JPH11190703A - Parts inspection equipment - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To accurately inspect the soldering state of a component to a printed circuit board. SOLUTION: Illuminating means 1, 3, 5 for illuminating a gap between a printed board 7 and a component 9 mounted on the printed board 7 from a component side surface, and a print illuminated by the illuminating means 1, 3, 5 The imaging means 11, 13, 15 for imaging the gap between the substrate 7 and the component 9, the illumination means 1, 3, 5 and the imaging means 11, 13, 15 are moved to a predetermined inspection position with respect to the component 9 to be inspected. Moving arrangement means to arrange and imaging means 1
Display means 17 for displaying the imaging results by 1, 13, and 15
This allows direct observation with the naked eye from the side surface of the gap under the component mounted on the printed circuit board in which various components are intricate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a component inspection apparatus for inspecting a soldering state of a component mounted on a printed circuit board.

[0002]

2. Description of the Related Art In mounting electronic components on a printed circuit board, it is important that soldering is performed securely. However, component mounting where the soldered portion is directly under the component and is not directly visible, for example, a ball grid Array components (hereinafter
In particular, in the case of mounting “parts” as appropriate, it is particularly difficult to inspect the state of soldering.

[0005] For example, in the method of performing a test by mechanical contact as shown in FIG. 5, even if it is effective for a peripheral circuit of a component, the solder ball 105 itself mounting and fixing the component 101 to a printed circuit board 103 is used. The probe 107 cannot be directly contacted. In the inspection using X-ray,
Although the state of the solder bridge between the solder balls can be easily found, it is difficult to detect the state in which the solder balls have risen from the pads on the printed circuit board. Further, the X-ray apparatus is difficult to handle, and the apparatus itself is expensive. In the energization inspection, when it is determined that the substrate is defective, a complicated analysis operation in which the influence of peripheral circuits is taken into account is required to specify the defective portion. On a high-density mounting board on which components are mounted, this analysis work becomes a heavy burden.

[0004]

As described above, for the inspection of the soldering state using, for example, a solder ball, there has been no suitable method conventionally, and it has been desired to provide a suitable inspection means.

[0005] The present invention has been made in view of the above,
An object of the present invention is to provide a component inspection apparatus capable of accurately inspecting a state of soldering a component to a printed circuit board.

[0006]

To achieve the above object, according to the present invention, there is provided an illuminating means for illuminating a gap between a printed board and a component mounted on the printed board from a side of the component. An imaging unit for imaging a gap between the printed circuit board and the component illuminated by the illumination unit; a moving arrangement unit for moving and arranging the illumination unit and the imaging unit to a predetermined inspection position with respect to the component to be inspected; And display means for displaying the imaging result.
With this configuration, it is possible to directly observe the gap under the component mounted on the printed board on which the various components are intricate from the side with the naked eye.

According to a second aspect of the present invention, in accordance with the first aspect of the present invention, there is provided a judging means for judging a soldering state in which a component is mounted and fixed on a printed circuit board based on image data from an imaging means. Is the gist. With this configuration, the soldering state can be performed automatically without manual intervention.

According to a third aspect of the present invention, in the second aspect of the present invention, the determining means includes: a mounting height calculating means for calculating a mounting height of the component on the printed circuit board; The present invention has a mounting angle calculating means for calculating the mounting angle with respect to the printed circuit board and a state determining means for determining a soldering state based on the obtained mounting height and mounting angle. With this configuration, even when the solder cannot be directly observed, the soldering state can be accurately determined.

According to a fourth aspect of the present invention, there is provided an illuminating means for illuminating a gap between a printed circuit board and a component mounted on the printed circuit board from a side surface of the component, and a position facing the illuminating means with the component interposed therebetween. Imaging means for imaging transmitted light in a gap between the printed circuit board and the component; moving arrangement means for moving and arranging the illumination means and the imaging means to a predetermined inspection position with respect to the component to be inspected; The gist of the present invention is to include a determination unit that determines a soldering state in which a component is mounted and fixed on a printed circuit board based on transmitted light. With this configuration, it is possible to determine the soldering state including the solder at a position below the component and not observable from the outside. In particular, it is effective to use highly directional light such as a laser as the illumination means.

According to a fifth aspect of the present invention, in the first or the fourth aspect of the present invention, the illuminating means includes a light source and a light guiding means for guiding light from the light source to an illuminated portion. The gist is that the imaging means includes a camera and a light guiding means for guiding light to be imaged to the camera. With this configuration, accurate imaging of the gap under the component is enabled.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing an inspection apparatus according to a first embodiment of the present invention. In the figure, 1 is a light source,
The gap between the printed board 7 and the components 9 mounted on the printed board 7 is illuminated via the optical fiber 3 and the light refracting portion 5 provided at the tip of the optical fiber 3. Reference numeral 11 denotes a camera that captures an image of the illuminated gap between the printed circuit board 7 and the component 9 via the light refracting unit 13 and the optical fiber 15. Here, the light source 1, the optical fiber 3,
Light refraction unit 5, camera 11, optical fiber 15, light refraction unit 1
3 means that the observation position can be changed as appropriate so that it can be moved relative to the printed circuit board 7 by a moving arrangement means (not shown). In this case, the printed circuit board 7 is fixed and the light source 1 and the camera 11 side are fixed. The printed board 7 may be moved with respect to the light source 1 and the camera 11.
An image display device 17 receives an image signal from the camera 11 and displays the image. In addition, the light refraction unit 5,
Reference numeral 13 denotes a light guiding means together with the optical fibers 3 and 15. The light guiding means 13 guides or collects light in a narrow gap between the component 9 and the printed circuit board 7. For example, a polarizer is used. .

Therefore, according to the present embodiment, the narrow gap between the component 9 and the printed circuit board 7 is illuminated based on the light from the light source 1, and the illuminated gap is imaged by the camera 11. Since the result is displayed and output on the image display device 17, the inspector can observe the condition of the solder ball 19 on the outermost peripheral portion of the component 9 from the side of the component.

FIG. 2 is a view showing an inspection apparatus according to a second embodiment of the present invention. Its features include a camera 1
The image processing unit 21 extracts a shape pattern based on the image data from No. 1 and the determination unit 23 determines the soldering state of the solder ball 19 from this shape pattern. In FIG. 2, the same components as those in FIG. 1 are denoted by the same reference numerals.

Therefore, according to the present embodiment, the condition inspection of the solder ball 19 at the outermost peripheral portion of the component 9 can be automatically performed without relying on human vision.

FIG. 3 is a view showing an inspection apparatus according to a third embodiment of the present invention. Its features include a camera 1
After the shape pattern is extracted by the image processing unit 21 based on the image data from No. 1, the component mounting height calculation unit 25 calculates the mounting height of the component 9 based on the extracted shape pattern, and further calculates the mounting height. The component mounting angle calculation unit 27 calculates the mounting angle of the component 9 with respect to the printed circuit board 7 based on the calculated mounting height and the mounting angle, and compares the obtained mounting height and mounting angle with the non-defective data. Is determined. Here, as for the calculation of the mounting height, either a method of calculating based on an image of a single side surface or a method of calculating from a shape pattern taken from a plurality of side surfaces may be used. In FIG. 3, the same components as those in FIG. 2 are denoted by the same reference numerals.

Therefore, according to the present embodiment, a detailed situation inspection of the solder ball 19 can be automatically performed without relying on human vision.

FIG. 4 is a diagram showing an inspection apparatus according to a fourth embodiment of the present invention. As a feature, a laser oscillation device 31 is used as a light source, and a light refraction portion 5 that guides a laser beam from the laser oscillation device 31 to a gap between the component 9 and the printed circuit board 7 is refracted with the gap interposed therebetween. The arrangement is such that the laser beam transmitted through the gap is observed by the camera 11 by disposing the laser beam at a position facing the portion 13. In FIG. 4, the same components as those in FIG. 2 are denoted by the same reference numerals.

Therefore, according to the present embodiment, it is possible to determine the soldering state of the solder ball 19 at a position, which is arranged below the component 9 and cannot be confirmed from the outside, in particular. That is, when there is a solder bridge in the solder ball 19 below the component, the laser beam irradiated via the light refracting portion 5 is not transmitted at all, or is observed as a significant shortage of light amount. In the case where the solder ball 19 is lifted or has an abnormal shape, for example, the reflected light from the surface of the solder ball 19 arranged under the component changes due to the irradiated laser light. This makes it possible to find defects.

[0020]

As described above, according to the first aspect of the present invention, it is possible to directly observe the gap under a component mounted on a printed circuit board on which various components are intricate from the side with the naked eye. Thus, the soldering state of the component can be accurately inspected.

According to the second aspect of the present invention, the soldering state is automatically determined based on the image data, so that the soldering state can be automatically performed without manual operation.

According to the third aspect of the present invention, the soldering state is automatically determined based on the mounting height and mounting angle of the component obtained based on the image data.
Even when the solder cannot be directly observed, the soldering state can be accurately determined.

According to the fourth aspect of the present invention, the illuminating means and the imaging means are arranged to face each other with the component interposed therebetween, and the state of soldering is determined based on transmitted light. The soldering state can be determined, including the solder at a position that cannot be observed from the outside.

According to the fifth aspect of the present invention, it is possible to accurately image the gap under the component.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a second embodiment of the present invention.

FIG. 3 is a diagram showing a third embodiment of the present invention.

FIG. 4 is a diagram showing a fourth embodiment of the present invention.

FIG. 5 is a diagram showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Light source 3,15 Optical fiber 5,13 Light refraction part 7 Printed circuit board 9 Parts 11 Camera 17 Image display device 19 Solder ball 21 Image processing part 23,29 Judgment part 25 Component mounting height calculating part 27 Component mounting angle calculating part 31 Laser oscillation device

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Eiji Kajiwara 1 Toshiba-cho, Fuchu-shi, Tokyo Inside the Fuchu factory, Toshiba Corporation

Claims (5)

[Claims] An illumination unit configured to illuminate a gap between a printed board and a component mounted on the printed board from a side of the component; an imaging unit configured to image a gap between the printed board and the component illuminated by the illumination unit; A component inspection apparatus, comprising: a moving arrangement unit that moves and arranges an illumination unit and an imaging unit to a predetermined inspection position with respect to a component to be inspected; and a display unit that displays an imaging result obtained by the imaging unit. 2. The inspection apparatus according to claim 1, further comprising: a determination unit configured to determine a soldering state in which the component is mounted and fixed on the printed circuit board based on image data from the imaging unit. The component inspection device according to 1. 3. The mounting device according to claim 1, wherein the determining unit calculates a mounting height of the component with respect to the printed circuit board, and calculates an mounting angle of the component with respect to the printed circuit board from the determined mounting height. 3. The component inspection apparatus according to claim 2, further comprising: state determination means for determining a soldering state based on the mounting height and the mounting angle. 4. An illuminating means for illuminating a gap between a printed board and a component mounted on the printed board from a side surface of the component;
Imaging means for imaging transmitted light in the gap between the printed circuit board and the component; moving arrangement means for moving and arranging the illumination means and the imaging means to a predetermined inspection position with respect to the component to be inspected; and transmitted light imaged by the imaging means A component inspection apparatus comprising: a determination unit configured to determine a soldering state in which a component is mounted and fixed on a printed circuit board based on a component. 5. The illuminating means includes a light source, and a light guiding means for guiding light from the light source to an illuminated part, and the imaging means includes a camera and a light for guiding light to be imaged to the camera. The component inspection apparatus according to claim 1, further comprising a guiding unit.