JPH11144974A - Laminated circuit components - Google Patents

Abstract

(57) [Problem] To easily assemble a lead terminal portion in a laminated circuit component such as a sheet transformer. SOLUTION: A plurality of substrates on which a coil pattern is formed are laminated to form an integrated coil substrate 1. Through holes 3 for mounting terminals are provided side by side at the edges of each layer of the laminated substrate 1, and metal terminals 4 are inserted into the through holes 3.
The lead terminals 2 for input and output are formed by welding to form a laminated circuit component. The metal terminal 4 is provided with a vertically split notch 4a at the tip thereof, and the cut 4
The substrate holding portion 4b serving as a stopper when the metal terminal 4 is inserted is formed by making the base end portion a larger in diameter than the hole diameter of the through hole 3. Therefore, when the terminal is soldered, the molten solder is cut through the through hole 3 along the cut 4a from the terminal tip.
Since the metal terminal 4 penetrates deeply, the connection between the metal terminal 4 and the through hole 3 is easy and reliable. Further, the plurality of metal terminals 4 can be mounted in a uniform state by the stopper function of the substrate holding portion 4b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated circuit component having a small and thin shape, such as a thin power transformer used in telephone exchanges and general-purpose inverters.

[0002]

2. Description of the Related Art FIG. 6 is an external perspective view of a conventional sheet transformer as an example of the above-mentioned thin power transformer.
FIG. 7 is an exploded perspective view of the seat transformer showing the assembly.

In the figure, reference numeral 21 denotes a laminated substrate (coil substrate) formed by laminating and integrating a plurality of substrates on which a series of coil patterns P are formed in the thickness direction to form a predetermined orbiting coil.
It is. A part of the coil pattern P of each layer of the laminated coil substrate 21 is drawn out to a through hole 23 for mounting a terminal, which is arranged along an edge of each substrate.
Reference numeral 26 denotes an insulating (synthetic resin) pedestal on which the coil substrate 21 is mounted. Metal terminals 24 corresponding to the through holes 23 provided in the coil substrate 21 at both ends of the pedestal 26. Is inserted. This metal terminal 24
Has one end protruding upward and the other end formed laterally in an L-shape to protrude, and is a surface-mountable type.

The coil substrate 21 is mounted on the insulating pedestal 26 so that the metal terminal 24 is inserted into each through hole 23.
And the metal terminals 24 inserted into the through holes 23 are soldered to form the input / output lead terminal portions 22.
Is formed, and the coil substrate 21 is fixed to the pedestal 26 by this soldering process. Further, the coil substrate 21
From above and below, a pair of E-type ferrite cores 25, 25 are mounted so as to sandwich the coil substrate to form a magnetic path of the orbiting coil, thereby forming a sheet transformer as a laminated circuit component.

The pair of E-type ferrite cores 25 mounted on the coil substrate 21 are adhered to the coil substrate 21 and the pedestal 26 by an adhesive 27, respectively.

As another example of the sheet transformer, as shown in FIG. 8, a single CP wire 29 is directly inserted into the through hole 23 of the coil board 21 and soldered without using the pedestal 26 as shown in FIG. Some lead terminals 22 are formed.

By the way, the above-mentioned laminated coil substrate 2
As shown in FIG. 9, a plurality of substrates 20 each having a coil pattern P printed on one side or both sides are used as shown in FIG. A metal wire such as a metal terminal 24 on the substrate 26 or a single CP wire 29 is sequentially inserted and soldered for each substrate, and is formed by being laminated and integrated.

[0008]

However, in such a conventional seat transformer, when the pedestal 26 with the terminal is used as the lead terminal portion 22, the metal terminal 24 itself is firmly fixed to the pedestal 26. Therefore, the formation of the lead terminal portion 22, that is, the connection work between the through hole 23 of the coil substrate 21 and the metal terminal 24 is easy, but on the other hand, a special insulating member such as the pedestal 26 is required. There is a problem that the size itself is increased and the cost is increased.

Further, in the method of directly attaching a single CP wire 29 as a metal terminal to the through hole 23 as in the conventional example shown separately, the number of parts can be reduced as compared with the above-described pedestal method, and the number of parts can be reduced. Although the cost can be reduced, since the used terminals are simple rod-shaped terminals, the inserted terminals cannot be fixed and the terminals are not aligned, and the terminals are easily dropped off from the through holes 23, so that the soldering work is complicated. In addition, after the terminals are mounted, the irregular terminals need to be cut back to uniform dimensions, resulting in extremely poor workability.

In addition, the above two methods have a structure in which the soldering state between the metal terminal 24 or the CP wire 29 and the inner layer substrate 20 is difficult to visually confirm, so that a terminal connection failure (solder failure). ) Is difficult to judge, and many defective products occur.

Further, as described above, in the laminating / multilayering process using a single-sided substrate or a double-sided substrate, the workability is extremely poor because the substrates 20 must be soldered one by one to the metal terminals 24. Further, as shown in FIG. 10, the solder 28
The swelling of the solder 28 creates a gap between the laminated inner layer boards, and the formed coil board 21
This has hindered the miniaturization and thinning of products.

The use of a ready-made multi-layer substrate without using a single-sided or double-sided substrate simplifies the above-described soldering process and reduces the number of work steps. However, the multi-layer substrate itself is expensive. However, the use of such a multilayered substrate has not been very advantageous.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the conventional type, and has improved laminating workability at the time of product assembly, cost reduction, and reduction in size and thickness. The purpose is to provide circuit components.

[0014]

That is, according to the first aspect of the present invention, a plurality of substrates on which a circuit pattern (P) is formed are sequentially laminated to form an integrated laminated substrate (1). A part of the circuit pattern (P) of each layer of the laminated substrate (1) is drawn out to a through hole (3) juxtaposed at an edge of each substrate, and a metal terminal (4) is inserted into the through hole (3). ) Are inserted and welded to form a lead terminal portion (2) for input / output, and a vertically cut portion (4a) is provided in a portion where the metal terminal (4) is inserted, and the cut portion (4a) is formed. The base end of 4a) has a larger diameter than the hole diameter of the through hole (3) to form a substrate holding portion (4b) serving as a stopper when the metal terminal (4) is inserted.

According to the second aspect of the present invention, the metal terminal (4) divided by the cut (4a) is provided with a hook-shaped barb (4c) at the tip end.

According to the third aspect of the present invention, the notch (4a) is formed to extend beyond the substrate holding portion (4b).

Further, in the present invention according to claim 4, the laminated substrate (1) is formed by laminating a plurality of single-sided substrates, double-sided substrates, or multilayer substrates, and the through holes (3) provided in each layer of the substrate. It is configured to be integrated by welding together.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention applied to a sheet transformer as a laminated circuit component will be described below with reference to FIGS.

FIG. 5 is an exploded perspective view showing the assembly of the seat transformer according to the present invention. In the figure, 1 is a coil pattern P
The coil substrate 1 according to the present embodiment is formed by laminating or multiplying a single-sided substrate or a double-sided substrate on which are formed in the thickness direction, and integrating the lands 3a of the respective substrates by welding each other. Reference numeral 4 denotes a metal terminal forming a lead terminal portion of the sheet transformer, and any one of the metal terminals 4 described in first to third embodiments described later is used.

By using, as a coil substrate, a laminated substrate in which a plurality of substrates are integrated by welding as in the present embodiment, not only the mounting of the metal terminals on the substrate, but also the soldering of the metal terminals 4 after the mounting, That is, the formation of the lead terminal portion can be performed very easily.

Reference numeral 5 denotes a pair of E-type ferrite cores.
These are mounted from above and below the coil substrate to form a magnetic path of the formed circular coil.

Next, an embodiment of the present invention in a process of laminating a plurality of substrates for forming the above-described coil substrate 1 and forming a multilayer structure will be described with reference to FIG.

The coil substrate 1 of the present embodiment is constituted by using a plurality of relatively inexpensive single-sided substrates, double-sided substrates, or multilayer substrates on which the coil patterns P are formed. A plurality (four) of through-holes 3 are arranged side by side at the same position in each layer of the substrate, and one of the plurality of through-holes 3 arranged in each layer of the substrate is provided in each of the layers. The coil pattern P of the corresponding substrate is drawn out. As shown in FIG. 4, the plurality of single-sided substrates and the double-sided substrates are overlapped, and the lands 3a of the respective layers of the substrates are brought into contact with each other so as to overlap in the substrate laminating direction.
The lands 3a contacted in this state are welded at once by high-frequency welding or the like, whereby the respective layers of the substrate are connected via the through holes 3, and the integrated laminated coil substrate 1 is formed.

As described above, by connecting the lands 3a of the respective layers of the substrate by welding, the gap between the inner layer substrates can be reduced as much as possible, and the product can be made thinner. In addition,
Although not shown, in the present embodiment, an insulating film is interposed in a small gap between the inner layer substrates caused by the thickness of the land 3a.

FIG. 1 shows a first embodiment of the metal terminal 4 described above, in which a lead terminal is mounted on a coil substrate.

In the drawing, reference numeral 1 denotes a cross-sectional view of a laminated coil substrate, and a plurality of (four) through holes 3 for mounting metal terminals 4 are arranged side by side along the edge of the substrate. ,
Further, although not shown, these through holes 3 are connected to the corresponding coil patterns of the respective layers of the substrate.

The metal terminals 4 mounted in these through holes 3 are in the shape of a round bar, and the outer diameter is slightly larger than the diameter of the through holes 3. A notch 4a, which is slightly longer than the substrate thickness, is provided in the distal end of the metal terminal 4 in the longitudinal direction to provide elasticity in the radial direction of the terminal. A substrate holding portion 4b serving as a stopper when the metal terminal 4 is mounted is formed.

Therefore, when mounting the metal terminal 4, the notch 4a of the metal terminal 4 is inserted (fitted) into the through hole 3 of the coil substrate 1 so as to reduce the diameter. At this time, the terminal end portion inserted by the elastic return of the notch 4a of the metal terminal 4 comes into close contact with the inner wall of the through hole 3, so that the metal terminal 4 does not easily fall off from the through hole 3 and facilitates the soldering process in the next step. With metal terminal 4
Is defined to have a fixed length with its tip slightly protruding from the substrate surface by the stopper action of the substrate holding portion 4b.

When soldering is performed from the upper surface side of the board in such a terminal mounted state, the molten solder flows downward along the cut 4a from the terminal tip, and the through hole 3 and the metal terminal 4
, The solder connection between the metal terminal 4 and the through hole 3 is ensured.

As described above, the insertion position of the metal terminal 4 is always regulated by the substrate holding portion 4b, and the plurality of metal terminals 4 are all aligned at the uppermost substrate edge at a uniform length. Since the mounting is performed, the present invention does not require the operation of cutting the metal terminal for adjusting the dimensions of the terminal, which has been conventionally performed.

FIG. 2 shows a second embodiment of the present invention, in which metal terminals are mounted on a coil substrate, similarly to the first embodiment of FIG. However, the shape of the metal terminal used is different from the embodiment of FIG.

That is, the metal terminal 4 of the present embodiment has a structure in which a notch 4a is provided to divide the terminal end portion, and a hook-shaped barb 4c is formed at each of the divided end portions. With such a terminal structure, the lug 4d of the hook-shaped barb 4c is locked to the upper surface of the substrate when the terminal is inserted,
The inserted metal terminal 4 is securely held and fixed to the coil substrate 1, which can completely prevent inconvenience such as detachment of the terminal which is likely to occur in the conventional type, and further facilitates the soldering operation in the next step. Of course, also in the present embodiment, the substrate holding portion 4b serving as a stopper when inserting the terminal is provided at the base end of the cut 4a.
Are formed, all the metal terminals 4 after mounting are unified to the same dimensions.

FIG. 3 shows a third embodiment of the present invention.

In the metal terminal 4 of the present embodiment, the notch 4a at the tip portion is extended to the substrate holding portion 4b, and the degree of penetration of solder after terminal mounting can be visually confirmed from the notch 4a at the portion of the substrate holding portion 4b. It is a structure.

That is, if the solder has sufficiently penetrated into the notch 4a of the substrate holding portion 4b during the soldering process,
The flow of the solder is good, and it can be judged that the connection between the through hole 3 and the metal terminal 4 of each inner layer substrate is reliable. On the other hand, when the solder does not sufficiently penetrate into the notch 4a, it is determined that the soldering to the inner layer substrate is insufficient. it can.

Further, in the present embodiment shown in FIG. 3, the hook-shaped barb 4c at the terminal end portion shown in FIG. 2 is not formed. However, it is naturally possible to form the barb 4c. Thereby, workability of terminal mounting including soldering is further improved.

As described above, in the multilayer circuit component formed by applying the present invention, the size and thickness of the product can be reduced, and the number of work steps can be reduced to reduce the cost of the product. Furthermore, by using the metal terminal of the present invention, the connection between the terminal and the substrate becomes easy and reliable, which can greatly contribute to improvement in product reliability and workability.

[0038]

As described above, according to the first aspect of the present invention, a plurality of substrates on which a circuit pattern such as a coil pattern is formed are sequentially laminated to form a laminated substrate such as an integrated coil substrate. Is formed, a part of the circuit pattern of each layer of the laminated board is drawn out to a through hole arranged in parallel with an edge of each board, and a metal terminal is inserted and welded into the through hole to be used for input / output. In the laminated circuit component in which the lead terminal portion is formed, a notch is provided in the insertion portion of the metal terminal, and the base end of the notch has a diameter larger than the hole diameter of the through-hole, and a stopper when the metal terminal is inserted. In the soldering process, the solder penetrates deeply into the through-hole along the notch from the tip of the terminal, and the connection between the metal terminal and the through-hole is secure. Since the soldering terminals poor conduction of reduced due to defective electrical reliability is improved.

Further, the insertion of the metal terminals is always restricted to a fixed amount by the stopper function of the substrate holding portion, and since a plurality of metal terminals can be mounted in a state where they are all arranged in a uniform size, the soldering which has conventionally been carried out each time has been performed. The work of cutting the metal terminal after the treatment is unnecessary, and the number of work steps can be reduced accordingly.

Further, according to the present invention described in claim 2,
Since the hook-shaped barb is provided at the tip of the metal terminal divided by the notch, the hook-shaped barb provided in the notch is locked on the upper surface of the substrate when the terminal is inserted, and the inserted terminal is held on the coil substrate. -Since it is fixed, the detachment of the mounting terminal is completely prevented, and the soldering work becomes extremely easy.

According to the third aspect of the present invention,
Since the cut is formed beyond the substrate holding portion, the degree of penetration of the solder at the time of terminal mounting can be visually confirmed from the cut of the substrate holding portion, and good / bad soldering conditions can be easily determined. Since checking can be performed, occurrence of defective products due to defective soldering can be prevented as much as possible.

Further, according to the present invention, the laminated substrate is formed by laminating a plurality of single-sided substrates, double-sided substrates, or multilayer substrates, and welding the through holes provided in each layer of the substrate. As a result, a relatively inexpensive laminated substrate can be easily realized. In addition, if integrated by welding, the gap between the inner substrates can be reduced as much as possible, and the thickness of the laminated substrate can be reduced, and the mounting and soldering of metal terminals for forming the lead terminals can be performed. This is extremely easy and can greatly contribute to a reduction in the cost of the laminated circuit component.

[Brief description of the drawings]

FIG. 1 is a view showing a first embodiment of the present invention and showing mounting of a metal terminal on a laminated substrate.

FIG. 2 is a view showing a second embodiment of the present invention, and showing attachment of a metal terminal different from FIG. 1 to a laminated substrate.

FIG. 3 is a view showing a third embodiment of the present invention, and showing attachment of a metal terminal different from that of FIG. 2 to a laminated substrate.

FIG. 4 is a view showing a process of laminating and integrating a plurality of single-sided substrates or double-sided substrates by welding of lands.

FIG. 5 is an exploded perspective view showing the assembly of the sheet transformer of the present invention using a single-sided board or a double-sided board.

FIG. 6 is an external perspective view of a conventional sheet transformer.

FIG. 7 is an exploded perspective view showing an assembly of a conventional sheet transformer.

FIG. 8 is an exploded perspective view showing an assembly of another conventional seat transformer different from FIG. 7;

FIG. 9 is an exploded perspective view showing the assembly of a conventional sheet transformer using a laminated substrate composed of a single-sided substrate or a double-sided substrate.

FIG. 10 is a diagram showing a process of laminating and integrating a plurality of single-sided substrates or double-sided substrates by soldering lands.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laminated board (coil board) 2 Lead terminal part 3 Through hole 4 Metal terminal 4a Notch 4b Board holding part 4c Return P Circuit pattern (coil pattern)

Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01F 31/00 F (72) Inventor Masami Miyamoto 5-36-11 Shimbashi, Minato-ku, Tokyo Inside Fuji Electric Chemical Co., Ltd.

Claims (4)

[Claims] An integrated laminated substrate is formed by sequentially laminating a plurality of substrates on which a circuit pattern is formed, and a part of a circuit pattern of each layer of the laminated substrate. Are drawn out into through holes (3) arranged side by side with the edge of each substrate, and metal terminals (4) are inserted and welded into the through holes (3) so that input / output lead terminal portions (2) are formed. ) Is formed on the laminated circuit component, wherein the metal terminal (4) is inserted vertically into the cut portion (4).
a), the base end of the cut (4a) having a larger diameter than the diameter of the through hole (3) to form a substrate holding portion (4b) serving as a stopper when the metal terminal (4) is inserted. Characterized laminated circuit components. 2. The multilayer circuit component according to claim 1, wherein a hook-shaped barb (4c) is provided at a tip portion of the metal terminal (4) divided by the cut (4a). 3. The laminated circuit component according to claim 1, wherein the cut (4a) is formed beyond the substrate holding portion (4b). 4. The laminated board (1) is integrated by laminating a plurality of single-sided boards, double-sided boards, or multilayer boards, and welding through holes (3) arranged in each layer of the board. The multilayer circuit component according to claim 1, wherein