the external environment. Improve the convection of the air inside the case and increase the drip-proofness of the inner wall of the case. Improve the heat dissipation to increase the degree of integration of electronic devices and electronic components and the permissible range. Expand versatility.

[0006]

Means for Solving the Problems Heating elements such as electronic equipment and electronic parts are housed in a sealed state inside a case body, and the case body is made of metal such as aluminum die cast. The structure is divided into a plurality as required. Inside the case body, a heating element such as an electronic circuit board or an electronic device is arranged in a state supported by a rack or an inner wall surface, and is forcibly air-cooled by an internal fan. An upper cover is disposed above the case body so as to cover the case body. An air intake is formed in the upper cover, and a cooling air flow path is formed between the case body and the upper cover. Air is inserted through the external fan arranged on the road. A projecting fin and a rib-like fin projecting in both directions are arranged on the partition wall of the case main body, and a heat exchange portion is formed by the projecting fin and the cooling air flow path located at an upper position. The lower edge around the upper cover is covered with a gap on the side of the case body, and the gap is a discharge opening for discharging air after heat exchange.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a sealed case for accommodating a heating element according to the present invention will be described below with reference to FIGS. In each of the drawings, reference numeral X denotes a heating element (electronic circuit board, electronic device), 1 denotes a case body, 2 denotes an upper cover, 3 denotes an internal fan, 4 denotes an external fan, and 5 denotes a heat exchange unit.

The case body 1 is shown in FIGS. 1, 4 and 6
As shown in FIG. 3, the heating element X is housed in a hermetically sealed state. The partition wall 11 is made of metal made by aluminum die casting or the like while keeping the internal environment isolated from the outside. And protruding fins 12A protruding from both sides thereof, and rib-like fins 1 protruding from at least the outer side surfaces (preferably both side surfaces).
2B, a rack portion 13 disposed inside the partition wall 11 for supporting the heating element X, and an upper mounting leg 14A and a lower mounting leg 1 disposed at the rear position for mounting on a supporting structure such as a vertical wall.
4B.

Further, as shown in FIGS. 3 and 5, the case body 1 employs a structure in which the case body 1 is divided into three parts, namely, main bodies A, B and C. With respect to the main body A having the main body 11, the main bodies B and C having the partition walls 11 having the I-shaped cross section are removed as necessary so that the inner side can be opened. The joints 11a of the main bodies A, B, and C are fastened by fasteners 11b such as bolts and nuts, and are assembled with a sealing material or the like so as to maintain airtightness.

As shown in FIGS. 1 and 2, the upper cover 2 has a frame 2A integrally disposed above a case body 1, and a flat upper plate 2B is fastened to the frame 2A. 11b, an air inlet 21 is opened in the upper plate portion 2B, a cooling air flow path 22 is formed between the upper body portion 2B and the case body 1, and a lower edge portion 23 of the frame portion 2A is A gap is formed with respect to the portion, and the gap portion serves as a discharge opening 24 for discharging the air after heat exchange to the outside. In addition, a cable connection port 25 is provided in the upper plate portion 2B, and an electric cable Y is electrically connected to a heating element X inside the case main body 1.

The internal fan 3 is disposed on the inner bottom of the case body 1 and circulates internal air to directly or protrude the fins 1 against the partition 11 as shown by an arrow in FIG.
The heat is radiated through the 2A and the rib-like fins 12B, and an air flow is formed near the inner surfaces of the fins to prevent the attachment of water droplets.

The external fan 4 is, as shown in FIG.
It is attached to the air intake 21 of the upper cover 2, and is set so as to introduce outside air into the heat exchange section 5 and the cooling air passage 22.

The heat exchanging section 5 is formed in the partition wall 11 and its vicinity. In particular, the upper surface of the case body 1 and the vicinity of the protruding fins 12A and the cooling air flow path 22 are formed in the same manner.
It is considered important in improving the heat exchange efficiency.

When the electronic circuit board or the like (heat generating element) X is stored in the case main body 1 in the heat generating element storing case configured as described above, the main bodies A, B, and C are divided. In the electronic device X, the electronic device X is attached directly to the inner wall surface of the case body 1, and the electronic circuit board X is attached to the rack 13 as shown in FIG. Is made.

When the heating element X is operated while housed inside the case body 1, the temperature of the air inside the case body 1 rises. When the internal fan 3 is operated at this time, a forced circulation flow of air is formed inside the case body 1 as shown by an arrow in FIG. The heat is removed by being transmitted to the air flow, and the heat is removed from the heating element X supported on the inner surface of the partition 11 by directly transmitting the heat to the partition 11 or the air flow. Heat is performed.

Therefore, the heat is released from the protruding fins 12A and the rib-shaped fins 12B as the temperature of the partition 11 rises. In addition, when the external fan 4 is operated, the arrow in FIG. As shown in the drawing, air is inserted into the cooling air flow path 22 to remove heat from the protruding fins 12A and the like in the heat exchange section 5 in a high temperature state. Is discharged. The operation of the external fan 4 causes a particularly high temperature state in FIG.
Can efficiently cool the protruding fins 12A and the like of the heat exchanging portion 5 shown in FIG. 1 even if the electronic circuit board and the electronic device X are housed in the case main body 1 in a highly integrated state. In addition, it is possible to enhance the heat radiation and secure the stable operation.

If the internal fan 3 and the external fan 4 are stopped when the heat generating element X is generating heat, the inside of the case body 1 is naturally turned off as shown by the arrow in FIG. Convection occurs and heat is released. At this time, when heat is transmitted to the cooling air flow path 22 via the heat exchange unit 5,
Natural convection in which the air inside the upper cover 2 flows in the direction opposite to the arrow in FIG. 1 occurs, and the air taken in from the discharge opening 24 is discharged from the air intake 21 after heat exchange. Therefore, one of the internal fan 3 and the external fan 4,
Alternatively, even when both are stopped, a minimum cooling effect is ensured.

[0018]

According to the sealed case for housing the heating element according to the present invention, the following effects can be obtained. (1) The heating element is housed in a sealed state inside the case body, and the case body is made of metal such as aluminum die-cast, so that the case body is isolated from the external environment, and has a sealing property, a moisture-proof property, and Dustproofness can be ensured. (2) By generating a circulating flow inside the case body, it is possible to prevent a phenomenon that water droplets are generated on the inner wall surface of the case. (3) The heating element is supported in a state of being divided into a plurality of portions on a rack or an inner wall surface, and the internal fan is forcibly air-cooled to enhance heat dissipation, thereby increasing the allowable range of integration of electronic devices and electronic components. can do. (4) An upper cover is arranged above the case body to form a cooling air flow path, and the air is passed through the heat exchange section by an external fan, so that the heat radiation of the case body is improved, Soundness can be ensured. (5) The projecting fins and the rib-like fins are arranged on the partition wall of the case body to improve heat dissipation, and the heat dissipation is improved by ensuring air flow between the lower edge of the upper cover and the case body. In addition to the above, it is possible to secure heat radiation when the internal fan and the external fan are stopped, and to expand versatility.

[Brief description of the drawings]

FIG. 1 is a front cross-sectional view showing one embodiment of a heat-generating element housing sealed case according to the present invention.

FIG. 2 is a plan view showing one embodiment of a heat-generating element housing sealed case according to the present invention.

FIG. 3 is a left side view showing an embodiment of the heat-generating element housing sealed case according to the present invention.

FIG. 4 is a front view of the heating element of FIG.

FIG. 5 is a view taken along line VV of FIG. 3;

FIG. 6 is a view taken along line VI-VI in FIG. 4;

[Explanation of symbols]

 X Heating element (electronic circuit board, electronic equipment) Y Electric cable 1 Case main body A, B, C main body 2 Upper cover 2A Frame part 2B Upper plate part 3 Internal fan 4 External fan 5 Heat exchange part 11 Partition 11a Joining part 11b Fastening Tools 12A Projecting fins 12B Rib-shaped fins 13 Rack section 14A Upper mounting leg 14B Lower mounting leg 21 Air intake 22 Cooling air flow path 23 Lower edge 24 Discharge opening

Claims (6)

[Claims] 1. A cooling air flow path (2) over and above a case body (1) for housing a heating element (X) in a sealed state.
An upper cover (2) forming the above (2) is disposed, and a heat exchange part (5) for exchanging heat with external air is disposed in a cooling air flow path. 2. A lower edge (23) of the upper cover (2);
The sealed case for storing a heating element according to claim 1, wherein a discharge opening (24) for discharging air after heat exchange is formed between the case body (1) and an upper side portion thereof. 3. A rack (1) for supporting a heating element (X) such as an electronic circuit board or an electronic device inside a case body (1).
3. The sealed case for housing a heating element according to claim 1, wherein 3) is provided. 4. The sealed case for accommodating a heating element according to claim 1, wherein an external fan (4) for inserting air is disposed in the cooling air flow path (22). 5. The heat-generating element housing seal according to claim 1, wherein an internal fan for forcibly circulating the internal air is disposed inside the case body. Case. 6. The partition wall (11) of the case body (1) is provided with a protruding fin (12A) protruding in both directions or a rib-shaped fin (12B) protruding outward. The sealed case for storing a heating element according to claim 1, 2, 3, 4, or 5.