JPH1090672A - Color filter and method of manufacturing color filter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a color filter having a black matrix having a high surface resistance and a sufficient optical density, and a manufacturing method capable of efficiently obtaining such a color filter. A resist layer made of a photosensitive resist containing a photoacid generator is exposed through a mask having a predetermined pattern, and a polyfunctional alkoxysilane gas is brought into contact with the resist layer to form a polysiloxane layer in an exposed region. After developing, a black matrix having a polysiloxane layer as a surface layer is formed, and then, on a transparent substrate on which the black matrix is not formed, a colored pattern of a plurality of colors is sequentially formed to have a predetermined number of colors. A colored layer is formed to form a color filter.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a color filter and a method for manufacturing a color filter, and more particularly to a color filter used for a liquid crystal display and the like and a method for manufacturing the color filter.

[0002]

2. Description of the Related Art For example, in a liquid crystal display (LCD), a color filter is used in both an active matrix system and a simple matrix system in order to meet the recent demand for colorization. For example, in an active matrix type liquid crystal display using a thin film transistor (TFT), three primary colors of red (R), green (G), and blue (B) are used as color filters, and each pixel of R, G, and B is used. The liquid crystal operates as a shutter by turning on and off the electrodes corresponding to the above, and light is transmitted through each of the R, G, and B pixels to perform color display. Color mixing is visually performed on the retina by the principle of additive color mixing in which liquid crystal shutters corresponding to pixels of two or more colors are opened to mix colors and make the colors look different.

The above color filter manufacturing method includes a dyeing method of coating a dyed base material, exposing and developing through a photomask to dye a formed pattern, and dispersing a colored pigment in a photosensitive resist in advance. In addition, there are a pigment dispersion method of exposing and developing through a photomask, and a printing method of printing each color with a printing ink.

[0004] In recent years, an electrodeposition method has attracted attention as a method of manufacturing a color filter. In this electrodeposition method, for example, a transparent electrode formed on a substrate is patterned, and a voltage is selectively applied only to a portion of the patterned transparent electrode where a colored layer of the same color is to be formed. The first color layer is formed by performing electrodeposition in the inside. Next, a voltage is selectively applied only to a portion where a colored layer of another color is formed,
Similarly, the second and subsequent color layers are formed to form R, G, B
Is formed (for example, JP-A-59-90818). As another electrodeposition method, a transparent electrode is formed on a substrate, a positive photosensitive resin layer is provided on the entire surface, exposed and developed in a pattern for the first color, and a colored electrode is formed on the exposed transparent electrode. Electrodeposition is performed in a bath to form a first color layer, and then exposure and development are performed only on a portion where another color layer is to be formed. Similarly, the second and subsequent color layers are formed. To form a color filter having R, G and B colored layers (Japanese Patent Laid-Open No. 61-279).
No. 803).

[0005]

The coloring layer formed by the above-described electrodeposition method is excellent in heat resistance, chemical resistance, weather resistance, etc. by using a pigment as a coloring material. This is advantageous in that it is excellent in uniformity and can cope with a large area.

However, in the production of a color filter by the electrodeposition method as described above, when a light-shielding layer (black matrix) is formed of metal chromium or the like before forming a colored layer,
Since the black matrix has conductivity, a colored layer is also formed on the black matrix when the colored layer is formed, and there is a problem that flatness is significantly impaired.

[0007] This problem also occurs when a black matrix is formed using a material in which a black pigment is dispersed, when a conductive material such as carbon black is used as the black pigment. .

Further, a method has been proposed in which after forming a colored layer composed of R, G, and B by an electrodeposition method, a photoresist in which a black pigment is dispersed is applied, and a black matrix is formed by exposure and development. However, there is a reciprocal relation to utilizing a photoreaction for a light-shielding material in the first place, and there has been a problem that a black matrix having a sufficient optical density cannot be obtained. Also, a method has been proposed in which a colored layer is formed by the above-described electrodeposition method, and then a black matrix is formed by electroless plating (Japanese Patent Laid-Open No. 6-27).
No. 3610). However, as shown in JP-A-61-279803, when the photosensitive resin layer coated on the entire surface is exposed each time a colored layer of each color is formed, the resolution of the photosensitive resin increases with the number of exposures. In particular, the color layer formed as a final color has a low resolution, and the black matrix formed thereafter is formed so as to cover a part of the color layer from the necessity of forming a color layer of each color of a certain area. Therefore, there is a problem that the flatness of the color filter is significantly impaired.

[0009] Such a problem occurs not only in the electrodeposition method but also in all methods for producing a color filter using an electrochemical reaction such as an electrolytic micelle method.

The present invention has been made in view of the above circumstances, and has a high surface resistance and a color filter provided with a black matrix having a sufficient optical density. It is an object of the present invention to provide a production method which can be obtained well.

[0011]

In order to achieve the above object, a color filter according to the present invention comprises a transparent substrate and a colored layer comprising a plurality of colored patterns formed in a predetermined pattern on the transparent substrate. And a black matrix formed so as to be located between the colored patterns, wherein at least the black matrix has a polysiloxane layer as a surface layer.

Further, the color filter of the present invention is configured such that a transparent electrode is provided between the transparent substrate, the colored layer and the black matrix.

In the method for producing a color filter according to the present invention, a photosensitive resist containing a photoacid generator is applied on a transparent substrate to form a resist layer, and the resist layer is formed through a mask having a predetermined pattern. A first step of exposing, and a second step of forming a black matrix having a polysiloxane layer as a surface layer by forming a polysiloxane layer in an exposed area by contacting the resist layer with a polyfunctional alkoxysilane gas and then developing the polysiloxane layer. And a third step of sequentially forming a plurality of colored patterns and forming a colored layer having a predetermined number of colors on the transparent substrate on which the black matrix is not formed. And

Further, in the method for manufacturing a color filter according to the present invention, in the first step, the whole surface of the transparent substrate may be
Alternatively, the configuration is such that a transparent electrode is previously formed in a predetermined pattern shape.

In the present invention, the exposed region of the resist layer composed of the photosensitive resist is insolubilized in the developing solution, and the photoacid generator contained in the photosensitive resist generates an acid. The polyfunctional alkoxysilane gas in contact with the exposed region of the resist layer is hydrolyzed by the action of the acid to cause polycondensation, and a polysiloxane network is formed on the surface of the exposed region to form a polysiloxane layer. The black matrix formed by development has a polysiloxane layer as a surface layer.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram showing one embodiment of the color filter of the present invention. In FIG. 1, a color filter 1 includes a transparent substrate 2 and a transparent electrode 3 on the transparent substrate 2.
A black matrix 5 formed in a predetermined pattern and a colored layer 7 composed of a plurality of colored patterns 7R, 7G, 7B, a protective layer 8 formed so as to cover the black matrix 5 and the colored layer 7, And an electrode 9. The black matrix 5 has a polysiloxane layer 6 as a surface layer.

As the transparent substrate 2 of the color filter 1,
A rigid material having no flexibility such as quartz glass, Pyrex glass, or a synthetic quartz plate, or a flexible material having flexibility such as a transparent resin film or an optical resin plate can be used. Among them, Corning 7059 glass is a material having a small coefficient of thermal expansion, is excellent in dimensional stability and workability in high-temperature heat treatment, and is an alkali-free glass containing no alkali component in the glass.
It is suitable for a color filter for an active matrix type LCD.

The transparent electrode 3 formed on the transparent substrate 2
Are indium tin oxide (ITO), zinc oxide (Zn
O), tin oxide (SnO) and the like, and can be formed using a transparent conductive material, and the thickness thereof is preferably about 200 to 2000 °.

The black matrix 5 can be formed by curing a photosensitive resist described later containing light-shielding particles such as carbon black in the range of 40 to 65% by weight. The siloxane layer 6 is provided with a thickness of about 0.03 to 0.1 μm, and the total thickness of the black matrix 5 is preferably about 0.8 to 1.2 μm. And this black matrix 5
It has a high surface resistance of about 10 ¹¹ to 10 ¹² Ω / □. If the thickness of the polysiloxane layer 6 constituting the black matrix 5 is less than 0.03 μm, the high surface resistance as described above cannot be imparted to the black matrix 5. Swelling is not preferred. Further, when the thickness of the black matrix 5 is less than 0.8 μm, the light-shielding properties of the black matrix are insufficient, while when the thickness of the black matrix exceeds 1.2 μm, the resolution is undesirably reduced.

The polysiloxane layer 6 includes a polysiloxane-resist composite layer.

The coloring layer 7 can be formed by an electrodeposition method using the transparent electrode 3, and in this case, an electrodeposition material as described later can be used. The coloring layer 7 can be formed by a conventionally known method such as a dyeing method, a pigment dispersion method, and a printing method.

The protective layer 8 is for the purpose of smoothing the surface of the color filter 1, improving the reliability and preventing contamination of the liquid crystal layer when used in a liquid crystal display (LCD). It can be formed using a transparent resin such as an epoxy resin or a polyimide resin, or a transparent inorganic compound such as silicon dioxide. The thickness of such a protective layer is preferably about 1.0 to 1.5 μm.

Further, as the transparent common electrode 9, an indium tin oxide (ITO) film or the like can be used. IT
The O film can be formed by a known method such as an evaporation method and a sputtering method, and the thickness is preferably about 800 to 1500 °.

In the above-described color filter of the present invention, the transparent electrode 3 exists between the transparent substrate 2 and the black matrix 5 and the colored layer 7, but the present invention is not limited to this.
The transparent electrode 3 may not be present.

Next, the method for manufacturing a color filter according to the present invention will be described with reference to the color filter according to the present invention shown in FIG. 1 as an example. FIG. 2 is a process chart for explaining the color filter manufacturing method of the present invention. In FIG. 2, as a first step, first, indium tin oxide (I
The transparent electrode 3 is formed of a transparent conductive material such as TO), zinc oxide (ZnO), and tin oxide (SnO). Such a transparent electrode 3 is formed, for example, by a general film forming method such as a sputtering method, a vacuum evaporation method, and a CVD method, and preferably has a thickness of about 200 to 2000 °. Next, a photosensitive resist containing a photoacid generator is applied on the transparent electrode 3 to form a resist layer 4 having a thickness of about 1.0 to 1.5 μm (FIG. 2A). Next, the resist layer 4 is exposed through a black matrix photomask 10 (FIG. 2B). By this exposure, the exposed region 4a of the resist layer 4 is insolubilized in the developing solution, and the photoacid generator contained in the photosensitive resist contains the acid generated by the exposure.

Next, as a second step, a polyfunctional alkoxysilane gas is brought into contact with the resist layer 4. As a result, the polyfunctional alkoxysilane gas in contact with the exposed portion 4a undergoes hydrolysis by the action of the acid contained in the exposed portion 4a to cause polycondensation, whereby a polysiloxane network is formed in the exposed region 4a, and the polysiloxane layer is formed. 6 are formed. Next, the black matrix 5 having the polysiloxane layer 6 as a surface layer is formed by developing and removing the unexposed area (FIG. 2C).

Next, as a third step, a photosensitive resist is applied on the transparent electrode 3 so as to cover the black matrix 5 to form a resist layer 4 '. The resist layer 4 'is exposed and developed through a mask to expose the transparent electrode 3 in a pattern corresponding to the red colored layer. Then, the transparent substrate 2 is immersed in an electrodeposition bath in which a red pigment is dispersed, a DC voltage is applied to the transparent electrode 3, and a red electrodeposition material is deposited on the exposed transparent electrode 3, and After drying, a colored layer 7R without pinholes is formed (FIG. 2D). In the formation of the colored layer 7R by the electrodeposition method, since the black matrix 5 has a polysiloxane layer 6 as a surface layer and exhibits high surface resistance, the red electrodeposition material is deposited only on the exposed transparent electrode 3. become. Next, the resist layer 4 'is exposed and developed through a photomask for a green colored layer, and similarly, a green colored layer 7G is formed on the transparent electrode 3 by electrodeposition. After exposing and developing the resist layer 4 'through the photomask described above and similarly forming a blue colored layer 7B by electrodeposition, the black matrix 5 and the colored layer 7 are cured by heating at 70 to 90 ° C. Let it. Further, the colored layers 7R, 7 formed as described above
G, 7B, a protective layer 8 and a transparent common electrode 9 are provided so as to cover the black matrix 5 to form a color filter 1 (FIG. 2E).

In the third step, the resist layer 4 'formed once is exposed a plurality of times.
Of the image is reduced. However, since the black matrix 5 having a high surface resistance has already been formed on the transparent electrode 3, even if the resolution of the resist layer 4 'is reduced and the accuracy of the removal position of the resist layer 4' is reduced, the black matrix 5 is not removed. Only the portion for forming the colored layer of the desired color surrounded by 5 is exposed, and the accuracy of forming the colored layer is not reduced.

The photosensitive resist used in the first step includes 9.5 parts by weight of o-cresol novolak epoxy acrylate (50% of hydroxyl groups reacted with phthalic anhydride), dipentaerythritol hexaacrylate A mixture of 9.5 parts by weight, 1.0 part by weight of Irgacure (manufactured by Ciba Geigy) and 80.0 parts by weight of ethyl cellosolve was mixed with 100 parts by weight, 50 parts by weight of carbon black and 10 parts by weight of a photoacid generator. And the like mixed at a ratio.

The photoacid generator to be contained in the photosensitive resist in the first step includes 2 (2'-furylethylidene) -4,6-bis (trichloromethyl) -S-triazine (manufactured by Sankyo Co., Ltd.). TFE-Triazine (trade name, manufactured by Wako Chemical), TPS-103 manufactured by Midori Kagaku Co., Ltd.
(Trade name), MDS-105 (trade name) manufactured by Midori Kagaku Co., Ltd., TAZ-106 (trade name) manufactured by Midori Kagaku Co., Ltd., and one or more of these are used. be able to.

Such a photoacid generator can be selected in consideration of a light source and the like used for exposing the resist layer.
It can be contained in the range of 5 to 15 parts by weight based on 100 parts by weight of the photosensitive resist.

The exposure of the resist layer 4 in the first step can be performed using a light source selected from the light sources such as an ultraviolet exposure device having an ultrahigh pressure mercury lamp in consideration of the relationship with the photoacid generator. .

The polyfunctional alkoxysilane gas used in the second step is a trifunctional and / or tetrafunctional alkoxysilane gas, specifically, methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, tetra Methoxysilane, tetraethoxysilane, tetrapropoxysilane and the like can be mentioned. Conditions for bringing such a polyfunctional alkoxysilane gas into contact with the resist layer 4 include, for example, a temperature of 20.
-25 ° C., relative humidity 58-95%, and contact time 3-15 minutes. By changing the contact condition, the exposure region 4a of the resist layer 4 is changed.
The thickness of the polysiloxane layer 6 formed can be controlled. For example, when the relative humidity is in the range of 58 to 95%, water can be absorbed and penetrated into the exposed region 4 a of the resist layer 4, and the hydrolysis of the polyfunctional alkoxysilane gas causes the resist layer 4 to be hydrolyzed by the presence of the water. The polysiloxane layer 6 is formed inside the exposure area 4a and formed inward from the surface of the resist layer 4. Thereby, the thickness of the black matrix 5 on which the polysiloxane layer 6 is formed can be kept the same as that of the resist layer 4. In this case, since the volume of the polysiloxane layer 6 is reduced by the polycondensation by performing the heat treatment after the colored layer 7 is formed in the third step, the thickness is reduced without changing the light shielding property of the black matrix 5 ( 0.03-0.05 μm)
It is possible to enhance the light shielding properties of the black matrix 5 having a unit thickness.

Examples of the developer used in the second step include an aqueous solution of potassium hydroxide, an aqueous solution of sodium hydroxide, tetramethylammonium hydroxide, and the like. , Rocking) and the like.

The photosensitive resist used in the above third step is, for example, OFF manufactured by Tokyo Ohka Kogyo Co., Ltd.
PR-800 and the like.

The electrodeposition material used in the third step is generally made of an organic material (polymer material), and its original form is well known as an electrodeposition coating method. In electrodeposition coating, there are cation electrodeposition and anion electrodeposition due to electrochemical reaction with the main electrode. This is categorized according to whether the electrodeposited material exists as a cation or behaves as an anion. Examples of the organic polymer substance used for the electrodeposition include various organic polymer substances such as natural oils and fats, synthetic oils and fats, alkyd resins, polyester resins, acrylic resins, and epoxy resins.

In the anion type, a maleated oil or a polybutadiene resin has been used for a long time, and the curing of the electrodeposited substance is by an oxidative polymerization reaction. The cationic type has many epoxy resins and can be used alone or modified. Other,
Melamine-based resins and acrylic-based resins are often used, and a strong colored layer can be formed by heat curing, light curing, or the like.

In the electrodeposition of a liquid crystal color filter, finely pulverized pigments and dyes are dispersed in an anion-type or cationic-type electrodeposition bath, and co-deposited on the conductive portion together with the ionic polymer material.

Examples of the developer used in the third step include an aqueous solution of potassium hydroxide, an aqueous solution of sodium hydroxide, tetramethylammonium hydroxide, and the like. , Rocking) and the like.

In the above-described color filter manufacturing method of the present invention, the colored layers 7R, 7G and 7B are formed by the electrodeposition method. However, the present invention is not limited to this.
The colored layer can be formed by utilizing an electrochemical reaction such as an electrolytic micelle method, or can be formed by a conventionally known method such as a dyeing method, a pigment dispersion method, and a printing method.

Further, in the color filter of the present invention in which the transparent electrode 3 does not exist, in the third step of the above-described manufacturing method of the present invention, a conventionally known method such as a dyeing method, a pigment dispersion method, a printing method, or the like is used. Except for forming a colored layer, it can be manufactured in the same manner.

[0043]

Next, the present invention will be described in more detail with reference to examples. (Example 1) First step First, a transparent electrode having a thickness of 1500 mm was formed on a 7059 glass substrate manufactured by Corning Co., Ltd. by sputtering to form a transparent electrode having a thickness of 1500 mm. A photosensitive resist prepared as described below is applied on the transparent electrode by spin coating, and then,
Drying was performed at 0 ° C. for 3 minutes to form a resist layer having a thickness of 1.0 μm.

(Preparation of Photosensitive Resist) First, a photosensitive resin having the following composition was prepared.

O-cresol novolak epoxy acrylate (50% of hydroxyl groups reacted with phthalic anhydride) 9.5 parts by weight Dipentaerythritol hexaacrylate 9.5 parts by weight Irgacure (Ciba Geigy) 1.0 parts by weight Ethyl Cell Solve 80.0 parts by weight Next, a pigment and a photoacid generator were mixed with this photosensitive resin to prepare a photosensitive resist.

・ Photosensitive resin: 100 parts by weight ・ Carbon black: 50 parts by weight ・ Photoacid generator (TAZ-106 manufactured by Midori Kagaku Co., Ltd.): 10 parts by weight Exposure was performed through a photomask (line width = 35 μm).
As an exposure light source, an ultraviolet exposure apparatus having an ultra-high pressure mercury lamp was used, and irradiation was performed for 10 seconds. Second step Next, methyltriethoxysilane is used as a trifunctional alkoxysilane gas, and the exposed resist layer is brought into contact with the exposed surface under the following conditions (the alkoxysilane is gasified with a nitrogen gas flow and brought into contact with the exposed surface): (By the CVD method) to form a polysiloxane layer in the exposed region to obtain a black matrix.

(Contact conditions) ・ Contact time: 3 minutes ・ Relative humidity: 58% ・ Temperature: 25 ° C. Then, development is performed using a 0.05% aqueous potassium hydroxide solution to remove the unexposed resist layer. After washing with water,
Heating was performed at 200 ° C. for 30 minutes to form a black matrix. Third Step Next, a photosensitive resist (OFPR-800 manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied on a glass substrate by a spin coating method, and then dried at 90 ° C. for 3 minutes and dried to a thickness of 3 μm. A resist layer was formed.

Next, the resist layer was exposed and developed through a photomask for the red coloring layer to expose the transparent electrode in a pattern corresponding to the red coloring layer. Next, a glass substrate was immersed in an electrodeposition solution for a red coloring layer prepared as described below, using a transparent electrode as an anode and a platinum electrode as a cathode so as to have an electrode interval of 30 mm. Electrodeposition was performed by applying a current for 60 seconds. Next, the substrate taken out of the electrodeposition liquid was sufficiently washed with water, and then dried at 100 ° C. for 10 minutes to form a red colored layer having good transparency.

(Preparation of Electrodeposition Solution for Red Colored Layer) First, a mixture having the following composition was prepared.

Acrylic resin ARON S-4030 manufactured by Toa Gosei Chemical Co., Ltd. 75 parts by weight Alkoxy melamine M-66B manufactured by Sumitomo Chemical Co., Ltd. 25 parts by weight Triethylamine 6 parts by weight Dinonyl naphthalene disulfide 0 Next, a pigment and water were mixed with this mixture to prepare an electrodeposition solution for a red colored layer.

• Mixture: 13.5 parts by weight • Naphthol red: 5 parts by weight • Water: 81.5 parts by weight Next, the resist layer was exposed and developed through a photomask for a green coloring layer. Electrodeposition was performed using the electrodeposition solution for the green colored layer under the same conditions as in the formation of the red colored layer. Next, the substrate taken out of the electrodeposition liquid was sufficiently washed with water, and then dried at 100 ° C. for 10 minutes to form a green colored layer having good transparency.

(Composition of electrodeposition solution for green coloring layer) Mixture (identical to that used for electrodeposition solution for red coloring layer) 13.5 parts by weight Phthalocyanine green 5 parts by weight Water 81 Further, the resist layer is exposed and developed through a photomask for a blue colored layer, and is subjected to electrodeposition using the electrodeposition solution for a blue colored layer having the following composition under the same conditions as in the formation of the red colored layer. Dressed. Next, the substrate taken out of the electrodeposition solution was sufficiently washed with water, and dried at 100 ° C. for 10 minutes to form a blue colored layer having good transparency.

(Composition of electrodeposition solution for blue coloring layer) Mixture (same as used for electrodeposition solution for red coloring layer) 13.5 parts by weight Copper phthalocyanine blue 5 parts by weight Water 81.5 parts by weight By the above first to third steps, a glass substrate is provided with a colored layer having a predetermined pattern and a black matrix positioned between the colored layers, and the black matrix is used as a surface layer of the polysiloxane layer. Was produced.

The surface resistance of the black matrix in this color filter was measured by HIRES manufactured by Mitsubishi Yuka Co., Ltd.
As a result of measurement by A-1P, it was 10 ¹² Ω / □, and it was confirmed that the sheet had a high surface resistance. Further, the thickness of the black matrix was 0.92 μm, and since the optical density D was 3.0, it was confirmed that the light shielding property of the unit thickness of the black matrix was high.

Further, a protective layer made of acrylic resin (thickness: 1.5 μm) and a transparent common electrode made of ITO (thickness: 1500 °) were provided so as to cover the black matrix and the colored layer of the obtained color filter. When a liquid crystal display (LCD) was manufactured using the above method and a color image was displayed, a good color image without color shift or bleeding was displayed. Example 2 As a photoacid generator, T manufactured by Midori Kagaku Co., Ltd.
Instead of AZ-106, TFE manufactured by Sanwa Chemical Co., Ltd.
A color filter was produced in the same manner as in Example 1 except that triazine was used.

The surface resistance, thickness, and optical density D of the black matrix in this color filter were measured in the same manner as in Example 1. As a result, the surface resistance = 10 ¹²
Ω / □, thickness = 0.93 μm, D = 3.0, it was confirmed that it had a high surface resistance value and a high light-shielding property.

Further, a protective layer made of acrylic resin (thickness: 1.5 μm) and a transparent common electrode made of ITO (thickness: 1500 °) were provided so as to cover the black matrix and the colored layer of the obtained color filter. When a liquid crystal display (LCD) was manufactured using the above method and a color image was displayed, a good color image without color shift or bleeding was displayed. (Example 3) A color filter was produced in the same manner as in Example 1 except that trifunctional methyltrimethoxysilane was used as the alkoxysilane gas used in the second step.

The surface resistance, thickness, and optical density D of the black matrix in this color filter were measured in the same manner as in Example 1. As a result, the surface resistance = 10 ¹²
Ω / □, thickness = 0.97 μm, D = 3.0, it was confirmed that it had a high surface resistance value and a high light-shielding property.

Further, a protective layer made of acrylic resin (thickness: 1.5 μm) and a transparent common electrode made of ITO (thickness: 1500 °) were provided so as to cover the black matrix and the colored layer of the obtained color filter. When a liquid crystal display (LCD) was manufactured using the above method and a color image was displayed, a good color image without color shift or bleeding was displayed. Comparative Example 1 A color filter was produced in the same manner as in Example 1 except that monofunctional ethoxytrimethylsilane was used as the alkoxysilane gas used in the second step.

The surface resistance, thickness, and optical density D of the black matrix in this color filter were measured in the same manner as in Example 1. As a result, the surface resistance = 10 ⁵
Ω / □, thickness = 1.00 μm, D = 3.0, the formation of the polysiloxane layer in the black matrix was insufficient, and the surface resistance was low.

[0061]

As described in detail above, according to the present invention, a colored layer comprising a plurality of colored patterns on a transparent substrate and a black matrix having a polysiloxane layer as a surface layer located between the colored patterns are provided. Since the color filter is provided, the black matrix of the color filter has a high surface resistance due to the polysiloxane layer, and has a sufficient optical density. In addition, by exposing a resist layer made of a photosensitive resist containing a photoacid generator through a mask having a predetermined pattern, the exposed area of the resist layer is insolubilized in a developing solution, and the resist layer is contained in the photosensitive resist. An acid is generated by the action of the photoacid generator to be performed, and then a polyfunctional alkoxysilane gas is brought into contact with the resist layer, and the polyfunctional alkoxysilane gas undergoes hydrolysis and polycondensation by the action of the above-mentioned acid to form a resist layer. A polysiloxane layer composed of a polysiloxane network is formed on the surface of the exposed region, and then developed to form a black matrix having a polysiloxane layer as a surface layer, and then on a transparent substrate on which the black matrix is not formed, By sequentially forming a plurality of colored patterns and forming a colored layer having a predetermined number of colors, The color filter described above can be manufactured, and in this manufacturing process, the black matrix has a high surface resistance due to the polysiloxane layer, so that the colored layer can be easily formed by any forming method including the electrodeposition method. And a good color filter can be manufactured.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing one embodiment of a color filter of the present invention.

FIG. 2 is a process diagram illustrating a method of manufacturing a color filter according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Color filter 2 ... Transparent substrate 3 ... Transparent electrode 4 ... Resist layer 4a ... Exposure area 5 ... Black matrix 6 ... Polysiloxane layer 7 ... Coloring layer

Claims (4)

[Claims] 1. A transparent substrate, a colored layer comprising a plurality of colored patterns formed in a predetermined pattern on the transparent substrate, and a black matrix formed so as to be located between the colored patterns. A color filter, wherein the black matrix has a polysiloxane layer as a surface layer. 2. The color filter according to claim 1, further comprising a transparent electrode between the transparent substrate, the coloring layer, and the black matrix. A first step of applying a photosensitive resist containing a photoacid generator on a transparent substrate to form a resist layer, and exposing the resist layer through a mask having a predetermined pattern; A second step of contacting the resist layer with a polyfunctional alkoxysilane gas to form a polysiloxane layer in an exposed region, and then developing the black matrix having a polysiloxane layer as a surface layer; and A third step of sequentially forming a plurality of colored patterns on the unformed transparent substrate to form a colored layer having a predetermined number of colors, the method comprising the steps of: 4. The color filter according to claim 3, wherein, in the first step, the transparent substrate is provided with transparent electrodes formed in advance on the entire surface or in a predetermined pattern. Method.