JPH1110376A - Cutting method - Google Patents
Cutting methodInfo
- Publication number
- JPH1110376A JPH1110376A JP9168479A JP16847997A JPH1110376A JP H1110376 A JPH1110376 A JP H1110376A JP 9168479 A JP9168479 A JP 9168479A JP 16847997 A JP16847997 A JP 16847997A JP H1110376 A JPH1110376 A JP H1110376A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- heat source
- crack
- uncut portion
- end point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
(57)【要約】
【課題】 材料の加工終点で切残しが発生したときに、
その切残し部を高い加工精度で確実に割断することが可
能な割断加工方法を提供する。
【解決手段】 材料の加工始点に形成した亀裂を、熱源
の印加により発生する熱応力によって成長させつつ、そ
の熱源を割断予定線に沿って移動することにより材料を
分離する割断加工法において、材料Ｗの加工終点ｂで切
残しが発生したときに、その切残し部Ａの後方側で、か
つ、材料Ｗの端面付近に熱源Ｈを印加し局部的に熱を加
えて応力を発生させることにより、切残し部Ａにおいて
亀裂を進展させて材料を切り離す。
(57) [Summary] [Problem] When uncut occurs at the end point of material processing,
Provided is a cleaving method capable of reliably cleaving the uncut portion with high processing accuracy. SOLUTION: In a cutting method in which a crack formed at a processing starting point of a material is grown by thermal stress generated by application of a heat source, and the heat source is moved along a predetermined cutting line to separate the material, the material is separated. When an uncut portion occurs at the processing end point b of W, a heat source H is applied to the rear side of the uncut portion A and near the end face of the material W to locally apply heat to generate stress. Then, a crack is developed in the uncut portion A to separate the material.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ガラス、セラミッ
クスあるいは半導体ウエハ等の脆性材料にレーザビーム
等の熱源を印加することにより発生する熱応力を利用し
て、その材料を割断する割断加工装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaving apparatus for cutting a brittle material such as glass, ceramics or a semiconductor wafer by using a thermal stress generated by applying a heat source such as a laser beam to the material. .
【０００２】[0002]
【従来の技術】材料を分離加工する技術として、スクラ
イバあるいはレーザ溶断等が挙げられるが、これらの加
工では、切断時においてカレット（屑）、溶融解痕及び
マイクロクラック等が発生するという問題がある。2. Description of the Related Art Techniques for separating and processing materials include scriber and laser fusing. However, such processing has a problem that cullets (dust), melting marks, microcracks, and the like are generated during cutting. .
【０００３】そこで、このような問題点を解消するた
め、最近では、レーザビーム等の熱源の印加により発生
する熱応力を利用して脆性材料を割断する割断加工方法
が提案されている。[0003] In order to solve such a problem, a cutting method for cutting a brittle material using thermal stress generated by application of a heat source such as a laser beam has recently been proposed.
【０００４】この加工方法は、脆性材料に予め亀裂を作
成しておき、その亀裂先端に局所的に熱源を印加して熱
応力を発生させるとともに、熱源の移動により亀裂を成
長させて材料を分離する技術で、この方法によれば、亀
裂を成長させるといった性質上、切りしろや、パーティ
クルが発生しないことから、上記した従来の加工法の問
題点を解決することができるといった特徴がある。In this working method, a crack is formed in advance in a brittle material, a heat source is locally applied to the crack tip to generate a thermal stress, and the material is separated by growing the crack by moving the heat source. According to this method, there is a feature that the above-mentioned problems of the conventional processing method can be solved because no cutting margin or particles are generated due to the property of growing a crack.
【０００５】[0005]
【発明が解決しようとする課題】ところで、脆性材料の
割断加工方法は、上記したように、加工材料に予め発生
させた亀裂先端の前方にレーザビーム等の熱源を印加し
て、その熱源中心と周辺との間に発生する温度勾配によ
り生じる集中応力で亀裂を成長させてゆく加工法である
ので、加工終点に材料の切残しが必ず発生する。すなわ
ち、熱源を亀裂先端の前方に印加しているので、亀裂の
成長が加工終点に近づいたときに、熱源が加工終点を通
過して材料から外れてしまい、この時点で亀裂の進展が
停止して材料の切残しが発生する。By the way, as described above, a method of cutting a brittle material is to apply a heat source such as a laser beam in front of a crack tip generated in advance in the work material, and to apply a heat source center to the heat source. Since this is a processing method in which a crack is grown by a concentrated stress generated by a temperature gradient generated between the surroundings and the surrounding area, uncut material always occurs at the processing end point. That is, since the heat source is applied in front of the crack tip, when the crack growth approaches the processing end point, the heat source passes through the processing end point and separates from the material, at which point the crack growth stops. Material is left behind.
【０００６】このような加工終点の切残しを解消する方
法として、従来、熱源が加工終点を通過して材料から外
れた後に、その熱源を逆向きに所定距離だけ移動させ、
この位置から再度加工終点に向けて移動する方法（２度
切り）、あるいは、亀裂の進展が加工終点に近づいた時
点で、熱源の移動速度を小さくする方法などが採られて
いるが、いずれの方法においても、切り離しの確実性が
なく、また材料を切り離せたとしても、亀裂の進展に曲
がりが生じて加工精度が非常に悪くなるという問題があ
る。[0006] As a method of eliminating the uncut portion at the processing end point, conventionally, after the heat source has passed through the processing end point and has been separated from the material, the heat source is moved in the opposite direction by a predetermined distance.
A method of moving from this position toward the processing end point again (cutting twice) or a method of reducing the moving speed of the heat source when the crack growth approaches the processing end point has been adopted. Also in the method, there is a problem that there is no certainty of the separation, and even if the material can be separated, the crack is bent in the progress of the crack and the processing accuracy is extremely deteriorated.
【０００７】本発明はそのような実情に鑑みてなされた
もので、材料の加工終点で切残しが発生したときに、そ
の切残し部を高い加工精度で確実に割断することが可能
な割断加工方法の提供を目的とする。[0007] The present invention has been made in view of such circumstances, and when the uncut portion occurs at the processing end point of the material, the cutting process capable of reliably cutting the uncut portion with high processing accuracy. The purpose is to provide a method.
【０００８】[0008]
【課題を解決するための手段】上記の目的を達成するた
め、本発明は、材料の加工始点に形成した亀裂を、熱源
の印加により発生する熱応力によって成長させつつ、そ
の熱源を割断予定線に沿って移動することにより材料を
分離する割断加工法において、図１に例示するように、
材料Ｗの加工終点ｂで切残しが発生したときに、その切
残し部Ａの後方側で、かつ、材料Ｗの端面付近に熱源Ｈ
を印加して局部的に熱を加えて応力を発生させる点に特
徴がある。In order to achieve the above object, the present invention provides a method for forming a crack at the starting point of processing a material by a thermal stress generated by applying a heat source, and cutting the heat source along a cutting line. In the cleaving method in which the material is separated by moving along, as illustrated in FIG.
When an uncut portion occurs at the processing end point b of the material W, the heat source H is located behind the uncut portion A and near the end surface of the material W.
Is applied to apply heat locally to generate stress.
【０００９】そして、このように材料Ｗの端面近傍に熱
源Ｈを印加すると、その局部的な加熱により、加工材料
Ｗに図１に示す矢印のような応力が発生して、熱源位置
を中心とする微小な撓み（反り）が生じ、この微小撓み
の発生により、材料Ｗの加工始点ａ付近が支点となっ
て、切残し部Ａの端部ｐつまり停止した亀裂ＣR の先端
に応力が集中的に作用し、この部分ｐの応力拡大係数が
材料の破壊じん性値を超える。これにより切残し部Ａで
亀裂が進展する結果、材料Ｗを切り離すことができる。When the heat source H is applied to the vicinity of the end face of the material W, a stress as shown by an arrow shown in FIG. Due to the generation of this minute bending, stress concentrates on the end p of the uncut portion A, that is, the tip of the stopped crack CR, around the processing start point a of the material W as a fulcrum. And the stress intensity factor of this portion p exceeds the fracture toughness value of the material. As a result, the crack is developed in the uncut portion A, so that the material W can be cut off.
【００１０】ここで、以上のように、切残し部Ａの後方
側で材料Ｗの端面近傍に熱源Ｈを印加した場合、その印
加位置が材料の加工終点ｂに近いほど、切残し部Ａで成
長する亀裂が材料幅の広い側に向かって進展し、これと
は逆に熱源Ｈの印加位置が加工終点に対して遠くなるほ
ど、亀裂が材料幅の狭い側に向かって進展するという傾
向がある。そこで、本発明においては、そのような点を
考慮して、材料Ｗの端面近傍に印加する熱源Ｈの加工終
点ｂに対する位置を適宜に調整することで、切残し部Ａ
で成長する亀裂の進展方向が曲がらないようにする。Here, as described above, when the heat source H is applied to the vicinity of the end face of the material W behind the uncut portion A, the closer the applied position is to the material processing end point b, the more the heat source H is applied. The growing crack propagates toward the wide side of the material width, and conversely, as the application position of the heat source H becomes farther from the processing end point, the crack tends to grow toward the narrow side of the material width. . Therefore, in the present invention, in consideration of such a point, the position of the heat source H applied to the vicinity of the end face of the material W with respect to the processing end point b is appropriately adjusted, so that the uncut portion A
The direction of the growth of the crack growing in the step is not bent.
【００１１】[0011]
【発明の実施の形態】本発明の実施の形態を、以下、図
面に基づいて説明する。まず、本発明の割断加工方法の
実施に使用する装置は、図２に示すように、ガラス材等
の加工材料Ｗを載置する加工テーブル（２軸移動）１
と、この加工テーブル１上に置かれた材料Ｗに、熱源と
してのレーザビームＨを照射するレーザ発振器２などを
主として構成されており、その加工テーブル１の移動に
よりレーザビームＨの材料Ｗへの照射位置を割断予定線
Ｌ上に沿って移動させることができる。また、加工テー
ブル１の移動によって、レーザビームＨの材料Ｗへの照
射位置を後述する動作で変更・調整することができる。Embodiments of the present invention will be described below with reference to the drawings. First, as shown in FIG. 2, an apparatus used for carrying out the cleaving method of the present invention is a processing table (biaxial movement) 1 on which a processing material W such as a glass material is placed.
And a laser oscillator 2 for irradiating the material W placed on the processing table 1 with a laser beam H as a heat source. The movement of the processing table 1 causes the laser beam H to be applied to the material W. The irradiation position can be moved along the planned cutting line L. Further, by moving the processing table 1, the irradiation position of the laser beam H on the material W can be changed and adjusted by an operation described later.
【００１２】次に、以上の装置を使用して、本発明の割
断加工方法を実施する際の加工手順を、以下、図１及び
図２を参照しつつ説明する。まず、加工材料Ｗの加工始
点ａに初期亀裂を作成する。その初期亀裂の作成には、
硬質工具を使用して材料端部に切欠きを形成する方法、
あるいは加工材料の表面に高出力のレーザビームを集光
して孔を加工しこの孔から亀裂を作成する方法等の公知
の方法を採用する。Next, a processing procedure for implementing the cleaving method of the present invention using the above apparatus will be described below with reference to FIGS. 1 and 2. First, an initial crack is formed at the processing start point a of the processing material W. To create the initial crack,
How to form a notch in the material edge using a hard tool,
Alternatively, a known method such as a method in which a high-power laser beam is condensed on the surface of a processing material to form a hole and a crack is formed from the hole is employed.
【００１３】次いで、初期亀裂ＣR の先端前方にレーザ
ビームＨを照射するとともに、そのビーム照射位置を加
工テーブル１の移動により割断予定線Ｌに沿って移動し
て、亀裂ＣR を加工始点ａから加工終点ｂに向けて成長
させてゆき、そのレーザビームＨの照射位置が加工終点
ｂを通過した時点で、割断予定線Ｌ上へのレーザビーム
照射を終了する。Next, a laser beam H is irradiated to the front of the tip of the initial crack CR, and the beam irradiation position is moved along the planned cutting line L by moving the processing table 1 so that the crack CR is processed from the processing start point a. The laser beam is grown toward the end point b, and when the irradiation position of the laser beam H passes through the processing end point b, the laser beam irradiation on the planned cutting line L is completed.
【００１４】この時点で、先にも述べたように、加工材
料Ｗの加工終点ｂには切残しが発生しており、これを解
消するため、この実施の形態では、図１に示すように、
切残し部Ａの後方側で、加工材料Ｗの端面（材料幅の狭
い側の端面）付近に、レーザビーム（熱源）Ｈを照射し
て切残し部Ａの割断加工を行う。At this point, as described above, the uncut portion occurs at the processing end point b of the processing material W, and in order to solve this, in this embodiment, as shown in FIG. ,
A laser beam (heat source) H is applied to the vicinity of the end face (the end face on the narrower side of the material width) of the processing material W on the rear side of the uncut portion A, and the uncut portion A is cut.
【００１５】すなわち、図１に示す位置に熱源Ｈを印加
して局部的に熱を加えることで、加工材料Ｗの材料幅の
狭い側に応力を発生させ、その応力により切残し部Ａの
端部ｐから亀裂を進展させることによって、加工材料Ｗ
を完全に切り離す。That is, by applying a heat source H to the position shown in FIG. 1 to locally apply heat, a stress is generated on the narrow side of the material width of the processing material W, and the end of the uncut portion A is generated by the stress. Propagating the crack from the part p allows the processing material W
Completely cut off.
【００１６】ここで、以上のように切残し部Ａの後方側
で材料Ｗの端面近傍にレーザビームＨを照射して局部的
に熱を加えた場合、その熱により発生する応力のバラン
スによって、切残し部Ａで進展する亀裂の方向が変化す
る。つまり、レーザビームＨの照射位置が加工材料Ｗの
加工終点ｂに近いと、切残し部Ａで成長する亀裂が材料
幅の広い側に向かって進展し、これとは逆に熱源Ｈの印
加位置が加工終点に対して遠くなると、亀裂が材料幅の
狭い側に向かって進展するという傾向がある。Here, as described above, when heat is locally applied by irradiating the laser beam H to the vicinity of the end face of the material W behind the uncut portion A, the balance of the stress generated by the heat causes The direction of the crack that propagates in the uncut portion A changes. In other words, when the irradiation position of the laser beam H is close to the processing end point b of the processing material W, the crack growing in the uncut portion A propagates toward the wider material width, and conversely, the application position of the heat source H When the distance from the processing end point increases, the crack tends to grow toward the narrower side of the material width.
【００１７】そこで、この実施の形態では、加工材料Ｗ
の端面付近に照射するレーザビームＨの加工終点ｂに対
する位置を調整して、材料Ｗにかかる応力のバランスを
適当に変化させつつ亀裂の成長方向をコントロールする
ことにより、亀裂を割断予定線Ｌ（図２参照）に沿って
直線状に成長させるといった制御方法を採用し、これに
より、材料の切り離しの確実性に加えて、切残し部Ａの
加工精度の向上も同時に達成する。Therefore, in this embodiment, the processing material W
By adjusting the position of the laser beam H applied to the vicinity of the end face with respect to the processing end point b and controlling the growth direction of the crack while appropriately changing the balance of the stress applied to the material W, the crack cutting line L ( A control method such as linear growth along (see FIG. 2) is adopted, thereby improving the processing accuracy of the uncut portion A at the same time in addition to the certainty of separating the material.
【００１８】なお、以上の実施の形態においては、熱源
としてレーザビームを用いた例を示したが、本発明はこ
れに限られることなく、例えば電子ビーム、電熱ヒータ
または火炎等の他の熱源を用いても本発明は実施可能で
ある。In the above embodiment, an example in which a laser beam is used as a heat source has been described. However, the present invention is not limited to this. For example, another heat source such as an electron beam, an electric heater or a flame may be used. The present invention can be implemented even when used.
【００１９】[0019]
【実施例】本発明の割断加工方法を実施した例を以下に
述べる。 a.加工材料：ガラス材（２００mm×２５０mm×厚さ０．
７mm） b.熱源 ：レーザビーム（熱量２０Ｗ，ビーム形状；
楕円（10mm×3mm ） c.加工位置：加工材料端４mm d.切残処理：図１において熱源Ｈの加工終点ｂに対する
距離ｄを、１０mm，１５mm，２０mm，３０mm，４０mm，
５０mm，１００mmとして切残し部Ａの加工を行った。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the cleaving method of the present invention is implemented will be described below. a. Processing material: glass material (200 mm x 250 mm x thickness 0.
7mm) b. Heat source: laser beam (heat amount 20W, beam shape;
Ellipse (10 mm × 3 mm) c. Processing position: Work material edge 4 mm d. Uncut processing: In FIG. 1, the distance d of the heat source H to the processing end point b is 10 mm, 15 mm, 20 mm, 30 mm, 40 mm,
The uncut portion A was processed to 50 mm and 100 mm.
【００２０】以上の条件で割断加工を行った各試料につ
いて、切残し部の表面精度を測定したところ、図３のグ
ラフに示すような結果が得られた。この結果から、上記
した加工条件の場合、加工終点ｂからの熱源Ｈの位置を
１００ｍｍ程度とすれば、切り離しの際の確率が１００
％で、しかも高い加工精度が得らることが確認できた。
一方、１００ｍｍ以下とした場合、切り落としが不安定
になるか、あるいは図３のグラフのプラス方向に大きく
曲がりが発生することが判明した。When the surface precision of the uncut portion was measured for each of the samples subjected to the cutting under the above conditions, the results shown in the graph of FIG. 3 were obtained. From this result, in the case of the above-described processing conditions, if the position of the heat source H from the processing end point b is set to about 100 mm, the probability at the time of separation is 100.
%, And it was confirmed that high processing accuracy was obtained.
On the other hand, when it is 100 mm or less, it has been found that the cut-off becomes unstable or a large bend occurs in the positive direction of the graph of FIG.
【００２１】[0021]
【発明の効果】以上説明したように、本発明の割断加工
方法によれば、材料の加工終点付近において切残しが発
生したときに、その切残し部の後方側で材料の端面付近
に熱源を印加して局部的に熱を加え、これによって発生
する応力によって亀裂を進展させて切残し部を割断する
ので、材料の切り離しの確実性が従来に比して大幅に向
上する。ちなみに、従来の方法（２度切り等）では切り
離しの際の確率が高々１０％程度であったのに対し、本
発明方法では９５％以上にまで向上させることができ
る。As described above, according to the cutting method of the present invention, when a notch occurs near the processing end point of a material, a heat source is provided near the end face of the material behind the uncut portion. Heat is applied locally to apply heat, and the stress generated thereby causes the crack to grow and break the uncut portion, so that the reliability of separating the material is greatly improved as compared with the related art. By the way, the probability at the time of separation is about 10% at most in the conventional method (cut twice, etc.), but can be increased to 95% or more in the method of the present invention.
【００２２】なお、本発明の割断加工方法において、上
記した切残し部の割断加工を実行する際に、加工終点に
対する熱源の印加位置を調整して亀裂の成長方向を制御
するという手法を付加すれば、材料の切り離しの確実性
に加えて、切残し部の加工精度の向上も同時に達成する
ことができる。It should be noted that, in the cleaving method of the present invention, when performing the above-described cleaving of the uncut portion, a method of controlling the growth direction of the crack by adjusting the position where the heat source is applied to the processing end point is added. If this is the case, in addition to the certainty of separating the material, it is possible to simultaneously improve the processing accuracy of the uncut portion.
【図１】本発明の割断加工方法の説明図FIG. 1 is an explanatory view of a cleaving method of the present invention.
【図２】本発明の割断加工方法の実施に使用する装置の
概略構成図FIG. 2 is a schematic configuration diagram of an apparatus used for carrying out the cleaving method of the present invention.
【図３】切残し部の加工精度を示すグラフFIG. 3 is a graph showing the processing accuracy of the uncut portion.
１ 加工テーブル ２ レーザ発振器 Ｈ レーザビーム（熱源） Ｗ 加工材料 Ｌ 割断予定線 ａ 加工始点 ｂ 加工終点 ＣR 亀裂 Ａ 切残し部 Reference Signs List 1 processing table 2 laser oscillator H laser beam (heat source) W processing material L scheduled cutting line a processing start point b processing end point CR crack A uncut portion
───────────────────────────────────────────────────── フロントページの続き (72)発明者 沖山 俊裕 兵庫県姫路市御国野町御着1174−22 (72)発明者 白浜 秀幸 長崎県長崎市梁川町612−42 (72)発明者 光武 克之 長崎県諫早市日の出町29−１ (72)発明者 大仁田 英信 長崎県大村市三城町955−１ (72)発明者 末永 知宏 長崎県大村市協和町764 旭ハイツ22号 (72)発明者 木下 耕一 長崎県大村市植松１丁目189−１ ファー ストコート205号 (72)発明者 前川 俊一 兵庫県伊丹市春日丘１−15 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshihiro Okiyama 1174-22, Gokunino-cho, Himeji-shi, Hyogo (72) Inventor Hideyuki Shirahama 612-42, Yanagawacho, Nagasaki-city, Nagasaki Prefecture 29-1 Hinodecho, Isahaya-shi, Japan (72) Inventor Hidenobu Onita 955-1, Miki-cho, Omura-shi, Nagasaki (72) Inventor Tomohiro Suenaga 764 Kyowa-cho, Omura-shi, Nagasaki 22 Asahi Heights 22 (72) Inventor Koichi Kinoshita 1st 189-1 Uematsu, Oomura, Nagasaki Pref.
Claims (2)
の印加により発生する熱応力によって成長させつつ、そ
の熱源を割断予定線に沿って移動することにより材料を
分離する割断加工法において、 材料の加工終点で切残しが発生したときに、その切残し
部の後方側で、かつ、材料の端面付近に、熱源を印加し
局部的に熱を加えて応力を発生させることにより、上記
切残し部で亀裂を進展させて材料を切り離すことを特徴
とする割断加工方法。1. A cutting method for separating a material by moving a heat source along a predetermined cutting line while growing a crack formed at a processing starting point of the material by a thermal stress generated by applying a heat source, When a notch occurs at the end point of material processing, a heat source is applied to the back side of the notch and near the end face of the material to locally apply heat to generate stress, thereby generating the stress. A cleaving method characterized in that a crack is developed in the remaining portion to separate the material.
残し部の加工を実行するときに、材料の端面付近に印加
する熱源の加工終点に対する位置を調整することによっ
て、当該切残し部での亀裂の成長方向を制御することを
特徴とする割断加工方法。2. The processing method according to claim 1, wherein the position of the heat source applied to the vicinity of the end face of the material with respect to the processing end point is adjusted when the processing of the uncut portion is performed. Cleaving method characterized by controlling the growth direction of cracks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9168479A JPH1110376A (en) | 1997-06-25 | 1997-06-25 | Cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9168479A JPH1110376A (en) | 1997-06-25 | 1997-06-25 | Cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1110376A true JPH1110376A (en) | 1999-01-19 |
Family
ID=15868867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9168479A Pending JPH1110376A (en) | 1997-06-25 | 1997-06-25 | Cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1110376A (en) |
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