JPH1096948A - Liquid crystal display - Google Patents

Abstract

(57) [Problem] To provide a liquid crystal display device having a small frame size in which a mounting area of a semiconductor element for driving a liquid crystal can be effectively used up to the vicinity of a seal resin of a display panel. SOLUTION: Two opposing upper transparent insulating substrates 24,
Liquid crystal was sealed between the lower transparent insulating substrates 25, and a driving IC 29 was embedded in a concave portion 27 formed on an inner portion 28 on the long side of the lower transparent insulating substrate 25 at a portion opposed thereto.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a liquid crystal display device having a driving IC around a display panel.

[0002]

2. Description of the Related Art Conventionally, a driving IC in a liquid crystal display device having a driving IC as a semiconductor element at a peripheral portion of a display panel.
As a mounting method of (1), a film carrier method which can connect a plurality of electrodes at once is known as a high-speed, high-productivity, narrow-pitch, and highly reliable method. In this film carrier method, device holes and outer holes are provided on a long film by punching with a die, and then an electrolytic copper foil is laminated. Next, patterning is performed by etching, and leads are formed extending over the device holes. A tin film having a thickness of 0.3 to 0.8 μm is formed on the entire surface of the lead by plating. On the other hand, a semiconductor element having an electrode in which a gold protrusion is formed on an aluminum pad via a barrier metal (chromium and copper) is used. The lead extending over the device hole is aligned with the electrode of the semiconductor element and joined to each other by thermocompression bonding.

A circuit unit is obtained by punching the film carriers to which the semiconductor elements have been bonded in this manner together with the film using a mold. This punched circuit unit is commonly called a TPC (tape carrier package). As shown in a plan view of FIG. 3, a conventional liquid crystal display device using this TPC has a T
The PC 3 is disposed, and the output-side lead 6 of the semiconductor element 5 formed on the film 4 of the TPC 3 is connected to the anisotropic conductive adhesive (A
CF), and is connected to the peripheral portion 2 of the display panel 1 by soldering, and the input-side lead 7 of the semiconductor element 5 is connected to a printed circuit board 8 arranged along the peripheral portion 2 of the display panel 1 by soldering. ing. Reference numeral 9 denotes an active area of the liquid crystal display device, and reference numeral 10 denotes a seal resin provided between two transparent insulating substrates of the liquid crystal display device. However, in the liquid crystal display device having such a configuration, since the TPC 3 and the printed circuit board 8 are used, the frame size (mounting area) of the liquid crystal display device is increased, so that it is difficult to obtain a compact liquid crystal display device and the cost increases. There is a problem.

On the other hand, as means for solving this problem,
2. Description of the Related Art A COG (chip-on-glass) system in which a semiconductor element is directly mounted on a transparent insulating substrate (glass) at a peripheral portion of a display panel is employed. FIG. 4 is a plan view of the liquid crystal display device according to the COG method, and FIG.
FIG. 5 is a side sectional view taken along line A ′. That is, of the upper transparent insulating substrate (glass) 12 and the lower transparent insulating substrate (glass) 13 constituting the display panel 11, the outer peripheral portion 14 of the lower transparent insulating substrate 13 whose outer periphery protrudes,
The semiconductor element 15 is mounted, the electrode of the semiconductor element 15 and the input side IT patterned on the lower transparent insulating substrate 13.
The O transparent electrode 16 and the output side ITO transparent electrode 17 are aligned and connected. The semiconductor element 15 has an electrode in which a gold projection is formed on an aluminum pad via a barrier metal (chromium and copper). Reference numeral 18 denotes a sealing resin provided between the upper transparent insulating substrate 12 and the lower transparent insulating substrate 13;
Reference numeral 9 denotes an anisotropic conductive adhesive (ACF) 2 on the input side ITO transparent electrode 16 patterned on the lower transparent insulating substrate 13.
The input FPC 21 connected through the line 0 is an active area of the liquid crystal display device.

[0005]

However, in such a conventional liquid crystal display device, the semiconductor element 15 is mounted on the projecting outer peripheral portion 14 of the lower transparent insulating substrate 13 constituting the display panel 11. Therefore, the area occupied by the width of the semiconductor element 15 (2.0 mm), the dimension of the output-side ITO transparent electrode 17 (1.0 mm), and the dimension of the input-side ITO transparent electrode 16 (2.5 mm) are required. The frame size (mounting area) 22 is large (5.5
mm), and there was a problem that it was not possible to sufficiently respond to a request for a narrower frame.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a liquid crystal display device having a narrow frame.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method in which a liquid crystal is sealed between two opposing transparent insulating substrates, and a liquid crystal is sealed at the opposing portion inside the outer periphery of the transparent insulating substrate. A liquid crystal display device in which a semiconductor element for driving a liquid crystal such as an IC for driving a liquid crystal is embedded in a formed concave portion. The mounting area of the semiconductor element for driving a liquid crystal is effective up to the vicinity of a seal resin provided between two transparent insulating substrates. Thus, the width dimension of the conventional semiconductor element can be ignored, the effective dimension of the input / output side ITO transparent electrode can be reduced, and a liquid crystal display device having a small frame size can be obtained.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a liquid crystal is sealed between two opposing transparent insulating substrates,
A liquid crystal display device in which a semiconductor element for driving a liquid crystal is embedded in a concave portion formed inside an outer peripheral portion of one of the transparent insulating substrates in the opposing portion, and a liquid crystal is formed in a concave portion formed inside the outer peripheral portion of the transparent insulating substrate in the opposing portion. Since the driving semiconductor element is embedded, the mounting area of the liquid crystal driving semiconductor element on the transparent insulating substrate can be effectively used up to the vicinity of the seal resin, and a liquid crystal display device having a small frame size can be obtained.

According to a second aspect of the present invention, a liquid crystal is sealed between two opposing transparent insulating substrates, and the liquid crystal is formed inside the outer peripheral portions of the two transparent insulating substrates at the opposing portions. This is a liquid crystal display device in which a liquid crystal driving semiconductor element is embedded in a concave portion, and the liquid crystal driving semiconductor element is embedded in a concave portion formed inside the outer peripheral portions of both transparent insulating substrates. Further, the mounting area of the semiconductor element for driving liquid crystal can be effectively used, and a liquid crystal display device having a small frame size can be obtained.

Hereinafter, embodiments of the liquid crystal display device of the present invention will be described with reference to the drawings. (Embodiment) FIG. 1 is a plan view of a liquid crystal display device according to an embodiment of the present invention, FIG. 2 is a side sectional view taken along line BB 'of FIG. 1, and both display panels 23 have a thickness of 1.1 mm. The upper transparent insulating substrate (glass) 24 and the lower transparent insulating substrate (glass) 25 are opposed to each other with a fixed interval therebetween with a sealing resin 26 interposed therebetween. Next, the liquid crystal display device according to the above-described embodiment will be described in accordance with the manufacturing process. Reference numeral 27 denotes a long side on the lower transparent insulating substrate (glass) 25 in a portion opposed to the upper transparent insulating substrate 24 and the lower transparent insulating substrate 25. In the outer peripheral portion inner side 28, about 0.2 mm from the dimensions (width 2.0 mm, length 17.0 mm, thickness 0.527 mm) of the drive IC 29 which is a semiconductor element for driving liquid crystal.
A recess having large dimensions (width 2.2 mm, length 17.2 mm, depth 0.7 mm) provided with the required number of 8 drive ICs 29 by chemical etching.
The dimensions of the drive IC 32 (2.3 mm in width and 15.0 in length)
mm, thickness 0.527mm) about 0.2mm larger (width 2.5mm, length 15.2mm, depth 0.7m)
m) is a concave portion provided by chemical etching for the required number of three drive ICs 32. The drive ICs 29 and 32 are formed by forming gold protrusions on an aluminum pad via a barrier metal (chromium and copper) by electrolytic plating. 33. Further, an acrylic resin layer 34 is formed on the inner surfaces of the recesses 27 and 30 having a depth of 0.7 mm formed in the lower transparent insulating substrate 25 by 0.05 to 0.05 mm.
It is applied in a thickness of 0.1 mm, and the drive ICs 29, 32 are put in the concave portions 27, 30 to which the acrylic resin layer 34 is applied within 15 minutes after the application, which is the touch drying time of the acrylic resin.
Is placed face up so that the electrode 33 faces upward, dried at room temperature and fixed. Further, the driving IC 2
Acrylic resin is again poured into the recesses 27 and 30 where the components 9 and 32 are placed, and the recesses 27 and 30 are completely covered and cured until they overlap the upper surface of the lower transparent insulating substrate 25 by about 0.1 mm. , 32 are buried.

Next, the acrylic resin on the electrodes 33 of the driving ICs 29 and 32 is removed by photolithography to form holes. By depositing ITO, which is a transparent electrode, over the entire surface of the lower transparent insulating substrate 25 by sputtering, the electrodes 33 of the drive ICs 29 and 32 and the ITO film are connected, and a conductive state can be obtained. After that, IT
The O film is etched into a desired pattern by a chemical etching method to obtain an output-side ITO pattern 35 and an input-side ITO pattern 36 on the lower transparent insulating substrate 25. On the other hand, on the upper transparent insulating substrate 24, ITO as a transparent electrode is vapor-deposited on the entire surface by a sputtering method, and the desired I
A TO pattern is formed. Next, an upper transparent insulating substrate 24 and a lower transparent insulating substrate 25 are provided opposite to each other via a sealing resin 26, and after the sealing resin 26 is cured by UV irradiation, liquid crystal is injected and sealed with a sealing resin. . afterwards,
The liquid crystal display device according to the present embodiment can be obtained by thermocompression bonding an input FPC 37 that gives an electric signal to the input side ITO pattern 36 via an anisotropic conductive adhesive (ACF) 38 and joining. In the above-mentioned manufacturing process, the output side ITO pattern 35 and the input side ITO pattern 35 are completely covered and hardened when the acrylic resin for embedding the drive ICs 29 and 32 is small by completely covering and curing the recesses 27 and 30 of the lower transparent insulating substrate 25. 36 may be broken at the edges of the recesses 27 and 30. If the amount of coating is large, the shape becomes convex. Similarly, when the output-side ITO pattern 35 and the input-side ITO pattern 36 are broken at the edge of the protrusion. There is. Note that 39 is an active area.

According to the liquid crystal display device of the present embodiment described above, the lower transparent insulating substrate 25 constituting the display panel 23 has the recesses 27 and 30 formed on the inner side 28 on the longer side and the outer side 31 on the shorter side. Since the drive ICs 29 and 32 are embedded, the mounting area can be effectively used up to the vicinity of the seal resin 26 of the display panel 23, and a liquid crystal display device having a small frame size 40 can be obtained.

In the liquid crystal display device according to the present embodiment, the drive ICs 29 and 32 are embedded on both the long side and the short side of the lower transparent insulating substrate 25, but are embedded on either one side. Also, not only the lower transparent insulating substrate 25,
The same effect as that of the present embodiment can be obtained by embedding it inside both outer peripheral portions of the upper transparent insulating substrate 24 and the lower transparent insulating substrate 25.

[0014]

As described above, according to the liquid crystal display device of the present invention, the mounting area of the semiconductor element for driving liquid crystal can be effectively utilized up to the vicinity of the sealing resin of the display panel, and a liquid crystal display device having a small frame size can be obtained. be able to.

[Brief description of the drawings]

FIG. 1 is a plan view of a liquid crystal display device according to an embodiment of the present invention.

FIG. 2 is a side sectional view taken along line B-B 'of FIG.

FIG. 3 is a plan view of a conventional liquid crystal display device.

FIG. 4 is a plan view of another conventional liquid crystal display device.

FIG. 5 is a side sectional view taken along line A-A ′ of FIG. 4;

[Explanation of symbols]

 1, 11, 23 Display panel 2 Peripheral part 3 TPC (film carrier package) 4 Film 5, 15 Semiconductor element 6 Output side lead 7 Input side lead 8 Printed circuit board 9, 21, 39 Active area 10, 18, 26 Seal resin 12 , 24 Upper transparent insulating substrate (glass) 13, 25 Lower transparent insulating substrate (glass) 14 Outer peripheral portion 16 Input ITO transparent electrode 17 Output ITO transparent electrode 19 Input FPC 20, 38 Anisotropic conductive adhesive (ACF) 22 , 40 Frame size (mounting part area) 27, 30 Recess 28 Inside long side outer periphery 29, 32 Drive IC 31 Short side outer periphery inside 33 Electrode 34 Acrylic resin layer 35 Output side ITO pattern 36 Input side ITO pattern 37 Input FPC

Claims (2)

[Claims] 1. A liquid crystal display in which liquid crystal is sealed between two opposing transparent insulating substrates, and a semiconductor element for driving liquid crystal is buried in a concave portion formed inside the outer peripheral portion of one of the opposing transparent insulating substrates. apparatus. 2. A liquid crystal is sealed between two opposing transparent insulating substrates, and a semiconductor element for driving a liquid crystal is buried in concave portions formed inside the outer peripheral portions of the two transparent insulating substrates at the opposing portions. Liquid crystal display.