JPH11195567A5 - - Google Patents

Info

Publication number
JPH11195567A5
JPH11195567A5 JP1997361010A JP36101097A JPH11195567A5 JP H11195567 A5 JPH11195567 A5 JP H11195567A5 JP 1997361010 A JP1997361010 A JP 1997361010A JP 36101097 A JP36101097 A JP 36101097A JP H11195567 A5 JPH11195567 A5 JP H11195567A5
Authority
JP
Japan
Prior art keywords
substrate
processing apparatus
support
supporting
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997361010A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11195567A (ja
Filing date
Publication date
Priority claimed from JP36101097A external-priority patent/JPH11195567A/ja
Priority to JP36101097A priority Critical patent/JPH11195567A/ja
Application filed filed Critical
Priority to SG1998005844A priority patent/SG71182A1/en
Priority to US09/211,875 priority patent/US6383890B2/en
Priority to TW087120962A priority patent/TW462086B/zh
Priority to EP98310414A priority patent/EP0926706A3/en
Priority to AU98182/98A priority patent/AU732765B2/en
Priority to CNB981263275A priority patent/CN1153258C/zh
Priority to KR10-1998-0058983A priority patent/KR100400590B1/ko
Publication of JPH11195567A publication Critical patent/JPH11195567A/ja
Priority to KR10-2003-0001768A priority patent/KR100408606B1/ko
Publication of JPH11195567A5 publication Critical patent/JPH11195567A5/ja
Withdrawn legal-status Critical Current

Links

JP36101097A 1997-12-26 1997-12-26 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法 Withdrawn JPH11195567A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP36101097A JPH11195567A (ja) 1997-12-26 1997-12-26 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
SG1998005844A SG71182A1 (en) 1997-12-26 1998-12-15 Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
US09/211,875 US6383890B2 (en) 1997-12-26 1998-12-15 Wafer bonding method, apparatus and vacuum chuck
TW087120962A TW462086B (en) 1997-12-26 1998-12-16 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
EP98310414A EP0926706A3 (en) 1997-12-26 1998-12-18 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
AU98182/98A AU732765B2 (en) 1997-12-26 1998-12-24 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
CNB981263275A CN1153258C (zh) 1997-12-26 1998-12-25 基片的加工设备、支撑设备、加工及制造方法
KR10-1998-0058983A KR100400590B1 (ko) 1997-12-26 1998-12-26 기판처리장치,기판지지장치,기판처리방법및기판제조방법
KR10-2003-0001768A KR100408606B1 (ko) 1997-12-26 2003-01-10 기판처리장치, 기판지지장치, 기판처리방법 및 기판제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36101097A JPH11195567A (ja) 1997-12-26 1997-12-26 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Publications (2)

Publication Number Publication Date
JPH11195567A JPH11195567A (ja) 1999-07-21
JPH11195567A5 true JPH11195567A5 (2) 2005-07-28

Family

ID=18471813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36101097A Withdrawn JPH11195567A (ja) 1997-12-26 1997-12-26 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Country Status (1)

Country Link
JP (1) JPH11195567A (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100431825B1 (ko) * 2001-09-14 2004-05-17 주식회사 케이이씨 전기화학적 식각장치
JP3948930B2 (ja) * 2001-10-31 2007-07-25 大日本スクリーン製造株式会社 薄膜形成装置および薄膜形成方法
US7948034B2 (en) * 2006-06-22 2011-05-24 Suss Microtec Lithography, Gmbh Apparatus and method for semiconductor bonding
SG2014009369A (en) * 2011-08-12 2014-09-26 Ev Group E Thallner Gmbh Apparatus and method for bonding substrates
TWI786408B (zh) * 2020-05-28 2022-12-11 環球晶圓股份有限公司 晶圓承載台及晶圓鑲埋結構的形成方法

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