JPH11205009A - Dielectric filter - Google Patents
Dielectric filterInfo
- Publication number
- JPH11205009A JPH11205009A JP10311758A JP31175898A JPH11205009A JP H11205009 A JPH11205009 A JP H11205009A JP 10311758 A JP10311758 A JP 10311758A JP 31175898 A JP31175898 A JP 31175898A JP H11205009 A JPH11205009 A JP H11205009A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- conductor
- electrode
- substrate
- dielectric resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
(57)【要約】
【課題】 小型で部品点数も削減でき、量産性に優れた
誘電体フィルタを提供することを目的とする。
【解決手段】 誘電体基体１ａと、誘電体基体１ａの外
側面に設けられた外導体１ｄと、誘電体基体１ａの内側
面に設けられた内導体１ｃと、誘電体基体１ａの一方の
端面に設けられ、外導体１ｄと内導体１ｃを連結する連
結導体１ｅと、外側面の一面に設けられ各導体と電気的
に接触しない結合用導体１ｆを有する誘電体共振器１を
少なくとも１つ以上具備し、この誘電体共振器１を絶縁
体基板２上に配置しこの絶縁体基板２上に設けた結合電
極６と結合用導体１ｆとを電気的に接合した誘電体フィ
ルタを構成する。
(57) [Problem] To provide a dielectric filter which is small in size, can reduce the number of parts, and is excellent in mass productivity. SOLUTION: A dielectric substrate 1a, an outer conductor 1d provided on an outer surface of the dielectric substrate 1a, an inner conductor 1c provided on an inner surface of the dielectric substrate 1a, and one end surface of the dielectric substrate 1a. And at least one dielectric resonator 1 having a connecting conductor 1e for connecting the outer conductor 1d and the inner conductor 1c and a coupling conductor 1f provided on one surface of the outer surface and not electrically contacting each conductor. The dielectric resonator 1 is provided on an insulating substrate 2 to constitute a dielectric filter in which a coupling electrode 6 provided on the insulating substrate 2 and a coupling conductor 1f are electrically joined.
Description
【０００１】[0001]
【発明が属する技術分野】本発明は高周波帯（ＶＨＦ〜
ＵＨＦ）において、無線通信機器などで使用される小型
で低損失な誘電体フィルタに関するものである。The present invention relates to a high frequency band (VHF-
UHF) relates to a small and low-loss dielectric filter used in wireless communication equipment and the like.
【０００２】[0002]
【従来の技術】近年、自動車電話や携帯電話、コードレ
ス電話等の移動通信機器に誘電体フィルタが使用されて
いるが、移動通信機器の小型化、高性能化に伴い、使用
される部品もプリント基板の表面から実装可能なチップ
部品に超小型化される傾向にあり、この傾向に沿った誘
電体フィルタの開発が要求されている。2. Description of the Related Art In recent years, dielectric filters have been used in mobile communication devices such as automobile phones, mobile phones, and cordless phones. There is a tendency that the size of the chip component can be reduced to a mountable chip component from the surface of the substrate, and development of a dielectric filter in accordance with this tendency is required.
【０００３】以下、従来の誘電体フィルタについて説明
する。図１４、図１５は、それぞれ従来の誘電体フィル
タを示す斜視図及び断面図である。図１４、図１５にお
いて、１は誘電体共振器であり２は絶縁体基板であっ
て、一方の主表面２ａに接地電極３が形成されている。
この接地電極３は、主表面２ａからスルホール電極４を
経由して他方の主表面２ｂ上に形成された接地電極５と
電気的に接続されている。また、接地電極３上には、複
数の誘電体共振器１がそれぞれ互いに接触した状態で配
置されている。Hereinafter, a conventional dielectric filter will be described. 14 and 15 are a perspective view and a sectional view, respectively, showing a conventional dielectric filter. 14 and 15, reference numeral 1 denotes a dielectric resonator, 2 denotes an insulating substrate, and a ground electrode 3 is formed on one main surface 2a.
The ground electrode 3 is electrically connected from the main surface 2a to the ground electrode 5 formed on the other main surface 2b via the through-hole electrode 4. A plurality of dielectric resonators 1 are arranged on the ground electrode 3 so as to be in contact with each other.
【０００４】誘電体共振器１は、それぞれ中央部に貫通
孔１ｂを有する角筒状の誘電体基体１ａからなる。貫通
孔１ｂの内面には内導体１ｃが、また誘電体基体１ａの
表面には外導体１ｄが形成され、また内導体１ｃと外導
体１ｄとの間を誘電体基体１ａの連結導体１ｅを介して
電気的に短絡する。また、この誘電体基体１ａの連結導
体１ｅと反対側の端面は導体がない開放端となってい
る。The dielectric resonator 1 is composed of a rectangular cylindrical dielectric substrate 1a having a through hole 1b at the center. An inner conductor 1c is formed on the inner surface of the through hole 1b, and an outer conductor 1d is formed on the surface of the dielectric base 1a. The inner conductor 1c and the outer conductor 1d are connected via the connecting conductor 1e of the dielectric base 1a. Electrical short circuit. The end face of the dielectric base 1a opposite to the connection conductor 1e is an open end having no conductor.
【０００５】この誘電体共振器１の外導体１ｄは、接地
電極３と半田付け等により電気的に接続されている。さ
らに誘電体共振器１の貫通孔１ｂには金属ターミナル７
が半田付け等により内導体１ｃと電気的に接続されてい
る。The outer conductor 1d of the dielectric resonator 1 is electrically connected to the ground electrode 3 by soldering or the like. Further, a metal terminal 7 is provided in the through hole 1b of the dielectric resonator 1.
Are electrically connected to the inner conductor 1c by soldering or the like.
【０００６】誘電体共振器１の開放端側が臨む絶縁体基
板２の前方部には外部回路と接続するための入出力電極
８とコンデンサ９ａ〜９ｆ、コイル１１ａ〜１１ｂ、金
属ターミナル７を接続するための結合電極１０が形成さ
れている。An input / output electrode 8 for connection to an external circuit, capacitors 9a to 9f, coils 11a to 11b, and a metal terminal 7 are connected to the front of the insulator substrate 2 facing the open end side of the dielectric resonator 1. Electrode 10 is formed.
【０００７】また、このフィルタは図１５の金属のシー
ルドケース１２を接地電極３や誘電体共振器１の外導体
１ｄとを半田付け等により接続し電気的なシールドを得
ている。In this filter, an electrical shield is obtained by connecting the metal shield case 12 of FIG. 15 to the ground electrode 3 and the outer conductor 1d of the dielectric resonator 1 by soldering or the like.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、以上の
ような従来の構成では、結合回路部のコンデンサ９ａ〜
９ｆ、コイル１１ａ〜１１ｂ、金属ターミナル７等を実
装するために、誘電体フィルタの大きさを小型化するこ
とが難しく、また部品点数が多いので工数がかかり、量
産性が悪いという問題があった。特に、誘電体共振器１
と金属ターミナル７との接続は貫通孔１ｂにおいて行う
ため難しい作業となり、さらに自動組立の障害となって
いた。However, in the above-described conventional configuration, the capacitors 9a to 9a of the coupling circuit portion are not provided.
9f, the mounting of the coils 11a to 11b, the metal terminals 7, and the like, it is difficult to reduce the size of the dielectric filter, and the number of parts is large, so that there is a problem that man-hours are required and mass productivity is poor. . In particular, the dielectric resonator 1
Since the connection between the metal terminal 7 and the metal terminal 7 is performed in the through hole 1b, it is a difficult operation, and furthermore, is an obstacle to automatic assembly.
【０００９】本発明は以上のような従来の課題を解決す
るもので、小型で部品点数も削減でき、量産性に優れた
誘電体フィルタを提供することを目的としている。An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a dielectric filter which is small in size, can reduce the number of parts, and is excellent in mass productivity.
【００１０】[0010]
【課題を解決するための手段】この目的を達成するため
に、開放端面側の外導体の１面に外導体から独立して結
合用導体を設けた誘電体共振器を少なくとも１個以上、
絶縁体基板上の接地電極に外導体を半田付け等により電
気的に接続し、また絶縁体基板上の回路電極に結合用導
体を半田付け等により電気的に接続して誘電体フィルタ
を構成する。In order to achieve this object, at least one or more dielectric resonators having a coupling conductor provided on one surface of the outer conductor on the open end surface independently of the outer conductor are provided.
An outer conductor is electrically connected to a ground electrode on the insulator substrate by soldering or the like, and a coupling conductor is electrically connected to a circuit electrode on the insulator substrate by soldering or the like to form a dielectric filter. .
【００１１】[0011]
【発明の実施の形態】請求項１記載の発明は、断面方形
形状の誘電体基体と、前記誘電体基体に設けられた１つ
の貫通孔と、前記誘電体基体の外周面に設けられた外導
体と、前記誘電体基体の内周面に設けられた内導体と、
前記誘電体基体の一方の端面に設けられ、前記外導体と
前記内導体を連結する連結導体と、前記外側面の一面に
設けられ、前記各導体と電気的に非接触となる１つの結
合用導体を有する誘電体共振器を具備し、前記誘電体共
振器を回路基板上に配置し前記回路基板上に設けた回路
電極と前記結合用導体とを電気的に接合するとともに、
前記回路基板にコンデンサ，コイルの少なくとも１つ以
上を設けた事によって、誘電体共振器の内導体と結合用
導体間との容量で結合容量を決定して回路との結合を行
わせることにより、コンデンサの一部や金属ターミナル
をなくすことができるので小型化を実現できる。さら
に、部品点数の削減により組立工数の削減ができる。DETAILED DESCRIPTION OF THE INVENTION The invention according to a first aspect of the present invention is directed to a dielectric substrate having a rectangular cross section, one through hole formed in the dielectric substrate, and an outer hole formed in the outer peripheral surface of the dielectric substrate. A conductor, an inner conductor provided on an inner peripheral surface of the dielectric substrate,
A connecting conductor provided on one end surface of the dielectric base body for connecting the outer conductor and the inner conductor, and one connecting conductor provided on one surface of the outer surface and electrically non-contacting with each conductor; A dielectric resonator having a conductor is provided, and the dielectric resonator is arranged on a circuit board, and a circuit electrode provided on the circuit board is electrically connected to the coupling conductor.
By providing at least one of a capacitor and a coil on the circuit board, a coupling capacitance is determined by a capacitance between an inner conductor of the dielectric resonator and a coupling conductor, and coupling with the circuit is performed. Since a part of the capacitor and the metal terminal can be eliminated, downsizing can be realized. Furthermore, the number of assembly steps can be reduced by reducing the number of parts.
【００１２】請求項２記載の発明は、請求項１におい
て、誘電体共振器を覆うシールドケースを設けた。According to a second aspect of the present invention, in the first aspect, a shield case for covering the dielectric resonator is provided.
【００１３】請求項３記載の発明は、請求項１におい
て、各導体を多層構造とした。請求項４記載の発明は、
請求項１において、誘電体基体はＢａＯ，ＴｉＯ2，Ｎ
ｄ2Ｏ3を含む。According to a third aspect of the present invention, in the first aspect, each conductor has a multilayer structure. The invention according to claim 4 is
In claim 1, the dielectric substrate is made of BaO, TiO 2 , N
d 2 O 3 .
【００１４】請求項５記載の発明は、請求項１におい
て、誘電体基体の表面を粗面化した。請求項６記載の発
明は、請求項５において、粗面化した表面粗度を５μｍ
〜９μｍとした。According to a fifth aspect of the present invention, in the first aspect, the surface of the dielectric substrate is roughened. According to a sixth aspect of the present invention, in the fifth aspect, the roughened surface roughness is 5 μm.
９9 μm.
【００１５】請求項７記載の発明は、請求項１におい
て、レジスト膜を誘電体基体上に塗布した後に各導体を
形成した。According to a seventh aspect of the present invention, in the first aspect, each conductor is formed after applying a resist film on the dielectric substrate.
【００１６】請求項８記載の発明は、請求項１におい
て、回路基板の第１及び第２の主表面に接地電極を形成
するとともに、前記回路基板にスルホールを形成し、前
記スルホール内にスルホール電極を設けて前記第１及び
第２の接地電極を電気的に接続し、前記接地電極と誘電
体共振器の外導体を接続した。According to an eighth aspect of the present invention, in the first aspect, a ground electrode is formed on the first and second main surfaces of the circuit board, a through hole is formed in the circuit board, and a through hole electrode is formed in the through hole. To electrically connect the first and second ground electrodes, and connect the ground electrode and the outer conductor of the dielectric resonator.
【００１７】（実施例１）図１及び図２はそれぞれ本発
明の第１の実施例における誘電体フィルタを示す斜視図
及び分解斜視図である。図１、図２において、１は誘電
体共振器である。(Embodiment 1) FIGS. 1 and 2 are a perspective view and an exploded perspective view, respectively, showing a dielectric filter according to a first embodiment of the present invention. 1 and 2, reference numeral 1 denotes a dielectric resonator.
【００１８】以下、誘電体共振器の構造について、図２
の誘電体共振器１を用いて説明する。ＢａＯ−ＴｉＯ2
−Ｎｄ2Ｏ3，ＢａＯ−ＴｉＯ2，ＺｎＯ2−ＳｎＯ2−Ｔ
ｉＯ2，ＢａＯ−Ｓｍ2Ｏ3−ＴｉＯ2，Ｌｎ2Ｏ3−ＢａＯ
−ＴｉＯ2系等の誘電体材料で構成された誘電体基体１
ａに貫通孔１ｂを設ける。この時、誘電体基体１ａの外
形形状は方形であり、貫通孔１ｂは断面円筒形に形成さ
れている。誘電体基体１ａの外側面には外導体１ｄが設
けられており、貫通孔１ｂを構成する内側面には内導体
１ｃが設けられている。外導体１ｄと内導体１ｃは一方
の端面に設けられた連結導体１ｅによって連結されてい
る。Hereinafter, the structure of the dielectric resonator will be described with reference to FIG.
A description will be given using the dielectric resonator 1 described above. BaO-TiO 2
—Nd 2 O 3 , BaO—TiO 2 , ZnO 2 —SnO 2 —T
iO 2 , BaO—Sm 2 O 3 —TiO 2 , Ln 2 O 3 —BaO
It made of a dielectric material 2 system or the like -TiO dielectric substrate 1
a is provided with a through hole 1b. At this time, the outer shape of the dielectric substrate 1a is square, and the through-hole 1b is formed in a cylindrical cross section. An outer conductor 1d is provided on an outer surface of the dielectric base 1a, and an inner conductor 1c is provided on an inner surface forming the through hole 1b. The outer conductor 1d and the inner conductor 1c are connected by a connecting conductor 1e provided on one end face.
【００１９】誘電体基体１ａの外側面の一面には、外導
体１ｄから離隔し絶縁された結合用導体１ｆが設けられ
ており、この結合用導体１ｆと内導体１ｃの間で誘電体
基体１ａを介してコンデンサを形成している。図３にこ
の誘電体共振器１の等価回路を示す。図３において１３
は誘電体共振器の共振回路部、１４は図２における誘電
体共振器１の内導体１ｃと結合用導体１ｆとの間に構成
されたコンデンサである。On one surface of the outer surface of the dielectric substrate 1a, there is provided a coupling conductor 1f separated from the outer conductor 1d and insulated. The dielectric substrate 1a is provided between the coupling conductor 1f and the inner conductor 1c. To form a capacitor. FIG. 3 shows an equivalent circuit of the dielectric resonator 1. In FIG.
Is a resonance circuit portion of the dielectric resonator, and 14 is a capacitor formed between the inner conductor 1c and the coupling conductor 1f of the dielectric resonator 1 in FIG.
【００２０】この誘電体共振器１を少なくとも１個以
上、絶縁体基板２上の接地電極３に外導体１ｄを半田付
け等により電気的に接続し、また絶縁体基板２上の結合
電極６に結合用導体１ｆを半田付け等により電気的に接
続して誘電体フィルタを構成する。At least one or more of the dielectric resonators 1 is electrically connected to the ground electrode 3 on the insulator substrate 2 by soldering or the like to the outer conductor 1d, and is connected to the coupling electrode 6 on the insulator substrate 2. The coupling conductor 1f is electrically connected by soldering or the like to form a dielectric filter.
【００２１】絶縁体基板２は平板であり、一方の主表面
２ａに接地電極３が形成されている。この接地電極３
は、主表面２ａからスルホール電極４を経由して他方の
主表面２ｂ上に形成された接地電極５と電気的に接続さ
れている。また、接地電極３上には、複数の誘電体共振
器１がそれぞれ互いに接触した状態で配置されている。
この誘電体共振器１の結合用導体１ｆは絶縁体基板２上
の結合電極６と半田等により電気的、機械的に接続さ
れ、また、外導体１ｄは接地電極３と半田等により電気
的、機械的に接続される。The insulator substrate 2 is a flat plate, and a ground electrode 3 is formed on one main surface 2a. This ground electrode 3
Are electrically connected from the main surface 2a via the through-hole electrode 4 to the ground electrode 5 formed on the other main surface 2b. A plurality of dielectric resonators 1 are arranged on the ground electrode 3 so as to be in contact with each other.
The coupling conductor 1f of the dielectric resonator 1 is electrically and mechanically connected to the coupling electrode 6 on the insulating substrate 2 by solder or the like, and the outer conductor 1d is electrically and mechanically connected to the ground electrode 3 by solder or the like. Connected mechanically.
【００２２】絶縁体基板２の前方部には外部回路と接続
するための入出力電極８とコンデンサ９ａ，９ｂ，９
ｃ、コイル１１ａ，１１ｂを接続するための結合電極１
０ａが形成されており、これ等の電極にコンデンサ９
ａ，９ｂ，９ｃ、コイル１１ａ，１１ｂ、誘電体共振器
１等を結合し誘電体フィルタを構成している。An input / output electrode 8 for connecting to an external circuit and capacitors 9a, 9b, 9
c, coupling electrode 1 for connecting coils 11a and 11b
0a are formed, and a capacitor 9 is connected to these electrodes.
a, 9b, 9c, the coils 11a, 11b, the dielectric resonator 1 and the like are combined to form a dielectric filter.
【００２３】また、この誘電体フィルタは図１の金属の
シールドケース１２を接地電極３や誘電体共振器１の外
導体１ｄとを半田付け等により接続し電気的なシールド
を得ている。In this dielectric filter, the metal shield case 12 of FIG. 1 is connected to the ground electrode 3 and the outer conductor 1d of the dielectric resonator 1 by soldering or the like to obtain an electric shield.
【００２４】誘電体共振器１の導体膜である内導体１
ｃ，外導体１ｄ，結合用導体１ｆは、それぞれ銅や銀等
の導電材料で構成された薄膜で構成されており、その膜
厚は５μｍ程度となるように形成される。本実施例で
は、導体膜を１層で構成したが、２層以上の多層にして
も良く、材料も２種以上用いても良い。さらに膜厚は５
μｍ程度としたが、誘電体フィルタの使用条件等によっ
て膜厚は適宜決定しなければならない。The inner conductor 1 which is a conductor film of the dielectric resonator 1
c, the outer conductor 1d, and the coupling conductor 1f are each formed of a thin film made of a conductive material such as copper or silver, and are formed to have a thickness of about 5 μm. In this embodiment, the conductor film is composed of one layer. However, the conductor film may be composed of two or more layers, and two or more materials may be used. Further, the film thickness is 5
The thickness is about μm, but the film thickness must be appropriately determined according to the conditions of use of the dielectric filter and the like.
【００２５】以上のように構成された誘電体フィルタに
ついて、以下その製造方法を説明する。A method of manufacturing the dielectric filter having the above configuration will be described below.
【００２６】まず原材料（ＢａＯ，ＴｉＯ2，Ｎｄ2Ｏ3
等）を所定量ずつ配合し、この配合物をミル等を用いて
混合する。次にこの混合物をスプレードライヤー等を用
いて粒度の調整及びバインダーの添加を行い造粒する。
次に造粒物を乾式プレスを用いて所定の形状に成形し、
その成形物を焼成炉で１３００℃〜１４００℃の温度で
焼結させ、筒型の誘電体基体１ａを作成する。次に誘電
体基体１ａ上に導体膜を形成する。まず導体膜を形成す
る場合には、様々な形成方法があるので、数例を挙げて
説明する。First, the raw materials (BaO, TiO 2 , Nd 2 O 3
) Are mixed in predetermined amounts, and this mixture is mixed using a mill or the like. Next, the mixture is granulated by adjusting the particle size and adding a binder using a spray dryer or the like.
Next, the granulated material is formed into a predetermined shape using a dry press,
The molded product is sintered in a firing furnace at a temperature of 1300 ° C. to 1400 ° C. to form a cylindrical dielectric substrate 1a. Next, a conductor film is formed on the dielectric substrate 1a. First, there are various methods for forming a conductive film, and therefore, a description will be given with reference to several examples.
【００２７】まず第１の方法として、導体膜を構成する
材料に銅を用いた時について説明する。誘電体基体１ａ
の表面をバレル研磨機やブラスト装置によって粗面化
し、その後に誘電体基体１ａにエッチング処理を施し
て、誘電体基体１ａの表面粗度を５μｍ〜９μｍ程度に
調整する。この時エッチング液としては、例えばＨＦ−
ＨＮＯ2系のものを用いる。次に誘電体基体１ａの全表
面を塩化第１錫等を用いて感受性化処理を行った後に、
全表面に触媒金属となるパラジウムを付着させ、誘電体
基体１ａの一部にレジスト膜を形成する。すなわち、誘
電体基体１ａの導体膜が付着してはならない部分にレジ
スト膜を形成する。レジスト膜はレジストインクを印刷
技術や転写技術等を用いて誘電体基体１ａ上に塗布し、
その塗布したレジストインクを乾燥硬化させることによ
って形成される。次にこのように加工された誘電体基体
１ａを無電解銅鍍金法を用いて、誘電体基体１ａ上に薄
い第１の銅膜を形成する。この時、第１の銅膜はレジス
ト膜が形成されていない部分のみに選択的に形成され
る。次に電解銅鍍金にて第１の銅膜の上に第２の銅膜を
積層し、導体膜を形成する。この時、導体膜は５μｍ程
度になるように形成する。そして最後にレジスト膜を溶
剤等で溶かし出して、導体膜を完成させる。なおこの製
造方法ではレジスト膜を印刷で誘電体基体１ａの所定の
位置にレジストインクを塗布した後に乾燥硬化させる方
法で形成したが、レジストとして感光性レジストを用い
る方法もある。すなわち、パラジウム等の触媒金属を誘
電体基体１ａに付着させた後に、誘電体基体１ａの全表
面に感光性レジストを塗布し、露光させて所定の部分の
感光性レジストのみを硬化させる。そして現像剤によっ
て、感光性レジストが硬化していない部分を洗い流し、
導体膜を完成させる。First, as a first method, a case where copper is used as a material for forming a conductive film will be described. Dielectric substrate 1a
The surface of the dielectric substrate 1a is roughened by a barrel polisher or a blast device, and then the dielectric substrate 1a is subjected to an etching treatment to adjust the surface roughness of the dielectric substrate 1a to about 5 μm to 9 μm. At this time, for example, HF-
HNO 2 type is used. Next, after performing a sensitization treatment on the entire surface of the dielectric substrate 1a using stannous chloride or the like,
Palladium, which is a catalytic metal, is attached to the entire surface, and a resist film is formed on a part of the dielectric substrate 1a. That is, a resist film is formed on a portion of the dielectric substrate 1a where the conductor film must not adhere. The resist film is formed by applying a resist ink on the dielectric substrate 1a using a printing technique, a transfer technique, or the like,
The resist ink is formed by drying and curing the applied resist ink. Next, a thin first copper film is formed on the dielectric substrate 1a thus processed by using an electroless copper plating method. At this time, the first copper film is selectively formed only on the portion where the resist film is not formed. Next, a second copper film is laminated on the first copper film by electrolytic copper plating to form a conductor film. At this time, the conductive film is formed to have a thickness of about 5 μm. Finally, the resist film is dissolved with a solvent or the like to complete the conductor film. In this manufacturing method, the resist film is formed by applying a resist ink to a predetermined position of the dielectric substrate 1a by printing and then drying and curing the resist film. However, there is also a method of using a photosensitive resist as the resist. That is, after a catalytic metal such as palladium is adhered to the dielectric substrate 1a, a photosensitive resist is applied to the entire surface of the dielectric substrate 1a, and is exposed to light to cure only a predetermined portion of the photosensitive resist. Then, the developer is used to wash away the areas where the photosensitive resist has not been cured,
Complete the conductor film.
【００２８】他の方法としては、Ａｇペーストを誘電体
基体１ａの全表面に印刷またはデップ法で塗布し、乾燥
した後に８００℃〜９００℃の温度で熱処理を行うこと
によって、導体膜を誘電体基体１ａの全表面に形成して
もよい。さらに、全表面に導体膜を形成後、ケミカルエ
ッチング、ドライエッチング等のエッチング技術を用い
て不要部分の導体膜を削除し、導体膜を完成させても良
い。As another method, an Ag paste is applied to the entire surface of the dielectric substrate 1a by printing or dipping, dried, and then subjected to a heat treatment at a temperature of 800 ° C. to 900 ° C. so that the conductive film is made of a dielectric material. It may be formed on the entire surface of the base 1a. Further, after the conductor film is formed on the entire surface, unnecessary portions of the conductor film may be removed by using an etching technique such as chemical etching or dry etching to complete the conductor film.
【００２９】また別の方法として、誘電体基体１ａの全
表面に導体膜を形成した後に、切削加工やレーザー加工
等を施して物理的に除去し、導体膜を完成させても良
い。As another method, a conductor film may be formed on the entire surface of the dielectric substrate 1a and then physically removed by cutting or laser processing to complete the conductor film.
【００３０】上述のように構成した誘電体共振器１と絶
縁体基板２を結合用導体１ｆと結合電極６が対向するよ
うに突合せ、クリーム半田等で外導体１ｄ，絶縁体基板
２上の接地電極３を接合するとともに、結合用導体１ｆ
と結合電極６をそれぞれクリーム半田等の接合材によっ
て接合する。The dielectric resonator 1 and the insulating substrate 2 configured as described above are joined so that the coupling conductor 1f and the coupling electrode 6 are opposed to each other, and the outer conductor 1d and the ground on the insulator substrate 2 are soldered with cream solder or the like. The electrode 3 is joined, and the connecting conductor 1f
And the bonding electrode 6 are respectively bonded by a bonding material such as cream solder.
【００３１】（実施例２）図４、図５はそれぞれ本発明
の第２の実施例における誘電体フィルタを示す斜視図及
び分解斜視図である。(Embodiment 2) FIGS. 4 and 5 are a perspective view and an exploded perspective view, respectively, showing a dielectric filter according to a second embodiment of the present invention.
【００３２】図４、図５において、２１は誘電体共振器
であり、誘電体共振器２１は図１、図２に示す（実施例
１）の構造とほぼ同じであるが、貫通孔２１ｂの形状が
異なっている。In FIGS. 4 and 5, reference numeral 21 denotes a dielectric resonator. The dielectric resonator 21 has substantially the same structure as that of the first embodiment shown in FIGS. The shape is different.
【００３３】まず誘電体共振器２１について説明する。
２１ａは誘電体材料で構成された誘電体基体で、誘電体
基体２１ａは外形が方形状に形成されている。さらに誘
電体基体２１ａには貫通孔２１ｂが設けられており、貫
通孔２１ｂには開放端側に形成された方形状の孔２１ｇ
と、孔２１ｇに連結した円筒状の孔２１ｈによって構成
されている。図１、図２に示す（実施例１）の誘電体共
振器１においては、貫通孔１ｂは開放端から連結端に至
るまで同一の径を有していたが、本実施例においては、
貫通孔２１ｂに段差部２１ｉが設けられていることが特
徴である。この構成によって貫通孔２１ｂ内に形成され
る内導体２１ｃを大きく形成できるので、結合用導体２
１ｆと内導体２１ｃとの間の入出力結合容量を大きくと
ることができ、高減衰量の誘電体フィルタを作成するこ
とができる。その他の構成は図１、図２に示すものと同
様の構成を有している。First, the dielectric resonator 21 will be described.
Reference numeral 21a denotes a dielectric base made of a dielectric material. The dielectric base 21a has a rectangular outer shape. Further, a through hole 21b is provided in the dielectric substrate 21a, and a square hole 21g formed on the open end side is formed in the through hole 21b.
And a cylindrical hole 21h connected to the hole 21g. In the dielectric resonator 1 shown in FIGS. 1 and 2 (Example 1), the through hole 1b has the same diameter from the open end to the connection end.
A feature is that a step 21i is provided in the through hole 21b. With this configuration, the inner conductor 21c formed in the through hole 21b can be formed large, so that the coupling conductor 2
The input / output coupling capacitance between 1f and the inner conductor 21c can be increased, and a high attenuation dielectric filter can be produced. Other configurations are the same as those shown in FIGS.
【００３４】なお、誘電体フィルタの構成としては、図
１、図２に示す（実施例１）の貫通孔１ｂが開放端から
連結端に至るまで同一の径を有する誘電体共振器１と、
図４、図５に示す本実施例の誘電体共振器２１とを混在
して使用しても良い。The configuration of the dielectric filter includes a dielectric resonator 1 having the same diameter from the open end to the connection end, as shown in FIGS. 1 and 2 (embodiment 1).
The dielectric resonator 21 of this embodiment shown in FIGS. 4 and 5 may be used in combination.
【００３５】加えて、本実施例の誘電体共振器２１の貫
通孔２１ｂは方形状であったが、長方形、多角形、楕円
形、円形でも同様の効果が得られる。In addition, although the through hole 21b of the dielectric resonator 21 of this embodiment has a square shape, the same effect can be obtained with a rectangular, polygonal, elliptical or circular shape.
【００３６】（実施例３）図６は本発明の第３の実施例
における誘電体フィルタを示す分解斜視図であり、誘電
体共振器の構造自体は、（実施例１）や（実施例２）の
ものと同様である。ただし、図面の都合上（実施例１）
の誘電体共振器１を基に説明を行う。(Embodiment 3) FIG. 6 is an exploded perspective view showing a dielectric filter according to a third embodiment of the present invention. The structure of the dielectric resonator itself is shown in (Embodiment 1) and (Embodiment 2). ). However, on account of the drawing (Example 1)
The description will be made based on the dielectric resonator 1 described above.
【００３７】この誘電体共振器１を少なくとも１個以
上、絶縁体基板２上の接地電極３に外導体１ｄを半田付
け等により電気的に接続し、また絶縁体基板２上の結合
電極６に結合用導体１ｆを半田付け等により電気的に接
続して誘電体フィルタを構成する。At least one or more of the dielectric resonators 1 are electrically connected to the ground electrode 3 on the insulating substrate 2 with the outer conductor 1d by soldering or the like. The coupling conductor 1f is electrically connected by soldering or the like to form a dielectric filter.
【００３８】絶縁体基板２は平板であり、一方の主表面
２ａに接地電極３が形成されている。この接地電極３
は、主表面２ａからスルホール電極４を経由して他方の
主表面２ｂ上に形成された接地電極５と電気的に接続さ
れている。また、接地電極３上には、複数の誘電体共振
器１がそれぞれ互いに接触した状態で配置されている。
この誘電体共振器１の結合用導体１ｆは絶縁体基板２上
の結合電極６と半田等により電気的、機械的に接続さ
れ、また、外導体１ｄは接地電極３と半田等により電気
的、機械的に接続される。The insulator substrate 2 is a flat plate, and a ground electrode 3 is formed on one main surface 2a. This ground electrode 3
Are electrically connected from the main surface 2a via the through-hole electrode 4 to the ground electrode 5 formed on the other main surface 2b. A plurality of dielectric resonators 1 are arranged on the ground electrode 3 so as to be in contact with each other.
The coupling conductor 1f of the dielectric resonator 1 is electrically and mechanically connected to the coupling electrode 6 on the insulating substrate 2 by solder or the like, and the outer conductor 1d is electrically and mechanically connected to the ground electrode 3 by solder or the like. Connected mechanically.
【００３９】絶縁体基板２０は４層の積層構造になって
おり、第１層は誘電体共振器１の結合用導体１ｆと接続
するための結合電極６と接地電極３を有している。第２
層はコイル電極１５を、第３層はコンデンサ電極１６
を、第４層は接地電極１７を有している。この接地電極
１７はスルーホル電極４により接地電極３，５と電気的
に接続している。また、コンデンサ電極１６は接地電極
１７との間で絶縁基板層１８を介してコンデンサを形成
している。また結合電極６とコイル電極１５、コンデン
サ電極１６は側面電極１９ａ、１９ｂ、１９ｃを介して
接続されている。この側面電極１９ａと１９ｃは入出力
電極も兼ねている。The insulator substrate 20 has a laminated structure of four layers, and the first layer has a coupling electrode 6 and a ground electrode 3 for connecting to the coupling conductor 1f of the dielectric resonator 1. Second
The layer is the coil electrode 15 and the third layer is the capacitor electrode 16
The fourth layer has a ground electrode 17. The ground electrode 17 is electrically connected to the ground electrodes 3 and 5 by the through hole electrode 4. The capacitor electrode 16 forms a capacitor between the capacitor electrode 16 and the ground electrode 17 via the insulating substrate layer 18. The coupling electrode 6, the coil electrode 15, and the capacitor electrode 16 are connected via side electrodes 19a, 19b, 19c. These side electrodes 19a and 19c also serve as input / output electrodes.
【００４０】なお、誘電体フィルタの構成としては、図
１、図２に示す（実施例１）の誘電体共振器１と、図
４、図５に示す（実施例２）の誘電体共振器２１とを混
在して使用しても良い。The structure of the dielectric filter includes the dielectric resonator 1 shown in FIGS. 1 and 2 (Embodiment 1) and the dielectric resonator shown in FIGS. 4 and 5 (Embodiment 2). 21 may be used in combination.
【００４１】（実施例４）図７及び図８はそれぞれ本発
明の第４の実施例における誘電体フィルタを示す斜視図
及び等価回路図である。誘電体共振器の構造自体は、
（実施例１）や（実施例２）のものと同様であるが、図
面の都合上（実施例１）の誘電体共振器１を基に説明を
行う。(Embodiment 4) FIGS. 7 and 8 are a perspective view and an equivalent circuit diagram showing a dielectric filter according to a fourth embodiment of the present invention. The structure of the dielectric resonator itself is
This is the same as that of (Example 1) or (Example 2), but for convenience of the drawing, the description will be made based on the dielectric resonator 1 of (Example 1).
【００４２】図７に示すのは、（実施例１）の構造の誘
電体フィルタを２個合成回路を通して一端で接続したデ
ュプレクサ構造の誘電体フィルタであり、１はそれぞれ
誘電体共振器である。この誘電体フィルタは図８に示す
ような等価回路構造となり、（実施例１）の誘電体フィ
ルタをａ部、ｂ部としてｃ部の合成回路により接続した
構造である。このｃ部の回路は２つの誘電体フィルタを
接続するための合成回路であり、本実施例においてはイ
ンピーダンスＺ１、Ｚ２が誘導性、Ｚ３＝０の場合であ
るが、それぞれの回路によりＺ１〜Ｚ３は容量性から誘
導性まで種々の値をとり、適当な値のコイルやコンデン
サにより実施することができる。この合成回路のコイル
は図７のコイル２２，２３に対応する。このコイル２
２、２３は電極２４に接続され合成入出力電極２５に接
続される。他の構成は（実施例１）と同様である。図９
に本実施例の特性例を示す。FIG. 7 shows a dielectric filter having a duplexer structure in which two dielectric filters having the structure of the first embodiment are connected at one end through a synthesis circuit. Reference numeral 1 denotes a dielectric resonator. This dielectric filter has an equivalent circuit structure as shown in FIG. 8, and has a structure in which the dielectric filters of (Example 1) are connected by a composite circuit of a part a and a part b as a part. The circuit in section c is a combining circuit for connecting two dielectric filters. In this embodiment, the impedances Z1 and Z2 are inductive and Z3 = 0. Can take various values from capacitive to inductive, and can be implemented with coils or capacitors of appropriate values. The coils of this combining circuit correspond to the coils 22 and 23 of FIG. This coil 2
Reference numerals 2 and 23 are connected to the electrode 24 and to the combined input / output electrode 25. Other configurations are the same as in the first embodiment. FIG.
FIG. 9 shows an example of the characteristics of this embodiment.
【００４３】なお、図７の絶縁体基板２は（実施例３）
のような積層型で内部に容量やコイルを一体形成したも
のでも同様の効果が得られる。The insulating substrate 2 shown in FIG.
The same effect can be obtained even when a capacitor and a coil are integrally formed in a laminated type as described above.
【００４４】（実施例５）図１０及び図１２はそれぞれ
本発明の第５の実施例における誘電体フィルタを示す斜
視図及び等価回路図である。誘電体共振器の構造自体
は、（実施例１）や（実施例２）のものと同様である
が、図面の都合上（実施例１）の誘電体共振器１を基に
説明を行う。図１０において１はそれぞれ誘電体共振器
である。(Embodiment 5) FIGS. 10 and 12 are a perspective view and an equivalent circuit diagram showing a dielectric filter according to a fifth embodiment of the present invention. Although the structure of the dielectric resonator itself is the same as that of (Embodiment 1) or (Embodiment 2), description will be made based on the dielectric resonator 1 of (Embodiment 1) for convenience of the drawing. In FIG. 10, 1 is a dielectric resonator.
【００４５】図１０に示すのは（実施例１）の構造の誘
電体フィルタとバンドパス構造の誘電体フィルタを一端
で接続したデュプレクサ構造のフィルタである。この誘
電体フィルタは図１２に示すような等価回路構造とな
り、（実施例１）の誘電体フィルタのａ部、合成回路の
ｃ部、バンドパスフィルタのｄ部、さらにノッチ回路の
ｅ部を接続した回路構成となっている。このｃ部の回路
は２つの誘電体フィルタを接続するための合成回路であ
り、本実施例においてはインピーダンスＺ１＝０、Ｚ２
が誘導性、Ｚ３＝０の場合であるが、それぞれの回路に
よりＺ１〜Ｚ３は容量性から誘導性まで種々の値をとり
適当な値のコイルやコンデンサにより実施することがで
きる。この合成回路のコイルは図１０のコイル２２に対
応する。このコイル２２、は電極２４に接続され合成入
出力電極２５に接続される。FIG. 10 shows a filter having a duplexer structure in which a dielectric filter having the structure of the first embodiment and a dielectric filter having a bandpass structure are connected at one end. This dielectric filter has an equivalent circuit structure as shown in FIG. 12, and connects part a of the dielectric filter of Example 1, part c of the synthesis circuit, part d of the bandpass filter, and part e of the notch circuit. Circuit configuration. The circuit in section c is a combining circuit for connecting two dielectric filters, and in this embodiment, impedances Z1 = 0, Z2
Is inductive and Z3 = 0, but Z1 to Z3 can take various values from capacitive to inductive depending on the respective circuits, and can be implemented by coils and capacitors of appropriate values. The coil of this synthesis circuit corresponds to the coil 22 of FIG. This coil 22 is connected to an electrode 24 and to a combined input / output electrode 25.
【００４６】バンドパスフィルタの例を図１１に示す。
誘電体共振器３１、３２は開放端面側の外導体３１ｄ，
３２ｄの２面に、外導体３１ｄ，３２ｄから独立した結
合用導体３１ｆ，３２ｆをそれぞれ直交するように設け
る。また、誘電体共振器３３は開放端面側の外導体３３
ｄの２面に、外導体３３ｄから独立した結合用導体３３
ｆをそれぞれ平行になるように設け、誘電体共振器３１
の側面に設けた結合用導体３１ｆと誘電体共振器３３の
側面に設けた結合用導体３３ｆとが密着するように、ま
た、誘電体共振器３３の側面に設けた結合用導体３３ｆ
と誘電体共振器３２の側面に設けた結合用導体３２ｆと
が密着するように配置し、半田等により電気的、機械的
に接続する。これらの誘電体共振器の接合によって得ら
れた誘電体フィルタを絶縁体基板２上の電極２６，２７
に、それぞれ電極２６が誘電体共振器３１の底部の結合
用導体３１ｆに電極２７が誘電体共振器３２の底部の結
合用導体３２ｆに密着するように配置し、半田等により
電気的、機械的に接続する。FIG. 11 shows an example of a band-pass filter.
The dielectric resonators 31 and 32 have outer conductors 31d,
On two surfaces of 32d, coupling conductors 31f and 32f independent of the outer conductors 31d and 32d are provided to be orthogonal to each other. Further, the dielectric resonator 33 is provided with an outer conductor 33 on the open end face side.
d, a coupling conductor 33 independent of the outer conductor 33d
f are provided in parallel with each other, and the dielectric resonator 31
The coupling conductor 31f provided on the side surface of the dielectric resonator 33 and the coupling conductor 31f provided on the side surface of the dielectric resonator 33 are in close contact with each other.
And the coupling conductor 32f provided on the side surface of the dielectric resonator 32 are arranged in close contact with each other, and are electrically and mechanically connected by soldering or the like. The dielectric filters obtained by joining these dielectric resonators are connected to the electrodes 26 and 27 on the insulating substrate 2.
The electrode 26 is disposed so as to be in close contact with the coupling conductor 31f at the bottom of the dielectric resonator 31, and the electrode 27 is disposed in close contact with the coupling conductor 32f at the bottom of the dielectric resonator 32. Connect to
【００４７】誘電体共振器３４は誘電体共振器１と同一
構造であり、絶縁体基板２上の電極２８に誘電体共振器
３４の結合用導体３４ｆが密着するように配置し、半田
等により電気的、機械的に接続する。以上のような本実
施例の特性例を図１３に示す。The dielectric resonator 34 has the same structure as the dielectric resonator 1, and is arranged so that the coupling conductor 34 f of the dielectric resonator 34 is in close contact with the electrode 28 on the insulating substrate 2 and soldered. Make electrical and mechanical connections. FIG. 13 shows a characteristic example of the present embodiment as described above.
【００４８】なお、図１０の絶縁体基板２は（実施例
３）のような積層型で内部に容量やコイルを一体形成し
たものでも同様の効果が得られる。The same effect can be obtained even if the insulator substrate 2 of FIG. 10 is a laminated type as in (Embodiment 3) in which a capacitor and a coil are integrally formed.
【００４９】[0049]
【発明の効果】以上のように本発明は、誘電体基体と、
誘電体基体の外側面に設けられた外導体と、誘電体基体
の内側面に設けられた内導体と、誘電体基体の一方の端
面に設けられ、外導体と内導体を連結する連結導体と、
外側面の一面に設けられ各導体と電気的に接触しない結
合用導体を有する誘電体共振器を少なくとも１つ以上具
備し、この誘電体共振器を絶縁体基板上に配置しこの絶
縁体基板上に設けた回路電極と結合用導体とを電気的に
接合した誘電体フィルタを構成することにより、小型で
広帯域フィルタを実現することができ、性能を向上する
ことができる。As described above, the present invention provides a dielectric substrate,
An outer conductor provided on the outer surface of the dielectric substrate, an inner conductor provided on the inner surface of the dielectric substrate, and a connecting conductor provided on one end surface of the dielectric substrate and connecting the outer conductor and the inner conductor; ,
At least one dielectric resonator having a coupling conductor that is provided on one surface of the outer surface and that does not make electrical contact with each conductor is provided. The dielectric resonator is disposed on an insulator substrate, and the dielectric resonator is disposed on the insulator substrate. By configuring the dielectric filter in which the circuit electrode provided in the above and the coupling conductor are electrically connected, a small-sized and broadband filter can be realized, and the performance can be improved.
【図１】本発明の第１の実施例における誘電体フィルタ
を示す斜視図FIG. 1 is a perspective view showing a dielectric filter according to a first embodiment of the present invention.
【図２】本発明の第１の実施例における誘電体フィルタ
を示す分解斜視図FIG. 2 is an exploded perspective view showing a dielectric filter according to the first embodiment of the present invention.
【図３】本発明の第１の実施例における誘電体共振器の
等価回路図FIG. 3 is an equivalent circuit diagram of the dielectric resonator according to the first embodiment of the present invention.
【図４】本発明の第２の実施例における誘電体フィルタ
を示す斜視図FIG. 4 is a perspective view showing a dielectric filter according to a second embodiment of the present invention.
【図５】本発明の第２の実施例における誘電体フィルタ
を示す分解斜視図FIG. 5 is an exploded perspective view showing a dielectric filter according to a second embodiment of the present invention.
【図６】本発明の第３の実施例における誘電体フィルタ
を示す分解斜視図FIG. 6 is an exploded perspective view showing a dielectric filter according to a third embodiment of the present invention.
【図７】本発明の第４の実施例における誘電体フィルタ
を示す斜視図FIG. 7 is a perspective view showing a dielectric filter according to a fourth embodiment of the present invention.
【図８】本発明の第４の実施例における誘電体フィルタ
の等価回路図FIG. 8 is an equivalent circuit diagram of a dielectric filter according to a fourth embodiment of the present invention.
【図９】本発明の第４の実施例における誘電体フィルタ
の特性図FIG. 9 is a characteristic diagram of a dielectric filter according to a fourth embodiment of the present invention.
【図１０】本発明の第５の実施例における誘電体フィル
タを示す斜視図FIG. 10 is a perspective view showing a dielectric filter according to a fifth embodiment of the present invention.
【図１１】本発明の一実施例における誘電体フィルタの
バンドパスフィルタを示す斜視図FIG. 11 is a perspective view showing a bandpass filter of a dielectric filter according to one embodiment of the present invention.
【図１２】本発明の第５の実施例における誘電体フィル
タの等価回路図FIG. 12 is an equivalent circuit diagram of a dielectric filter according to a fifth embodiment of the present invention.
【図１３】本発明の第５の実施例における誘電体フィル
タの特性図FIG. 13 is a characteristic diagram of a dielectric filter according to a fifth embodiment of the present invention.
【図１４】従来の誘電体フィルタを示す斜視図FIG. 14 is a perspective view showing a conventional dielectric filter.
【図１５】従来の誘電体フィルタを示す断面図FIG. 15 is a sectional view showing a conventional dielectric filter.
【符号の説明】 １ 誘電体共振器 １ａ 誘電体基体 １ｂ 貫通孔 １ｃ 内導体 １ｄ 外導体 １ｅ 連結導体 １ｆ 結合用導体 ２ 絶縁体基板 ３ 接地電極 ４ スルホール電極 ６ 結合電極 １２ シールドケース ２０ 絶縁体基板 ２１ 誘電体共振器 ２１ａ 誘電体基体 ２１ｂ 貫通孔 ２１ｃ 内導体 ２１ｄ 外導体 ２１ｆ 結合用導体 ２１ｇ 孔 ２１ｈ 孔 ２１ｉ 段差部 ３１ 誘電体共振器 ３１ｄ 外導体 ３１ｆ 結合用導体 ３２ 誘電体共振器 ３２ｄ 外導体 ３２ｆ 結合用導体 ３３ 誘電体共振器 ３３ｄ 外導体 ３３ｆ 結合用導体 ３４ 誘電体共振器 ３４ｆ 結合用導体DESCRIPTION OF SYMBOLS 1 Dielectric resonator 1a Dielectric substrate 1b Through hole 1c Inner conductor 1d Outer conductor 1e Connection conductor 1f Coupling conductor 2 Insulator substrate 3 Ground electrode 4 Through hole electrode 6 Coupling electrode 12 Shield case 20 Insulator substrate Reference Signs List 21 dielectric resonator 21a dielectric base 21b through hole 21c inner conductor 21d outer conductor 21f coupling conductor 21g hole 21h hole 21i step portion 31 dielectric resonator 31d outer conductor 31f coupling conductor 32 dielectric resonator 32d outer conductor 32f Coupling conductor 33 Dielectric resonator 33d Outer conductor 33f Coupling conductor 34 Dielectric resonator 34f Coupling conductor
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大野 博司 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroshi Ohno 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (8)
基体に設けられた１つの貫通孔と、前記誘電体基体の外
周面に設けられた外導体と、前記誘電体基体の内周面に
設けられた内導体と、前記誘電体基体の一方の端面に設
けられ、前記外導体と前記内導体を連結する連結導体
と、前記外側面の一面に設けられ、前記各導体と電気的
に非接触となる結合用導体を有する誘電体共振器を具備
し、前記誘電体共振器を回路基板上に配置し前記回路基
板上に設けた回路電極と前記結合用導体とを電気的に接
合するとともに、前記回路基板にコンデンサ，コイルの
少なくとも１つ以上を設けたことを特徴とする誘電体フ
ィルタ。1. A dielectric substrate having a rectangular cross section, one through hole provided in the dielectric substrate, an outer conductor provided on an outer peripheral surface of the dielectric substrate, and an inner periphery of the dielectric substrate. An inner conductor provided on a surface, a connecting conductor provided on one end surface of the dielectric base, connecting the outer conductor and the inner conductor, and a connecting conductor provided on one surface of the outer surface, and electrically connected to each of the conductors. A dielectric resonator having a non-contacting coupling conductor, wherein the dielectric resonator is disposed on a circuit board, and a circuit electrode provided on the circuit board is electrically connected to the coupling conductor. A dielectric filter, wherein at least one of a capacitor and a coil is provided on the circuit board.
た事を特徴とする請求項１記載の誘電体フィルタ。2. The dielectric filter according to claim 1, wherein a shield case for covering the dielectric resonator is provided.
求項１記載の誘電体フィルタ。3. The dielectric filter according to claim 1, wherein each conductor has a multilayer structure.
を含むことを特徴とする請求項１記載の誘電体フィル
タ。4. The dielectric substrate is made of BaO, TiO 2 , Nd 2 O 3
The dielectric filter according to claim 1, further comprising:
する請求項１記載の誘電体フィルタ。5. The dielectric filter according to claim 1, wherein the surface of the dielectric substrate is roughened.
たことを特徴とする請求項５記載の誘電体フィルタ。6. The dielectric filter according to claim 5, wherein the roughened surface roughness is 5 μm to 9 μm.
各導体を形成した事を特徴とする請求項１記載の誘電体
フィルタ。7. The dielectric filter according to claim 1, wherein each conductor is formed after applying a resist film on the dielectric substrate.
極を形成するとともに、前記回路基板にスルホールを形
成し、前記スルーホール内にスルホール電極を設けて前
記第１及び第２の接地電極を電気的に接続し、前記接地
電極と誘電体共振器の外導体を接続した事を特徴とする
請求項１記載の誘電体フィルタ。8. A first and a second electrode, wherein a ground electrode is formed on the first and second main surfaces of the circuit board, a through hole is formed in the circuit board, and a through hole electrode is provided in the through hole. 2. The dielectric filter according to claim 1, wherein a ground electrode is electrically connected, and the ground electrode is connected to an outer conductor of the dielectric resonator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10311758A JPH11205009A (en) | 1994-08-03 | 1998-11-02 | Dielectric filter |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6182260A JP2907010B2 (en) | 1994-08-03 | 1994-08-03 | Dielectric filter |
| JP10311758A JPH11205009A (en) | 1994-08-03 | 1998-11-02 | Dielectric filter |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6182260A Division JP2907010B2 (en) | 1994-08-03 | 1994-08-03 | Dielectric filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11205009A true JPH11205009A (en) | 1999-07-30 |
Family
ID=16115146
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6182260A Expired - Fee Related JP2907010B2 (en) | 1994-08-03 | 1994-08-03 | Dielectric filter |
| JP10311758A Pending JPH11205009A (en) | 1994-08-03 | 1998-11-02 | Dielectric filter |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6182260A Expired - Fee Related JP2907010B2 (en) | 1994-08-03 | 1994-08-03 | Dielectric filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP2907010B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1085593A3 (en) * | 1999-09-14 | 2002-09-18 | Murata Manufacturing Co., Ltd. | Dielectric resonator device, dielectric duplexer, and communication apparatus incorporating same |
| JP2009290897A (en) * | 2006-01-17 | 2009-12-10 | Hitachi Metals Ltd | High frequency circuit component and communication device using such high frequency circuit component |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6350102A (en) * | 1986-08-20 | 1988-03-03 | Fujitsu Ltd | Dielectric resonator |
| JP2753096B2 (en) * | 1989-02-16 | 1998-05-18 | 松下電器産業株式会社 | Coaxial dielectric resonator |
| JPH0644165Y2 (en) * | 1989-03-06 | 1994-11-14 | 富士電気化学株式会社 | Dielectric resonator for oscillator circuit |
| JP2737253B2 (en) * | 1989-06-01 | 1998-04-08 | 富士通株式会社 | Dielectric filter |
| JPH03125502A (en) * | 1989-10-11 | 1991-05-28 | Fujitsu Ltd | Microwave circuit module |
| JP2846744B2 (en) * | 1990-03-20 | 1999-01-13 | 三洋電機株式会社 | Dielectric resonator and dielectric filter |
| JP3162790B2 (en) * | 1991-03-25 | 2001-05-08 | 三洋電機株式会社 | Dielectric filter |
| JPH06132706A (en) * | 1992-09-07 | 1994-05-13 | Murata Mfg Co Ltd | Dielectric resonance parts |
-
1994
- 1994-08-03 JP JP6182260A patent/JP2907010B2/en not_active Expired - Fee Related
-
1998
- 1998-11-02 JP JP10311758A patent/JPH11205009A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1085593A3 (en) * | 1999-09-14 | 2002-09-18 | Murata Manufacturing Co., Ltd. | Dielectric resonator device, dielectric duplexer, and communication apparatus incorporating same |
| US6573809B1 (en) | 1999-09-14 | 2003-06-03 | Murata Manufacturing Co., Ltd. | Dielectric resonator device, dielectric duplexer, and communication apparatus incorporating same |
| JP2009290897A (en) * | 2006-01-17 | 2009-12-10 | Hitachi Metals Ltd | High frequency circuit component and communication device using such high frequency circuit component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0846404A (en) | 1996-02-16 |
| JP2907010B2 (en) | 1999-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH098506A (en) | Band stop filter | |
| JP2002246503A (en) | Electronic component and method of manufacturing the same | |
| JP2851966B2 (en) | Multilayer dielectric filter | |
| JPH0115164Y2 (en) | ||
| JP2907010B2 (en) | Dielectric filter | |
| JPH0653710A (en) | Antenna multicoupler | |
| JPS63300593A (en) | Ceramic composite substrate | |
| JP2778432B2 (en) | Dielectric filter | |
| JP2780591B2 (en) | Dielectric filter | |
| JP2860010B2 (en) | Multilayer dielectric filter | |
| JP3889179B2 (en) | Antenna device | |
| JPH11195554A (en) | Multilayer ceramic electronic device and method of manufacturing the same | |
| JP3381956B2 (en) | Multilayer dielectric filter | |
| JPH0623041Y2 (en) | Dielectric coaxial resonator | |
| JPS6028113Y2 (en) | Composite parts that can be trimmed | |
| JP2004296927A (en) | Wiring board for storing electronic components | |
| JP3563580B2 (en) | High frequency composite circuit board and method of manufacturing the same | |
| JP2661004B2 (en) | Dielectric filter | |
| JP2585866Y2 (en) | Dielectric resonator | |
| JPH0817673A (en) | Mica capacitor | |
| JP3802639B2 (en) | Band stop filter | |
| JPH10107503A (en) | Dielectric filter | |
| JP2727447B2 (en) | Circuit device having a dielectric filter | |
| JPH04356801A (en) | Dielectric filter | |
| US20040113710A1 (en) | Nonreciprocal circuit device and communication device |