JPH11150133A5 - - Google Patents

Info

Publication number
JPH11150133A5
JPH11150133A5 JP1998227052A JP22705298A JPH11150133A5 JP H11150133 A5 JPH11150133 A5 JP H11150133A5 JP 1998227052 A JP1998227052 A JP 1998227052A JP 22705298 A JP22705298 A JP 22705298A JP H11150133 A5 JPH11150133 A5 JP H11150133A5
Authority
JP
Japan
Prior art keywords
semiconductor element
substrate
electrodes formed
adhesive sheet
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998227052A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11150133A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10227052A priority Critical patent/JPH11150133A/ja
Priority claimed from JP10227052A external-priority patent/JPH11150133A/ja
Publication of JPH11150133A publication Critical patent/JPH11150133A/ja
Publication of JPH11150133A5 publication Critical patent/JPH11150133A5/ja
Pending legal-status Critical Current

Links

JP10227052A 1997-09-04 1998-08-11 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法 Pending JPH11150133A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10227052A JPH11150133A (ja) 1997-09-04 1998-08-11 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-239924 1997-09-04
JP23992497 1997-09-04
JP10227052A JPH11150133A (ja) 1997-09-04 1998-08-11 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法

Publications (2)

Publication Number Publication Date
JPH11150133A JPH11150133A (ja) 1999-06-02
JPH11150133A5 true JPH11150133A5 (2) 2005-01-20

Family

ID=26527481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10227052A Pending JPH11150133A (ja) 1997-09-04 1998-08-11 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法

Country Status (1)

Country Link
JP (1) JPH11150133A (2)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
JP4567988B2 (ja) 2004-02-05 2010-10-27 株式会社日立製作所 紙状ｒｆｉｄタグおよびその製造方法
JP5052085B2 (ja) * 2005-09-29 2012-10-17 株式会社半導体エネルギー研究所 ピックアップ装置
KR100697844B1 (ko) 2006-06-30 2007-03-20 (주) 케이비씨테크 한지를 이용한 알에프아이디 카드 및 그 제조방법
JP5090443B2 (ja) * 2007-05-14 2012-12-05 株式会社アルバック ドライエッチング方法
JP5405266B2 (ja) * 2009-10-27 2014-02-05 シャープ株式会社 電子部品搬送装置
JP5405267B2 (ja) * 2009-10-27 2014-02-05 シャープ株式会社 電子部品搬送装置
JP2014053517A (ja) * 2012-09-10 2014-03-20 Hitachi High-Tech Instruments Co Ltd 受渡用ステージ及びダイピックアップ装置並びにダイボンディング装置
JP6236206B2 (ja) * 2013-02-26 2017-11-22 リンテック株式会社 シート剥離装置および剥離方法
JP5900392B2 (ja) * 2013-03-21 2016-04-06 富士ゼロックス株式会社 フィルム分離装置
WO2017168498A1 (ja) * 2016-03-28 2017-10-05 富士機械製造株式会社 部品供給装置、実装装置及び部品供給方法
JP6860405B2 (ja) * 2017-04-05 2021-04-14 アルプスアルパイン株式会社 剥離方法及びプログラム
JP6962163B2 (ja) * 2017-12-08 2021-11-05 株式会社村田製作所 積層電極体の製造装置
JP7125650B2 (ja) * 2018-03-27 2022-08-25 株式会社東京精密 ウェーハ分割装置及び方法
CN112766446A (zh) * 2021-01-12 2021-05-07 深圳市金冠威科技有限公司 智能卡rfid全自动化生产线

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