JPH11192573A - Laser processing apparatus and processing method - Google Patents

Laser processing apparatus and processing method

Info

Publication number
JPH11192573A
JPH11192573A JP10002107A JP210798A JPH11192573A JP H11192573 A JPH11192573 A JP H11192573A JP 10002107 A JP10002107 A JP 10002107A JP 210798 A JP210798 A JP 210798A JP H11192573 A JPH11192573 A JP H11192573A
Authority
JP
Japan
Prior art keywords
processing point
optical system
laser
welding
intensity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10002107A
Other languages
Japanese (ja)
Inventor
Hiroshi Tarui
大志 樽井
Hironori Sakamoto
宏規 坂元
Takakuni Iwase
孝邦 岩瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP10002107A priority Critical patent/JPH11192573A/en
Publication of JPH11192573A publication Critical patent/JPH11192573A/en
Pending legal-status Critical Current

Links

Landscapes

  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Laser Beam Processing (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable continuous welding at an applied section and to improve water-tightness, rigidity and strength by combining a device measuring the laser reflected light intensity from a processing point, a device for vibrating a condenser optical system and a device for controlling the relative distance between the condenser optical system and the processing point and making online correction of the misalignment of a focal position. SOLUTION: The reflection from the laser beam 2 from the processing point 10 is less when laser welding is keyhole welding and good welding quality is obtd. The formation of the keyhole at the processing point 10 is no longer possible when the focal density changes and the power density at the processing point 10 changes and falls below a certain threshold. Consequently, the laser beam reflectivity from the processing point 10 increases and the reflectivity when the keyhole is not formed attains about 60%. An oscillation device control section 15 receives the time signal attaining the differential peak value of the reflected light intensity from a photodetecting intensity computing section 14 and corrects the central value of amplitude to a correct direction from the position of the condenser optical system 8 of this time.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、レーザ加工装置及
び加工方法に関する。
[0001] The present invention relates to a laser processing apparatus and a processing method.

【0002】[0002]

【従来の技術】スチール及びアルミ等のYAGレーザ重
ね継手溶接では、図6に示すような継手形状が考えられ
る。図において、符号2はレーザ光、9は被溶接材、1
0は加工点、11は溶融部である。
2. Description of the Related Art In welding a YAG laser lap joint of steel, aluminum, or the like, a joint shape as shown in FIG. 6 can be considered. In the figure, reference numeral 2 denotes a laser beam, 9 denotes a material to be welded, 1
0 is a processing point and 11 is a fusion zone.

【0003】継手形状Aは、最も一般的な重ね継手形状
で、重なり合った2枚の被溶接材9に垂直方向からレー
ザ光2を照射し、接合を行なっている。継手形状Bは、
隅肉継手形状である。片側の被溶接材9の角部にレーザ
光2を照射することにより、2枚の被溶接材9の接合を
行なっている。継手形状Cは、被溶接材9のフランジ端
部にレーザ光2を照射させ、2枚の被溶接材9の接合を
行なっている。継手形状Dは、被溶接材9のフランジ合
わせ部にフランジ端と反対方向からレーザ光2を照射さ
せ、2枚の被溶接材9の接合を行なっている。被溶接材
9がプレス成形品であるような場合、2枚の被溶接材9
が接する位置にバラツキが生じやすい。
The joint shape A is the most common lap joint shape, in which two overlapping workpieces 9 are irradiated with a laser beam 2 from a vertical direction to perform joining. The joint shape B is
Fillet joint shape. By irradiating the laser beam 2 to the corner of the workpiece 9 on one side, the two workpieces 9 are joined. In the joint shape C, the laser beam 2 is irradiated to the end of the flange of the workpiece 9 to join the two workpieces 9 together. In the joint shape D, the laser beam 2 is irradiated to the flange fitting portion of the material to be welded 9 from the direction opposite to the flange end, and the two materials to be welded 9 are joined. When the material to be welded 9 is a press-formed product, the two materials to be welded 9 are
Variations are likely to occur at the positions where they come into contact.

【0004】従来のレーザ加工装置としては、例えば図
7に示すような構造のものがある。図において、符号2
はレーザ光、5は光ファイバ、6はレーザ加工ヘッド、
7はコリメータ、8は集光光学系、9は被溶接材、10
は加工点、11は溶融部、16は継手隙間矯正用ロー
ラ、17は隙間矯正ローラと加工ヘッドとの相対距離を
保つためのステーである。
As a conventional laser processing apparatus, there is one having a structure as shown in FIG. 7, for example. In the figure, reference numeral 2
Is a laser beam, 5 is an optical fiber, 6 is a laser processing head,
7 is a collimator, 8 is a condensing optical system, 9 is a material to be welded, 10
Denotes a processing point, 11 denotes a fusion zone, 16 denotes a joint gap correcting roller, and 17 denotes a stay for maintaining a relative distance between the gap correcting roller and the processing head.

【0005】この従来技術は、加工ヘッド6(集光光学
系8)との相対位置を制御するローラ16等による押さ
え治具で被溶接材9の継手隙間を矯正しながら、加工点
10にレーザ光2を照射し接合を行うものである。加工
点10と集光光学系8との距離は、隙間矯正用ローラ1
6とステー17により一定距離に保持されるため、加工
点10での焦点位置は常に設定された値に保つことがで
き、安定した溶接品質を得ることが可能となる。
In this prior art, a laser beam is applied to a processing point 10 while correcting a joint gap of a workpiece 9 by a holding jig using a roller 16 or the like for controlling a relative position with respect to a processing head 6 (a condensing optical system 8). Light 2 is irradiated to perform bonding. The distance between the processing point 10 and the condensing optical system 8 depends on the gap correcting roller 1.
Since it is maintained at a constant distance by the stay 6 and the stay 17, the focal position at the processing point 10 can always be kept at a set value, and stable welding quality can be obtained.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、このよ
うな従来のレーザ加工装置にあっては、隙間矯正の役割
を果たす押さえローラ16では、加工点10と集光光学
系8との相対距離の制御が不可能な継手形状、例えば、
図6に示した継手形状C及びDでは、安定した溶接がで
きないため、安定した溶接品質を得ることができず、レ
ーザの特徴である連続溶接が不可能となり、その結果、
水密性がない、あるいは、剛性強度が低下するという問
題点があった。
In such a conventional laser processing apparatus, however, the control of the relative distance between the processing point 10 and the condensing optical system 8 is controlled by the pressing roller 16 which serves to correct the gap. Impossible joint shapes, for example,
In the joint shapes C and D shown in FIG. 6, since stable welding cannot be performed, stable welding quality cannot be obtained, and continuous welding, which is a characteristic of laser, cannot be performed.
There is a problem that there is no watertightness or the rigidity is reduced.

【0007】本発明は、このような従来の問題点に着目
してなされたもので、加工点10からのレーザの反射光
を測定し、焦点位置ずれをオンラインで補正することに
より、上記問題点を解決することを目的としている。
The present invention has been made in view of such a conventional problem. By measuring the reflected light of the laser beam from the processing point 10 and correcting the focal position shift online, the above problem can be solved. It is intended to solve.

【0008】[0008]

【課題を解決するための手段】上述の課題を解決するた
めに、請求項1に記載の発明は、YAGレーザ溶接にお
いて、溶接中に加工点から反射するYAGレーザ光の強
度を測定し、その反射光強度から加工点の焦点位置ずれ
を検知し、オンラインで焦点位置を補正することを特徴
とするものである。
In order to solve the above-mentioned problems, the invention according to claim 1 measures the intensity of YAG laser light reflected from a processing point during welding in YAG laser welding. The present invention is characterized in that a focus position shift of a processing point is detected from reflected light intensity and the focus position is corrected online.

【0009】また、請求項2に記載の発明は、YAGレ
ーザ溶接において、集光光学系を被溶接材に対して垂直
方向に振動させながら溶接中に加工点から反射するYA
Gレーザ光の強度を測定し、その反射光強度の時間微分
値の位相と集光光学系位置の位相とから加工点の焦点位
置ずれ方向を検知し、オンラインで焦点位置を補正する
ことを特徴とするものである。
According to a second aspect of the present invention, in the YAG laser welding, the YA which reflects from a processing point during welding while vibrating a condensing optical system in a direction perpendicular to a material to be welded.
Measures the intensity of the G laser light, detects the direction of the focal position shift of the processing point from the phase of the time derivative of the reflected light intensity and the phase of the condensing optical system position, and corrects the focal position online. It is assumed that.

【0010】さらに、請求項3に記載の発明は、YAG
レーザ溶接において、集光光学系を被溶接材に対して垂
直方向にその振幅を焦点深度以下で振動させながら溶接
中に加工点から反射するYAGレーザ光の強度を測定
し、その反射光強度の時間微分値の位相と集光光学系位
置の位相とから加工点の焦点位置ずれ方向を検知し、オ
ンラインで焦点位置を補正することを特徴とするもので
ある。
[0010] Further, the invention according to claim 3 is a method for producing a YAG
In laser welding, the intensity of YAG laser light reflected from a processing point during welding is measured while oscillating the condensing optical system in the direction perpendicular to the material to be welded at a depth of focus or less, and the reflected light intensity is measured. The method is characterized in that the direction of the focal position shift of the processing point is detected from the phase of the time differential value and the phase of the position of the condensing optical system, and the focal position is corrected online.

【0011】[0011]

【発明の実施の形態】以下、本発明によるレーザ加工装
置及び加工方法の実施の形態を添付図面を参照して詳細
に説明する。図1は、本発明によるレーザ加工装置及び
加工方法の一実施の形態の構成を示す図である。また、
図2は、焦点位置とレーザ光反射強度との関係を示した
模式図である。図3〜図5は、それぞれ、被溶接材9と
集光光学系8との距離が適正で溶接品質が良好な場合、
被溶接材9と集光光学系8との距離が短すぎて溶接不良
を起こす場合、被溶接材9と集光光学系8との距離が遠
すぎて溶接不良を起こす場合の、本発明の実施の形態に
よる集光光学系8位置とレーザ反射光強度及びその時間
微分値との位相を比較した図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a laser processing apparatus and a processing method according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a diagram showing a configuration of an embodiment of a laser processing apparatus and a processing method according to the present invention. Also,
FIG. 2 is a schematic diagram showing the relationship between the focal position and the laser beam reflection intensity. FIGS. 3 to 5 show the case where the distance between the workpiece 9 and the condensing optical system 8 is appropriate and the welding quality is good, respectively.
When the distance between the workpiece 9 and the condensing optical system 8 is too short to cause welding failure, when the distance between the workpiece 9 and the condensing optical system 8 is too long to cause welding failure, the present invention FIG. 9 is a diagram comparing the positions of the condensing optical system 8 with the laser reflected light intensity and the time derivative thereof according to the embodiment.

【0012】まず、構成を説明すると、図1において、
符号1はYAGレーザ発振器、2はレーザ光、3はハー
フミラー、4は出力ウィンド、5は光ファイバ、6はレ
ーザ加工ヘッド、7はコリメータ、8は集光光学系、9
は被溶接材、10は加工点、11は溶融部、12はバン
ドパスフィルタ、13は受光部、14は受光強度演算
部、15はオシレーション制御部である。
First, the structure will be described. In FIG.
Reference numeral 1 denotes a YAG laser oscillator, 2 denotes a laser beam, 3 denotes a half mirror, 4 denotes an output window, 5 denotes an optical fiber, 6 denotes a laser processing head, 7 denotes a collimator, 8 denotes a condensing optical system, 9
Is a workpiece, 10 is a processing point, 11 is a fusion zone, 12 is a bandpass filter, 13 is a light receiving unit, 14 is a light receiving intensity calculation unit, and 15 is an oscillation control unit.

【0013】図1について説明する。YAGレーザ発振
器1から発振されたレーザ光2は、伝送光学系(4,
5,7,8)を通り、加工点10に到達する。加工点1
0で反射したレーザ光2は、同じ経路を通ってハーフミ
ラー3に当たり、受光部13の方向に反射する。受光部
13の直前に配置されたバンドパスフィルタ12によ
り、加工点10からのレーザ反射光以外の光を遮断し、
受光部13には反射したレーザ光2のみが計測される。
計測された反射光強度は、受光強度演算部14で時間微
分され、そのピーク値をとる時間をオシレーション制御
部15に出力する。オシレーション制御部15は、受光
強度演算部14からの信号と集光光学系8の位相とから
焦点位置ずれを計算し、その距離を補正する。
Referring to FIG. The laser light 2 oscillated from the YAG laser oscillator 1 is transmitted to the transmission optical system (4, 4).
5, 7, 8), and reaches the processing point 10. Processing point 1
The laser light 2 reflected at 0 hits the half mirror 3 through the same path and is reflected in the direction of the light receiving unit 13. The bandpass filter 12 disposed immediately before the light receiving unit 13 blocks light other than the laser reflected light from the processing point 10,
The light receiving unit 13 measures only the reflected laser light 2.
The measured reflected light intensity is time-differentiated by the received light intensity calculation unit 14, and the peak value is output to the oscillation control unit 15. The oscillation control unit 15 calculates the focal position shift from the signal from the received light intensity calculation unit 14 and the phase of the light collecting optical system 8, and corrects the distance.

【0014】本実施の形態における被溶接材9には、ア
ルミ合金A6N01−T5、板厚t=20mmを使用し
た。溶接条件は、加工点出力4.0kW、加工速度3m
/min.、コリメータ焦点距離200mm、集光光学
系焦点距離150mm、焦点位置ジャストフォーカスと
した。集光光学系の振幅は0.3mm、周波数は50H
zで実験を行なった。
As the material 9 to be welded in the present embodiment, an aluminum alloy A6N01-T5 and a thickness t = 20 mm were used. The welding conditions were a processing point output of 4.0 kW and a processing speed of 3 m.
/ Min. , The focal length of the collimator was 200 mm, the focal length of the condensing optical system was 150 mm, and the focal position was just focused. The condensing optical system has an amplitude of 0.3mm and a frequency of 50H
The experiment was performed at z.

【0015】評価は、溶接ビードの外観評価及び断面観
察により行なった。ブローホールが発生していないこ
と、溶け込み形状が深溶け込み形状であることを要求品
質とした。本実施の形態での溶接品質は、要求品質を満
たしていた。
The evaluation was performed by evaluating the appearance of the weld bead and observing the cross section. The required quality is that no blowholes are generated and the penetration shape is a deep penetration shape. The welding quality in the present embodiment satisfied the required quality.

【0016】次に、本実施の形態の作用を説明する。レ
ーザ溶接がキーホール溶接となり、良好な溶接品質を得
ているとき、加工点10からのレーザ光2の反射は少な
い(20%以下)。焦点位置が変化することにより、加
工点10でのパワー密度が変動し、あるスレッショルド
以下になると加工点10にキーホールを形成できなくな
る。その結果、加工点10からのレーザ光反射率が高く
なり、キーホールが形成されていないときの反射率は約
60%となる(図2参照)。
Next, the operation of the present embodiment will be described. When laser welding is keyhole welding and good welding quality is obtained, the reflection of laser beam 2 from processing point 10 is small (20% or less). When the focal position changes, the power density at the processing point 10 fluctuates. When the power density falls below a certain threshold, a keyhole cannot be formed at the processing point 10. As a result, the reflectance of the laser beam from the processing point 10 increases, and the reflectance when no keyhole is formed is about 60% (see FIG. 2).

【0017】集光光学系8は、オシレーション装置によ
り、焦点深度以下の振幅でレーザ照射方向に振動してい
る。
The condensing optical system 8 is oscillated in the laser irradiation direction by an oscillation device with an amplitude smaller than the depth of focus.

【0018】集光光学系8と加工点10との距離が適正
な範囲で集光光学系8が振動している場合、時間に対す
る集光光学系8の位置、レーザ光反射光強度及びその時
間微分の関係は、図3に示すようになる。
When the converging optical system 8 is vibrating within a proper range of the distance between the converging optical system 8 and the processing point 10, the position of the converging optical system 8 with respect to time, the intensity of reflected laser light, and the time The relation of differentiation is as shown in FIG.

【0019】集光光学系8と加工点10との距離が適正
な範囲よりも短い距離で集光光学系8が振動している場
合、時間に対する集光光学系8の位置、レーザ光反射光
強度及びその時間微分の関係は、図4に示すようにな
り、集光光学系8が加工点10に近づいた点で反射光強
度の微分値がピークをとる。
When the distance between the converging optical system 8 and the processing point 10 is shorter than an appropriate range, the converging optical system 8 is vibrating at a shorter distance than the position of the converging optical system 8 with respect to time and the reflected laser beam. The relationship between the intensity and its time derivative is as shown in FIG. 4, and the differential value of the reflected light intensity has a peak at the point where the condensing optical system 8 approaches the processing point 10.

【0020】集光光学系8と加工点10との距離が適正
な範囲よりも長い距離で集光光学系8が振動している場
合、時間に対する集光光学系8の位置、レーザ光反射光
強度及びその時間微分の関係は、図5に示すようにな
り、集光光学系8が加工点10から遠ざかった点で反射
光強度の微分値がピークをとる。
When the distance between the converging optical system 8 and the processing point 10 is longer than an appropriate range, the converging optical system 8 vibrates at a position longer than the appropriate range. The relationship between the intensity and the time derivative thereof is as shown in FIG. 5, and the differential value of the reflected light intensity reaches a peak at a point where the light-collecting optical system 8 moves away from the processing point 10.

【0021】オシレーション装置制御部15は、受光強
度演算部14からの反射光強度の微分ピーク値をとる時
間信号を受けて、そのときの集光光学系8の位相から、
振幅の中心値を適正な方向に補正する。
The oscillation device control unit 15 receives the time signal from the received light intensity calculation unit 14 that takes the differential peak value of the reflected light intensity, and calculates the time signal from the phase of the condensing optical system 8 at that time.
The center value of the amplitude is corrected in an appropriate direction.

【0022】[0022]

【発明の効果】以上、詳細に説明したように、本発明に
よれば、その構成を、加工点10からのレーザ反射光強
度を測定する装置と、集光光学系8を振動させる装置、
及び、集光光学系8と加工点10との相対距離を制御す
る装置の組合せとしたため、溶接品質が安定するという
効果が得られ、その結果、適用部位における連続溶接が
可能となり、水密性、剛性強度向上という効果が得られ
る。
As described in detail above, according to the present invention, the structure of the present invention includes an apparatus for measuring the intensity of the laser reflected light from the processing point 10, an apparatus for oscillating the condensing optical system 8,
In addition, since the combination of the device for controlling the relative distance between the condensing optical system 8 and the processing point 10 is obtained, the effect of stabilizing the welding quality is obtained. As a result, continuous welding at the application site becomes possible, The effect of improving rigidity is obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明によるレーザ加工装置及び加工方法の一
実施の形態の構成を示す図である。
FIG. 1 is a diagram showing a configuration of an embodiment of a laser processing apparatus and a processing method according to the present invention.

【図2】焦点位置とレーザ光反射強度との関係を示した
模式図である。
FIG. 2 is a schematic diagram showing a relationship between a focal position and a laser beam reflection intensity.

【図3】被溶接材9と集光光学系8との距離が適正で溶
接品質が良好な場合の、本発明の実施の形態による集光
光学系8位置とレーザ反射光強度及びその時間微分値と
の位相を比較した図である。
FIG. 3 shows the position of the condensing optical system 8 according to the embodiment of the present invention, the intensity of laser reflected light, and the time derivative thereof when the distance between the workpiece 9 and the condensing optical system 8 is appropriate and the welding quality is good. It is the figure which compared the phase with the value.

【図4】被溶接材9と集光光学系8との距離が短すぎて
溶接不良を起こす場合の、本発明の実施の形態による集
光光学系8位置とレーザ反射光強度及びその時間微分値
との位相を比較した図である。
FIG. 4 shows the position of the condensing optical system 8 according to the embodiment of the present invention, the intensity of laser reflected light, and the time derivative thereof when the distance between the workpiece 9 and the condensing optical system 8 is too short to cause welding failure. It is the figure which compared the phase with the value.

【図5】被溶接材9と集光光学系8との距離が遠すぎて
溶接不良を起こす場合の、本発明の実施の形態による集
光光学系8位置とレーザ反射光強度及びその時間微分値
との位相を比較した図である。
FIG. 5 shows the position of the condensing optical system 8 according to the embodiment of the present invention, the intensity of laser reflected light, and the time derivative thereof when the distance between the workpiece 9 and the condensing optical system 8 is too large to cause welding failure. It is the figure which compared the phase with the value.

【図6】YAGレーザ重ね継手溶接による継手形状を示
す図である。
FIG. 6 is a view showing a joint shape by YAG laser lap joint welding.

【図7】従来技術によるレーザ加工装置の構成を示す図
である。
FIG. 7 is a diagram showing a configuration of a laser processing apparatus according to a conventional technique.

【符号の説明】 1 YAGレーザ発振器 2 レーザ光 3 ハーフミラー 4 出力ウィンド 5 光ファイバ 6 レーザ加工ヘッド 7 コリメータ 8 集光光学系 9 被溶接材 10 加工点 11 溶融部 12 バンドパスフィルタ 13 受光部 14 受光強度演算部 15 オシレーション制御部[Description of Signs] 1 YAG laser oscillator 2 Laser beam 3 Half mirror 4 Output window 5 Optical fiber 6 Laser processing head 7 Collimator 8 Condensing optical system 9 Workpiece material 10 Processing point 11 Fused portion 12 Bandpass filter 13 Light receiving portion 14 Light intensity calculator 15 Oscillation controller

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 YAGレーザ溶接において、 溶接中に加工点から反射するYAGレーザ光の強度を測
定し、その反射光強度から加工点の焦点位置ずれを検知
し、オンラインで焦点位置を補正することを特徴とする
レーザ加工装置及び加工方法。
1. A method for measuring the intensity of YAG laser light reflected from a processing point during welding in a YAG laser welding, detecting a focus position shift of the processing point from the reflected light intensity, and correcting the focal position online. And a processing method.
【請求項2】 YAGレーザ溶接において、 集光光学系を被溶接材に対して垂直方向に振動させなが
ら溶接中に加工点から反射するYAGレーザ光の強度を
測定し、その反射光強度の時間微分値の位相と集光光学
系位置の位相とから加工点の焦点位置ずれ方向を検知
し、オンラインで焦点位置を補正することを特徴とする
レーザ加工装置及び加工方法。
2. In YAG laser welding, the intensity of YAG laser light reflected from a processing point during welding is measured while oscillating a converging optical system in a direction perpendicular to a material to be welded, and the time of the reflected light intensity is measured. A laser processing apparatus and a processing method, wherein a direction of a focus position shift of a processing point is detected from a phase of a differential value and a phase of a condensing optical system position, and the focus position is corrected online.
【請求項3】 YAGレーザ溶接において、 集光光学系を被溶接材に対して垂直方向にその振幅を焦
点深度以下で振動させながら溶接中に加工点から反射す
るYAGレーザ光の強度を測定し、その反射光強度の時
間微分値の位相と集光光学系位置の位相とから加工点の
焦点位置ずれ方向を検知し、オンラインで焦点位置を補
正することを特徴とするレーザ加工装置及び加工方法。
3. In YAG laser welding, the intensity of YAG laser light reflected from a processing point during welding is measured while oscillating the condensing optical system in the direction perpendicular to the workpiece to be welded with its amplitude below the depth of focus. A laser processing apparatus and a processing method, wherein a direction of a focus position shift of a processing point is detected from a phase of a time differential value of the reflected light intensity and a phase of a condensing optical system position, and the focal position is corrected online. .
JP10002107A 1998-01-08 1998-01-08 Laser processing apparatus and processing method Pending JPH11192573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10002107A JPH11192573A (en) 1998-01-08 1998-01-08 Laser processing apparatus and processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10002107A JPH11192573A (en) 1998-01-08 1998-01-08 Laser processing apparatus and processing method

Publications (1)

Publication Number Publication Date
JPH11192573A true JPH11192573A (en) 1999-07-21

Family

ID=11520134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10002107A Pending JPH11192573A (en) 1998-01-08 1998-01-08 Laser processing apparatus and processing method

Country Status (1)

Country Link
JP (1) JPH11192573A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011141296A (en) * 2003-11-19 2011-07-21 New Index As Proximity detector
JP2019051540A (en) * 2017-09-14 2019-04-04 ファナック株式会社 Laser processing apparatus that adjusts the focus shift according to the contamination level of the optical system during laser processing
CN114654079A (en) * 2020-12-22 2022-06-24 达航科技股份有限公司 Processing point power adjustment method and printed circuit board laser processing device
CN115922074A (en) * 2022-11-15 2023-04-07 宁波江丰电子材料股份有限公司 Laser welding method for flammable metal target-containing component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011141296A (en) * 2003-11-19 2011-07-21 New Index As Proximity detector
JP2019051540A (en) * 2017-09-14 2019-04-04 ファナック株式会社 Laser processing apparatus that adjusts the focus shift according to the contamination level of the optical system during laser processing
US11235419B2 (en) 2017-09-14 2022-02-01 Fanuc Corporation Laser machining device for adjusting focus shift based on contamination level of optical system during laser machining
CN114654079A (en) * 2020-12-22 2022-06-24 达航科技股份有限公司 Processing point power adjustment method and printed circuit board laser processing device
CN114654079B (en) * 2020-12-22 2024-06-11 达航科技股份有限公司 Processing point power adjusting method and printed substrate laser processing device
CN115922074A (en) * 2022-11-15 2023-04-07 宁波江丰电子材料股份有限公司 Laser welding method for flammable metal target-containing component

Similar Documents

Publication Publication Date Title
CA1298353C (en) Device for and method of establishing joints by means of laser beams
US5841097A (en) Process and apparatus for welding workpieces with two or more laser beams whose spots are oscillated across welding direction
JPH0550277A (en) Laser welding method for different thickness materials
JP2001030089A (en) Laser welding method
CN113814564A (en) Laser welding method and apparatus
JPH08257773A (en) Laser welding method
JPH11192573A (en) Laser processing apparatus and processing method
JP5061670B2 (en) Laser welding method
JPS60199585A (en) Laser welding machine
RU2194601C2 (en) Method for controlling welded joint
JP2007229773A (en) Laser welding method and laser welding apparatus
JPH0436794B2 (en)
JP4273542B2 (en) Laser welding method
JPS57106489A (en) Laser joining method
JPH08257774A (en) Joining method for hot rolled billets
SU1741999A1 (en) Method and apparatus for tracking the joint of welded articles
JPH10202379A (en) Welded structure
JP2792340B2 (en) Laser welding method
Coste et al. Application of vision to laser welding: Increase of operating tolerances using beam-oscillation and filler-wire
JPS5949112B2 (en) Laser welding method
JP3774536B2 (en) Butt welding method and apparatus for hot rolled steel slab
JPH1076383A (en) Laser welding monitoring method
JPS5837074B2 (en) Laser welding method
JP2501594B2 (en) Focus position adjustment method of laser processing machine
JPH09174257A (en) Longitudinal vibration laser tack welding method