JPH11167352A - 物品 - Google Patents

物品

Info

Publication number: JPH11167352A
Authority: JP; Japan
Prior art keywords: article; support film; flat; signal transmission; conductor
Prior art date: 1997-09-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP10255520A

Other languages

English (en)

Japanese (ja)

Inventor

Matt C Kesler

シー．ケスラーマット

J Scott Reynolds Sr

レイノルズ，シニアジェイ．スコット

Robert A Russell

エー．ラッセルロバート

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Gore Enterprise Holdings Inc

Original Assignee

Gore Enterprise Holdings Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-09-11

Filing date

1998-09-09

Publication date

1999-06-22

1998-09-09 Application filed by Gore Enterprise Holdings Inc filed Critical Gore Enterprise Holdings Inc

1999-06-22 Publication of JPH11167352A publication Critical patent/JPH11167352A/ja

Status Pending legal-status Critical Current

Links

239000012790 adhesive layer Substances 0.000 claims abstract description 28
230000008054 signal transmission Effects 0.000 claims abstract description 23
239000004020 conductor Substances 0.000 claims description 56
229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
239000004810 polytetrafluoroethylene Substances 0.000 claims description 12
-1 polytetrafluoroethylene Polymers 0.000 claims description 9
239000000758 substrate Substances 0.000 claims description 9
229910052782 aluminium Inorganic materials 0.000 claims description 8
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
239000004642 Polyimide Substances 0.000 claims description 6
229910052802 copper Inorganic materials 0.000 claims description 6
239000010949 copper Substances 0.000 claims description 6
229920000728 polyester Polymers 0.000 claims description 6
229920001721 polyimide Polymers 0.000 claims description 6
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
229910052737 gold Inorganic materials 0.000 claims description 5
239000010931 gold Substances 0.000 claims description 5
239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 4
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 4
239000000203 mixture Substances 0.000 claims description 4
229920009441 perflouroethylene propylene Polymers 0.000 claims description 4
229920000642 polymer Polymers 0.000 claims description 4
229910052710 silicon Inorganic materials 0.000 claims description 4
239000010703 silicon Substances 0.000 claims description 4
229910000861 Mg alloy Inorganic materials 0.000 claims description 3
SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims description 3
239000004033 plastic Substances 0.000 claims description 3
229920003023 plastic Polymers 0.000 claims description 3
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
229910052721 tungsten Inorganic materials 0.000 claims description 3
239000010937 tungsten Substances 0.000 claims description 3
238000003466 welding Methods 0.000 claims 2
238000009472 formulation Methods 0.000 claims 1
229920006267 polyester film Polymers 0.000 claims 1
238000009210 therapy by ultrasound Methods 0.000 abstract description 2
238000005311 autocorrelation function Methods 0.000 description 23
238000000034 method Methods 0.000 description 21
239000000463 material Substances 0.000 description 17
230000005540 biological transmission Effects 0.000 description 12
239000011521 glass Substances 0.000 description 9
238000004519 manufacturing process Methods 0.000 description 6
239000000853 adhesive Substances 0.000 description 3
230000001070 adhesive effect Effects 0.000 description 3
238000009125 cardiac resynchronization therapy Methods 0.000 description 3
239000012212 insulator Substances 0.000 description 3
239000004973 liquid crystal related substance Substances 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000002184 metal Substances 0.000 description 3
238000007796 conventional method Methods 0.000 description 2
QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
238000005516 engineering process Methods 0.000 description 2
239000011810 insulating material Substances 0.000 description 2
239000010410 layer Substances 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
238000004806 packaging method and process Methods 0.000 description 2
239000002245 particle Substances 0.000 description 2
239000002904 solvent Substances 0.000 description 2
235000003325 Ilex Nutrition 0.000 description 1
241000209035 Ilex Species 0.000 description 1
229920001774 Perfluoroether Polymers 0.000 description 1
241000233805 Phoenix Species 0.000 description 1
230000003466 anti-cipated effect Effects 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000003618 dip coating Methods 0.000 description 1
239000012769 display material Substances 0.000 description 1
229920000295 expanded polytetrafluoroethylene Polymers 0.000 description 1
238000001125 extrusion Methods 0.000 description 1
239000000945 filler Substances 0.000 description 1
229920002313 fluoropolymer Polymers 0.000 description 1
239000004811 fluoropolymer Substances 0.000 description 1
239000011888 foil Substances 0.000 description 1
238000009434 installation Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
239000012528 membrane Substances 0.000 description 1
239000007769 metal material Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
239000002861 polymer material Substances 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
239000011148 porous material Substances 0.000 description 1
239000000843 powder Substances 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
230000004043 responsiveness Effects 0.000 description 1
230000000717 retained effect Effects 0.000 description 1
238000007789 sealing Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000005245 sintering Methods 0.000 description 1
239000011877 solvent mixture Substances 0.000 description 1
239000012815 thermoplastic material Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display

Landscapes

Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Multi-Conductor Connections (AREA)
Coupling Device And Connection With Printed Circuit (AREA)
Insulated Conductors (AREA)
Liquid Crystal (AREA)

JP10255520A 1997-09-11 1998-09-09 物品 Pending JPH11167352A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US92798497A	1997-09-11	1997-09-11
US08/927984		1997-09-11

Publications (1)

Publication Number	Publication Date
JPH11167352A true JPH11167352A (ja)	1999-06-22

Family

ID=25455536

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP10255520A Pending JPH11167352A (ja)	1997-09-11	1998-09-09	物品

Country Status (3)

Country	Link
EP (1)	EP0902500A3 (de)
JP (1)	JPH11167352A (de)
KR (1)	KR19990029275A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4725046B2 (ja) *	2003-08-20	2011-07-13	東ソー株式会社	ディスプレイ用プラスチック基板および表示素子
DE602005010225D1 (de) *	2005-06-13	2008-11-20	Research In Motion Ltd	Elektrischer Verbinder und elektrisches System für ein Bauteil in einem elektronischen Gerät
US7408786B2 (en)	2005-06-13	2008-08-05	Research In Motion Limited	Electrical connector and system for a component in an electronic device
KR100696629B1 (ko) *	2005-09-26	2007-03-19	삼성에스디아이 주식회사	플라즈마 디스플레이 장치
EP2027760A2 (de) *	2006-05-22	2009-02-25	Philips Intellectual Property & Standards GmbH	Verbindungsanordnung und verfahren zur verbindung eines hochstromkabels mit einem metalldünnfilm
CN104167234A (zh) *	2014-08-29	2014-11-26	孙金福	一种铜包铝镁合金线
KR102635524B1 (ko) *	2018-09-18	2024-02-13	삼성디스플레이 주식회사	표시장치 및 이의 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6377284U (de) *	1986-11-10	1988-05-23
US5424605A (en) *	1992-04-10	1995-06-13	Silicon Video Corporation	Self supporting flat video display
DE4327099A1 (de) *	1993-08-12	1995-02-16	Sican Gmbh	Kupplungselement zur Verbindung von auf Folie geführten Mikrostreifenleitungen
JP3143565B2 (ja) *	1994-02-28	2001-03-07	キヤノン株式会社	フレキシブルプリント配線、その接続装置、及び電気回路装置

1998
- 1998-08-06 KR KR1019980031968A patent/KR19990029275A/ko not_active Withdrawn
- 1998-09-09 JP JP10255520A patent/JPH11167352A/ja active Pending
- 1998-09-10 EP EP98307316A patent/EP0902500A3/de not_active Withdrawn

Also Published As

Publication number	Publication date
EP0902500A3 (de)	2000-11-29
KR19990029275A (ko)	1999-04-26
EP0902500A2 (de)	1999-03-17

Publication	Publication Date	Title
US5354392A (en)	1994-10-11	Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves
US8362488B2 (en)	2013-01-29	Flexible backplane and methods for its manufacture
US4375379A (en)	1983-03-01	Process of making a multiple conductor flexible wire cable
CN102037614B (zh)	2014-03-19	粘接材料卷轴
EP1468443A1 (de)	2004-10-20	Vorrichtung mit kleinen und grossen strukturelementen und deren herstellungsverfahren
AU2003205307A1 (en)	2003-09-18	Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US9332641B2 (en)	2016-05-03	Connection structure of circuit board
US7408263B2 (en)	2008-08-05	Anisotropic conductive coatings and electronic devices
JP2009188114A (ja)	2009-08-20	フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器
US6380681B1 (en)	2002-04-30	Video Display and manufacturing method therefor
JPH11167352A (ja)	1999-06-22	物品
KR100406090B1 (ko)	2003-11-14	이방성 도전 필름
KR20240049589A (ko)	2024-04-16	접속 필름의 제조 방법
JP2011077125A (ja)	2011-04-14	配線板、配線板の製造方法、配線板の接続構造及び配線板の接続方法
JPS58180088A (ja)	1983-10-21	配線基板
JP2011077126A (ja)	2011-04-14	配線板、配線板の製造方法、配線板の接続構造及び配線板の接続方法
JP5082296B2 (ja)	2012-11-28	配線付き接着剤及び回路接続構造
JP2020174090A (ja)	2020-10-22	配線基板、複合基板及び複合基板の製造方法
JPH01194209A (ja)	1989-08-04	熱接着性可撓性配線部材
JP3138859B2 (ja)	2001-02-26	プリント基板とテープキャリアパッケージとの接続部のコーティング材硬化方法およびその硬化方法を用いた液晶表示装置
JP2000150009A (ja)	2000-05-30	回路の接続部材及びその製造方法
JPH11288002A (ja)	1999-10-19	液晶駆動回路モジュールおよび該モジュールを用いた液晶表示装置
JP3257246B2 (ja)	2002-02-18	Ｔａｂ用テープキャリア，及びその製造方法
JPH10335791A (ja)	1998-12-18	フレキシブルプリント配線板及びその製造方法
JPH05218634A (ja)	1993-08-27	回路の接続方法

JPH11167352A - 物 品 - Google Patents