JPH11140694A - Jig for plating wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jig for use in plating wafers with which electric resistance may be reduced, the need for a wiring housing space is eliminated and the formation of the compact jig is possible. SOLUTION: This jig includes a first holding member 10 and second holding member 40 holding the front and rear surfaces of the wafer 100. The second holding member 40 is constituted by coating a conductor made of aluminum with a dielectric substance made of a fluororesin. The second holding member 40 is constituted by having an opening 41 for exposing the surface to be electroplated of the wafer 100, a seal packing 43 mounted at the circumference of the opening 41 and an energizing member 60 for wafer energization mounted at the second holding member 40 via the seal packing 43 so as to be made conducting with the conductor of the second holding member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer plating jig used for fixing a wafer and performing electrolytic plating on the surface of the wafer.

[0002]

2. Description of the Related Art When electroplating a wafer surface, it is necessary to immerse the wafer in an electroplating solution and at the same time to contact a conductive pin formed on the wafer surface with a current-carrying pin to flow a current through the conductive film. Therefore, a jig for plating a wafer is used.

FIG. 2 is a view showing a conventional jig for plating a wafer of this kind, wherein FIG. 2A is a perspective view (open state), and FIG. 2B is a side sectional view (closed state). (C) is an enlarged view of a portion C in (b) of FIG.

That is, the jig includes first and second holding members 110 and 140 for holding the front and back surfaces of the wafer 100,
One side of both is hingedly connected by a hinge 131,
A seal packing 143 is attached in a ring shape around the opening 141 provided in the second holding member 140, and three energizing pins 145 are attached to the seal packing 143.

Each energizing pin 145 is connected by a metal wire 147 wired in a ring-shaped wiring housing groove (not shown) provided on the second holding member 140, and one of the energizing pins 145 is connected to one of the energizing pins 145. Of the second holding member 1
It is drawn out to the outside through a through-hole 151 provided in 40 (see FIG. 3C).

The first holding member 11 shown in FIG.
0 (b) by holding the wafer 100 in the concave portion 111 of the “0” and holding the second holding member 140 thereon.
As shown in FIG.
At the same time, the leading end of the conducting pin 145 is brought into contact with a conductive film (not shown) on the surface of the wafer 100 to enable electricity to flow.

[0007]

However, in the case where a method of connecting a metal wire 147 is used as a method of passing a current to each of the energizing pins 145 as in the above conventional example, the metal wire 147 is provided on the second holding member 140. Since the metal wire 147 cannot be thickened because it is accommodated in the wiring housing groove, the electric resistance may not be ignored.

Further, since the second holding member 140 needs a wiring housing groove serving as a housing space for housing the metal wire 147 and a connection portion between the metal wire 147 and the conducting pin 145, the thickness of the second holding member 140 can be reduced. Be inhibited. Especially the energizing pin 1
The number of the metal wires 147 and the number of the connection portions increase when the number of the wires 45 increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a jig for plating a wafer which can reduce electric resistance, does not require a wiring storage space, and can be made compact.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a jig for plating a wafer, which holds the wafer so as to expose a surface to be subjected to electrolytic plating. Comprises a first holding member and a second holding member for sandwiching the front and back surfaces of the wafer, and the second holding member coats a conductor exposed on its surface with an insulator, and forms a surface on which the electrolytic plating of the wafer is performed. An opening that is exposed, a seal packing attached around the opening, and an energizing member for energizing the wafer that is attached so as to be electrically connected to the conductor of the second holding member via the seal packing. And The second holding member is formed by coating the surface of an aluminum conductor with an insulator. The insulator coated on the second holding member was a fluororesin.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1A and 1B are views showing a jig for plating a wafer according to an embodiment of the present invention. FIG. 1A is a perspective view (opened state), and FIG. 1B is a side sectional view (closed state). (C) is an enlarged view of a portion A in (b) of FIG.

As shown in FIG.
It has first and second holding members 10 and 40 for holding the front and back surfaces of the front and back sides, and one side of both is connected to be openable and closable by a hinge 31. Hereinafter, each component will be described.

The first holding member 10 is a rectangular flat plate, and has a concave portion 11 for accommodating the wafer 100 at the center thereof. The first holding member 10 may be formed entirely of an insulator, or may be formed by coating the surface of a conductor with an insulator.

On the other hand, the second holding member 40 has an opening 41 at a position facing the recess 11, and a ring-shaped seal packing 43 is attached around the opening 41 so as to surround the opening 41. It is configured such that three current-carrying members (current-carrying pins) 60 are attached inside.

The second holding member 40 is formed by covering the entire surface of an aluminum plate as a conductor with a fluororesin (eg, PTFE (polytetrafluoroethylene)) as an insulator.
It is insulated by coating. In addition, the second holding member 4 is provided above the second holding member 40.
The wiring 49 is connected so as to conduct with the conductor constituting 0.

On the other hand, the seal packing 43 has a U-shaped cross section, and is formed such that both end sides 43a and 43b are in contact with the surface of the wafer 100 and the surface of the first holding member 10, respectively.

The seal packing 4 of the second holding member 40
3 are located at predetermined positions (three places) on the surface with which
As shown in (c), a protrusion 47 is provided so as to protrude, and the protrusion 47 is provided in the through hole 4 formed in the seal packing 43.
5 penetrates.

The end surface 47a of the projection 47 is stripped of the coated insulator to expose the inner conductor, and the end surface 47a is provided with an L-shaped metal plate conducting member 60. Are fixed by screws 65. That is, the current-carrying member 60 is attached via the seal packing 43 so as to be electrically connected to the conductor forming the second holding member 40.

In this embodiment, the current-carrying member 60 is the same as that shown in FIG.
As shown in (a), three places are provided, but other numbers may be used as needed. The larger the number of the current-carrying members 60, the better the uniformity of the entire surface of the wafer 100 can be plated.
Even if a large number of zeros are attached, there is no need to connect the metal wires 147 to the respective energizing pins 145 as in the conventional example shown in FIG. 2, and only by fixing the energizing member 60 to the projection 47 provided at each location. Since it is good, the mounting work can be easily performed.

Further, since the metal wire 147 is not used, there is no possibility that the electric resistance increases.

Also, as shown in FIG.
Since there is no need for a wiring storage groove for storing the wiring 7, the thickness of the second holding member 40 can be reduced, and compactness can be achieved.

Further, since each of the conducting members 60 is independently attached to the second holding member 40, only the necessary one of the projections 47 provided at a plurality of locations is provided to the conducting member 6.
By attaching 0 or removing it as necessary, the number and the attachment position of the conducting members 60 can be easily changed.

Next, how to use this jig will be described. That is, the wafer 100 is accommodated in the concave portion 11 of the first holding member 10 shown in FIG. 1A, and the second holding member 40 is put on the second holding member 40 so as to be clamped, and as shown in FIG. The periphery is held down by the seal packing 43 and at the same time, the wafer 100
The leading end of the current-carrying member 60 is brought into contact with a not-shown conductive film on the surface to enable current to flow. The first and second holding members 10 and 40 are fixed between the side 13 of the first holding member 10 and the second holding member 40.
Is performed by holding between the sides 55 by a “U” -shaped fixture 70.

Then, the jig is immersed in an electrolytic plating solution, and an electric current is applied between an anode (not shown) provided in the electrolytic plating solution and the wiring 49, so that the surface exposed from the opening 41 of the wafer 100 is electrolytically plated. Is done. Note that the electrolytic plating solution does not touch the portion of the conductive member 60 due to the seal of the seal packing 43.

The jig for plating a wafer according to the present invention comprises:
Needless to say, it can be used for various electrolytic plating such as bump plating and damascene.

In the above embodiment, an example is shown in which the entire second holding member is formed of an electric conductor and the surface thereof is coated with an insulator. May be configured to coat a conductor and further coat an insulator on the surface. In short, any structure may be used as long as the structure is such that at least the conductor exposed on the surface is coated with an insulator.

In the above embodiment, the current-carrying member 60 is fixed to the projection 47 provided on the second holding member 40. However, a projection is provided on the current-carrying member 60 side, and this is inserted into the through hole 45 of the seal packing 43. The connection structure between the two can be variously modified, such as being fixed to the surface of the second holding member 40 without the protrusion 47, and in essence, is connected to the conductor provided on the second holding member via the seal packing. Any structure may be used as long as it is an energizing member for energizing the wafer to be attached. Further, the current-carrying member is not limited to the pin-shaped member, and may have other various shapes.

The material of the conductor constituting the second holding member 40 is not limited to metal, but may be any conductive material. As the insulator to be coated, in addition to the above-described embodiments, various insulators such as vinyl chloride, heat-resistant vinyl chloride, polypropylene, polyether sulfone, polyether ether ketone, polycarbonate, polyethylene, polystyrene, and polyvinylidene fluoride can be used. Can be used.

[0029]

As described in detail above, the present invention has the following excellent effects. Since the second holding member itself is used as a conductor to the current-carrying member, the sectional area can be increased and the electric resistance can be reduced.

Since no wiring is required, no wiring storage space is required. Even if the number of current-carrying members is increased, the size of the jig does not change, and compactness can be achieved.

The work of mounting the current-carrying member is easy.

Since each of the current-carrying members is independently attached to the second holding member, unnecessary members can be omitted or easily removed, and the number of current-carrying members can be easily changed. .

Since the entire second holding member is made of an aluminum conductor, the conductivity is good and the weight is light.
Plating work becomes easy.

Since the insulating material to be coated on the second holding member is made of a fluororesin, the drainage of the solution is good and the carry-in of the plating solution to the next step can be reduced.

[Brief description of the drawings]

FIG. 1 is a view showing a jig for plating a wafer according to an embodiment of the present invention, wherein FIG. 1A is a perspective view and FIG.
Is a side sectional view, and FIG. 3C is an enlarged view of a portion A in FIG.

FIG. 2 is a view showing a conventional example, and FIG. 2 (a) is a perspective view,
FIG. 1B is a side sectional view, and FIG. 1C is an enlarged view of a portion C in FIG. 1B.

[Explanation of symbols]

 Reference Signs List 10 first holding member 40 second holding member 41 opening 43 seal packing 60 conducting member 100 wafer

Claims (3)

[Claims] 1. A jig for plating a wafer for holding a wafer so as to expose a surface to be subjected to electrolytic plating, wherein the jig for plating a wafer includes a first holding member for holding the front and back surfaces of the wafer and a second holding member. A holding member, wherein the second holding member coats a conductor exposed on the surface thereof with an insulator, an opening exposing a surface of the wafer to be subjected to electrolytic plating, and a seal packing attached around the opening. A jig for plating a wafer, comprising: an energizing member for energizing the wafer, which is attached so as to be electrically connected to the conductor of the second holding member via the seal packing. 2. The jig for plating a wafer according to claim 1, wherein the second holding member is formed by coating a surface of a conductor made of aluminum with an insulator. 3. The jig for plating a wafer according to claim 1, wherein the insulator coated on the second holding member is a fluororesin.