JPH11192571A5 - - Google Patents

Info

Publication number: JPH11192571A5
Authority: JP; Japan
Prior art keywords: laser; laser beam; processing; branching; workpiece
Prior art date: 1998-01-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP1998001518A

Other languages

English (en)

Japanese (ja)

Other versions

JPH11192571A (ja

JP3853499B2 (ja

Filing date

1998-01-07

Publication date

2005-01-20

1998-01-07 Application filed filed Critical

1998-01-07 Priority to JP00151898A priority Critical patent/JP3853499B2/ja

1998-01-07 Priority claimed from JP00151898A external-priority patent/JP3853499B2/ja

1999-07-21 Publication of JPH11192571A publication Critical patent/JPH11192571A/ja

2005-01-20 Publication of JPH11192571A5 publication Critical patent/JPH11192571A5/ja

2006-12-06 Application granted granted Critical

2006-12-06 Publication of JP3853499B2 publication Critical patent/JP3853499B2/ja

2018-01-07 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

JP00151898A 1998-01-07 1998-01-07 レーザー加工装置 Expired - Fee Related JP3853499B2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP00151898A JP3853499B2 (ja)	1998-01-07	1998-01-07	レーザー加工装置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP00151898A JP3853499B2 (ja)	1998-01-07	1998-01-07	レーザー加工装置

Publications (3)

Publication Number	Publication Date
JPH11192571A JPH11192571A (ja)	1999-07-21
JPH11192571A5 true JPH11192571A5 (de)	2005-01-20
JP3853499B2 JP3853499B2 (ja)	2006-12-06

Family

ID=11503728

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP00151898A Expired - Fee Related JP3853499B2 (ja)	1998-01-07	1998-01-07	レーザー加工装置

Country Status (1)

Country	Link
JP (1)	JP3853499B2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100691924B1 (ko) *	1999-04-27	2007-03-09	지에스아이 루모닉스 인코퍼레이티드	재료 가공 장치 및 방법
US6875951B2 (en)	2000-08-29	2005-04-05	Mitsubishi Denki Kabushiki Kaisha	Laser machining device
JP4780881B2 (ja) *	2001-09-28	2011-09-28	京セラ株式会社	プリプレグシートのレーザによる穿孔方法
JP2004185322A (ja) *	2002-12-03	2004-07-02	Sumitomo Heavy Ind Ltd	加工計画方法及び装置
WO2007077630A1 (ja) *	2006-01-06	2007-07-12	Mitsubishi Denki Kabushiki Kaisha	レーザ加工装置、プログラム作成装置およびレーザ加工方法
KR100794062B1 (ko) *	2006-07-06	2008-01-10	미쓰비시덴키 가부시키가이샤	레이저 가공 장치, 프로그램 작성 장치 및 레이저 가공 방법
JP4933424B2 (ja) *	2006-09-28	2012-05-16	三菱電機株式会社	レーザ加工装置
US9421638B2 (en)	2006-12-22	2016-08-23	Panasonic Intellectual Property Management Co., Ltd.	Laser processing apparatus and laser processing method using the same technical field
JP4947146B2 (ja) *	2007-06-28	2012-06-06	パナソニック株式会社	レーザ加工装置
CN105722340A (zh) *	2015-12-25	2016-06-29	惠州中京电子科技有限公司	一种pcb板的盲孔加工方法
JP6484204B2 (ja) *	2016-09-09	2019-03-13	ファナック株式会社	ガルバノスキャナ
CN114505602B (zh) *	2022-04-19	2022-07-01	中国工程物理研究院激光聚变研究中心	一种多轴旋切扫描系统的使用方法
CN116390361B (zh) *	2023-06-07	2023-10-20	淄博芯材集成电路有限责任公司	基于回旋型镭射轨迹优化x型镭射孔应力均匀性的方法
CN120460938B (zh) *	2025-07-14	2025-09-30	西南交通大学	一种激光钻孔方法

1998
- 1998-01-07 JP JP00151898A patent/JP3853499B2/ja not_active Expired - Fee Related

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