JPH11109384A - Sealing and sealing materials for liquid crystal cells - Google Patents
Sealing and sealing materials for liquid crystal cellsInfo
- Publication number
- JPH11109384A JPH11109384A JP27252897A JP27252897A JPH11109384A JP H11109384 A JPH11109384 A JP H11109384A JP 27252897 A JP27252897 A JP 27252897A JP 27252897 A JP27252897 A JP 27252897A JP H11109384 A JPH11109384 A JP H11109384A
- Authority
- JP
- Japan
- Prior art keywords
- sealing material
- weight
- parts
- liquid crystal
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003566 sealing material Substances 0.000 title claims abstract description 56
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 22
- 210000002858 crystal cell Anatomy 0.000 title claims abstract description 18
- 238000007789 sealing Methods 0.000 title description 5
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 239000000178 monomer Substances 0.000 claims abstract description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 7
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003999 initiator Substances 0.000 claims abstract description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 210000004027 cell Anatomy 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- -1 2-ethylhexyl Chemical group 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- FDMRENBOOJPTAN-UHFFFAOYSA-N NCCC[Si](N)(N)N Chemical class NCCC[Si](N)(N)N FDMRENBOOJPTAN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical group CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- WSTZPWUPYWHZRR-UHFFFAOYSA-N ethene;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical group C=C.CCC(CO)(CO)CO WSTZPWUPYWHZRR-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- RQAGEUFKLGHJPA-UHFFFAOYSA-N prop-2-enoylsilicon Chemical compound [Si]C(=O)C=C RQAGEUFKLGHJPA-UHFFFAOYSA-N 0.000 description 1
- JOLPFRQHFARWCF-UHFFFAOYSA-N propane-1,2,3-triol;prop-1-ene Chemical group CC=C.OCC(O)CO JOLPFRQHFARWCF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(57)【要約】
【課題】 密着性、耐湿性、可撓性にすぐれた硬化層を
形成する液晶セル用の紫外線硬化型のシール材及び封孔
材を提供する。
【構成】 (A)エポキシアクリレートオリゴマー
100重量部
(B)常温で液状のエポキシ樹脂
5〜120重量部
(C)重合性不飽和モノマー
0〜 80重量部
(D)シランカップリング剤
1〜 50重量部
及び
(E)光重合開始剤
0.1〜10重量部
からなる液晶セル用の紫外線硬化型シール材または封孔
材。(57) [Problem] To provide a UV-curable sealing material and a sealing material for a liquid crystal cell which form a cured layer having excellent adhesion, moisture resistance and flexibility. [Constitution] (A) Epoxy acrylate oligomer
100 parts by weight (B) Epoxy resin liquid at room temperature
5 to 120 parts by weight (C) polymerizable unsaturated monomer
0 to 80 parts by weight (D) silane coupling agent
1 to 50 parts by weight and (E) a photopolymerization initiator
An ultraviolet-curable sealing material or sealing material for a liquid crystal cell comprising 0.1 to 10 parts by weight.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、密着性、耐湿性、
可撓性等に優れた硬化層を形成する液晶セル用の紫外線
硬化型のシール材及び封孔材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to adhesiveness, moisture resistance,
The present invention relates to an ultraviolet-curable sealing material and a sealing material for a liquid crystal cell which form a cured layer having excellent flexibility and the like.
【0002】[0002]
【従来の技術】液晶セルは、通常、周辺がシール材層で
囲まれた一対の電極基板間隙に、シール材層の切れ目か
らなる注入孔より液晶を注入し、しかる後、注入孔を封
孔材にて封孔処理して製造されている。2. Description of the Related Art In a liquid crystal cell, liquid crystal is usually injected into a gap between a pair of electrode substrates whose periphery is surrounded by a sealing material layer from an injection hole formed by a cut in the sealing material layer, and then the injection hole is sealed. It is manufactured by sealing with a material.
【0003】ところで、従来シール材としては有機系材
料、特に二液型エポキシ樹脂組成物、一液型エポキシ樹
脂組成物が主として使用されている。[0003] Conventionally, organic materials, particularly two-pack type epoxy resin compositions and one-pack type epoxy resin compositions, have been mainly used as seal materials.
【0004】しかしながら二液型エポキシ樹脂組成物
は、ポットライフが短かく、増粘し易いためにロット毎
に調製する必要があり、生産効率が悪いという問題点が
あった。一方一液型エポキシ樹脂組成物は150〜20
0℃の高温で、数十分間加熱する必要があるため、やは
り、生産効率が不十分であるという問題点があった。However, the two-pack type epoxy resin composition has a problem that the pot life is short and the viscosity tends to increase, so that it has to be prepared for each lot, and the production efficiency is poor. On the other hand, the one-pack type epoxy resin composition is 150 to 20.
Since it is necessary to heat at a high temperature of 0 ° C. for several tens of minutes, the production efficiency is still insufficient.
【0005】また従来封孔材としては、二液型エポキシ
樹脂組成物、紫外線硬化型樹脂組成物が主として使用さ
れている。Conventionally, two-pack type epoxy resin compositions and ultraviolet-curable resin compositions have been mainly used as sealing materials.
【0006】しかしながら二液型エポキシ樹脂組成物
は、シール材で述べたのと同様に生産効率が悪く、一方
紫外線硬化型樹脂組成物は、電極基板への密着性、耐湿
性等が不十分であったり、硬化収縮によるセルギャップ
の歪の発生、剥離等が生じやすいという問題点があっ
た。However, the production efficiency of the two-pack type epoxy resin composition is poor as described for the sealing material, while the ultraviolet-curable resin composition has insufficient adhesion to the electrode substrate and moisture resistance. Also, there is a problem that distortion of a cell gap due to curing shrinkage, peeling, and the like are likely to occur.
【0007】[0007]
【発明が解決しようとする課題】本発明は、上記の様な
諸問題を解決するものであり、紫外線硬化型シール材や
封孔材の短時間で、かつ常温で、紫外線照射により硬化
する特徴を生かしつつ、密着性、耐湿性、可撓性等に優
れた硬化層を形成するシール材及び封孔材を提供するこ
とを目的とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and is characterized in that a UV-curable sealing material or sealing material is cured by UV irradiation in a short time at room temperature. It is an object of the present invention to provide a sealing material and a sealing material which form a cured layer excellent in adhesion, moisture resistance, flexibility and the like while utilizing the above.
【0008】[0008]
【課題を解決するための手段】本発明者等は、上記目的
を達成するために鋭意検討の結果、エポキシアクリレー
トオリゴマーを主成分とする紫外線硬化型組成物に、エ
ポキシ樹脂とシランカップリング剤を配合すれば上記目
的が達成されることを見い出し、本発明に到達した。Means for Solving the Problems The present inventors have made intensive studies to achieve the above object, and as a result, an epoxy resin and a silane coupling agent were added to an ultraviolet-curable composition containing an epoxy acrylate oligomer as a main component. It has been found that the above objects can be achieved by blending, and the present invention has been achieved.
【0009】すなわち、本発明は、 (A)エポキシアクリレートオリゴマー 100重量部、 (B)常温で液状のエポキシ樹脂 5〜120重量部、 (C)重合性不飽和モノマー 0〜 80重量部、 (D)シランカップリング剤 1〜 50重量部、 及び (E)光重合開始剤 0.1〜 10重量部 からなる液晶セル用の紫外線硬化型シール材又は封孔材
に関するものである。That is, the present invention relates to (A) 100 parts by weight of an epoxy acrylate oligomer, (B) 5 to 120 parts by weight of an epoxy resin which is liquid at room temperature, (C) 0 to 80 parts by weight of a polymerizable unsaturated monomer, (D) ) A silane coupling agent of 1 to 50 parts by weight, and (E) a photopolymerization initiator of 0.1 to 10 parts by weight.
【0010】[0010]
【発明の実施の形態】以下本発明の液晶セル用の紫外線
硬化型シール材及び封孔材の組成物について説明する。BEST MODE FOR CARRYING OUT THE INVENTION The composition of a UV-curable sealing material and a sealing material for a liquid crystal cell of the present invention will be described below.
【0011】本発明で使用するエポキシアクリレートオ
リゴマー〔以下(A)成分という〕は、ポリエポキシド
を化学量論的当量のアクリル酸又はメタクリル酸と反応
させることにより製造される。ポリエポキシドとして
は、エポキシ基を2個以上有する従来から公知のポリエ
ポキシドが利用出来、具体的には、ビスフェノールA、
ビスフェノールF、等にエピクロルヒドリンを反応させ
て得られるビスフェノール型ポリエポキシド;ノボラッ
ク樹脂にエピクロルヒドリンを反応して得られるノボラ
ック型ポリエポキシド;ブタジエンとクロトンアルデヒ
ドとの反応生成物を過酢酸によりエポキシ化させて得ら
れる環式脂肪族ポリエポキシド等が代表的なものとして
挙げられるが、これらに限定されるものではない。The epoxy acrylate oligomer (hereinafter referred to as "component (A)") used in the present invention is produced by reacting a polyepoxide with a stoichiometric equivalent of acrylic acid or methacrylic acid. As the polyepoxide, a conventionally known polyepoxide having two or more epoxy groups can be used, and specifically, bisphenol A,
Bisphenol-type polyepoxide obtained by reacting epichlorohydrin with bisphenol F, etc .; Novolak-type polyepoxide obtained by reacting epichlorohydrin with a novolak resin; Ring obtained by epoxidizing the reaction product of butadiene with crotonaldehyde with peracetic acid Representative examples include, but are not limited to, formula aliphatic polyepoxides.
【0012】またエポキシアクリレートオリゴマーは、
例えばエチレンオキサイド変性物であってもよい。The epoxy acrylate oligomer also comprises
For example, it may be a modified ethylene oxide.
【0013】なお、エポキシアクリレートオリゴマーは
常温で液状のものが好ましいが、固形であっても後述す
る重合性不飽和モノマーに溶解するものであれば使用可
能である。The epoxy acrylate oligomer is preferably liquid at room temperature, but any solid can be used as long as it is soluble in the polymerizable unsaturated monomer described below.
【0014】本発明で使用する常温で液状のエポキシ樹
脂〔以下(B)成分という〕は、シール材、封孔材に可
撓性をもたせ、電極基板の多少の伸縮に対して追従性を
よくし、また耐衝撃性をよくするために配合するもので
あり、通常エポキシ当量が172〜226、好ましくは
172〜190のものが適当である。The epoxy resin which is liquid at room temperature (hereinafter referred to as component (B)) used in the present invention imparts flexibility to the sealing material and the sealing material, and has good follow-up properties to some extent of expansion and contraction of the electrode substrate. It is blended to improve the impact resistance, and usually has an epoxy equivalent of 172 to 226, preferably 172 to 190.
【0015】具体的には、ビスフェノールA型エポキシ
樹脂、ビスフェノールF型エポキシ樹脂等のビスフェノ
ール型エポキシ樹脂、フェノールノボラック型エポキシ
樹脂、オルソクレゾールノボラック型エポキシ樹脂等の
ノボラック型エポキシ樹脂、環式脂肪族エポキシ樹脂、
複素環式エポキシ樹脂等が代表的なものとして挙げられ
る。Specifically, bisphenol-type epoxy resins such as bisphenol A-type epoxy resin and bisphenol F-type epoxy resin, novolak-type epoxy resins such as phenol novolak-type epoxy resin, ortho-cresol novolak-type epoxy resin, and cycloaliphatic epoxy resin,
Heterocyclic epoxy resins are typical examples.
【0016】本発明で使用する重合性不飽和モノマー
〔以下(C)成分という〕は、塗布作業性や封孔作業性
を向上させるとともに各種物理的、化学的強度を向上さ
せるために配合するものであり、重合性不飽和基を少な
くとも1個以上、好ましくは2〜3個有するモノマーで
ある。The polymerizable unsaturated monomer (hereinafter referred to as "component (C)") used in the present invention is compounded to improve coating workability and sealing workability and to improve various physical and chemical strengths. And a monomer having at least one, and preferably two to three, polymerizable unsaturated groups.
【0017】具体的には、トリメチロールプロパントリ
(メタ)アクリレート、トリメチロールプロパン−エチ
レンオキシド付加トリ(メタ)アクリレート、グリセリ
ン−プロピレンオキシド付加トリ(メタ)アクリレート
等の重合性不飽和基を3個有するモノマー、テトラエチ
レングリコールジ(メタ)アクリレート、トリプロピレ
ングリコールジ(メタ)アクリレート、1,4−ブタン
ジオールジ(メタ)アクリレート、1,6−ヘキサンジ
オールジ(メタ)アクリレート、ネオペンチルグリコー
ルジ(メタ)アクリレート、トリエチレングリコールジ
(メタ)アクリレート等の重合性不飽和基を2個有する
モノマー、2−エチルヘキシル(メタ)アクリレート、
ジプロピレングリコールモノ(メタ)アクリレート、メ
チル(メタ)アクリレート、エチル(メタ)アクリレー
ト、プロピル(メタ)アクリレート、等の重合性不飽和
基を1個有するモノマーが代表的なものとして挙げられ
る。Specifically, it has three polymerizable unsaturated groups such as trimethylolpropane tri (meth) acrylate, trimethylolpropane-ethylene oxide-added tri (meth) acrylate, and glycerin-propylene oxide-added tri (meth) acrylate. Monomers, tetraethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) A) a monomer having two polymerizable unsaturated groups, such as acrylate and triethylene glycol di (meth) acrylate, 2-ethylhexyl (meth) acrylate,
Typical examples include monomers having one polymerizable unsaturated group such as dipropylene glycol mono (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, and propyl (meth) acrylate.
【0018】本発明で使用するシランカップリング剤
〔以下(D)成分という〕は、電極基板との密着性を向
上させるために配合するものである。The silane coupling agent (hereinafter referred to as "component (D)") used in the present invention is compounded to improve the adhesion to the electrode substrate.
【0019】(D)成分の具体例としては、ビニルトリ
ス(βメトキシエトキシ)シラン、ビニルトリエトキシ
シラン、ビニルトリメトキシシラン、ビニルトリメトキ
シシラン等のビニルシラン系、γ−メタクリロキシプロ
ピルトリメトキシシラン等のアクリルシラン系、β−
(3,4エポキシシクロヘキシル)エチルトリメトキシ
シラン、γ−グリシドキシプロピルトリメトキシシラ
ン、γ−グリシドキシプロピルメチルジエトキシシラン
等のエポキシシラン系、N−β(アミノエチル)γ−ア
ミノプロピルトリメトキシシラン、γ−アミノプロピル
トリエトキシシラン、N−フェニル−γ−アミノプロピ
ルトリメトキシシラン等のアミノシラン系、その他γ−
メルカプトプロピルトリメトキシシラン、γ−クロロプ
ロピルトリメトキシシラン等のシランカップリング剤が
代表的なものとして挙げられる。特に本発明においては
重合性不飽和基を含有するビニルシラン系、アクリルシ
ラン系が密着性向上だけでなく、緻密な層を形成するた
め耐湿性等も向上するので好ましい。Specific examples of the component (D) include vinylsilanes such as vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane and vinyltrimethoxysilane, and γ-methacryloxypropyltrimethoxysilane and the like. Acrylic silane, β-
Epoxysilanes such as (3,4 epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, N-β (aminoethyl) γ-aminopropyltri Aminosilanes such as methoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, and other γ-
Typical examples include silane coupling agents such as mercaptopropyltrimethoxysilane and γ-chloropropyltrimethoxysilane. In particular, in the present invention, vinylsilane-based and acrylsilane-based polymers containing a polymerizable unsaturated group are preferred because not only the adhesion is improved, but also the moisture resistance and the like are improved because a dense layer is formed.
【0020】本発明で使用する光重合開始剤〔以下
(E)成分という〕は、紫外線のエネルギーによりフリ
ーラジカルを発生し、上記(A)成分、(C)成分及び
重合性不飽和基を有する(D)成分とをラジカル重合さ
せ、シール材、封孔材を硬化させるために配合するもの
である。The photopolymerization initiator (hereinafter referred to as the component (E)) used in the present invention generates free radicals by the energy of ultraviolet rays and has the components (A), (C) and a polymerizable unsaturated group. It is compounded to radically polymerize the component (D) and cure the sealing material and the sealing material.
【0021】(E)成分としては、従来から公知の各種
化合物が特に制限なく使用可能であるが、具体的には、
ベンゾイン、ベンゾフェノン、アセトフェノンあるいは
これらのエステルやエーテルなどの誘導体が代表的なも
のとして挙げられる。As the component (E), various known compounds can be used without any particular limitation.
Representative examples include benzoin, benzophenone, acetophenone, and derivatives thereof such as esters and ethers.
【0022】本発明のシール材、封孔材は、以上説明し
た(A)成分、(B)成分、(C)成分、(D)成分及
び(E)成分を含有し、これら配合割合は、(A)成分
100重量部に対し、(B)成分は、5〜120重量
部、好ましくは10〜100重量部が適当であり、
(C)成分は、0〜80重量部、好ましくは5〜70重
量部が適当であり、(D)成分は、1〜50重量部、好
ましくは10〜30重量部が適当であり、また(E)成
分は、0.1〜10重量部、好ましくは1〜7重量部が
適当である。The sealing material and the sealing material of the present invention contain the components (A), (B), (C), (D) and (E) described above. The component (B) is suitably used in an amount of 5 to 120 parts by weight, preferably 10 to 100 parts by weight, per 100 parts by weight of the component (A).
The component (C) is suitably used in an amount of 0 to 80 parts by weight, preferably 5 to 70 parts by weight, and the component (D) is suitably used in an amount of 1 to 50 parts by weight, preferably 10 to 30 parts by weight. The component (E) is suitably used in an amount of 0.1 to 10 parts by weight, preferably 1 to 7 parts by weight.
【0023】なお、(B)成分が上記範囲より少ない
と、可撓性が悪くなり、電極基板に対する追従性、耐衝
撃性等が低下し逆に過剰になると、得られる硬化層の各
種物理的、化学的強度が悪くなるので、いずれも好まし
くない。If the component (B) is less than the above range, the flexibility is deteriorated, and the followability to the electrode substrate, the impact resistance and the like are reduced. Any of these methods is not preferable because the chemical strength is deteriorated.
【0024】また、(C)成分は、(A)成分が常温で
液状であれば必ずしも配合する必要ないが、作業性をよ
くするため配合するのが望ましい。しかし過剰になる
と、粘度が低くなり過ぎ、正常なシール材層、封孔材層
を形成しにくくなり、硬化時の収縮が大きくなり、もろ
くなる。The component (C) is not necessarily required to be added if the component (A) is liquid at room temperature, but is preferably added to improve workability. However, when the amount is excessive, the viscosity becomes too low, so that it is difficult to form a normal sealing material layer and a sealing material layer, and the shrinkage at the time of curing becomes large, making it brittle.
【0025】また(D)成分が、上記範囲より少ないと
密着性が不十分となり、逆に過剰になっても密着性向上
効果が得られず、経済的でないので、いずれも好ましく
ない。If the amount of the component (D) is less than the above range, the adhesion becomes insufficient. If the amount is too large, the effect of improving the adhesion cannot be obtained, and it is not economical.
【0026】また(E)成分が、上記範囲より少ないと
短時間による紫外線照射で十分なる硬化層が形成出来
ず、逆に過剰になると電極基板に悪影響及ぼしやすくな
るのでいずれも好ましくない。If the amount of the component (E) is less than the above range, a sufficient cured layer cannot be formed by short-time irradiation with ultraviolet light, and if the amount is too large, the electrode substrate is likely to be adversely affected.
【0027】本発明のシール材、封孔材は、上記(A)
〜(E)成分以外にも、必要に応じて透明ガラスビーズ
や樹脂ビーズなどの光伝播材、体質顔料、溶剤、さらに
はチクソトロピー材などの添加剤を配合することも可能
である。また、シール材については、一対の電極基材を
一定間隙に保持するための、ガラスビーズやガラス繊維
やプラスチックビーズ等のスペーサーを配合してもよ
い。The sealing material and the sealing material of the present invention can be obtained by the above (A)
In addition to the components (E) to (E), if necessary, it is also possible to incorporate additives such as light-transmitting materials such as transparent glass beads and resin beads, extender pigments, solvents, and thixotropic materials. In addition, a spacer such as glass beads, glass fiber, or plastic beads for holding the pair of electrode base materials at a constant gap may be included in the sealing material.
【0028】本発明のシール材を使用してシール層を形
成する方法としては、例えば電極基板の一方の周辺に1
乃至4ヶ所切れ目(注入孔)を残して、シール材をスク
リーン印刷するか、あるいはディスペンサーを用いるな
どしてセルギャップ(電極基板間隙)の2〜3倍程度の
厚さに塗布し、必要に応じて乾燥炉に入れ溶剤を揮発さ
せた後、他方の基板をかぶせ、圧力をかけながら所望の
セルギャップの厚さにし、しかる後紫外線を照射してシ
ール材を硬化させ、硬化シール層を形成する。As a method of forming a seal layer using the seal material of the present invention, for example, a method of forming a seal layer around one side of an electrode substrate is used.
Or 4 to 3 times the cell gap (electrode substrate gap) by screen printing or using a dispenser, leaving a cut (injection hole) at 4 places, if necessary After putting in a drying oven to evaporate the solvent, cover the other substrate, apply pressure to the desired cell gap thickness, and then irradiate ultraviolet rays to cure the sealing material to form a cured sealing layer. .
【0029】なお、紫外線照射は1〜3kW程度の水銀
灯、メタルハライドランプ、ケミカルランプ等にて紫外
線を数秒乃至数十秒照射するのが適当である。It is appropriate to irradiate ultraviolet rays for several seconds to several tens of seconds with a mercury lamp, metal halide lamp, chemical lamp or the like of about 1 to 3 kW.
【0030】また、本発明の封孔材を使用して注入孔を
封孔する方法としては、例えば液晶セル内に注入孔より
液晶注入後、封孔材を注入孔に塗布し、密封し、マスク
を介して注入孔付近のみ、シール材の場合と同様にして
紫外線を照射して封孔材を硬化させる。As a method for sealing an injection hole by using the sealing material of the present invention, for example, after injecting liquid crystal from the injection hole into a liquid crystal cell, the sealing material is applied to the injection hole, and sealed. The sealing material is cured by irradiating ultraviolet rays only in the vicinity of the injection hole through the mask in the same manner as in the case of the sealing material.
【0031】[0031]
【実施例】以下、本発明について更に実施例により詳細
に説明する。なお、実施例中「部」は、重量基準で示
す。EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples. In the examples, "parts" are shown on a weight basis.
【0032】実施例1〜3及び比較例1〜2(シール
材):表1に示す組成物を三本ロールにて混練し、該混
練物100部に、直径6μmのミルドファイバーからな
るスペーサー0.5部を室温で十分混合し、スペーサー
含有のシール材を調製した。Examples 1 to 3 and Comparative Examples 1 and 2 (sealant): The compositions shown in Table 1 were kneaded with a three-roll mill, and 100 parts of the kneaded material was filled with a spacer 0 made of a 6 μm diameter milled fiber. 0.5 part was sufficiently mixed at room temperature to prepare a sealing material containing a spacer.
【0033】[0033]
【表1】 備考:注1)ビスフェノールA型ポリエポキシド−ジアクリレート(平均分子量 1100) 注2)エポキシ当量184〜194の液状ビスフェノールA型エポキシ 樹脂 注3)「アエロジル#200」(日本アエロジル社製商品名) 実施例4〜5及び比較例3〜4(封孔材):表2に示す
組成物を三本ロールにて混練し、封孔材を調製した。[Table 1] Note: Note 1) Bisphenol A type polyepoxide-diacrylate (average molecular weight 1100) Note 2) Liquid bisphenol A type epoxy resin with an epoxy equivalent of 184 to 194 Note 3) "Aerosil # 200" (trade name of Nippon Aerosil Co., Ltd.) 4 to 5 and Comparative Examples 3 to 4 (sealing material): The compositions shown in Table 2 were kneaded with a three-roll mill to prepare a sealing material.
【0034】[0034]
【表2】 備考:注1)、注2)、注3)は表1と同じ。[Table 2] Remarks: Note 1), Note 2), Note 3) are the same as Table 1.
【0035】実施例1〜3及び比較例1〜2で得られた
シール材、実施例4〜5及び比較例3〜4で得られた封
孔材の性能評価をするために、以下の方法にて液晶セル
を製造し、密着性、耐湿性の試験をし、その結果を表3
に示した。The following methods were used to evaluate the performance of the sealing materials obtained in Examples 1 to 3 and Comparative Examples 1 and 2, and the sealing materials obtained in Examples 4 to 5 and Comparative Examples 3 and 4. , A liquid crystal cell was manufactured, and adhesion and moisture resistance tests were performed.
It was shown to.
【0036】透明電極付きガラス基板(周辺)に、スペ
ーサー含有のシール材を、液晶注入孔を残してスクリー
ン印刷(325メッシュ)し、該ガラス基板に2枚目の
透明電極付きガラス基板を張り合せ、蝶クリップで圧着
した後、メタルハライドランプ(1.5kW)を使用
し、ランプ高さ10cmの位置より紫外線を60秒間照
射した。A sealing material containing a spacer is screen-printed (325 mesh) on a glass substrate with a transparent electrode (periphery) while leaving a liquid crystal injection hole, and a second glass substrate with a transparent electrode is bonded to the glass substrate. After pressing with a butterfly clip, a metal halide lamp (1.5 kW) was used to irradiate ultraviolet rays from a position at a lamp height of 10 cm for 60 seconds.
【0037】得られた空セルに注入孔からビフェニル型
液晶を注入した後、注入孔を封孔材にて封じて、シール
材の場合と同様にして紫外線を30秒間照射して硬化さ
せた。After injecting the biphenyl-type liquid crystal into the obtained empty cell from the injection hole, the injection hole was sealed with a sealing material, and irradiated with ultraviolet rays for 30 seconds in the same manner as in the case of the sealing material to be cured.
【0038】得られた液晶セルについて次のように評価
した。 〈密着性試験〉液晶セルを80℃×95%RHの環境下
に200時間放置、室内自然放置10時間を1サイクル
とし、10サイクル試験した後、ナイフにてセルの剥離
状況を調べた。The obtained liquid crystal cell was evaluated as follows. <Adhesion Test> The liquid crystal cell was left in an environment of 80 ° C. × 95% RH for 200 hours, and the room was left naturally for 10 hours as one cycle. After a 10-cycle test, the cell was peeled off using a knife.
【0039】○:剥離せず △:剥離やや難
×:剥離やや簡単 〈耐湿性試験〉液晶セルを80℃×95%RHの環境下
に1000時間放置後、端子間に5V、50Hz、デュ
ーティ1/2の矩形波を印加し、電流値から、変化率にて
信頼性を判定した。:: No peeling Δ: Slightly peeling
×: Peeling somewhat easy <Moisture resistance test> After leaving the liquid crystal cell in an environment of 80 ° C. × 95% RH for 1000 hours, a rectangular wave of 5 V, 50 Hz, and a duty of 1/2 was applied between the terminals. Reliability was determined based on the rate of change.
【0040】○:変動が微小(電流値が初期の2倍未
満)で信頼性良好 △:変動が多少あり(電流値が初期の2〜3倍)、信頼
性やや乏しい ×:変動が大きく(電流値が初期の3倍超える)、信頼
性乏しい:: small fluctuation (current value is less than twice the initial value) and good reliability Δ: slight fluctuation (current value is 2 to 3 times the initial value), reliability is somewhat poor ×: large fluctuation ( The current value exceeds 3 times the initial value), poor reliability
【0041】[0041]
【表3】 表3より明らかの通り、実施例1〜3の本発明のシール
材及び実施例4〜5の本発明の封孔材を使用した液晶セ
ルは、密着性よく、また高温多湿環境下で電流値の変動
が微小で信頼性が良好であり耐湿性に優れていた。[Table 3] As is clear from Table 3, the liquid crystal cells using the sealing material of the present invention of Examples 1 to 3 and the sealing material of the present invention of Examples 4 to 5 have good adhesiveness and have a high current value under a high temperature and high humidity environment. Was small, the reliability was good, and the moisture resistance was excellent.
【0042】一方シランカップリング剤を配合しない比
較例1のシール材、比較例3の封孔材を使用した液晶セ
ルは、密着性、耐湿性とも不良であった。On the other hand, the liquid crystal cells using the sealing material of Comparative Example 1 containing no silane coupling agent and the sealing material of Comparative Example 3 had poor adhesion and moisture resistance.
【0043】また、エポキシ樹脂を配合しない比較例2
のシール材、比較例4の封孔材を使用した液晶セルは、
密着性、耐湿性がやや劣っていた。これは、ガラス基材
の伸縮にシール材層、封孔材層が追従しにくいための結
果と考えられる。Comparative Example 2 not containing an epoxy resin
The liquid crystal cell using the sealing material of Comparative Example 4 and the sealing material of Comparative Example 4
Adhesion and moisture resistance were slightly inferior. This is probably because the sealing material layer and the sealing material layer hardly follow the expansion and contraction of the glass substrate.
【0044】[0044]
【発明の効果】本発明の液晶セル用シール材及び封孔材
は、紫外線硬化型であるので、短時間で、かつ常温で紫
外線照射により硬化し、得られる硬化層は密着性、耐湿
性、可撓性等に優れているので高信頼性のある液晶セル
を得ることが可能となった。The sealing material and the sealing material for a liquid crystal cell of the present invention are of an ultraviolet curing type, and are cured by ultraviolet irradiation in a short time at room temperature, and the resulting cured layer has adhesion, moisture resistance, Because of its excellent flexibility and the like, a highly reliable liquid crystal cell can be obtained.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山崎 雅治 栃木県大田原市薄葉1920−1 (72)発明者 長島 義久 神奈川県平塚市寺田縄462−1 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Masaharu Yamazaki 1920-1 Usaba, Otawara-shi, Tochigi (72) Inventor Yoshihisa Nagashima 462-1 Teradana, Hiratsuka-shi, Kanagawa
Claims (2)
材。(A) 100 parts by weight of an epoxy acrylate oligomer; (B) 5 to 120 parts by weight of an epoxy resin which is liquid at room temperature; (C) 0 to 80 parts by weight of a polymerizable unsaturated monomer; (D) silane coupling. An ultraviolet-curable sealing material or a sealing material for a liquid crystal cell, comprising 1 to 50 parts by weight of an agent and 0.1 to 10 parts by weight of (E) a photopolymerization initiator.
を含有することを特徴とする請求項1記載の液晶セル用
の紫外線硬化型シール材又は封孔材。2. The ultraviolet-curable sealing material or sealing material for a liquid crystal cell according to claim 1, wherein the silane coupling agent contains a polymerizable unsaturated group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27252897A JPH11109384A (en) | 1997-10-06 | 1997-10-06 | Sealing and sealing materials for liquid crystal cells |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27252897A JPH11109384A (en) | 1997-10-06 | 1997-10-06 | Sealing and sealing materials for liquid crystal cells |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11109384A true JPH11109384A (en) | 1999-04-23 |
Family
ID=17515157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27252897A Withdrawn JPH11109384A (en) | 1997-10-06 | 1997-10-06 | Sealing and sealing materials for liquid crystal cells |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11109384A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002092718A1 (en) * | 2001-05-16 | 2002-11-21 | Sekisui Chemical Co., Ltd. | Curing resin composition and sealants and end-sealing materials for displays |
| JP2005202308A (en) * | 2004-01-19 | 2005-07-28 | Sekisui Chem Co Ltd | Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element |
| JP2007314660A (en) * | 2006-05-25 | 2007-12-06 | Nippon Kayaku Co Ltd | Periphery sealer for etching glass substrate and its cured product |
| CN100398621C (en) * | 2001-05-16 | 2008-07-02 | 积水化学工业株式会社 | Cured resin composition and sealant and capping material for displays |
| JP2009167314A (en) * | 2008-01-17 | 2009-07-30 | Sekisui Chem Co Ltd | Liquid crystal dropping method sealing agent, vertical conduction material, and liquid crystal display device |
-
1997
- 1997-10-06 JP JP27252897A patent/JPH11109384A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002092718A1 (en) * | 2001-05-16 | 2002-11-21 | Sekisui Chemical Co., Ltd. | Curing resin composition and sealants and end-sealing materials for displays |
| US7253131B2 (en) | 2001-05-16 | 2007-08-07 | Sekisui Chemical Co., Ltd. | Curing resin composition and sealants and end-sealing materials for displays |
| CN100398621C (en) * | 2001-05-16 | 2008-07-02 | 积水化学工业株式会社 | Cured resin composition and sealant and capping material for displays |
| JP2005202308A (en) * | 2004-01-19 | 2005-07-28 | Sekisui Chem Co Ltd | Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element |
| JP2007314660A (en) * | 2006-05-25 | 2007-12-06 | Nippon Kayaku Co Ltd | Periphery sealer for etching glass substrate and its cured product |
| JP2009167314A (en) * | 2008-01-17 | 2009-07-30 | Sekisui Chem Co Ltd | Liquid crystal dropping method sealing agent, vertical conduction material, and liquid crystal display device |
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| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20041207 |