JPH11103198A - Component mounting device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To automatically select and use a plurality of types of suction nozzles in an electronic component mounting device with a simple and small device, with high reliability, higher speed, and diversification of electronic components. The purpose is to be able to respond to. SOLUTION: In order to correct the rotational position of a part 1, a rotating body 21 directly connected to a rotating drive means (motor) 73 via a speed reducer 24 is rotated around an axis Z3 orthogonal to a rotating axis Z2 of the rotating body 21. A turret portion 27 that supports a plurality of types of component handling means 5 by rotation so as to be sequentially positioned at a component handling position where the component 1 can be handled on the rotation axis Z2 of the rotating body 21 is rotated. A rotation engaging means 60, 61, 74, 64 for rotating the Z-axis around the Z3 axis to position the predetermined component handling means 5 at the component handling position by the rotary drive motor 73 for correcting I do.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component to be supplied (or mounted) at a predetermined position on a component mounting object such as a circuit board by handling a supplied component by suction by a suction nozzle or by holding and handling the chuck by a mechanical chuck. The present invention relates to a mounting device.

[0002]

2. Description of the Related Art In recent years, as electronic components without leads, so-called chip components, have become widespread, their shapes and sizes have become various. In an electronic component mounting apparatus that manufactures an electronic circuit board using a large number of these various electronic components in combination, these various and many electronic components are sequentially handled and mounted (or mounted) on a printed circuit board.
The time required to manufacture two electronic circuit boards is lengthened by the number of required types of components and the number of required components, and the rate of occurrence of troubles due to mishandling due to differences in the types of components increases. For this reason, further speedup and improvement in reliability are desired. In addition, mounting refers to placing a component on, for example, cream solder on a printed circuit board and attaching it to a temporary fixing state such as adhesion, and is post-processed to be fixed and mounted by melting and solidifying the cream solder by a reflow device. is necessary. In addition, the mounting means that the components are fixed on the printed circuit board at the same time as the components so that post-processing does not need to be performed. In the present specification, both such mounting and mounting are considered as mounting, and the following description will proceed.

Conventionally, in order to meet the above-mentioned demands, as shown in FIG. 4, a plurality of heads a for handling supplied electronic components and mounting them at predetermined positions on a printed circuit board are provided with a plurality of types of electronic components to be handled. Equipped with a suction nozzle, each time an electronic component is mounted, an object suitable for the type of the component is selected and used, so that any type of electronic component can be handled without error and at high speed.

In order to handle such electronic components, the suction nozzle unit c provided on the mounting head a has a rotating body d rotatable about a vertical axis in a unit main body c1. An end face cam e having a cam face e1 at its lower end is fixedly provided on the unit body c1 so as to face a lower peripheral portion of the unit body c1. Various suction nozzles b of the same number as the number of electronic components g handled by the mounting head a are provided at equal intervals in the circumferential direction on the outer peripheral portion of the rotating body d. An object corresponding to the type of the electronic component g to be mounted is revolved and moved to the component handling position, so that various suction nozzles b can be selectively used.

Each of the suction nozzles b is connected to a lower end of a nozzle shaft f, and can only move up and down with respect to an outer cylinder h provided so as to be able to rotate the nozzle shaft f at a predetermined position on an outer peripheral portion of a rotating body d. Is inserted so that they are integrated. Thereby, the nozzle b can rotate integrally with the nozzle shaft f and the rotating body d, and can move up and down with respect to the rotating body d integrally with the nozzle shaft f. At the upper end of the outer cylinder h, an engaging portion j for rotation driving means (not shown) is provided, and the rotation position can be changed by rotating the suction nozzle b by engagement with the rotation driving means as required. Further, a cam follower k for the end face cam e is provided at a lower portion of each nozzle shaft f protruding from the lower end of the outer cylinder h, and a spring i for urging the nozzle shaft f upward is provided. End revolution cam of suction nozzle b and end cam e corresponding to end cam e
1 height position.

Therefore, the cam surface e1 of the end cam e is revolved to a component handling position in a rotation direction in which the electronic component g supplied by the rotation of the rotating body d in each suction nozzle b is sucked or mounted. The electronic components g to be supplied are protruded to the maximum downward as shown by the solid line in FIG.
The suction nozzle b which is not at the component handling position is moved upward as shown by a virtual line in FIG. 4, for example, so as to be retracted upward from the component handling height position. .

[0007] Thus, depending on the type of electronic component g handled by the mounting head a, a plurality of suction nozzles are provided depending on which suction nozzle b is revolved and moved to the component handling position by rotating the rotating body d. b can be properly used as needed. Also, at the component handling position, the direction of the electronic component g where the suction nozzle b is sucked by the suction nozzle b,
In other words, when the rotational position is inappropriate, at the preset orientation correction position including the suction position and the mounting position, the upper end of the outer cylinder h corresponding to the suction nozzle b that has sucked the electronic component g with the incorrect rotational position is set. By engaging a rotating means (not shown) with the engaging portion j and rotating the outer cylinder h around its axis, the suction nozzle b is rotated via the nozzle shaft f, and the electronic component g on which the suction nozzle b is suctioned. Rotation position can be corrected.

The mounting head a is provided with a plurality of suction nozzle units c around its own rotation axis z. When the mounting head a rotates, each suction nozzle unit c is moved to the component supply position and the component mounting position. When repeatedly moved and the suction nozzle unit c is at the component suction position,
When the suction nozzle b is protruded downward at the component handling position in the rotation direction of the rotating body d, the supplied electronic component g is suctioned, and when the suction nozzle unit c is at the component mounting position, the suction nozzle b The electronic component g that is being sucked is mounted by projecting b downward at the component handling position in the rotation direction of the rotating body d.

Each suction nozzle unit c is supported so as to be able to move up and down with respect to the mounting head a, and a cam follower m provided in each suction nozzle unit c has a groove cam (not shown) fixed around the rotation axis of the mounting head a. The suction nozzle unit c that has reached the component suction position by being engaged
Is set to a required height corresponding to the component mounting position.

[0010]

However, in the above-described conventional configuration, the rotation support structure for correcting the direction of the electronic component g sucked by the suction nozzle b and the engagement portion receiving rotation for correction are provided. This is necessary for each of the plurality of suction nozzles b provided on the rotating body d for suctioning and mounting components, and since the air paths communicating with the suction nozzles are individually provided, the structure of the component mounting head a Is complicated, expensive, and large, and there is a limit to speeding up work.

The relative positions of the engaging portions j corresponding to the plurality of suction nozzles b held by the rotating body d vary, and the rotation of the suction nozzle b for correcting the direction of the electronic component g is controlled by rotation. A transmission error is likely to occur, and this transmission error greatly affects the accuracy of mounting the sucked electronic component g on the printed circuit board. Therefore, the reliability is not yet sufficient, and even if this is to be reduced even a little, If a reduction gear is installed between the joint j and the nozzle shaft f, this reduction gear is required for each suction nozzle b. Therefore, the mounting head a is more complicated, expensive, and large. Becomes

Further, since the rotational drive is performed by an external engagement operation, the higher the work speed, the greater the impact at the time of engagement, and the possibility of transmission of vibration to the component g may occur. Driving can be performed only when the mounting head is stopped, and it is considered that there is a limit to the rotational operation due to external engagement.

[0013] For these reasons, it is difficult to cope with increasingly diversified electronic components and further high-speed mounting.

An object of the present invention is to enable automatic selection and use of a suction nozzle according to the type of a part to be handled and rotation operation by a simple and small apparatus, and to correct the rotational position of a part with high accuracy, thereby further increasing the speed. It is an object of the present invention to provide a highly-reliable component mounting apparatus capable of responding to the development of electronic components and diversification of electronic components.

[0015]

In order to achieve the above object, a component mounting apparatus according to the present invention stores a plurality of components, and supplies component supply means for supplying the components each time the component is required. In accordance with the product type of parts handling parts such as suction nozzles and mechanical chucks, which are equipped with a plurality of parts supply units corresponding to the parts and the parts supplied from each part supply means are mounted at predetermined positions on the parts to be handled In a component mounting apparatus equipped with a plurality of types of mounting heads, a rotary body having a rotary drive motor on a rotary shaft for defining and correcting the rotational position of a component and determining an angle is provided. A turret portion supported so as to be sequentially positioned at a plurality of types of component handling positions by rotation about an axis orthogonal to the rotation axis, and the rotation of the turret portion is used for positioning the component rotation. As prescribed component handling means by the rotational driving motor is positioned in the component handling position, used also serves, and switching means for switching it is characterized in that provided within the head.

In such a configuration, any component handling means such as a suction nozzle or a mechanical chuck provided by rotation of the turret by the rotating means can be selectively positioned at the component handling position by switching the switching means.
Various parts can be handled and mounted at high speed by the parts handling means corresponding to the type of parts to be handled each time. In particular, when the various parts handling means are located at the parts handling position, the rotating body rotates. Since it is located on the axis and the rotating means of this rotating body is always directly connected to the rotating shaft, not an external engaging means, it is possible to achieve highly accurate and accurate component rotational position correction with a very simple configuration. In addition, the same motor can be used to selectively rotate multiple types of parts handling means, providing high reliability, a simple mounting head structure, small size, and low cost, and capable of coping with further diversification and high speed. Becomes

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A typical embodiment of the present invention will be described below with reference to FIGS.

This embodiment shows an electronic component mounting apparatus used to manufacture an electronic circuit board by mounting electronic components on a printed circuit board. As shown in FIG. 3, the electronic component mounting apparatus includes a component cassette 2 serving as a component supply means for storing a plurality of electronic components 1 and supplying them when necessary. A plurality of component supply units 3 corresponding to required types, and a suction nozzle as a component handling means for handling electronic components 1 supplied from each component supply cassette 2 and mounting them at predetermined positions on a printed circuit board 4 as a mounting target. 5 and mechanical chuck etc.
A plurality of types of mounting heads 6 corresponding to the types of parts to be handled. In this embodiment, three or more kinds of suction nozzles 5a to 5c, --- are provided as component handling means.

A mounting head 6 is mounted on a support board 8 provided on a component supply section 3 and a board support section 7 supporting the printed board 4 and supporting the mounting of the electronic component 1 by a rotating shaft 9. It is rotatably supported, and is intermittently rotated by an intermittent rotation drive device 11 installed on the support substrate 8. Further, the mounting head 6 of the present embodiment is provided with a plurality of suction nozzle units 12 equipped with the plurality of types of suction nozzles 5a to 5c, at equidistant intervals at a plurality of positions in the circumferential direction as in the conventional case. By the intermittent rotation about the shaft 9, each suction nozzle unit 12 is sequentially opposed to a component supply position facing the component supply unit 3 and a component mounting position facing the printed circuit board 4, and
Each time 2 faces the component supply position, the suction nozzles 5a to 5a
By moving the component corresponding to the type of the electronic component 1 required at that time to the component handling position, the supplied predetermined electronic component 1 is sucked, and each suction nozzle unit 12 is moved to the component mounting position. Suction nozzle 5a
A predetermined electronic component 1 on which an object at a component handling position among 5c and 5c is attached is mounted at a predetermined position on the printed circuit board 4. Here, if each of the suction nozzle units 12 is provided with the same combination of suction nozzles 5a to 5c, it is advantageous to handle a large number of electronic components 1 at high speed. It is advantageous to change the combination of the suction nozzles 5a to 5c,.

In the present embodiment in which the component supply cassettes 2 are arranged, the component supply unit 3 supplies the predetermined electronic component 1 required at each time to the opposing suction nozzle unit 12. The electronic component 1 is reciprocated in a desired direction, and is controlled so that the one containing the predetermined electronic component 1 is located at the component supply position. As shown in FIG. 3, the substrate support 7 has an X table 13a that moves in the X direction and a Y table 13b that moves on the X table 13a in the X direction and the Y direction perpendicular to the plane of the drawing. XY table 1
The printed circuit board 4 is supported on the printed circuit board 3 and is moved in the XY2 directions so that the predetermined electronic components 1 of the printed circuit board 4 are mounted.

Each suction nozzle unit 12 is mounted on a slide 15 that slides up and down along a guide portion 14 provided on the mounting head 6, and a cam follower 16 provided on the slider 15 is provided with a rotating shaft 9 on the mounting head 6. And is engaged with a cam groove 17a on the outer periphery of the cam 17 attached to the support substrate 8. Accordingly, as each suction nozzle unit 12 sequentially turns between the component supply position and the component mounting position due to the intermittent rotation of the mounting head 6, the corresponding cam followers 16 move in the cam grooves 17a. For example, at the component supply position, the predetermined electronic component 1 supplied here is sucked by the suction nozzles 5a to 5a.
The height required for suction holding by the corresponding type of c, ---, and at the component mounting position, the predetermined electronic component 1 is mounted at a predetermined position of the printed circuit board 4 positioned here. The height is controlled so as to be required. Therefore, as shown in FIG. 4, it is possible to cope with a difference in the position of the component supply unit 3 and the substrate support unit 7 at which the component is handled.

Next, a more specific configuration of the suction nozzle unit 12 will be described with reference to FIGS.

As shown in FIGS. 1 and 2, the suction nozzle unit 12 is attached to the slider 15 so as to be able to move up and down for sucking and adhering parts, and is attached so that it is always at the reference position which has moved upward. A rotating body 21 that holds the suction nozzles 5a to 5c,... So that the rotational position can be corrected is provided at a lower end portion of the force holder 12a by a bearing 22 with a rotating axis Z2 parallel to the rotating axis Z1 of the mounting head 6 (see FIG. 3). And a motor 73 fixed to the holder 12 positions the rotary shaft 23. A speed reducer 24 is provided between the rotating body 21 and the rotating shaft 23, and an input shaft 24 a of the speed reducing device 24 is a rotating shaft 23, and an output shaft 24 b of the speed reducing device 24 is a driven shaft 21 c of the rotating body 21, respectively. The couplings 25 and 26 are connected so as to be integrally rotatable, and the rotation of the rotating shaft 23 is reduced by the speed reducer 24 and transmitted to the rotating body 21.

A gear 60 is fixed to a lower portion of the rotating body 21, and a lower portion thereof is a U-shaped rod portion 21b. Inside the U-shaped rod portion 21b, the plurality of kinds of suction nozzles 5a to 5c,. Are provided radially around the rotation axis Z3, and the turret part 27 is extended over both side walls of the U-shaped rod part 21b so as to be rotatable around the rotation axis Z3 provided by the bearing 65. The rotation axis Z3 is orthogonal to the rotation axis Z2.

In this embodiment, the rotation axis Z3 is a rotation shaft in which the one-way clutch 64 and the gear 64 are integrated, and the gear 64 is engaged with the gear 61 via the gear 74, and is engaged with the gear 61 via the gear 61. And the rotation of the rotation axis Z2 is U
It is transmitted to the U-shaped rod portion 21b and the rotation axis Z3 by the action of the one-way clutch 64. That is, when the rotation direction of the motor 73 is clockwise (or counterclockwise), the clutch is engaged and the U-shaped rod 21 and the Z3 axis rotate simultaneously. In the present embodiment, the nozzles necessary for simultaneous rotation are selected, while the clutch is released when the rotation direction is counterclockwise (or clockwise), and the U-shaped rod 2 is turned off.
Only 1 rotates, and the Z3 axis is turned around, and stopped by the hook 69. By utilizing this mechanism, rotational positioning and nozzle selection can be performed within the nozzle head at any timing during the intermittent operation of the head, the number of external engagement mechanisms is reduced, and the structure around the head is simplified.

Reference numeral 69 denotes a hook which holds a selected nozzle. Reference numeral 71 denotes a biasing tension spring. That is, the hook 67 is engaged with the predetermined groove of the plate 70 at the component handling position facing downward as in the suction nozzle 5a of FIG.

In this embodiment, the rotation direction of the U-shaped rod 21 and the rotation direction of the Z3 axis are always restricted to a fixed direction. However, the gear 60 is moved up and down by a cylinder or the like without using the one-way clutch 64. ON-engagement with 61
If a mechanism for turning off is used, regulation of the rotation direction can be eliminated. However, the necessity of air piping, larger dimensions,
Considering the reliability and the reliability, it can be said that a structure that is always engaged as in the present embodiment is desirable.

Although a configuration in which the gear 29 is disposed on the Z3 axis as shown in FIG. 5 is also conceivable, this configuration requires engagement with a fixed motor 56 as shown in FIG. 9, the work is performed at a limited timing (while the head is stopped) during the intermittent rotational movement, and a large time loss occurs.

Although it is ideal to connect the motor 58 directly to the Z3 axis as shown in Japanese Patent Application Laid-Open No. 8-97597, it is not realistic such as an increase in the number of motors, an increase in the number of drivers, and an increase in weight (FIG. 7). reference).

In this embodiment, the case where various electronic components 1 are mounted on the printed circuit board 4 has been described as an example. However, the present invention is not limited to this case. The same can be applied to.

[0031]

According to the component mounting apparatus of the present invention, various types of components can be handled and mounted at high speed without error by component handling means corresponding to the type of component to be handled each time. The parts handling means are equally rotated by the direct rotation of one common motor received by the rotating body and are rotated without difference between them, and the nozzle is selected, and the rotational position of the parts is corrected by the rotation of the plural kinds of parts handling means. Can be achieved with a simple configuration without errors, high reliability, the mounting head structure is simple, small and inexpensive, and it can sufficiently cope with further diversification and high-speed mounting. .

[Brief description of the drawings]

FIG. 1 (a) is a longitudinal sectional view of an entire suction nozzle unit of an electronic component mounting apparatus showing an embodiment of the component mounting apparatus of the present invention. FIG. 1 (b) shows a suction side air path of a rotating body of the embodiment. Sectional view

FIG. 2 is a perspective view of the suction nozzle unit of FIG. 1;

FIG. 3 is a schematic configuration diagram of an electronic component mounting apparatus according to a typical embodiment of the present invention.

FIG. 4 is a sectional view of a suction nozzle unit in a conventional electronic component mounting apparatus.

FIG. 5 is a perspective view of a suction nozzle unit in a conventional electronic component mounting apparatus.

FIG. 6 is a schematic configuration diagram of an electronic component mounting apparatus using the suction nozzle unit of FIG. 5;

FIG. 7 is a schematic configuration diagram of an electronic component mounting apparatus using a conventional suction nozzle unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Component supply cassette 3 Component supply part 4 Printed circuit board 5, 5a-5c Suction nozzle 6 Mounting head 7 Substrate support part 8 Support substrate 9 Rotating shaft 11 Intermittent drive device 12 Suction nozzle unit 12a Holder 14 Guide part 15 Slider 16 Cam follower 17 Cam 21 Rotating body 21a, 27a Sliding contact surface 23, 29 Rotary shaft 24 Reduction gear 27 Turret 41 Suction air path 41a Suction side air path 41a1 Suction port 41b Suction side air path 41b1 Suction port Z2, Z3 Rotation axis Reference Signs List 60 gear 61 gear 64 one-way clutch built-in gear shaft 67 hook 70 plate 73 motor 74 gear

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Makoto Seno 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Yasui Hirai 1006 Odaka Kadoma Kadoma City Osaka Pref.

Claims (1)

[Claims] 1. A component supply unit that stores a plurality of components and supplies a plurality of component supply units each time a component is required according to a required type of component. Rotation to correct the rotational position of a component in a component mounting device equipped with multiple types of mounting heads corresponding to the types of component handling components such as suction nozzles and mechanical chucks to be mounted at predetermined positions on the target component On a rotating body having a drive motor on a rotating shaft, a component handling position in which a plurality of types of component handling means can be used to handle components on the rotating axis of the rotating body by rotating around an axis orthogonal to the rotating axis of the rotating body. A turret portion supported so as to be sequentially positioned on the turret portion, and rotation of the turret portion is controlled by a predetermined component handling means by a rotation drive motor for positioning the component rotation. So as to be positioned in goods handling position, and use an alternate function,
A component mounting apparatus, wherein switching means for switching is provided in the mounting head.