JPH1116708A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture thermally and mechanically tough outer electrodes by a method, wherein the electrode material coated on the outer electrode parts of a plurality of electronic component elements is baked to be integrated. SOLUTION: A pair of ceramic capacitor elements 1 in the same length and width are laminated to put together the outer electrode coated surfaces. Firstly, one outer electrode part is coated with an electrode material to be dried up and then the other outer electrode part is similarly coated with the electrode material, and after drying up to be baked up to a specific temperature for the formation of the outer electrodes 2. An electronic component such an integrated capacitor, etc., left intact can be used as a chip electronic part, while this integrated electronic component elements 3 contained in a U shaped cap 4 or a box shaped cap can be connected by cream solder, etc., to produce an electronic part 5. Furthermore, the electronic component made of the outer electrode part coated with the electrode material to be dried up and baked can be immersed in melted solder, thereby enabling a solder layer to be formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to electronic components such as ceramic capacitors and ceramic varistors.

[0002]

2. Description of the Related Art Electronic components surface-mounted on electronic circuit boards include, for example, ceramic capacitors and ceramic varistors. These electronic components include a laminate type, a single plate-like component, and a component in which a plurality of plate-like components are used by laminating them. Further, in order to mount them on a circuit board, there is a configuration in which a metal cap is fitted to external electrodes formed on a plate-like side surface, and a lower portion of the cap is soldered to the circuit board. FIG. 3 shows the configuration of a conventionally used ceramic capacitor with a cap. That is, an external electrode material is applied in advance to both side surfaces of one ceramic capacitor element 11 to form an external electrode 12, and an adhesive 13 made of epoxy resin is applied between the lower and upper surfaces of the capacitor element 11. 2
The two capacitors are bonded in a plane to integrate the two capacitors. A U-shaped metal cap 14 previously coated with cream solder on its inner surface is fitted to the group of capacitor elements 11 and dried and dried.
By heating and melting the cream solder,
The external electrode 12 of the capacitor element 11 was connected to the cap 14.

However, in such a ceramic capacitor with a cap, an appropriate amount of cream solder is applied to the connection surface between the external electrode 12 of the capacitor element 11 and the metal cap 14 in order to connect the external electrode 12 of the capacitor element 11 and the cap 14. Must be applied. However, the amount of the cream solder must be set to an appropriate amount depending on the size of the bonding surface of the capacitor element 11 and the gap between the bonding surface of the capacitor element 11 and the metal cap 14. The amount of contact between the electrode 12 and the cap 14 is insufficient, resulting in poor electrical characteristics such as a lack of capacitance. If the amount of the cream solder is too large, the melted excess cream solder flows to the bonding surface of the two capacitor elements 11 that are planarly bonded, and a short circuit between the electrodes occurs.

Further, such a ceramic capacitor with a cap is provided with a metal cap 1 in advance in order to connect the external electrode 12 of the capacitor element 11 and the cap 14.
4 is coated with the cream solder and the external electrode processed capacitor element 11 is fitted, and then the cream solder is melted by heating. However, if the amount of heat is small or the heating time is short, the cream solder may not melt completely. As a result, poor electrical characteristics such as a loss of capacitance occur.

[0005] In such electronic components, the connection state between the external electrode 12 and the cap 14 of the electronic component cannot be visually checked. Therefore, in general, the cream solder is heated by unnecessarily high heat or a long heating time. Are melted and connected, but the adhesive bonding the lower and upper surfaces of the two capacitor elements 11 melts and flows due to the heat of melting of the cream solder, and penetrates and connects between the capacitor element 11 and the metal cap 14. If a defect occurs or the amount of heat of melting of the cream solder is excessive, the adhesive is burned and carbonized to cause a defect such as an electric short circuit.

In an electronic component having the above structure, for example, a ceramic capacitor, an adhesive is injected between the upper surface and the lower surface of the capacitor element 11. A gap twice as large as the thickness of the external electrode 12 formed on the side surface is generated. Therefore, when the adhesive is injected, the adhesive needs to have a viscosity to contact the upper and lower surfaces of the capacitor element 11 and maintain the shape. is there. If the viscosity of the adhesive is too low, the adhesive will flow and cause poor bonding, or will flow out to the bonding surface between the metal cap 14 and the capacitor element 11 and cause a disconnection failure. If the viscosity is too high, the capacitor element 11
There is a problem in that the adhesive does not flow to the upper and lower surfaces of the film, resulting in poor adhesion.

[0007]

As described above, in an electronic component in which many and many types of capacitor elements are stacked, an appropriate amount of cream solder is applied to the connection surface between the external electrode of the capacitor element and the metal cap. In addition, there has been a problem that the heating at the time of melting the cream solder to connect the electronic component to the metal cap must be an appropriate amount of heat. Furthermore, when an adhesive is injected between the upper and lower surfaces of an electronic component element such as a capacitor element and bonded, depending on the properties and viscosity of the adhesive, poor adhesion between the electronic component elements and poor connection with a metal cap may occur. There was a problem that occurred.

An object of the present invention is to solve such a drawback and to provide an electronic component which integrates electronic component elements without using an adhesive and does not cause defective electrical characteristics. It was done.

[0009]

According to a first aspect of the present invention, an electrode material applied to external electrode portions of two or more electronic component elements is integrated by baking. It is characterized by the following.

In the electronic component according to the first aspect,
Since an electrode material is applied to the external electrode surfaces of a large number of electronic component elements and baked at a predetermined temperature, an integrated electronic component can be obtained by this baking. In such an electronic component, an adhesive is not used to integrate a large number of electronic component elements, so that there is no occurrence of an adhesion failure due to the flow of the adhesive or a short circuit due to carbonization of the adhesive.

According to a second aspect of the present invention, there is provided an electronic component in which electrode materials applied to external electrode portions of two or more electronic component elements are integrated by baking, and the external electrode portion of the electronic component is formed on an inner surface. It is characterized by comprising a U-shaped or box-shaped cap connected. In the electronic component described in claim 2, since the electronic component element is integrated without using an adhesive, a connection failure due to the outflow of the adhesive to the contact surface between the electronic component element and the metal cap occurs. There is no.

The connection between the electronic component element and the metal cap having a U-shape or a box shape is made by integrating the electronic component element to form an external electrode. It has features that are sufficient in terms of point.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings, taking a ceramic capacitor as an example. As shown in FIG. 1, two ceramic capacitor elements 1 having the same length and width are stacked and the external electrode application surfaces are aligned, firstly, an electrode material is applied to one external electrode portion and dried, and then the other is applied. After the electrode material was applied and dried in the same manner on the external electrode portion, it was fired at a predetermined temperature to form the external electrode 2.

As described above, the two ceramic capacitor elements 1 have a problem in the strength only by coating and drying the electrode material on the external electrode portion, and it is difficult to use the ceramic capacitor element 1 as it is. By hardening by heating, the external electrode 2 which is tough both thermally and mechanically is obtained, and a capacitor in which the capacitor element 1 is integrated can be obtained.

The electronic component such as a capacitor integrated as described above can be used as it is as a chip-type electronic component, but the electronic component element 3 integrated in this manner is as shown in FIG. An electronic component 5 housed in the inner surface of the U-shaped cap 4 or a box-shaped cap (not shown) and connected by cream solder or the like can be obtained.

In the above embodiment, two ceramic capacitor elements 1 having the same length and width have been described.
Similar effects can be obtained with electronic components having different widths.

In the above embodiment, two ceramic capacitor elements 1 are stacked, the external electrode application surfaces are aligned, the external electrode portion is coated with an electrode material, dried, and then hardened at a predetermined temperature to form the external electrode. 2 was described, but in order to further improve the mechanical strength and the soldering performance to the electronic circuit board, the electronic components that were coated with the electrode material on the external electrode, dried and baked were melted with molten solder. The solder layer can be formed on the external electrode by immersion in the electrode.

In the above-described embodiment, the case where a ceramic capacitor is used as an electronic component has been described.

[0019]

As described above, in the electronic component according to the present invention, since the electronic component elements are integrated and the electrode material is applied to the external electrode portion and baked, the integrated tough electrode is formed. It is also possible to improve the solderability by forming a solder layer on the external electrode surface.

Further, it can be used as a cap-type electronic component by connecting to the inner surface of a U-shaped or box-shaped cap.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component according to the present invention.

FIG. 2 is a front view showing an embodiment of a cap-type electronic component according to the present invention.

FIG. 3 is a front view showing a conventional electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Capacitor element 2 ... External electrode 3 ... Electronic component element 4 ... U-shaped cap 5 ... Electronic component

Claims (2)

[Claims] An electronic component comprising two or more electronic component elements, wherein an electrode material applied to an external electrode portion of the electronic component element is baked and integrated. 2. An electronic component in which electrode materials applied to external electrode portions of two or more electronic component elements are integrated by baking, and a U-shaped or box in which the external electrode portion of the electronic component is connected to an inner surface. An electronic component comprising a shape cap.