JPH11176552A - Terminal and conductor connection method - Google Patents
Terminal and conductor connection methodInfo
- Publication number
- JPH11176552A JPH11176552A JP9362062A JP36206297A JPH11176552A JP H11176552 A JPH11176552 A JP H11176552A JP 9362062 A JP9362062 A JP 9362062A JP 36206297 A JP36206297 A JP 36206297A JP H11176552 A JPH11176552 A JP H11176552A
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- Prior art keywords
- terminal
- tin
- wire
- plated
- conductor
- Prior art date
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Abstract
(57)【要約】
【課題】端子と導体の界面の接合強度に信頼性の高いも
のを得ることのできる、端子と導体の接続方法を提供す
る。
【解決手段】銅及び銅合金または複合線にそれらの構成
材より低融点の金属をメッキしたメッキ線素線またはメ
ッキ線素線を撚り合わせた撚線と、上記と同様の低融点
の金属をメッキした端子を、圧力を加えながら加熱する
ことにより、導体と端子の空隙に低融点のメッキ材が液
相として浸入し、この液相のメッキ金属を介して固相の
導体と固相の端子の拡散を促進させかつ圧接を行なう。
より好ましくは、錫メッキ銅素線または錫メッキ銅素線
の撚線に錫メッキをした撚線と、錫メッキ金属端子を、
圧着した後、加圧しながら２KA〜４KAの範囲で加熱する
ことにより、錫を溶融させ液相として端子と素線または
撚線の接合部近傍の空隙に浸入させる。
(57) [Problem] To provide a method of connecting a terminal and a conductor which can obtain a highly reliable bonding strength at an interface between the terminal and the conductor. A stranded wire obtained by plating copper and a copper alloy or a composite wire with a metal having a lower melting point than those constituting materials and a stranded wire obtained by twisting a plated wire and a metal having the same low melting point as described above. By heating the plated terminals while applying pressure, a low-melting-point plating material enters the gap between the conductor and the terminal as a liquid phase, and passes through the solid-phase conductor and the solid-phase terminal through the liquid-phase plated metal. Is promoted and pressure welding is performed.
More preferably, a tin-plated copper wire or a tin-plated stranded wire obtained by tinning a stranded wire of a tin-plated copper wire, and a tin-plated metal terminal,
After pressure bonding, by heating under pressure in the range of 2 KA to 4 KA, the tin is melted and infiltrated as a liquid phase into the gap near the joint between the terminal and the strand or stranded wire.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品等におけ
る金属製の端子と導体の接続方法に関する。The present invention relates to a method for connecting a metal terminal and a conductor in an electronic component or the like.
【０００２】[0002]
【従来の技術】電線導体（素線または撚線）と金属端子
の接続や電線導体同志の接続において、圧着法で接合が
行われている。2. Description of the Related Art In connection between an electric wire conductor (elementary wire or stranded wire) and a metal terminal or between electric wire conductors, joining is performed by a crimping method.
【０００３】圧着法は、冷間で端子に導体を機械的に保
持する方法であり、導体と端子が金属的に接合していな
いので、長時間のヒートサイクルテストを行うと、接合
界面の酸化、腐食のために信頼性が低下する傾向があ
る。[0003] The crimping method is a method of mechanically holding a conductor to a terminal in a cold state. Since the conductor and the terminal are not metallically joined, if a long-time heat cycle test is carried out, oxidation of the joint interface will occur. , There is a tendency for reliability to decrease due to corrosion.
【０００４】また、抵抗溶接機による熱圧着法もよく使
われており、荷重をかけながら電流を流すことにより、
銅導体同志を接続する技術からなる。この方法では、多
数本の撚線の接続が難しいという欠点がある。A thermocompression bonding method using a resistance welding machine is also widely used.
It consists of technology for connecting copper conductors. This method has a disadvantage that it is difficult to connect a large number of twisted wires.
【０００５】それに対して、撚線同志を圧着と熱圧接に
て接続する方法が提案されている。この方法は、圧着作
用と熱圧着による金属結合を行う方法であり、金属結合
を有しながら圧着材と同等の引張り強度を有せしめてい
る（文献；藤巻他、溶接学会論文集第１１巻（１９９
３）２号Ｐ２７７参照）。On the other hand, there has been proposed a method of connecting stranded wires by crimping and hot pressing. This method is a method of performing metal bonding by press bonding and thermocompression bonding, and has a tensile strength equivalent to that of a pressure bonded material while having metal bonding (Reference: Fujimaki et al., Journal of the Japan Welding Society, Vol. 11 ( 199
3) No. 2, p. 277).
【０００６】また、超音波圧接法も提案され、一部で使
用されており、金属結合が可能となっているが、撚線の
接合には使用し難いのが現状である。[0006] An ultrasonic pressure welding method has also been proposed and used in some cases, and is capable of metal bonding, but at present it is difficult to use it for joining stranded wires.
【０００７】[0007]
【発明が解決しようとする課題】前述した従来技術つま
り、圧着による方法、熱圧着による方法、圧着＋熱圧着
による方法、超音波接合法では、端子と導体とを固相
（固体）と固相（固体）の接合を行う方法であり、一部
で金属的接合は得られるものの、界面の接合強度に不安
が残っていた。In the above-mentioned conventional techniques, that is, a method by crimping, a method by thermocompression, a method by crimping + thermocompression, and an ultrasonic bonding method, a terminal and a conductor are connected to a solid phase (solid). This is a method of joining (solid), and although metallic joining can be obtained in part, uneasiness remains in the joining strength at the interface.
【０００８】よって、端子と導体との接合技術におい
て、より耐食性、耐酸化性等の信頼性のある方法の開発
が強く望まれていた。Therefore, in the joining technique between the terminal and the conductor, there has been a strong demand for the development of a more reliable method such as corrosion resistance and oxidation resistance.
【０００９】そこで、本発明の解決すべき課題（目的）
は、端子と導体の界面の接合強度に信頼性の高いものを
得ることのできる、端子と導体の接続方法を提供するこ
とにある。Therefore, the problems to be solved by the present invention (objects)
It is an object of the present invention to provide a method for connecting a terminal and a conductor, which can obtain a highly reliable bonding strength at an interface between the terminal and the conductor.
【００１０】[0010]
【課題を解決するための手段】本発明により提供する第
一手段による端子と導体の接続方法は、銅及び銅合金ま
たは複合線にそれらの構成材より低融点の金属をメッキ
したメッキ線素線またはメッキ線素線を撚り合わせた撚
線と、上記の低融点金属と同様の低融点の金属をメッキ
した端子を、圧力を加えながら加熱することにより、導
体と端子の空隙に低融点のメッキ材が液相として浸入
し、この液相のメッキ金属を介して固相の導体と固相の
端子の拡散を促進させかつ圧接を行なうことにより、端
子と導体の接合界面強度を高くする方法からなる。According to a first aspect of the present invention, there is provided a method for connecting a terminal and a conductor, wherein the method comprises the steps of: plating a copper and copper alloy or a composite wire with a metal having a lower melting point than those of the components; Alternatively, by heating a stranded wire obtained by twisting a plated wire and a terminal plated with a low melting point metal similar to the above low melting point metal while applying pressure, a low melting point plating is applied to the gap between the conductor and the terminal. The material penetrates as a liquid phase, and by promoting the diffusion of the solid-phase conductor and the solid-state terminal through this liquid-phase plated metal and performing pressure welding, the method increases the interface strength between the terminal and the conductor. Become.
【００１１】前記第一手段の方法において、メッキ材と
しては、錫（ｍｐ２３１．９℃）、銀（ｍｐ９６０．８
℃）及びそれらより融点の低い金属材料を用いることが
望ましい。また、加熱手段としては通電加熱（抵抗加
熱）を用いるか、加熱源として、加熱された金属治具、
光ビーム、半導体レーザーを用いると良い。或いは加熱
源の代用として超音波を負荷することも可能である。In the method of the first means, tin (mp 231.9 ° C.), silver (mp 960.8
C.) and metal materials having a lower melting point than these. As the heating means, electric heating (resistance heating) is used, or as a heating source, a heated metal jig,
Light beams and semiconductor lasers are preferably used. Alternatively, ultrasonic waves can be applied as a substitute for the heating source.
【００１２】本発明により提供する第二手段による端子
と導体の接続方法は、錫メッキ銅素線または錫メッキ銅
素線の撚線に錫メッキをした撚線と、錫メッキ金属端子
を、圧着した後、加圧しながら２KA〜４KAの範囲で加熱
することにより、錫を溶融させ液相として端子と素線ま
たは撚線の接合部近傍の空隙に浸入させる方法からな
る。The method for connecting a terminal and a conductor by the second means provided by the present invention is a method of crimping a tin-plated copper wire or a tin-plated stranded wire obtained by tinning a stranded wire of a tin-plated copper wire and a tin-plated metal terminal. Then, by heating under pressure in the range of 2 KA to 4 KA, tin is melted and infiltrated as a liquid phase into a void near the joint between the terminal and the strand or the stranded wire.
【００１３】前記第二手段の方法において用いる低融点
金属材料としての錫は、銅系材料（端子及び導体）と接
合した場合に固溶強化され接続強度がより一層高まる。
また、錫は、銅系材料（端子及び導体）と接合した場合
に、電気化学的にアノードとして作用するために、端子
と導体の接続部の耐食性をより一層向上させることがで
きる。[0013] Tin as a low melting point metal material used in the method of the second means is solid-solution strengthened when joined to a copper-based material (terminal and conductor) to further increase the connection strength.
In addition, when tin is bonded to a copper-based material (terminal and conductor), it acts electrochemically as an anode, so that the corrosion resistance of the connection between the terminal and the conductor can be further improved.
【００１４】前記第二手段の方法において、加熱手段と
しては、通電加熱を用いるか、加熱源として、加熱され
た金属治具、光ビーム、半導体レーザーを用いると良
い。或いは加熱源の代用として超音波を負荷することも
可能である。また、素線または撚線と端子とを、圧着を
経ずに直接加圧しながら通電加熱する方法をとることも
可能である。さらに、接合部近傍の空隙に浸入させるメ
ッキ材質の融点が、銅線または金属端子の材質の融点よ
りも低いことが望ましい。In the method of the second means, it is preferable to use electric heating as the heating means, or to use a heated metal jig, light beam, or semiconductor laser as the heating source. Alternatively, ultrasonic waves can be applied as a substitute for the heating source. It is also possible to adopt a method in which the wire or the stranded wire and the terminal are energized and heated while being directly pressed without undergoing crimping. Further, it is desirable that the melting point of the plating material penetrating into the gap near the joint is lower than the melting point of the material of the copper wire or the metal terminal.
【００１５】本発明により提供する第三手段による端子
と導体の接続方法は、銅素線または銅撚線と、錫メッキ
した金属端子を、圧着加工しながら通電加熱することに
より、端子側の錫を溶融させ液相として端子と素線また
は撚線の接合部近傍の空隙に浸入させる方法からなる。The method for connecting a terminal and a conductor by the third means provided by the present invention is as follows: a copper element wire or a stranded copper wire and a tin-plated metal terminal are heated while being press-bonded, so that the tin on the terminal side is heated. Is melted and infiltrated as a liquid phase into a void near the joint between the terminal and the strand or stranded wire.
【００１６】尚、上記のいずれの手段においても、メッ
キ材質に鉛を含まず、最近の環境問題に対応させること
が望ましい。In any of the above-mentioned means, it is desirable that the plating material does not contain lead and that it is adapted to recent environmental problems.
【００１７】[0017]
【発明の実施の形態】以下、本発明の第二手段の方法を
具体化した実施例について説明する。錫メッキの軟銅線
（φ０．１２７）を７本撚り合わせた撚線と、０．１６
mmt の黄銅（Ｃｕ−％Ｚｎ）製の端子を、図１のよう
に、つまり、錫メッキ軟銅撚線１上に略Ｕ字状の黄銅製
端子２を配置し、黄銅製端子２の両外面から圧着治具
３，３によって１０kgf の荷重をかけ、１〜３KAの電流
値で通電状態下で０．３sec の圧着を実施した。撚線の
みの破断強度は２．２kgf である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments embodying the method of the second means of the present invention will be described. Twisted seven tinned annealed copper wires (φ0.127) and 0.16
The mm t brass (Cu-% Zn) made from the terminal, as shown in FIG. 1, that is, on the tin-plated soft copper stranded wire 1 is disposed a substantially U-shaped brass terminals 2, the brass terminal 2 both A load of 10 kgf was applied from the outer surface by the crimping jigs 3 and 3, and the crimping was performed at a current value of 1 to 3 KA for 0.3 sec under the energized state. The breaking strength of the stranded wire alone is 2.2 kgf.
【００１８】上記の実施例に対して黄銅製端子２と錫メ
ッキ軟銅撚線１の接続強度を評価するために、黄銅製端
子と錫メッキ軟銅撚線の引張り試験を行った。その結
果、破断強度は、電流値１KAにおいて１．９kgf で２kg
f に達せず、それ以上の１．５KAで２．０５kgf 、２．
０KAで２．０５、３．０KAで２．０５kgf であった。In order to evaluate the connection strength between the brass terminal 2 and the tin-plated soft copper stranded wire 1 with respect to the above embodiment, a tensile test was performed on the brass terminal and the tin-plated soft copper stranded wire. As a result, the breaking strength was 2 kg at 1.9 kgf at a current value of 1 KA.
1.5 kgf at 1.5 KA higher than f.
It was 2.05 kgf at 0 KA and 2.05 kgf at 3.0 KA.
【００１９】図２に、黄銅製の端子５と錫メッキ軟銅線
による撚線４の接続部の断面写真を示した。この断面写
真は、アンモニア−過酸化水素水でエッチングして接続
状況を分かるようにしてある。図２ａ）は比較例で電流
値１．５KAでの通電による場合の接続状況、図２ｂ）は
電流値２．０KA、図２ｃ）は電流値３．０KAでの通電に
よる場合の接続状況である。FIG. 2 shows a cross-sectional photograph of a connection portion between the brass terminal 5 and the stranded wire 4 made of tin-plated soft copper wire. In this cross-sectional photograph, the connection state can be understood by etching with ammonia-hydrogen peroxide solution. 2a) is a connection example in the comparative example when energizing at a current value of 1.5 KA, FIG. 2b) is a connecting state when energizing at a current value of 3.0 KA, and FIG. .
【００２０】ここで、図２ｃ）は、撚線４が端子５によ
って楕円状に圧潰変形され、撚線４の素線間及び撚線４
と端子５との間をメッキ材のスズ６が埋めた構造となっ
ていることが見られる。Here, FIG. 2C) shows that the stranded wire 4 is crushed and deformed in an elliptical shape by the terminal 5, and the space between the strands of the stranded wire 4 and the stranded wire 4 are shown.
It can be seen that tin 6 of the plating material is buried between the terminal 5 and the terminal 5.
【００２１】通常行われている、単なる冷間圧着では端
子と導体間に空隙を生じるのは避けられないが、上記の
実施例の場合には、メッキ材の錫と導体部の銅が通電下
での加熱拡散により金属的に結合しており、長時間放置
による銅線と銅線の間、銅線と端子の間の酸化や腐食に
よる信頼性の低下を防ぐことが可能となる。Although it is unavoidable that a gap is formed between the terminal and the conductor in the ordinary cold crimping which is usually performed, in the case of the above-described embodiment, the tin of the plating material and the copper of the conductor are not energized. It is possible to prevent a decrease in reliability due to oxidation or corrosion between the copper wires and between the copper wires and the terminals due to being left for a long time.
【００２２】即ち、ＭＩＬＳＴＤ１３４４Ａの湿度一定
の熱サイクルテスト（１サイクルの条件：湿度９０〜９
６％、温度条件６５℃×３ｈ→２．５ｈ、２５℃→２．
５ｈ６５℃×３ｈ→２．５ｈ、２５℃×２ｈ→０．５
ｈ、−１０℃×３ｈ→０．５ｈ、２５℃×２ｈ）を１０
サイクルにて接続部の電気抵抗を測定し、試験前の電気
抵抗で除すると、空隙の少ない図２ｃ）の実施例では、
３．０KAで１．０１の値を示し、これは接続部の劣化が
殆どないことを意味する。That is, a heat cycle test of MILSTD 1344A at a constant humidity (one cycle condition: humidity 90 to 9)
6%, temperature condition 65 ° C. × 3 h → 2.5 h, 25 ° C. → 2.
5h 65 ℃ × 3h → 2.5h 、 25 ℃ × 2h → 0.5
h, −10 ° C. × 3 h → 0.5 h, 25 ° C. × 2 h)
When the electrical resistance of the connection is measured in a cycle and divided by the electrical resistance before the test, the example of FIG.
A value of 1.01 is shown at 3.0 KA, which means that there is almost no deterioration of the connection portion.
【００２３】それに比べて、図２ａ）の例や単なる圧着
によるものでは、１．２５〜１．３８の値を示し、これ
は接続部の信頼性が劣っていることの現れである。On the other hand, in the example shown in FIG. 2A) or by simple crimping, values of 1.25 to 1.38 are shown, which indicates that the reliability of the connection portion is inferior.
【００２４】上記のようなことから、本発明の実施例で
ある図２ｃ）及び図２ｂ）によれば、接続部の信頼性に
優れていることが分かる。From the above, according to FIGS. 2c) and 2b) of the embodiment of the present invention, it can be seen that the reliability of the connection portion is excellent.
【００２５】以上のような検討の結果をまとめると次の
ようになる。耐食性及び耐酸化性のある接合部とは、接
合部に空隙の少ないものである。空隙があるとその空隙
の部分で空気に触れるため、導体が酸化し易かったり、
空隙に水が溜まり易くなることから、空隙の少ない接続
が望ましいのである。The results of the above study are summarized as follows. A joint having corrosion resistance and oxidation resistance is one having few voids in the joint. If there is a gap, the conductor is easily oxidized because it touches air at the gap,
Since water easily accumulates in the voids, a connection with few voids is desirable.
【００２６】また、抵抗溶接のとき、脆いＣｕ6 Ｓｎ5
等の化合物が形成されないように、銅の中に錫が固溶し
た接合界面の錫濃度の低い接合状態になっていることが
望ましい。そのため、錫メッキの場合では、電流が２KA
以上で４KA以下が良い。その点は、以下の表１を参照さ
れたい。In resistance welding, fragile Cu 6 Sn 5
In order to prevent the formation of such a compound as above, it is desirable that the joining interface in which tin is dissolved in copper is in a joining state with a low tin concentration. Therefore, in the case of tin plating, the current is 2 KA
Above, 4KA or less is good. In that regard, see Table 1 below.
【００２７】[0027]
【表１】 [Table 1]
【００２８】表１は、黄銅製端子と錫メッキ軟銅撚線の
接続部においての、特定の電流値による通電加熱圧着に
おいての接続部界面の症状を診断した結果を示したもの
である。Table 1 shows the results of diagnosing the symptom of the interface at the connection between the brass terminal and the tin-plated soft copper stranded wire during the heating and crimping with a specific current value.
【００２９】表１から明らかなように、電流値が１．５
KA以下の場合では、熱サイクルテスト前後の抵抗比が大
きい。これは、接合部の空隙が多いためである。また、
その場合では、接合界面の錫濃度が２〜１０％と高く
（ＸＭＡで点分析で評価）、脆い化合物を形成する可能
性のあることが分かった。As is apparent from Table 1, when the current value is 1.5
In the case of KA or less, the resistance ratio before and after the thermal cycle test is large. This is because there are many gaps at the joint. Also,
In that case, the tin concentration at the bonding interface was as high as 2 to 10% (evaluated by point analysis with XMA), and it was found that a brittle compound could be formed.
【００３０】表１において、２．０KA以上の場合では、
熱サイクルテスト前後の抵抗比が約１．０であり安定し
ている。これらの接合界面の錫濃度は２％以下であり、
化合部が存在する可能性は少ないとみてよい。しかし、
４．５KA以上の場合には、圧着部表面に傷が多くなり、
製品としての使用には適さないものである。In Table 1, in the case of 2.0 KA or more,
The resistance ratio before and after the heat cycle test is about 1.0, which is stable. The tin concentration at these bonding interfaces is 2% or less,
It may be considered that there is little possibility that the compound is present. But,
In the case of 4.5 KA or more, the surface of the crimping part has many scratches,
It is not suitable for use as a product.
【００３１】前述した実施例による効果を列挙すると次
の通りである。端子と導体との接合強度において高い
ものが得られる。即ち錫が銅系材料（端子及び導体）に
拡散し、固溶強化できる。経時的劣化対応の信頼性に
優れる。端子と導体の間への錫メッキの溶融・浸入で
耐食性に優れたものとなる。即ち、錫がアノードとな
る。接続部を保護することが可能。端子と導体の自
動接続に適する簡易技術となり得る。The effects of the above-described embodiment are listed as follows. A high bonding strength between the terminal and the conductor can be obtained. That is, tin diffuses into the copper-based material (terminal and conductor) and can be solid-solution strengthened. Excellent reliability for deterioration over time. Melting and infiltration of tin plating between terminals and conductors results in excellent corrosion resistance. That is, tin becomes the anode. Connections can be protected. It can be a simple technology suitable for automatic connection between terminals and conductors.
【００３２】[0032]
【発明の効果】以上説明したような本発明によれば、端
子と導体の界面の接合強度に信頼性の高いものを得るこ
とのできる、端子と導体の接続方法を提供するという所
期の課題（目的）を達成することができる。According to the present invention as described above, it is an object of the present invention to provide a method of connecting a terminal and a conductor which can obtain a highly reliable bonding strength at the interface between the terminal and the conductor. (Objective) can be achieved.
【図１】本発明の実施例にして、錫メッキ軟銅撚線に黄
銅製端子を通電加熱圧着する様子を示す斜視説明図。FIG. 1 is a perspective explanatory view showing a state in which a brass terminal is heated and pressure-bonded to a tin-plated soft copper stranded wire according to an embodiment of the present invention.
【図２】ａ），ｂ），ｃ）ともに、錫メッキ軟銅撚線と
黄銅製端子との圧着接続後の横断面をエッチング処理し
た後の組織で示した写真で、ａ）は負荷電流１．５KA、
ｂ）は負荷電流２．０KA、ｃ）は負荷電流３．０KAの場
合を示す。FIGS. 2 (a), 2 (b) and 2 (c) are photographs showing a structure after etching a cross section of a tin-plated soft copper stranded wire and a brass terminal after crimping connection. .5KA,
b) shows a case where the load current is 2.0 KA, and c) shows a case where the load current is 3.0 KA.
１ 錫メッキ軟銅撚線 ２ 黄銅製端子 ３ 圧着治具 ４ 錫メッキ軟銅撚線 ５ 黄銅製端子 ６ 錫 DESCRIPTION OF SYMBOLS 1 Tin-plated soft copper stranded wire 2 Brass terminal 3 Crimp jig 4 Tin-plated soft copper stranded wire 5 Brass terminal 6 Tin
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｂ２３Ｋ 20/10 Ｂ２３Ｋ 20/10 (72)発明者 早川 良和 茨城県日立市日高町５丁目１番１号 日立 電線株式会社日高工場内 (72)発明者 遠藤 勝雄 茨城県日立市川尻町４丁目10番１号 日立 電線加工株式会社内──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI B23K 20/10 B23K 20/10 (72) Inventor Yoshikazu Hayakawa 5-1-1 Hidakacho, Hitachi City, Ibaraki Prefecture Hitachi Cable, Ltd. Inside the Hidaka Plant (72) Inventor Katsuo Endo 4-10-1, Kawajiri-cho, Hitachi City, Ibaraki Prefecture Inside Hitachi Cable Processing Co., Ltd.
Claims (8)
材より低融点の金属をメッキしたメッキ線素線またはメ
ッキ線素線を撚り合わせた撚線と、上記の低融点金属と
同様の低融点の金属をメッキした端子を、圧力を加えな
がら加熱することにより、導体と端子の空隙に低融点の
メッキ材が液相として浸入し、この液相のメッキ金属を
介して固相の導体と固相の端子の拡散を促進させかつ圧
接を行なう、端子と導体の接続方法。A stranded wire obtained by twisting a plated wire or a plated wire obtained by plating a metal having a lower melting point than copper or a copper alloy or a composite wire on a composite wire thereof, By heating the terminal plated with the low melting point metal while applying pressure, the low melting point plating material penetrates into the gap between the conductor and the terminal as a liquid phase, and the solid phase conductor passes through the liquid phase plated metal. A method for connecting a terminal and a conductor, which promotes diffusion of the terminal of the solid phase and press-contacts the terminal.
℃）、銀（ｍｐ９６０．８℃）及びそれらより融点の低
い金属材料を用いる、請求項１記載の端子と導体の接続
方法。2. Tin (mp 231.9) is used as a plating material.
The method for connecting a terminal and a conductor according to claim 1, wherein a metal material having a melting point lower than those of the above is used.
か、加熱源として、加熱された金属治具、光ビーム、半
導体レーザーを用いるか、或いは加熱源の代用として超
音波を負荷する、請求項１記載の端子と導体の接続方
法。3. The method according to claim 1, wherein heating is performed by using electric heating (resistance heating), a heated metal jig, a light beam, a semiconductor laser is used as a heating source, or an ultrasonic wave is applied as a substitute for the heating source. Item 2. The method for connecting a terminal and a conductor according to Item 1.
線に錫メッキをした撚線と、錫メッキ金属端子を、圧着
した後、加圧しながら２KA〜４KAの範囲で加熱すること
により、錫を溶融させ液相として端子と素線または撚線
の接合部近傍の空隙に浸入させる、端子と導体の接続方
法。4. A tin-plated copper strand or a tin-plated copper strand, and a tin-plated stranded wire and a tin-plated metal terminal are crimped, and then heated in a range of 2 KA to 4 KA while applying pressure. A method of connecting a terminal and a conductor, wherein tin is melted and infiltrated as a liquid phase into a void near a joint between the terminal and a strand or a stranded wire.
して、加熱された金属治具、光ビーム、半導体レーザー
を用いるか、或いは加熱源の代用として超音波を負荷す
る、請求項４記載の端子と導体の接続方法。5. The method according to claim 4, wherein electric heating is used as the heating, a heated metal jig, a light beam, a semiconductor laser is used as a heating source, or an ultrasonic wave is loaded as a substitute for the heating source. How to connect terminals and conductors.
と端子とを、圧着を経ずに直接加圧しながら通電加熱す
る、端子と導体の接続方法。6. The method of connecting a terminal and a conductor according to claim 4, wherein the element wire or the stranded wire and the terminal are energized and heated while directly applying pressure without undergoing crimping.
接合部近傍の空隙に浸入させるメッキ材質の融点が、銅
線または金属端子の材質の融点よりも低い、端子と導体
の接続方法。7. The method of claim 4 or claim 6, wherein
A method of connecting a terminal and a conductor, wherein a melting point of a plating material to be penetrated into a void near a joint is lower than a melting point of a material of a copper wire or a metal terminal.
端子を、圧着加工しながら通電加熱することにより、端
子側の錫を溶融させ液相として端子と素線または撚線の
接合部近傍の空隙に浸入させる、端子と導体の接続方
法。8. A copper wire or a twisted copper wire and a tin-plated metal terminal are heated while being press-bonded, thereby melting the tin on the terminal side and joining the terminal and the wire or the twisted wire as a liquid phase. A method of connecting a terminal and a conductor that penetrates a void near the part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9362062A JPH11176552A (en) | 1997-12-11 | 1997-12-11 | Terminal and conductor connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9362062A JPH11176552A (en) | 1997-12-11 | 1997-12-11 | Terminal and conductor connection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11176552A true JPH11176552A (en) | 1999-07-02 |
Family
ID=18475784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9362062A Pending JPH11176552A (en) | 1997-12-11 | 1997-12-11 | Terminal and conductor connection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11176552A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002160069A (en) * | 2000-11-27 | 2002-06-04 | Honda Motor Co Ltd | Terminal joining method |
| JP2004515198A (en) * | 2000-11-30 | 2004-05-20 | コンパクト ダイナミクス ゲーエムベーハー | Stator for electric machine and manufacturing method thereof |
| EP1328058A3 (en) * | 2002-01-10 | 2006-07-05 | Mitsubishi Denki Kabushiki Kaisha | Rotary electric machine and method for connecting stator conductors |
| JP2010140672A (en) * | 2008-12-09 | 2010-06-24 | Mitsubishi Electric Corp | Joint structure |
| WO2014082408A1 (en) * | 2012-11-29 | 2014-06-05 | Gu Guobiao | Wire stock automatic soldering process and wire stock automatic soldering machine |
| CN107552940A (en) * | 2017-08-30 | 2018-01-09 | 北京无线电测量研究所 | One Albatra metal terahertz waveguide diffusion connection manufacture method |
| JP2018128447A (en) * | 2016-12-15 | 2018-08-16 | デルフィ・テクノロジーズ・インコーポレイテッド | Method for predicting the strength of ultrasonic welded joints |
| US20210313090A1 (en) * | 2018-11-26 | 2021-10-07 | Hitachi Metals, Ltd. | Cable and harness |
| CN115070196A (en) * | 2022-08-08 | 2022-09-20 | 南昌航空大学 | Welding joint of conductive copper bar and multi-strand copper wire and friction stir welding method |
| JP2024546049A (en) * | 2021-11-15 | 2024-12-17 | シュトルンク コネクト オートメイテッド ソリューションズ ゲー・エム・ベー・ハー ウント コー． カー・ゲー | Segment control of position dependent welding parameters |
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| JP2004515198A (en) * | 2000-11-30 | 2004-05-20 | コンパクト ダイナミクス ゲーエムベーハー | Stator for electric machine and manufacturing method thereof |
| EP1328058A3 (en) * | 2002-01-10 | 2006-07-05 | Mitsubishi Denki Kabushiki Kaisha | Rotary electric machine and method for connecting stator conductors |
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| JP2018128447A (en) * | 2016-12-15 | 2018-08-16 | デルフィ・テクノロジーズ・インコーポレイテッド | Method for predicting the strength of ultrasonic welded joints |
| CN107552940A (en) * | 2017-08-30 | 2018-01-09 | 北京无线电测量研究所 | One Albatra metal terahertz waveguide diffusion connection manufacture method |
| US20210313090A1 (en) * | 2018-11-26 | 2021-10-07 | Hitachi Metals, Ltd. | Cable and harness |
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| JP2024546049A (en) * | 2021-11-15 | 2024-12-17 | シュトルンク コネクト オートメイテッド ソリューションズ ゲー・エム・ベー・ハー ウント コー． カー・ゲー | Segment control of position dependent welding parameters |
| CN115070196A (en) * | 2022-08-08 | 2022-09-20 | 南昌航空大学 | Welding joint of conductive copper bar and multi-strand copper wire and friction stir welding method |
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