JPH11145579A - Semiconductor manufacturing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a product in reliability by a method, wherein a body clamp of a lead processing equipment which comes in direct contact with a molded package is made of flexible material, and a lead is processed by the lead processing equipment. SOLUTION: A molded package 1 is fed to a package receiver 4. The fed molded package 1 is supported with a body clamp 2. The leads of the molded package 1 fixed and supported are each formed by lead clamps 5. Lead forming units 6 are moved in both a lateral and a vertical directions as controlled by an electromoter, and the body clamp 2 is moved in a vertical direction by an electromoter. The leads of the molded package 1 are processed by the lead clamps 5 as the are, while keeping the molded package 1 clamped by the body clamp 2, and then the lead clomps 5 are lifted from the leads and separated. With this setup, pressure applied to a molded package becomes small, even when the molded package is clamped by a body clamp, so that the molded package can prevent crackings and deterioration in coplanarity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a lead processing apparatus for a semiconductor device.

[0002]

FIG. 3 is a side view showing a conventional lead processing apparatus. Referring to FIG. 3, this conventional lead processing apparatus includes a package receiving portion 4 for receiving a mold package 1, a body clamp portion 2 for holding the mold package, and a component (S) for directly pressing the mold package 1.
US material 3) and clamp part 5 for forming a lead
And a lead molding unit 6.

In recent years, the thickness of the mold package 1 has been reduced. When the mold package 1 is thin and has a large area, the mold package 1 is warped. When the warpage occurs, the mold package 1 pressed by the body clamp portion 2 and the package receiving portion 4 is fixed in a forced state regardless of the presence or absence of the warp, and the molded package 1 is processed in the fixed state. You.

The leads of the processed mold package 1 are processed in the direction opposite to the warpage, so that the coplanarity deteriorates. The mold package 1 whose coplanarity has deteriorated has an adverse effect when mounted on a substrate.

[0005] The body clamp 2 fixedly supports the mold package 1 with pins. By fixedly supporting the mold package 1, coplanarity is improved.

Conventionally, an SUS material 3 is used for the body clamp portion 2. The SUS material 3 has corrosion resistance and is easy to process because the body clamp portion 2
It is used for

[0007]

The above-mentioned conventional lead processing apparatus has the following problems.

[0008] The first problem is as follows. The mold package 1 is pressed by the body clamp 2 (SUS material 3), and the body clamp 2 (SUS material 3) comes into contact with the mold package 1. In this case, an impact is applied between the mold package 1 and the body clamp 2 (SUS material 3). Since the portion (pin) in contact with the shocked mold package 1 is made of the SUS material 3, the portion is hard and may cause a chip crack.

As a second problem, as shown in FIG. 4, when the mold package 1 is warped, the mold package 1 is pinched by a pin having hardness (SUS material 3).
By forcibly fixing and supporting, the leads of the mold package 1 are processed while being warped.

When lead processing is performed while the mold package 1 is warped, coplanarity deteriorates. Deterioration of coplanarity leads to lower product reliability.

Accordingly, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a driving unit of a body clamp unit for fixing and supporting a mold package of a lead processing apparatus without changing the conventional driving unit. Another object of the present invention is to provide a semiconductor manufacturing apparatus that improves product reliability by changing a contact portion to a soft and flexible material such as rubber.

[0012]

According to the present invention, in order to achieve the above object, a lead processing is carried out by using a flexible material for a body clamp portion directly in contact with a mold package.

[0013]

Embodiments of the present invention will be described below. In the semiconductor manufacturing apparatus of the present invention, in a preferred embodiment, lead processing is performed on a body clamp portion directly in contact with a mold package by using a flexible material instead of a conventional SUS material (pin). I did something like that.

Therefore, according to the embodiment of the present invention,
When the body clamp directly contacts the mold package, chip cracks due to pressure can be prevented.

Further, in the embodiment of the present invention, even when the mold package is warped, deterioration of coplanarity can be prevented by using a flexible material for the body clamp portion.

According to the embodiment of the present invention, even if the body clamp is in direct contact with the mold package, chip cracks and the like do not occur, and the yield and product reliability can be improved.

[0017]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention;

FIGS. 1 and 2 are side views showing one embodiment of the present invention.

First, referring to FIG. 1, in one embodiment of the present invention, a mold package 1 is supplied to a package receiving portion 4. The supplied mold package 1 is fixedly supported by the body clamp 2. The fixedly supported mold package 1 is subjected to lead processing by a lead clamp unit 5. The lead forming unit 6 is vertically and horizontally driven and controlled by an electric motor as shown in the figure, and the body clamp 2 is also driven and controlled to move vertically by the electric motor.

FIG. 2 shows a state in which the mold package 1 is supplied to the package receiving section 4 and fixed by the body clamp section 2 in one embodiment of the present invention.

At this time, the body clamp 2 descends from the upper surface of the mold package 1, and the mold package 1 is fixedly supported by the rubber material 3 of the body clamp 2. The fixedly supported mold package 1 is subjected to lead processing by the lead clamp unit 5 in a state where the body package is clamped.

After the lead processing is completed, the lead clamp 5 is separated from the lead. After the lead clamp 5 is separated, the body clamp 2 rises.

In one embodiment of the present invention, a rubber material 3 is used in a portion of the body clamp 2 that comes into contact with the mold package 1. A portion of the body clamp portion 2 that contacts the mold package 1 may be made of a convex-shaped flexible material other than rubber.

[0024]

As described above, according to the present invention,
Since the pressure applied to the mold package during body clamping is reduced, chip cracks can be prevented.

According to the present invention, the coplanarity can be prevented from deteriorating by using a material capable of deforming the body clamp portion and a flexible material against the warpage of the mold package.

Therefore, according to the present invention, the chip crack and coplanarity due to the body clamp are improved, so that there is an effect that the product reliability is improved.

[0027]

[Brief description of the drawings]

FIG. 1 is a side view showing an embodiment of the present invention.

FIG. 2 is a side view showing a clamped state in one embodiment of the present invention.

FIG. 3 is a side view showing a configuration of a conventional lead processing apparatus.

FIG. 4 is a side view showing a clamped state in a conventional lead processing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mold package 2 Body clamp part 3 SUS material / rubber material 4 Package receiving part 5 Lead clamp part 6 Lead molding unit

Claims (4)

[Claims] 1. A semiconductor manufacturing apparatus for performing lead processing of a semiconductor device, wherein a flexible material is used for a body clamp portion directly in contact with the semiconductor device. 2. The semiconductor manufacturing apparatus according to claim 1, wherein rubber is used as said flexible material. 3. The semiconductor manufacturing apparatus according to claim 1, wherein the body clamp is driven by an electric motor, and the semiconductor package is controlled to be capable of soft clamping. 4. A semiconductor manufacturing apparatus for performing lead processing of a semiconductor device, wherein a portion of the body pad portion for clamping the semiconductor package accommodated in a package receiving portion, which comes into contact with the package, is made of a flexible member, and has a hemispherical shape. A semiconductor manufacturing apparatus characterized by having a convex shape such as a shape.