JPH11204460A - ウエハのメッキ治具 - Google Patents

ウエハのメッキ治具

Info

Publication number
JPH11204460A
JPH11204460A JP10018151A JP1815198A JPH11204460A JP H11204460 A JPH11204460 A JP H11204460A JP 10018151 A JP10018151 A JP 10018151A JP 1815198 A JP1815198 A JP 1815198A JP H11204460 A JPH11204460 A JP H11204460A
Authority
JP
Japan
Prior art keywords
wafer
jig
plating
energizing
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10018151A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11204460A5 (2
Inventor
Junichiro Yoshioka
潤一郎 吉岡
Masaya Tomioka
賢哉 富岡
Satoshi Sendai
敏 千代
Atsushi Chono
篤 丁野
Naomitsu Ozawa
直光 小沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP10018151A priority Critical patent/JPH11204460A/ja
Priority to PCT/JP1999/000059 priority patent/WO1999035309A1/ja
Priority to EP99900165A priority patent/EP1087039B9/en
Priority to US09/600,028 priority patent/US6365020B1/en
Priority to DE69939827T priority patent/DE69939827D1/de
Priority to KR1020007007645A priority patent/KR100586473B1/ko
Publication of JPH11204460A publication Critical patent/JPH11204460A/ja
Publication of JPH11204460A5 publication Critical patent/JPH11204460A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP10018151A 1998-01-12 1998-01-12 ウエハのメッキ治具 Pending JPH11204460A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP10018151A JPH11204460A (ja) 1998-01-12 1998-01-12 ウエハのメッキ治具
PCT/JP1999/000059 WO1999035309A1 (fr) 1998-01-12 1999-01-12 Support pour metallisation de tranches
EP99900165A EP1087039B9 (en) 1998-01-12 1999-01-12 Wafer plating jig
US09/600,028 US6365020B1 (en) 1998-01-12 1999-01-12 Wafer plating jig
DE69939827T DE69939827D1 (de) 1998-01-12 1999-01-12 Beschichtungshaltevorrichtung für wafer
KR1020007007645A KR100586473B1 (ko) 1998-01-12 1999-01-12 웨이퍼의 도금지그

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10018151A JPH11204460A (ja) 1998-01-12 1998-01-12 ウエハのメッキ治具

Publications (2)

Publication Number Publication Date
JPH11204460A true JPH11204460A (ja) 1999-07-30
JPH11204460A5 JPH11204460A5 (2) 2007-04-19

Family

ID=11963625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10018151A Pending JPH11204460A (ja) 1998-01-12 1998-01-12 ウエハのメッキ治具

Country Status (6)

Country Link
US (1) US6365020B1 (2)
EP (1) EP1087039B9 (2)
JP (1) JPH11204460A (2)
KR (1) KR100586473B1 (2)
DE (1) DE69939827D1 (2)
WO (1) WO1999035309A1 (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010107766A (ko) * 2000-05-26 2001-12-07 마에다 시게루 기판처리장치 및 기판도금장치
JP2015151577A (ja) * 2014-02-14 2015-08-24 株式会社Ｊｃｕ 基板めっき治具
JP2018009215A (ja) * 2016-07-13 2018-01-18 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US20040007460A1 (en) * 2002-07-15 2004-01-15 Karl Sagedahl Clamping device having barbed pin
US20050145486A1 (en) * 2004-01-07 2005-07-07 Chung-Ho Chen Clipping device of an electroplating base plate
US20050274604A1 (en) * 2004-02-06 2005-12-15 Koji Saito Plating apparatus
USD583779S1 (en) 2006-07-13 2008-12-30 Ebara Corporation Electrolytic plating anode
USD572673S1 (en) 2006-07-13 2008-07-08 Ebara Corporation Anode shaft
US7507319B2 (en) * 2006-07-21 2009-03-24 Ebara Corporation Anode holder
US8932443B2 (en) 2011-06-07 2015-01-13 Deca Technologies Inc. Adjustable wafer plating shield and method
US9464362B2 (en) 2012-07-18 2016-10-11 Deca Technologies Inc. Magnetically sealed wafer plating jig system and method
KR101647074B1 (ko) 2016-06-07 2016-08-09 정진호 사면 연동 로테이션에 기반을 둔 도금 지그 거치용 틸팅 승강 유도체
CN112251796A (zh) * 2020-10-15 2021-01-22 中山市汇佳精密科技有限公司 应用于太阳能电池片电镀挂具上的可翻转框架
CN119943672B (zh) * 2025-01-03 2025-10-31 华天科技（西安）有限公司 一种单颗qfn框架类产品锡化的方法、治具

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2739117A (en) * 1952-06-18 1956-03-20 Gen Motors Corp Electroplating fixture
US3461059A (en) * 1966-10-10 1969-08-12 Hammond Machinery Builders Inc Power operated electro-chemical fixture
DE3028635A1 (de) * 1980-07-29 1982-03-04 Degussa Ag, 6000 Frankfurt Vorrichtung zum partiellen galvanischen beschichten
JPS61187379A (ja) 1985-02-15 1986-08-21 Sanyo Electric Co Ltd 光起電力装置の製造方法
JPS61187379U (2) * 1985-05-13 1986-11-21
JPH0686676B2 (ja) * 1985-10-18 1994-11-02 旭化成工業株式会社 メツキ用電極部
JPS62188798A (ja) * 1986-02-14 1987-08-18 Fujitsu Ltd メツキ用コンタクトピン
FR2633452B1 (fr) * 1988-06-28 1990-11-02 Doue Julien Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
JPH05222587A (ja) * 1992-02-06 1993-08-31 Ibiden Co Ltd 電着塗装用クランプ
JPH0813198A (ja) * 1994-07-04 1996-01-16 Hitachi Ltd 接触導通用電極及びそれを用いた半導体製造装置
US6228231B1 (en) * 1997-05-29 2001-05-08 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
CH693133A5 (de) * 1997-08-21 2003-03-14 Mecatool Ag Kupplungsanordnung für eine Bearbeitungseinrichtung.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010107766A (ko) * 2000-05-26 2001-12-07 마에다 시게루 기판처리장치 및 기판도금장치
JP2015151577A (ja) * 2014-02-14 2015-08-24 株式会社Ｊｃｕ 基板めっき治具
JP2018009215A (ja) * 2016-07-13 2018-01-18 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置

Also Published As

Publication number Publication date
EP1087039B1 (en) 2008-10-29
US6365020B1 (en) 2002-04-02
WO1999035309A1 (fr) 1999-07-15
EP1087039A4 (en) 2006-05-31
EP1087039B9 (en) 2009-08-19
KR100586473B1 (ko) 2006-06-07
DE69939827D1 (de) 2008-12-11
EP1087039A1 (en) 2001-03-28
KR20010034038A (ko) 2001-04-25

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