JPH11195567A - 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法 - Google Patents

基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Info

Publication number
JPH11195567A
JPH11195567A JP36101097A JP36101097A JPH11195567A JP H11195567 A JPH11195567 A JP H11195567A JP 36101097 A JP36101097 A JP 36101097A JP 36101097 A JP36101097 A JP 36101097A JP H11195567 A JPH11195567 A JP H11195567A
Authority
JP
Japan
Prior art keywords
substrate
wafer
support
supporting
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP36101097A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11195567A5 (2
Inventor
Toru Takizawa
亨 滝沢
Kenji Yamagata
憲二 山方
Takao Yonehara
隆夫 米原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP36101097A priority Critical patent/JPH11195567A/ja
Priority to SG1998005844A priority patent/SG71182A1/en
Priority to US09/211,875 priority patent/US6383890B2/en
Priority to TW087120962A priority patent/TW462086B/zh
Priority to EP98310414A priority patent/EP0926706A3/en
Priority to AU98182/98A priority patent/AU732765B2/en
Priority to CNB981263275A priority patent/CN1153258C/zh
Priority to KR10-1998-0058983A priority patent/KR100400590B1/ko
Publication of JPH11195567A publication Critical patent/JPH11195567A/ja
Priority to KR10-2003-0001768A priority patent/KR100408606B1/ko
Publication of JPH11195567A5 publication Critical patent/JPH11195567A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP36101097A 1997-12-26 1997-12-26 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法 Withdrawn JPH11195567A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP36101097A JPH11195567A (ja) 1997-12-26 1997-12-26 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
SG1998005844A SG71182A1 (en) 1997-12-26 1998-12-15 Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
US09/211,875 US6383890B2 (en) 1997-12-26 1998-12-15 Wafer bonding method, apparatus and vacuum chuck
TW087120962A TW462086B (en) 1997-12-26 1998-12-16 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
EP98310414A EP0926706A3 (en) 1997-12-26 1998-12-18 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
AU98182/98A AU732765B2 (en) 1997-12-26 1998-12-24 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
CNB981263275A CN1153258C (zh) 1997-12-26 1998-12-25 基片的加工设备、支撑设备、加工及制造方法
KR10-1998-0058983A KR100400590B1 (ko) 1997-12-26 1998-12-26 기판처리장치,기판지지장치,기판처리방법및기판제조방법
KR10-2003-0001768A KR100408606B1 (ko) 1997-12-26 2003-01-10 기판처리장치, 기판지지장치, 기판처리방법 및 기판제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36101097A JPH11195567A (ja) 1997-12-26 1997-12-26 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Publications (2)

Publication Number Publication Date
JPH11195567A true JPH11195567A (ja) 1999-07-21
JPH11195567A5 JPH11195567A5 (2) 2005-07-28

Family

ID=18471813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36101097A Withdrawn JPH11195567A (ja) 1997-12-26 1997-12-26 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Country Status (1)

Country Link
JP (1) JPH11195567A (2)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100431825B1 (ko) * 2001-09-14 2004-05-17 주식회사 케이이씨 전기화학적 식각장치
KR100489761B1 (ko) * 2001-10-31 2005-05-16 다이닛뽕스크린 세이조오 가부시키가이샤 박막 형성장치 및 박막 형성방법
JP2009542012A (ja) * 2006-06-22 2009-11-26 ズース マイクロテク，アイエヌシー． 半導体接合のための装置及び方法
KR20140050644A (ko) * 2011-08-12 2014-04-29 에베 그룹 에. 탈너 게엠베하 기판의 접합을 위한 장치 및 방법
JP2021190688A (ja) * 2020-05-28 2021-12-13 環球晶圓股▲ふん▼有限公司Global Wafers Co., Ltd. ウェハマウントステーションおよびウェハ埋め込み構造の形成方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100431825B1 (ko) * 2001-09-14 2004-05-17 주식회사 케이이씨 전기화학적 식각장치
KR100489761B1 (ko) * 2001-10-31 2005-05-16 다이닛뽕스크린 세이조오 가부시키가이샤 박막 형성장치 및 박막 형성방법
JP2009542012A (ja) * 2006-06-22 2009-11-26 ズース マイクロテク，アイエヌシー． 半導体接合のための装置及び方法
US9613840B2 (en) 2011-08-12 2017-04-04 Ev Group E. Thallner Gmbh Apparatus and method for bonding substrates
JP2014529885A (ja) * 2011-08-12 2014-11-13 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板のボンディング装置及び方法
JP2016213491A (ja) * 2011-08-12 2016-12-15 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板のボンディング装置及び方法
KR20140050644A (ko) * 2011-08-12 2014-04-29 에베 그룹 에. 탈너 게엠베하 기판의 접합을 위한 장치 및 방법
KR20190094255A (ko) * 2011-08-12 2019-08-12 에베 그룹 에. 탈너 게엠베하 기판의 접합을 위한 장치 및 방법
JP2019186560A (ja) * 2011-08-12 2019-10-24 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板のボンディング装置及び方法
KR20200104431A (ko) * 2011-08-12 2020-09-03 에베 그룹 에. 탈너 게엠베하 기판의 접합을 위한 장치 및 방법
TWI708307B (zh) * 2011-08-12 2020-10-21 Ｅｖ集團Ｅ塔那有限公司 接合基板之設備及方法
JP2022174267A (ja) * 2011-08-12 2022-11-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板のボンディング装置及び方法
KR20230106735A (ko) * 2011-08-12 2023-07-13 에베 그룹 에. 탈너 게엠베하 기판의 접합을 위한 장치 및 방법
JP2021190688A (ja) * 2020-05-28 2021-12-13 環球晶圓股▲ふん▼有限公司Global Wafers Co., Ltd. ウェハマウントステーションおよびウェハ埋め込み構造の形成方法

Similar Documents

Publication Publication Date Title
KR100396014B1 (ko) 기판처리장치,기판지지장치,기판처리방법및기판제조방법
JPH10256107A (ja) 基板処理装置及びその方法並びに基板の製造方法
KR100408606B1 (ko) 기판처리장치, 기판지지장치, 기판처리방법 및 기판제조방법
KR102447744B1 (ko) 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체
JP5909453B2 (ja) 剥離装置、剥離システムおよび剥離方法
JP5969663B2 (ja) 剥離装置、剥離システムおよび剥離方法
JP4066889B2 (ja) 貼り合わせ基板およびその製造方法
JP2003100727A (ja) シートフィルム保持機構、カセット、搬送機構、薄膜形成装置ならびにシートフィルム搬送方法
KR20140133416A (ko) 박리 장치, 박리 시스템, 박리 방법 및 컴퓨터 기억 매체
JP2010135436A (ja) 基板への接着テープ貼り付け装置
JP2856216B2 (ja) 半導体ウエハに粘着テープを接着する方法
JP2005039035A (ja) 基板貼合せ方法およびその装置
JPH11195567A (ja) 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
TWI719161B (zh) 晶圓之加工方法
JP3580227B2 (ja) 複合基板の分離方法及び分離装置
JP6631684B2 (ja) 基板接合方法および基板接合装置
JP7203918B2 (ja) 接合装置、接合システム、接合方法及びコンピュータ記憶媒体
JPH11195696A (ja) 基板支持台及び基板処理装置
JP2002190435A (ja) 基板の接合処理方法及び接合処理装置
KR20230031777A (ko) 기판의 분할 방법
TW202326897A (zh) 半導體製造裝置及其製造方法
JP2012146844A (ja) 薄膜形成システム
TW202146162A (zh) 保護構件之厚度調整方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041224

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041224

RD01 Notification of change of attorney

Effective date: 20041224

Free format text: JAPANESE INTERMEDIATE CODE: A7426

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20041224

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20060327