JPH11106934A - Production of metal oxide thin film and metal oxide thin film - Google Patents
Production of metal oxide thin film and metal oxide thin filmInfo
- Publication number
- JPH11106934A JPH11106934A JP26702897A JP26702897A JPH11106934A JP H11106934 A JPH11106934 A JP H11106934A JP 26702897 A JP26702897 A JP 26702897A JP 26702897 A JP26702897 A JP 26702897A JP H11106934 A JPH11106934 A JP H11106934A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal oxide
- thin film
- alkoxide
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910044991 metal oxide Inorganic materials 0.000 title claims abstract description 43
- 150000004706 metal oxides Chemical class 0.000 title claims abstract description 43
- 239000010409 thin film Substances 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000002184 metal Substances 0.000 claims abstract description 72
- 229910052751 metal Inorganic materials 0.000 claims abstract description 72
- 238000000576 coating method Methods 0.000 claims abstract description 42
- 239000011248 coating agent Substances 0.000 claims abstract description 41
- 150000003839 salts Chemical class 0.000 claims abstract description 31
- 150000004703 alkoxides Chemical class 0.000 claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000013078 crystal Substances 0.000 claims abstract description 13
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 26
- -1 indium alkoxide Chemical class 0.000 claims description 16
- 229910052718 tin Inorganic materials 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052738 indium Inorganic materials 0.000 claims description 10
- 239000010419 fine particle Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 150000002471 indium Chemical class 0.000 claims description 4
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 3
- 239000000654 additive Substances 0.000 abstract description 14
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 13
- 239000007788 liquid Substances 0.000 abstract description 13
- 239000002904 solvent Substances 0.000 abstract description 12
- 238000002834 transmittance Methods 0.000 abstract description 12
- 230000007062 hydrolysis Effects 0.000 abstract description 8
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 229920000620 organic polymer Polymers 0.000 abstract description 4
- 238000006297 dehydration reaction Methods 0.000 abstract description 3
- 238000009833 condensation Methods 0.000 abstract description 2
- 230000005494 condensation Effects 0.000 abstract description 2
- 230000018044 dehydration Effects 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 17
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 238000003980 solgel method Methods 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 239000013522 chelant Chemical class 0.000 description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 7
- 229910052753 mercury Inorganic materials 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000003377 acid catalyst Substances 0.000 description 5
- 150000001408 amides Chemical class 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 4
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 150000004677 hydrates Chemical class 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 150000004715 keto acids Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- CCTFOFUMSKSGRK-UHFFFAOYSA-N propan-2-olate;tin(4+) Chemical compound [Sn+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] CCTFOFUMSKSGRK-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000004716 alpha keto acids Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- 229940007550 benzyl acetate Drugs 0.000 description 2
- 150000004718 beta keto acids Chemical class 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- OVZUSPADPSOQQN-UHFFFAOYSA-N tri(propan-2-yloxy)indigane Chemical compound [In+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] OVZUSPADPSOQQN-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- NGCDGPPKVSZGRR-UHFFFAOYSA-J 1,4,6,9-tetraoxa-5-stannaspiro[4.4]nonane-2,3,7,8-tetrone Chemical compound [Sn+4].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O NGCDGPPKVSZGRR-UHFFFAOYSA-J 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- FIPWRIJSWJWJAI-UHFFFAOYSA-N Butyl carbitol 6-propylpiperonyl ether Chemical compound C1=C(CCC)C(COCCOCCOCCCC)=CC2=C1OCO2 FIPWRIJSWJWJAI-UHFFFAOYSA-N 0.000 description 1
- 229920001747 Cellulose diacetate Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- XURCIPRUUASYLR-UHFFFAOYSA-N Omeprazole sulfide Chemical compound N=1C2=CC(OC)=CC=C2NC=1SCC1=NC=C(C)C(OC)=C1C XURCIPRUUASYLR-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- VBXWCGWXDOBUQZ-UHFFFAOYSA-K diacetyloxyindiganyl acetate Chemical compound [In+3].CC([O-])=O.CC([O-])=O.CC([O-])=O VBXWCGWXDOBUQZ-UHFFFAOYSA-K 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- HHFAWKCIHAUFRX-UHFFFAOYSA-N ethoxide Chemical compound CC[O-] HHFAWKCIHAUFRX-UHFFFAOYSA-N 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 150000004675 formic acid derivatives Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 150000002472 indium compounds Chemical class 0.000 description 1
- LKEDUJPRSZGTHZ-UHFFFAOYSA-H indium(3+);oxalate Chemical compound [In+3].[In+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O LKEDUJPRSZGTHZ-UHFFFAOYSA-H 0.000 description 1
- CXIAOEXVDRAYBR-UHFFFAOYSA-N indium(3+);propan-1-olate Chemical compound [In+3].CCC[O-].CCC[O-].CCC[O-] CXIAOEXVDRAYBR-UHFFFAOYSA-N 0.000 description 1
- SBFKENUEAOCRNR-UHFFFAOYSA-K indium(3+);triformate Chemical compound [In+3].[O-]C=O.[O-]C=O.[O-]C=O SBFKENUEAOCRNR-UHFFFAOYSA-K 0.000 description 1
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 1
- IGUXCTSQIGAGSV-UHFFFAOYSA-K indium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[In+3] IGUXCTSQIGAGSV-UHFFFAOYSA-K 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- NBTOZLQBSIZIKS-UHFFFAOYSA-N methoxide Chemical compound [O-]C NBTOZLQBSIZIKS-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 150000003891 oxalate salts Chemical class 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001713 poly(ethylene-co-vinyl alcohol) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920005735 poly(methyl vinyl ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- IKNCGYCHMGNBCP-UHFFFAOYSA-N propan-1-olate Chemical compound CCC[O-] IKNCGYCHMGNBCP-UHFFFAOYSA-N 0.000 description 1
- OGHBATFHNDZKSO-UHFFFAOYSA-N propan-2-olate Chemical compound CC(C)[O-] OGHBATFHNDZKSO-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- PYKSLEHEVAWOTJ-UHFFFAOYSA-N tetrabutoxystannane Chemical compound CCCCO[Sn](OCCCC)(OCCCC)OCCCC PYKSLEHEVAWOTJ-UHFFFAOYSA-N 0.000 description 1
- FPADWGFFPCNGDD-UHFFFAOYSA-N tetraethoxystannane Chemical compound [Sn+4].CC[O-].CC[O-].CC[O-].CC[O-] FPADWGFFPCNGDD-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- TWRYZRQZQIBEIE-UHFFFAOYSA-N tetramethoxystannane Chemical compound [Sn+4].[O-]C.[O-]C.[O-]C.[O-]C TWRYZRQZQIBEIE-UHFFFAOYSA-N 0.000 description 1
- YFCQYHXBNVEQKQ-UHFFFAOYSA-N tetrapropoxystannane Chemical compound CCCO[Sn](OCCC)(OCCC)OCCC YFCQYHXBNVEQKQ-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- YZJQPSAZKVXWEZ-UHFFFAOYSA-J tin(4+) tetraformate Chemical compound [Sn+4].[O-]C=O.[O-]C=O.[O-]C=O.[O-]C=O YZJQPSAZKVXWEZ-UHFFFAOYSA-J 0.000 description 1
- CVNKFOIOZXAFBO-UHFFFAOYSA-J tin(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Sn+4] CVNKFOIOZXAFBO-UHFFFAOYSA-J 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- YJGJRYWNNHUESM-UHFFFAOYSA-J triacetyloxystannyl acetate Chemical compound [Sn+4].CC([O-])=O.CC([O-])=O.CC([O-])=O.CC([O-])=O YJGJRYWNNHUESM-UHFFFAOYSA-J 0.000 description 1
- JWRQFDQQDBJDHD-UHFFFAOYSA-N tributoxyindigane Chemical compound CCCCO[In](OCCCC)OCCCC JWRQFDQQDBJDHD-UHFFFAOYSA-N 0.000 description 1
- MCXZOLDSEPCWRB-UHFFFAOYSA-N triethoxyindigane Chemical compound [In+3].CC[O-].CC[O-].CC[O-] MCXZOLDSEPCWRB-UHFFFAOYSA-N 0.000 description 1
- FGPUIKFYWJXRBX-UHFFFAOYSA-N trimethoxyindigane Chemical compound [In+3].[O-]C.[O-]C.[O-]C FGPUIKFYWJXRBX-UHFFFAOYSA-N 0.000 description 1
- YQMWDQQWGKVOSQ-UHFFFAOYSA-N trinitrooxystannyl nitrate Chemical compound [Sn+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O YQMWDQQWGKVOSQ-UHFFFAOYSA-N 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Surface Treatment Of Glass (AREA)
- Chemically Coating (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は,金属酸化物薄膜の
製造法及び金属酸化物薄膜に関する。The present invention relates to a method for producing a metal oxide thin film and a metal oxide thin film.
【0002】[0002]
【従来の技術】透明導電膜は,可視光透過性が良く,導
電性も良好なため,LCD,タッチパネル,センサー,太
陽電池や無機及び有機ELなどの電極や太陽熱利用のため
の選択透過膜などに用いられている。2. Description of the Related Art Transparent conductive films have good visible light transmittance and good conductivity, and are used for LCDs, touch panels, sensors, electrodes for solar cells, inorganic and organic EL, and selective transmission films for solar heat. It is used for
【0003】このような,透明導電膜の中でも,金属酸
化物系の透明導電膜(特に酸化スズ(SnO2)系や酸化イ
ン ジウム(In2O3)系の透明導電膜)は他の材料系の
透明導電膜に比べその比抵抗が低く,可視光の透過率が
高く安定性もよいため,一般的に用いられている。更
に,エッチングのしやすさなどの点から,スズをドープ
した酸化インジウム(In2O3),いわゆるITOが広く用い
られている。Among such transparent conductive films, metal oxide-based transparent conductive films (particularly, tin oxide (SnO 2 ) and indium oxide (In 2 O 3 ) -based transparent conductive films) are other materials. It is generally used because of its lower specific resistance, higher visible light transmittance, and better stability than the transparent conductive film. In addition, tin-doped indium oxide (In 2 O 3 ), so-called ITO, is widely used in terms of ease of etching.
【0004】ところで,これらの金属酸化物系の透明導
電膜は,従来から蒸着法,イオンプレーティング法,ス
パッタリング法などによって,基板上に結晶性もしく
は,非晶性の金属酸化物を付着させることにより形成さ
れている。これらの真空成膜法では,装置コストや製造
コストが高くなるため,ゾル−ゲル法のような湿式プロ
セスへの期待が大きい。Incidentally, these metal oxide-based transparent conductive films have conventionally been prepared by depositing a crystalline or amorphous metal oxide on a substrate by vapor deposition, ion plating, sputtering, or the like. Is formed. In these vacuum film forming methods, since the equipment cost and the manufacturing cost are increased, there is great expectation for a wet process such as a sol-gel method.
【0005】独国特許3300589号には,ゾル−ゲル法に
よる低比抵抗,高透過率の成膜法が開示されている。し
かしながら,ゾル−ゲル法のような湿式プロセスにおい
ても,良好な性能の,すなわち,比抵抗が低く,可視光
の透過率がよい膜を得るためには,通常300℃から500℃
程度に基板が加熱される必要がある。このため用いるこ
とのできる基板には制限が加えられる。従って,有機高
分子基板上に成膜するには,成膜温度を250℃以下最も
好ましくは,100℃以下にすることができるような成膜
法が望まれている。[0005] German Patent No. 3300589 discloses a film formation method of low specific resistance and high transmittance by a sol-gel method. However, even in a wet process such as the sol-gel method, in order to obtain a film with good performance, that is, a film having low specific resistance and good transmittance of visible light, usually from 300 to 500 ° C.
The substrate needs to be heated to a degree. For this reason, there are restrictions on the substrates that can be used. Therefore, in order to form a film on an organic polymer substrate, a film forming method capable of setting the film forming temperature to 250 ° C. or lower, most preferably 100 ° C. or lower is desired.
【0006】特開平3-188938号には,光照射による低温
成膜,特開平8-253318号には,酸触媒及び酸アミドを用
いた低温成膜の技術が開示されている。しかしながら,
これらの技術では,それぞれ,得られた膜の抵抗値が十
分に低くない,なお必要とする温度が高い,光照射の時
間が長い,などの問題点がある。従って,さらに低温で
低抵抗の透明導電膜を成膜する方法が望まれている。Japanese Patent Application Laid-Open No. 3-188938 discloses a technique for low-temperature film formation by light irradiation, and Japanese Patent Application Laid-Open No. 8-253318 discloses a technique for low-temperature film formation using an acid catalyst and an acid amide. However,
Each of these techniques has problems such as the resistance value of the obtained film is not sufficiently low, the required temperature is still high, and the light irradiation time is long. Therefore, a method of forming a low-resistance transparent conductive film at a lower temperature is desired.
【0007】[0007]
【発明が解決しようとする課題】本発明の目的は,従来
の蒸着法,イオンプレーティング法,スパッタリング法
によった場合よりも低温かつ短時間で,低い抵抗値と高
い可視光透過率を有する金属酸化物系の透明導電膜を形
成することができる方法を提供することである。また,
本発明の目的は,上述したような低温かつ短時間で成膜
され,低い抵抗値と高い可視光透過率を有する金属酸化
物系の透明導電膜を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a low resistance value and a high visible light transmittance at a lower temperature and in a shorter time than in the case of the conventional vapor deposition method, ion plating method and sputtering method. An object of the present invention is to provide a method capable of forming a metal oxide-based transparent conductive film. Also,
An object of the present invention is to provide a metal oxide-based transparent conductive film which is formed at a low temperature and in a short time as described above and has a low resistance value and a high visible light transmittance.
【0008】[0008]
【課題を解決するための手段】本発明の目的は,以下の
手段によって達成された。 (イ) 透明基板上に成膜された金属酸化物系薄膜の製
造法において,金属アルコキシド及び/あるいは金属塩
を含有する液を,(a)零℃以下で加水分解反応させる
工程,及び(b)透明基板上に塗布し,塗布被膜を加熱
する工程を含むことを特徴とする金属酸化物系薄膜の製
造法。 (ロ) (b)工程における塗布被膜の加熱が20℃〜10
0℃であることを特徴とする上記(イ)の金属酸化物系
薄膜の製造法。(ハ) (a)工程で加水分解される金
属アルコキシド及び/又は金属塩を含 有する塗布液に,目的とする金属酸化物微粒子種結晶が
添加されていることを特徴とする上記(イ)ないし
(ロ)の金属酸化物系薄膜の製造法。 (ニ) (b)工程と同時に,もしくは引き続いて塗布
被膜に紫外光及びあるいは可視光を照射することを特徴
とする上記(イ)ないし(ハ)の金属酸化物系薄膜の製
造法。 (ホ) (a)工程で用いられる金属アルコキシド及び
/又は金属塩を含有する塗布液が,インジウムアルコキ
シド及び/又はインジウム塩,及び,スズアルコキシド
及び/又はスズ塩を含有する塗布液であることを特徴と
する上記(イ)ないし(ニ)の金属酸化物系薄膜の製造
法。 (ヘ) 上記(イ)ないし(ホ)の製造法によって製造
された金属酸化物系薄膜。The object of the present invention has been attained by the following means. (A) in a method for producing a metal oxide thin film formed on a transparent substrate, (a) a step of subjecting a liquid containing a metal alkoxide and / or a metal salt to a hydrolysis reaction at a temperature of 0 ° C. or lower; A method for producing a metal oxide-based thin film, comprising a step of coating on a transparent substrate and heating the coating film. (B) The heating of the coating film in the step (b) is from 20 ° C to 10 ° C.
The method for producing a metal oxide-based thin film according to the above (a), wherein the temperature is 0 ° C. (C) The target liquid crystal microparticle seed crystal is added to the coating liquid containing the metal alkoxide and / or metal salt to be hydrolyzed in the step (a), wherein (B) A method for producing a metal oxide thin film. (D) The method for producing a metal oxide-based thin film according to the above (a) to (c), wherein the coating film is irradiated with ultraviolet light and / or visible light simultaneously with or after the step (b). (E) The coating liquid containing the metal alkoxide and / or metal salt used in the step (a) is a coating liquid containing indium alkoxide and / or indium salt and tin alkoxide and / or tin salt. The method for producing a metal oxide thin film according to any one of the above (a) to (d). (F) A metal oxide-based thin film manufactured by the manufacturing method of (a) to (e).
【0009】[0009]
【発明の実施の形態】以下本発明について詳細に説明す
る。本発明の製造法においては,以下の2つのプロセス
を含むものである。金属アルコキシド及び/又は金属塩
を含有する液を,(a)零℃以下で加水分解反応させる
工程(b)続いて,透明基板上に塗布し,塗布被膜を加
熱する工程DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The manufacturing method of the present invention includes the following two processes. (A) a step of subjecting a solution containing a metal alkoxide and / or a metal salt to a hydrolysis reaction at a temperature of 0 ° C. or less; (b) a step of applying the liquid on a transparent substrate and heating the coating film
【0010】本発明において,金属アルコキシド及び/
又は金属塩の例としては,金属メトキシド,金属エトキ
シド,金属プロポキシド,金属イソプロポキシド,金属
ブトキシド等が挙げられる。金属塩の例としては,ギ酸
塩,酢酸塩,シュウ酸塩,硝酸塩,金属ハロゲン化物等
及び/又はこれらの水和物,及びこれらの化合物と,α
−またはβ−ジケトン類,α−又はβ−ケト酸類,前記
ケト酸類のエステル類,α−又はβ−アミノアルコール
類等とのキレート化合物,酸アミド類のようにキレート
より弱い配位を行う化合物との配位化合物,さらには,
前記化合物を中和及び/又は加水分解して得られる水酸
化金属等も含む。In the present invention, a metal alkoxide and / or
Alternatively, examples of metal salts include metal methoxide, metal ethoxide, metal propoxide, metal isopropoxide, metal butoxide and the like. Examples of metal salts include formates, acetates, oxalates, nitrates, metal halides and the like and / or hydrates thereof, and compounds thereof, and α
-Or β-diketones, α- or β-keto acids, esters of the above keto acids, chelate compounds with α- or β-amino alcohols, and compounds that form weaker coordination compounds than chelate such as acid amides And a coordination compound with
It also includes metal hydroxide and the like obtained by neutralizing and / or hydrolyzing the compound.
【0011】本発明において,金属アルコキシド,及び
/又は金属塩を構成する金属の例としては,Li,Be,
B,Na,Mg,Al,Si,K,Ca,Sc,V,Cr,Mn,Fe,Co,N
i,Cu,Zn,Ga,Rb,Sr,Y,Zr,Ti,Nb,Mo,Cd,In,
Sn ,Sb,Cs,Ba,La,Hf,Ta,W,Tl, Pb, Bi,C
e,Pr, Nd, Pm, Sm, Eu, Gd, Tb,Dy, Ho, E
r,Tm,Yb,及びLuなどが挙げられる。これらは単一で
用いられてもよいし,2つ以上組み合わせて用いられて
もよい。これらのうち,好ましくは,B,Mg,Al,Si,C
a,V,Mn,Fe,Cu,Zn,Ga,Sr,Y,Zr,Nb,Cd,In,S
n,Sb,Ba,La,Ta,W, Pb, Bi,及びCeから選ばれ
る。In the present invention, examples of the metal constituting the metal alkoxide and / or the metal salt include Li, Be,
B, Na, Mg, Al, Si, K, Ca, Sc, V, Cr, Mn, Fe, Co, N
i, Cu, Zn, Ga, Rb, Sr, Y, Zr, Ti, Nb, Mo, Cd, In,
Sn, Sb, Cs, Ba, La, Hf, Ta, W, Tl, Pb, Bi, C
e, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, E
r, Tm, Yb, and Lu. These may be used alone or in combination of two or more. Of these, preferably, B, Mg, Al, Si, C
a, V, Mn, Fe, Cu, Zn, Ga, Sr, Y, Zr, Nb, Cd, In, S
Selected from n, Sb, Ba, La, Ta, W, Pb, Bi, and Ce.
【0012】本発明において,塗布液の溶媒としては,
メタノール,エタノール,プロパノール,イソプロピル
アルコール,ブタノールなどのアルコール類,エチレン
グリコール,トリメチレングリコールなどのグリコール
類,アセトン,メチルエチルケトン,ジエチルケトン,
アセチルアセトン,イソホロンなどのケトン類,酢酸エ
チル,酢酸ブチル,酢酸ベンジルなどのエステル類,メ
トキシエタノール,エトキシエタノール等のエーテルア
ルコール類,ジオキサン,テトラヒドロフラン等 のエ
ーテル類,N,N-ジメチルホルムアミド,N,N-ジメチル
アセトアミドなどの酸アミド類,トルエン,キシレン等
の芳香族炭化水素類などが挙げられる。また これら
の,媒体に水が含まれても良い。溶媒の種類及び組成に
おいては,使用する金属アルコキシド及び/あるいは金
属塩に従って選択する。例えば,使用する金属塩が塩化
物であり,その他の添加物が水溶性である場合,水また
は,媒体として水と有機溶媒の混合物を使用し,また,
金属アルコキシドを使用し,その他の添加物が有機溶剤
に可溶性の場合には,媒体としては有機溶剤あるいは有
機溶剤と水の混合物を使用するとよい。In the present invention, the solvent of the coating solution is
Alcohols such as methanol, ethanol, propanol, isopropyl alcohol and butanol, glycols such as ethylene glycol and trimethylene glycol, acetone, methyl ethyl ketone, diethyl ketone,
Ketones such as acetylacetone and isophorone, esters such as ethyl acetate, butyl acetate and benzyl acetate, ether alcohols such as methoxyethanol and ethoxyethanol, ethers such as dioxane and tetrahydrofuran, N, N-dimethylformamide, N, N Acid amides such as -dimethylacetamide; and aromatic hydrocarbons such as toluene and xylene. In addition, water may be contained in these media. The type and composition of the solvent are selected according to the metal alkoxide and / or metal salt used. For example, if the metal salt used is chloride and the other additives are water-soluble, use water or a mixture of water and an organic solvent as a medium;
If a metal alkoxide is used and the other additives are soluble in an organic solvent, the medium may be an organic solvent or a mixture of an organic solvent and water.
【0013】また,以後にのべる乾燥負荷を減らす溶媒
として低沸点化合物を用いることができるが,その揮発
性のため取り扱いには注意を要する。このような例とし
て,アセトンが挙げられる。Although a low-boiling compound can be used as a solvent to reduce the drying load described below, care must be taken in handling due to its volatility. One such example is acetone.
【0014】上記溶媒の使用量は使用する金属アルコキ
シド及び/又は金属塩及び他の添加物の種類によって変
化するが,一般的には,上記金属アルコキシド及び/又
は金属塩及び他の添加物の重量成分が1〜30重量%にす
ることが好ましい。より好ましくは,2〜25重量%であ
り,さらに好ましくは,3〜20重量%である。溶媒の量
が不足すると,塗布性が悪化する等,溶媒の量が多すぎ
ると,得られる金属酸化物系薄膜の膜厚が低下し,欠陥
が生じやすくなる等の問題が生じる。The amount of the solvent used varies depending on the type of the metal alkoxide and / or metal salt and other additives to be used, but generally, the weight of the metal alkoxide and / or metal salt and the other additives is changed. Preferably, the content of the component is 1 to 30% by weight. More preferably, it is 2 to 25% by weight, and still more preferably 3 to 20% by weight. When the amount of the solvent is insufficient, the coatability is deteriorated. For example, when the amount of the solvent is too large, the thickness of the obtained metal oxide-based thin film decreases, and problems such as defects are likely to occur.
【0015】本発明の,金属アルコキシド及び/又は金
属塩を含有する塗布液には他の添加物が含まれても良
い。他の添加物の例としては,得られる塗布物のバイン
ダーとして機能する樹脂などがある。この場合,低温で
崩壊する樹脂,あるいは酸発生剤と併用して酸発生で崩
壊する樹脂が適当である。上記樹脂の使用量が多すぎる
と,得られる金属酸化物系の透明導電膜の膜質が悪化
し,望ましい抵抗値が得られない等の点で不十分であ
る。The coating solution containing a metal alkoxide and / or a metal salt of the present invention may contain other additives. Examples of other additives include resins that function as binders in the resulting coating. In this case, a resin that disintegrates at a low temperature or a resin that disintegrates by acid generation in combination with an acid generator is suitable. If the amount of the resin used is too large, the quality of the resulting metal oxide-based transparent conductive film deteriorates and is insufficient in that a desired resistance value cannot be obtained.
【0016】また,他の添加物としては,金属アルコキ
シド及び/又は金属塩の加水分解を促進する酸触媒,あ
るいは塩基触媒が挙げられる。酸触媒の例としては,塩
酸,硝酸,ホウ酸,ホウフッ化水素酸等の鉱酸,及び/
あるいは,酢酸,トリフルオロ酢酸,p-トルエンスル
ホン酸,メタンスルホン酸等の有機酸などが挙げられ
る。また,光照射によって酸を発生する光酸発生剤も用
いられる。例としては,ジフェニルヨードニウムヘキサ
フルオロホスフェートなどが挙げられる。また,塩基触
媒の例としては,トリエタールアミン,トリエチルアミ
ン,1,8-ジアザビシクロ[5.4.0]-7-ウンデセン,アン
モニア,ホスフィン等が挙げられる。しかしながら,こ
れらの添加量は多いと加水分解反応が加速しすぎて零℃
以下で反応速度を抑制する意味がなくなるので,十分少
ない量を用いるか全く用いない法が好ましい。Further, other additives include an acid catalyst or a base catalyst which promotes hydrolysis of a metal alkoxide and / or a metal salt. Examples of acid catalysts include mineral acids such as hydrochloric acid, nitric acid, boric acid, borofluoric acid, and / or
Alternatively, organic acids such as acetic acid, trifluoroacetic acid, p-toluenesulfonic acid, methanesulfonic acid and the like can be mentioned. In addition, a photoacid generator that generates an acid by light irradiation is also used. Examples include diphenyliodonium hexafluorophosphate and the like. Examples of the base catalyst include trietalamine, triethylamine, 1,8-diazabicyclo [5.4.0] -7-undecene, ammonia, and phosphine. However, if the amount of these additives is large, the hydrolysis reaction will accelerate too much
Since there is no point in suppressing the reaction rate in the following, a method using a sufficiently small amount or not using the amount at all is preferable.
【0017】更に,他の添加物としては,染料,有機顔
料,及び/又はカーボンブラックなどの無機含量を本発
明の目的を損なわない範囲の量加えてもよい。このよう
な着色剤を含むことにより着色された金属酸化物薄膜を
得ることもできる。Further, as other additives, an inorganic content such as a dye, an organic pigment, and / or carbon black may be added in an amount which does not impair the object of the present invention. By containing such a coloring agent, a colored metal oxide thin film can be obtained.
【0018】本発明においては,(a)工程で用いられ
る金属アルコキシド及び/又は金属塩を含有する塗布液
が,零℃以下で加水分解反応された後に塗布されること
が要件である。In the present invention, it is required that the coating solution containing the metal alkoxide and / or the metal salt used in the step (a) is applied after being subjected to a hydrolysis reaction at 0 ° C. or lower.
【0019】零℃以下での加水分解は,反応が遅く,や
や長い時間を必要とするが,得られた溶液もしくはゾル
を用いた塗布を行った場合,結晶化のための加熱温度の
低下が観察される。原因は不明であるが,低温反応での
溶液中の金属−酸素のネットワーク構造もしくはゲルの
ネットワーク構造がアモルファスではあるが,結晶に近
い構造をとっているのではないかと考えられる。反応温
度が低いことは必要であるが,温度が低いほど反応時間
が長く成るため,極端に低温にすることは実用的ではな
い。好ましくは,−30℃〜0℃であり,さらに好まし
くは,−20℃〜0℃である。加水分解時間は、特に限
定されるものではないが、通常1分〜120時間の間で
適宜行われる。The hydrolysis at a temperature of 0 ° C. or lower is slow in the reaction and requires a relatively long time. However, when the obtained solution or sol is used for coating, the heating temperature for crystallization decreases. To be observed. Although the cause is unknown, it is thought that the metal-oxygen network structure or the gel network structure in the solution in the low-temperature reaction is amorphous, but may have a structure close to a crystal. It is necessary that the reaction temperature be low, but the lower the temperature, the longer the reaction time. Therefore, it is not practical to make the temperature extremely low. The temperature is preferably from -30 ° C to 0 ° C, and more preferably from -20 ° C to 0 ° C. Although the hydrolysis time is not particularly limited, it is usually appropriately set in the range of 1 minute to 120 hours.
【0020】本発明において,透明基板とは,ガラス,
有機ポリマー,ガラス繊維強化プラスチックス,セラミ
ックス等からなる,平板,立体物,フィルムをいう。な
かでも有機ポリマーのフィルムが好ましく,例として
は,セルローストリアセテート,セルロースジアセテー
ト,ニトロセルロース,ポリスチレン,ポリエチレンテ
レフタレート,ポリエチレンナフタレート,シンジオタ
クチックポリスチレン,ポリエチレン被覆紙,ポリエー
テルスルホン,ポリアリレート,ポリフッ化ビニリデ
ン,テフロンなどを用いることができる。また,これら
の支持体には温度や湿度の変化によって寸法が変化す
る,いわゆる寸度安定性を向上する目的で,ポリ塩化ビ
ニリデン系ポリマーを含む防水層を設けてもよい。さら
に,ガスバリアーの目的で,有機及び/又は無機化合物
の薄膜を設けてもよい。有機薄膜の例としてはポリビニ
ルアルコール,ポリ(エチレン-co-ビニルアルコール)
等があげられ,無機化合物の例としては,シリカ,アル
ミナ,タルク,バーミキュライト,カオリナイト,雲
母,合成雲母等が挙げられる。また,その他諸機能のた
め基板中に各種有機及び/又は無機添加物が加えられて
いてもよい。In the present invention, the transparent substrate is glass,
A flat plate, three-dimensional object, or film made of organic polymers, glass fiber reinforced plastics, ceramics, etc. Among them, organic polymer films are preferable, and examples thereof include cellulose triacetate, cellulose diacetate, nitrocellulose, polystyrene, polyethylene terephthalate, polyethylene naphthalate, syndiotactic polystyrene, polyethylene coated paper, polyether sulfone, polyarylate, and polyfluoride. Vinylidene, Teflon, or the like can be used. Further, these supports may be provided with a waterproof layer containing a polyvinylidene chloride-based polymer for the purpose of improving the so-called dimensional stability, whose dimensions change with changes in temperature and humidity. Further, a thin film of an organic and / or inorganic compound may be provided for the purpose of gas barrier. Examples of organic thin films are polyvinyl alcohol and poly (ethylene-co-vinyl alcohol)
And examples of the inorganic compound include silica, alumina, talc, vermiculite, kaolinite, mica, and synthetic mica. In addition, various organic and / or inorganic additives may be added to the substrate for other various functions.
【0021】本発明における塗布方法は,スピンコート
法,ディップコート法,スプレーコート法,ロールコー
ト法,スクリーン印刷法等の公知の方法がいずれも使用
することができる。大量生産を安価に行うためには,ロ
ールコートが好ましい。特に,バーを用いる方法,ギー
サーを用いる方法は好ましい方法である。また,パター
ニングを塗布時にできるという点で,スクリーン印刷法
やオフセット印刷法も好ましい。塗布量は,得られる透
明導電膜の用途によって異なるが,一般的には溶媒以外
の有効成分塗量として0.1〜10 ml/m2である。より好ま
しくは,0.2〜7ml/m2であり,さらに好ましくは0.4〜5
ml/m2である。As a coating method in the present invention, any of known methods such as spin coating, dip coating, spray coating, roll coating, and screen printing can be used. For mass production at low cost, roll coating is preferred. Particularly, a method using a bar and a method using a gieser are preferable methods. Also, a screen printing method and an offset printing method are preferable in that the patterning can be performed at the time of coating. The coating amount varies depending on the use of the obtained transparent conductive film, but is generally 0.1 to 10 ml / m 2 as the coating amount of the active ingredient other than the solvent. More preferably from 0.2~7ml / m 2, more preferably 0.4 to 5
ml / m 2 .
【0022】塗布被膜の加熱は溶媒の乾燥とともに,金
属アルコキシドや金属塩の加水分解および脱水縮合のた
めに行われる。塗布後の加熱条件は,基板にダメージを
あたえないために,低温で行われることが好ましい。好
ましくは,20℃〜100℃で行われる。さらに好ましく
は,30℃〜80℃で行われる。加熱時間は、特に限定され
るものではないが、通常1分〜120時間の間で適宜行
われる。The heating of the coating film is performed not only for drying the solvent but also for hydrolysis and dehydration condensation of the metal alkoxide and metal salt. The heating conditions after the application are preferably performed at a low temperature so as not to damage the substrate. Preferably, it is carried out at 20 ° C to 100 ° C. More preferably, it is carried out at 30 ° C to 80 ° C. Although the heating time is not particularly limited, it is usually appropriately performed in the range of 1 minute to 120 hours.
【0023】本発明において,形成された薄膜の機械的
強度が要求される時には,この薄膜の上に保護膜を形成
すればよい。この保護膜を形成する際には,通常の保護
膜形成用塗布液,例えばアルコキシシラン加水分解物を
含むシリカ系被膜形成用塗布液が用いられる。In the present invention, when a mechanical strength of the formed thin film is required, a protective film may be formed on the thin film. When this protective film is formed, a normal coating liquid for forming a protective film, for example, a coating liquid for forming a silica-based film containing an alkoxysilane hydrolyzate is used.
【0024】本発明において,金属アルコキシド及び/
又は金属塩を含有する塗布液に,目的とする金属酸化物
微粒子種結晶が添加されていることは好ましい。金属酸
化物微粒子種結晶の添加割合は,好ましくは,金属アル
コキシド及び/又は金属塩からゾルが生成した場合のゾ
ル重量の10wt%〜90wt%であり,特に好ましくは,10wt%
〜80wt%である。以後に述べるように,本発明において
は,光照射により金属酸化物が結晶化する場合がある
が,この場合は,種結晶が添加されていることにより,
金属酸化物の結晶化がさらに促進する。金属アルコキシ
ド及び/及び/又は金属塩の10wt%〜90wt%の金属酸化物
微粒子種結晶を添加すれば,結晶化の促進に実効があ
る。ホモエピタキシャル成長が関与していると思われ
る。In the present invention, the metal alkoxide and / or
Alternatively, it is preferable that the metal oxide fine particle seed crystal is added to the coating solution containing the metal salt. The addition ratio of the metal oxide fine particle seed crystal is preferably 10 wt% to 90 wt% of the sol weight when the sol was formed from the metal alkoxide and / or the metal salt, and particularly preferably 10 wt%.
~ 80 wt%. As described below, in the present invention, the metal oxide may be crystallized by light irradiation. In this case, since the seed crystal is added,
Crystallization of the metal oxide is further promoted. Addition of 10 wt% to 90 wt% of metal oxide fine particle seed crystals of metal alkoxide and / or metal salt is effective in promoting crystallization. It seems that homoepitaxial growth is involved.
【0025】種結晶の大きさは任意であるが,透過率の
観点から球換算で0.1μm以下が好ましい。Although the size of the seed crystal is arbitrary, it is preferably 0.1 μm or less in terms of sphere from the viewpoint of transmittance.
【0026】加える種結晶は目的とする金属酸化物その
ものでなくても,結晶形が同じ,及び/又は格子定数が
近い値をとるものなど,ヘテロエピタキシャルに都合の
良いものを使用することもできる。例えば,ITO薄膜を
作成する場合,酸化インジウムを種結晶として用いるこ
とができる。The seed crystal to be added may not be the target metal oxide itself, but may be any one that is suitable for heteroepitaxial growth, such as one having the same crystal form and / or having a value close to the lattice constant. . For example, when forming an ITO thin film, indium oxide can be used as a seed crystal.
【0027】上述の種結晶は,市販品を用いても,合成
したものを用いてもよい。金属酸化物薄膜がITOの場
合,市販品では三菱マテリアル製,住友金属鉱山製のも
のなどを用いることができる。合成法については,ゾル
−ゲル法,水熱合成の他通常の焼結などが挙げられる。
ゾル−ゲル法については,「ゾル−ゲル法の科学,作花
済夫,アグネ承風社,1988」,「ゾル−ゲル法による薄
膜コーティング技術,技術情報協会編,1994」や「ゾル
−ゲル法の現状と展望,山根正之監修,技術情報サービ
ス懇談会[ATIS]ゾル−ゲル法リポート刊行会,1992」な
どに詳しく記述されている。As the above seed crystal, a commercially available product or a synthesized product may be used. When the metal oxide thin film is ITO, commercially available products such as those manufactured by Mitsubishi Materials and Sumitomo Metal Mining can be used. Examples of the synthesis method include a sol-gel method, hydrothermal synthesis, and ordinary sintering.
For details on the sol-gel method, see "Sol-gel Method Science, Saio Sakubana, Agne Shofusha, 1988", "Sol-gel Method for Thin Film Coating, Technical Information Association, 1994" and "Sol-Gel Method". The current status and future prospects of the law, supervised by Masayuki Yamane, Technical Information Services Conference [ATIS] Sol-Gel Method Report Publishing Association, 1992 ”, etc. are described in detail.
【0028】本発明においては,塗布膜の加熱時及び/
又は加熱後に,光照射をされるとよい。塗布被膜に紫外
光もしくは可視光を照射する光源は,150nm〜700nmの波
長の光を発生する限りにおいてどんなものを用いてもよ
い。例えば,超高圧水銀ランプ,高圧水銀ランプ,低圧
水銀ランプ,キセノンランプ,ハロゲンランプ,ナトリ
ウムランプなどが挙げられる。好ましくは,超高圧水銀
ランプ,高圧水銀ランプ,低圧水銀ランプ,キセノンラ
ンプである。また,フォトマスクを併用することによっ
て透明導電 性パターンが形成できる。また,レーザー
発振装置を使用することもできる。レーザー発振装置と
しては,エキシマレーザー,アルゴンレーザー,ヘリウ
ムネオンレーザー,半導体レーザー,YAGレーザー,炭
酸ガスレーザー,色素レーザー等が挙げられる。レーザ
ー光を用いた場合,照射部分以外は金属酸化物と成らな
いので,塗布時にスクリーン印刷等を用いることなくパ
ターン形成ができる。また,シンクロトロン放射光を利
用することもできる。これらの装置は,照射したい波長
を考慮して選ぶ事ができる。金属アルコキシド及び/又
は金属塩を含む塗布液の反応を行った場合,金属酸化物
の生成ともに,金属水酸化物も残るが,この金属-OH結
合の吸収を考慮して,400nm以下の紫外光含む光を発生
する装置を用いるとよい。更に,脱水反応が進行して,
メタロキサンネットワークが形成した場合,金属-O-金
属結合の吸収は,金属-OH結合より短波長であるが,金
属-O-金属結合を活性化することができる波長の光照射
によって,金属酸化物の結晶化が促進する。照射時間
は、特に限定されるものではないが、通常1分〜120
時間の間で適宜行われる。In the present invention, when the coating film is heated and / or
Alternatively, light irradiation may be performed after heating. As a light source for irradiating the coating film with ultraviolet light or visible light, any light source may be used as long as light having a wavelength of 150 nm to 700 nm is generated. For example, there are an ultra-high pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a xenon lamp, a halogen lamp, a sodium lamp, and the like. Preferred are an ultra-high pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, and a xenon lamp. In addition, a transparent conductive pattern can be formed by using a photomask together. Further, a laser oscillation device can be used. Examples of the laser oscillation device include an excimer laser, an argon laser, a helium neon laser, a semiconductor laser, a YAG laser, a carbon dioxide laser, and a dye laser. When a laser beam is used, a portion other than the irradiated portion does not become a metal oxide, so that a pattern can be formed without using screen printing or the like at the time of application. Synchrotron radiation can also be used. These devices can be selected in consideration of the wavelength to be irradiated. When a coating solution containing a metal alkoxide and / or a metal salt is reacted, a metal hydroxide is left along with the formation of the metal oxide, but taking into account the absorption of the metal-OH bond, an ultraviolet light of 400 nm or less is considered. It is preferable to use a device that generates light including the light. Furthermore, the dehydration reaction proceeds,
When a metalloxane network is formed, the absorption of the metal-O-metal bond is shorter than that of the metal-OH bond, but the metal oxide is exposed to light of a wavelength that can activate the metal-O-metal bond. The crystallization of the product is accelerated. The irradiation time is not particularly limited, but is usually 1 minute to 120 minutes.
It is done as appropriate during the time.
【0029】本発明において,光照射プロセスでの雰囲
気は自由であるが,ある程度の還元雰囲気で行うことは
好ましい。ある程度の還元雰囲気下では酸素欠陥の増大
によるキャリアー密度の増大及び/又は粒界への酸素分
子の吸着が抑制されたものと考えられる。In the present invention, the atmosphere in the light irradiation process is free, but it is preferable to carry out in a certain reducing atmosphere. It is considered that under a certain reducing atmosphere, an increase in carrier density due to an increase in oxygen vacancies and / or an adsorption of oxygen molecules to grain boundaries was suppressed.
【0030】一方,光照射によって分解する高沸点低分
子量溶媒を使用してもよい。このような例としてイソホ
ロン,酢酸ベンジルが挙げられる。On the other hand, a high boiling point low molecular weight solvent which decomposes by light irradiation may be used. Such examples include isophorone and benzyl acetate.
【0031】また,金属アルコキシド及び/又は金属塩
を含有する液に,添加できるものとして,光照射を行う
場合は,光崩壊製樹脂なども用いることができる。例え
ば,ポリメチルビニルケトン,ポリビニルフェニルケト
ン,ポリスルホン,p-ジアゾジフェニルアミン・パラ
ホルムアルデヒド重縮合物等のジアゾニウム塩類,1,2
-ナフトキノン-2-ジアジド-5-スルホン酸イソブチルエ
ステルなどのキノンジアジド類,ポリメチルメタクリレ
ート,ポリフェニルメチルシラン,ポリメチルイソプロ
ぺニルケトンなどが挙げられる。上記樹脂の場合,金属
アルコキシドもしくは金属塩の合計100重量部あたり0〜
1000重量部の割合で使用することが望ましい。上記樹脂
の使用量が多すぎると,得られる金属酸化物系の透明導
電膜の膜質が悪化し,望ましい抵抗値が得られない等の
点で不十分である。When light irradiation is performed as a material that can be added to a liquid containing a metal alkoxide and / or a metal salt, a resin made by photolysis can be used. For example, diazonium salts such as polymethyl vinyl ketone, polyvinyl phenyl ketone, polysulfone, p-diazodiphenylamine / paraformaldehyde polycondensate, 1,2
Quinonediazides such as -naphthoquinone-2-diazide-5-sulfonic acid isobutyl ester; polymethyl methacrylate; polyphenylmethylsilane; polymethylisopropenyl ketone; In the case of the above resin, 0 to 100 parts by weight of total metal alkoxide or metal salt
It is desirable to use 1000 parts by weight. If the amount of the resin used is too large, the quality of the resulting metal oxide-based transparent conductive film deteriorates and is insufficient in that a desired resistance value cannot be obtained.
【0032】更に,光照射を行う場合に,照射光波長と
金属アルコキシド,金属塩及び/又はこれらのキレート
化合物の吸収波長が異なる場合に,金属アルコキシド及
び/又は金属塩を含有する液に他の添加物として光増感
剤を加えるとよい。Further, when the light irradiation is performed, when the wavelength of the irradiated light is different from the absorption wavelength of the metal alkoxide, the metal salt and / or the chelate compound thereof, another liquid containing the metal alkoxide and / or the metal salt is added to the liquid. It is preferable to add a photosensitizer as an additive.
【0033】本発明においては,金属アルコキシド及び
/あるいは金属塩を含有する塗布液が,インジウムアル
コキシド及び/又はインジウム塩,及び/又は,スズア
ルコキシド及びスズ塩を含有する塗布液であることが好
ましい。インジウムアルコキシドの例としては,インジ
ウムメトキシド,インジウムエトキシド,インジウムプ
ロポキシド,インジウムイソプロポキシド,インジウム
ブトキシド等が挙げられる。インジウム塩の例として
は,ギ酸インジウム,酢酸インジウム,シュウ酸インジ
ウム,硝酸インジウム,塩化インジウム等及び/又はこ
れらの水和物,及びこれらの化合物と,α−またはβ−
ジケトン類,α−又はβ−ケト酸類,前記ケト酸類のエ
ステル類,α−又はβ−アミノアルコール等とのキレー
ト化合物,酸アミド類のようにキレートより弱い配位を
行う化合物との配位化合物,さらには,前記化合物を中
和及び/又は加水分解して得られる水酸化インジウム等
も含む。スズアルコキシドの例としては,スズメトキシ
ド,スズエトキシド,スズプロポキシド,スズイソプロ
ポキシド,スズブトキシド等が挙げられる。スズ塩の例
としては,ギ酸スズ,酢酸スズ,シュウ酸スズ,硝酸ス
ズ,塩化スズ等及び/又はこれらの水和物,及びこれら
の化合物と,α−またはβ−ジケトン類,α−又はβ−
ケト酸類,前記ケト酸類のエステル類,α−又はβ−ア
ミノアルコール等とのキレート化合物,酸アミド類のよ
うにキレートより弱い配位を行う化合物との配位化合
物,さらには,前記化合物を中和及び/又は加水分解し
て得られる水酸化スズ等も含む。In the present invention, the coating solution containing a metal alkoxide and / or a metal salt is preferably a coating solution containing an indium alkoxide and / or an indium salt and / or a tin alkoxide and a tin salt. Examples of indium alkoxide include indium methoxide, indium ethoxide, indium propoxide, indium isopropoxide, indium butoxide and the like. Examples of indium salts include indium formate, indium acetate, indium oxalate, indium nitrate, indium chloride, and / or hydrates thereof, and compounds thereof, and α- or β-
Coordination compounds with diketones, α- or β-keto acids, esters of the keto acids, chelate compounds with α- or β-aminoalcohols, and compounds such as acid amides that perform coordination weaker than chelate And indium hydroxide obtained by neutralizing and / or hydrolyzing the compound. Examples of the tin alkoxide include tin methoxide, tin ethoxide, tin propoxide, tin isopropoxide, tin butoxide and the like. Examples of tin salts include tin formate, tin acetate, tin oxalate, tin nitrate, tin chloride, and / or hydrates thereof, and compounds thereof, and α- or β-diketones, α- or β. −
Keto acids, esters of the keto acids, chelate compounds with α- or β-aminoalcohols, coordination compounds with compounds that perform weaker coordination than chelate such as acid amides, Also includes tin hydroxide obtained by summing and / or hydrolyzing.
【0034】上記,インジウム化合物とスズ化合物が用
いられた場合の比率は,インジウムとスズの原子比にお
いて,インジウム/スズ=99/1〜 80/20であることが好
ましい。さらに好ましくは,インジウム/スズ=97/3〜85
/15である。スズの量が減ると,キャリアー密度が低く
なり,導電性が悪化する等の点で不十分であり,一方,
スズの量が増えるとキャリアーの散乱が起こるため,キ
ャリアー移動度が低下して導電性が悪化する等の点で不
十分である。When the indium compound and the tin compound are used, the ratio is preferably indium / tin = 99/1 to 80/20 in atomic ratio of indium to tin. More preferably, indium / tin = 97/3 to 85
/ 15. When the amount of tin decreases, the carrier density decreases and the conductivity deteriorates, which is insufficient.
When the amount of tin increases, carrier scattering occurs, which is insufficient in that the carrier mobility decreases and the conductivity deteriorates.
【0035】本発明の金属酸化物薄膜は,例えば液晶パ
ネル,タッチパネル,太陽電池,さらには無機及び有機
ELの材料として用いることができる。The metal oxide thin film of the present invention can be used for, for example, liquid crystal panels, touch panels, solar cells, and inorganic and organic
It can be used as EL material.
【0036】次に,本発明の金属酸化物薄膜の製造法の
例を具体的に示すが,本発明はこれらに限定されるもの
ではない。Next, specific examples of the method for producing a metal oxide thin film of the present invention will be specifically described, but the present invention is not limited to these.
【0037】(表面抵抗及び比抵抗値の測定)表面抵抗
は,三菱化学(株)製 LORESTA-FPを用いて四探針法に
よって測定した。 (膜厚の測定)膜厚は,王水エッチングしたサンプルを
用いて表面形状顕微鏡(キーエンス社)測定するか,も
しくは,SEM〔JEOL JSM-5400;加速電圧:20kV〕断面を
測定することにより求めた。 (透過率の測定)550nmの透過率を,自記分光光度計UV2
400-PC(島津製)用いて測定した。 (X線回折測定)粉末X線回折装置(理学電気(株)
製)を用いて測定した(広角ゴニオメータ使用,CuKα
線,2θ/θスキャン)。(Measurement of Surface Resistance and Specific Resistance) The surface resistance was measured by a four-probe method using LORESTA-FP manufactured by Mitsubishi Chemical Corporation. (Measurement of film thickness) The film thickness is obtained by measuring with a surface profile microscope (Keyence Corporation) using a sample that has been etched with aqua regia, or by measuring the cross section of an SEM [JEOL JSM-5400; accelerating voltage: 20 kV]. Was. (Measurement of transmittance) Measure the transmittance at 550 nm with a self-recording spectrophotometer UV2.
It measured using 400-PC (made by Shimadzu). (X-ray diffraction measurement) Powder X-ray diffractometer (Rigaku Denki Co., Ltd.)
(With wide angle goniometer, CuKα)
Line, 2θ / θ scan).
【0038】実施例−1 ITO薄膜の合成 インジウムイソプロポキシド(In(OC3H7)3)とスズイ
ソプロポキシド(Sn(OC3H7)4)をインジウムとスズの
原子比においてIn/Sn=0.93/0.07となるように混合し,
イソプロピルアルコールに加え,酢酸を添加して,零℃
で30時間加水分解した。この液を,ホウケイ酸ガラス
(1mm厚)およびポリエチレンテレフタレート(PET;17
5μm厚)にワイアーバーにより塗布し,80℃に30分加熱
した。Example 1 Synthesis of ITO Thin Film Indium isopropoxide (In (OC 3 H 7 ) 3 ) and tin isopropoxide (Sn (OC 3 H 7 ) 4 ) were converted to In / tin at an atomic ratio of In / tin. Mix so that Sn = 0.93 / 0.07,
Add acetic acid to isopropyl alcohol, and add 0 ℃
For 30 hours. This solution was mixed with borosilicate glass (1 mm thick) and polyethylene terephthalate (PET;
(5 μm thickness) with a wire bar and heated to 80 ° C. for 30 minutes.
【0039】実施例−2 塗布液に,ITO微粒子(住友金属製)を,インジウム及
びスズのイソプロポキシドからゾルが生成した場合のゾ
ル重量の10wt%加えたこと以外は,実施例−1と同様な
操作を行った。Example 2 Example 1 was repeated except that ITO fine particles (manufactured by Sumitomo Metal) were added to the coating solution in an amount of 10 wt% of the sol weight when a sol was formed from indium and tin isopropoxide. A similar operation was performed.
【0040】実施例−3 加熱時に低圧水銀等で光照射したこと以外は,実施例−
1と同様な操作を行った。Example 3 Example 3 was repeated except that light was irradiated with low-pressure mercury during heating.
Operation similar to 1 was performed.
【0041】比較例−1 塗布前の加水分解を40℃で行う以外は,実施例−1と同
様な操作を行った。Comparative Example 1 The same operation as in Example 1 was performed except that the hydrolysis before coating was performed at 40 ° C.
【0042】比較例−2 塗布前の加水分解を40℃で行い,塗布後の加熱を500℃
で行う以外は,実施例−1と同様な操作を行った。Comparative Example 2 Hydrolysis before coating was performed at 40 ° C., and heating after coating was performed at 500 ° C.
The same operation as in Example 1 was performed except that the above operation was performed.
【0043】結果を表1にまとめた。また,試料11のX
線回折図を図1に示した。The results are summarized in Table 1. The X of sample 11
The line diffraction pattern is shown in FIG.
【0044】[0044]
【表1】 [Table 1]
【0045】表1から明らかな様に本発明の試料は,低
温短時間で成膜され,抵抗値も低く,透過率も高いこと
がわかる。As is clear from Table 1, the sample of the present invention is formed at a low temperature and in a short time, and has a low resistance value and a high transmittance.
【0046】[0046]
【発明の効果】本発明の製造法を使用することにより,
金属酸化物系の透明導電膜を低温かつ短時間で形成する
ことができ,得られた透明導電膜の比抵抗が低く,可視
光透過率が高いことが分かった。By using the manufacturing method of the present invention,
It was found that a metal oxide-based transparent conductive film could be formed at a low temperature in a short time, and the obtained transparent conductive film had a low specific resistance and a high visible light transmittance.
【図1】試料11のX線回折図を示す。FIG. 1 shows an X-ray diffraction diagram of Sample 11.
【手続補正書】[Procedure amendment]
【提出日】平成9年11月6日[Submission date] November 6, 1997
【手続補正1】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0016[Correction target item name] 0016
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【0016】また,他の添加物としては,金属アルコキ
シド及び/又は金属塩の加水分解を促進する酸触媒,あ
るいは塩基触媒が挙げられる。酸触媒の例としては,塩
酸,硝酸,ホウ酸,ホウフッ化水素酸等の鉱酸,及び/
あるいは,酢酸,トリフルオロ酢酸,p-トルエンスル
ホン酸,メタンスルホン酸等の有機酸などが挙げられ
る。また,光照射によって酸を発生する光酸発生剤も用
いられる。例としては,ジフェニルヨードニウムヘキサ
フルオロホスフェートなどが挙げられる。また,塩基触
媒の例としては,トリエタールアミン,トリエチルアミ
ン,1,8-ジアザビシクロ[5.4.0]-7-ウンデセン,アン
モニア,ホスフィン等が挙げられる。しかしながら,こ
れらの添加量は多いと加水分解反応が加速しすぎて零℃
以下で反応速度を抑制する意味がなくなるので,十分少
ない量を用いるか全く用いないことが好ましい。Further, other additives include an acid catalyst or a base catalyst which promotes hydrolysis of a metal alkoxide and / or a metal salt. Examples of acid catalysts include mineral acids such as hydrochloric acid, nitric acid, boric acid, borofluoric acid, and / or
Alternatively, organic acids such as acetic acid, trifluoroacetic acid, p-toluenesulfonic acid, methanesulfonic acid and the like can be mentioned. In addition, a photoacid generator that generates an acid by light irradiation is also used. Examples include diphenyliodonium hexafluorophosphate and the like. Examples of the base catalyst include trietalamine, triethylamine, 1,8-diazabicyclo [5.4.0] -7-undecene, ammonia, and phosphine. However, if the amount of these additives is large, the hydrolysis reaction will accelerate too much
Since it is meaningless to suppress the reaction rate below, it is preferable to use a sufficiently small amount or not to use it at all.
Claims (6)
膜の製造法において,金属アルコキシド及び/又は金属
塩を含有する液を,(a)零℃以下で加水分解反応させ
る工程,及び(b)透明基板上に塗布し,塗布被膜を加
熱する工程を含むことを特徴とする金属酸化物系薄膜の
製造法。1. A method for producing a metal oxide thin film formed on a transparent substrate, comprising: (a) hydrolyzing a solution containing a metal alkoxide and / or a metal salt at a temperature of 0 ° C. or lower; (B) A method for producing a metal oxide-based thin film, comprising a step of applying the composition on a transparent substrate and heating the applied film.
℃〜100℃であることを特徴とする請求項1記載の金属
酸化物系薄膜の製造法。2. The method according to claim 2, wherein the heating of the coating film in step (b)
The method for producing a metal oxide-based thin film according to claim 1, wherein the temperature is from 100C to 100C.
キシド及び/又は金属塩を含有する塗布液に,目的とす
る金属酸化物微粒子種結晶が添加されていることを特徴
とする請求項1ないし2記載の金属酸化物系薄膜の製造
法。3. The method according to claim 1, wherein a seed crystal of the desired metal oxide fine particles is added to a coating solution containing a metal alkoxide and / or a metal salt to be hydrolyzed in the step (a). 3. The method for producing a metal oxide-based thin film according to any one of claims 1 to 2.
て塗布被膜に紫外光及び/又は可視光を照射することを
特徴とする請求項1ないし3記載の金属酸化物系薄膜の
製造法。4. The method for producing a metal oxide thin film according to claim 1, wherein the coating film is irradiated with ultraviolet light and / or visible light simultaneously with or after the step (b).
ド及び/又は金属塩を含有する塗布液が,インジウムア
ルコキシド及び/又はインジウム塩,及び,スズアルコ
キシド及び/又はスズ塩を含有する塗布液であることを
特徴とする請求項1ないし4記載の金属酸化物系薄膜の
製造法。5. The coating solution containing a metal alkoxide and / or metal salt used in the step (a) is a coating solution containing indium alkoxide and / or indium salt and tin alkoxide and / or tin salt. 5. The method for producing a metal oxide-based thin film according to claim 1, wherein:
製造された金属酸化物系薄膜。6. A metal oxide-based thin film produced by the production method according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26702897A JPH11106934A (en) | 1997-09-30 | 1997-09-30 | Production of metal oxide thin film and metal oxide thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26702897A JPH11106934A (en) | 1997-09-30 | 1997-09-30 | Production of metal oxide thin film and metal oxide thin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11106934A true JPH11106934A (en) | 1999-04-20 |
Family
ID=17439058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26702897A Pending JPH11106934A (en) | 1997-09-30 | 1997-09-30 | Production of metal oxide thin film and metal oxide thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11106934A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005510073A (en) * | 2001-11-15 | 2005-04-14 | スペクトラ インコーポレイテッド | Directed piezoelectric film |
| DE102009009337A1 (en) | 2009-02-17 | 2010-08-19 | Evonik Degussa Gmbh | Process for the preparation of semiconductive indium oxide layers, indium oxide layers produced by the process and their use |
| DE102009009338A1 (en) | 2009-02-17 | 2010-08-26 | Evonik Degussa Gmbh | Indium alkoxide-containing compositions, process for their preparation and their use |
| JPWO2014119680A1 (en) * | 2013-01-31 | 2017-01-26 | 日産化学工業株式会社 | Glass substrate and device using the same |
-
1997
- 1997-09-30 JP JP26702897A patent/JPH11106934A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005510073A (en) * | 2001-11-15 | 2005-04-14 | スペクトラ インコーポレイテッド | Directed piezoelectric film |
| DE102009009337A1 (en) | 2009-02-17 | 2010-08-19 | Evonik Degussa Gmbh | Process for the preparation of semiconductive indium oxide layers, indium oxide layers produced by the process and their use |
| DE102009009338A1 (en) | 2009-02-17 | 2010-08-26 | Evonik Degussa Gmbh | Indium alkoxide-containing compositions, process for their preparation and their use |
| WO2010094583A1 (en) | 2009-02-17 | 2010-08-26 | Evonik Degussa Gmbh | Method for producing semiconducting indium oxide layers, indium oxide layers produced according to said method and their use |
| WO2010094581A1 (en) | 2009-02-17 | 2010-08-26 | Evonik Degussa Gmbh | Compositions containing indium alkoxide, method for the production thereof, and use thereof |
| KR20110131179A (en) * | 2009-02-17 | 2011-12-06 | 에보니크 데구사 게엠베하 | Compositions containing indium alkoxides, methods for their preparation and uses thereof |
| JP2012518087A (en) * | 2009-02-17 | 2012-08-09 | エボニック デグサ ゲーエムベーハー | Indium alkoxide-containing composition, process for producing the composition and use of the composition |
| JPWO2014119680A1 (en) * | 2013-01-31 | 2017-01-26 | 日産化学工業株式会社 | Glass substrate and device using the same |
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