JPH11214796A - Heat sink for laser device and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a heat sink of a laser element and a method of manufacturing the same, which can surely make a heat sink main body airtight, can improve a heat radiation effect, and can be easily manufactured. A heat sink body (25) having a recess (29) on its surface and a plurality of connection terminal through holes (25a, 25b), and a surface of the heat sink body (25) partially embedded in the recess (29) of the heat sink body (25). And a laser element mounting portion 23 that is provided so as to protrude further.
Is characterized in that the diameter of the buried portion is larger than the diameter of the portion protruding from the surface of the heat sink body 25.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a heat sink of a laser element to which a laser element used for a signal pickup of D is attached and radiates heat from the laser element, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a semiconductor laser device used for a signal pickup of a CD or a DVD generates heat during operation, and therefore, a semiconductor laser device is attached to a heat sink to radiate heat generated from the semiconductor laser device.

FIG. 6 is a perspective view showing a heat sink of a conventional semiconductor laser device. In the figure, 1 is a heat sink of a semiconductor laser device, 2 is a semiconductor laser device, 3 is a mounting portion of a semiconductor laser device, 4, 5 are connection terminals, 4a and 5a.
Is a terminal portion, 6 is a ground terminal, 7 is a heat sink body, 8
Reference numerals a and 8b denote terminal through holes, reference numeral 9 denotes an element mounting portion through hole, and reference numeral 10 denotes insulating glass. That is, the terminal through holes 8a and 8b are provided in the plate-shaped heat sink body 7 made of iron, and the element mounting portion through hole 9 is provided. The semiconductor laser device mounting portion 3 made of copper or a copper alloy is press-fitted into the device mounting portion through hole 9 and brazed. A part of the semiconductor laser device mounting portion 3 is provided so as to protrude from the heat sink body 7, and the semiconductor laser device mounting portion 3 protruding from the heat sink body 7 is compressed so as to form two opposing flat surfaces, The semiconductor laser device 2 is mounted on one of the compressed flat surfaces. The terminal through holes 8a,
The connection terminals 4 and 5 are respectively penetrated through 8b and are hermetically sealed with the insulating glass 10. Terminal portions 4a and 5a are respectively provided at the upper ends of the connection terminals 4 and 5, and the terminal portions 4a and 5a are connected to the semiconductor laser device 2 by wire bonding. The ground terminal 6 is brazed to the lower surface of the heat sink body 7, or
It is attached by a method such as resistance welding.

[0004]

By using iron as the material of the heat sink body 7, the connection terminals 4 and 5 can be better sealed to the terminal through holes 8a and 8b with the insulating glass 10. However, since the thermal conductivity of iron is smaller than the thermal conductivity of copper, copper is used as the material of the semiconductor laser device mounting portion 3. Is smaller than the portion protruding from the upper surface of the heat sink body 7, so that a sufficient heat radiation effect cannot be obtained. Further, since the semiconductor laser device mounting portion 3 is press-fitted into the device mounting portion through hole 9 of the heat sink body 7, there is a possibility that the heat sink body 7 may be cracked, and there is a problem in airtightness.

Conventionally, it is difficult to manufacture the semiconductor laser device mounting portion 3 by itself with high accuracy. Further, since the conventional semiconductor laser device mounting portion 3 is brazed to the device mounting portion through hole 9, For example, when heated to a high temperature such as 1000 ° C., there is a disadvantage that the positional accuracy of the semiconductor laser element mounting portion 3 is reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to surely make a heat sink main body airtight.
An object of the present invention is to provide a heat sink for a laser element and a method for manufacturing the same, which can improve the heat radiation effect, and can be manufactured easily, with high precision and at low cost.

[0007]

In order to achieve the above object, a heat sink of a laser device according to the present invention comprises a plate-shaped heat sink body having a concave portion on the surface and a plurality of connection terminal through holes, and A laser element mounting portion partially embedded in the concave portion of the heat sink main body and provided so as to protrude from the surface of the heat sink main body, wherein the diameter of the embedded portion of the concave portion of the heat sink main body protrudes from the surface of the heat sink main body. It is characterized by being formed larger than the diameter of the part.

In the method for manufacturing a heat sink for a laser element according to the present invention, a concave part forming step of forming a concave part in a plate-shaped heat sink main body part, and a material for a laser element mounting part is pressed into the concave part formed in the concave part forming step. A press-fitting step, a compression step of compressing the material of the laser element mounting portion and the surface of the heat sink main body after the press-fitting step so that the surfaces of the heat sink main body become flat, and after the compression step, the heat sink main body and the laser element mounting portion Forming a heat sink body by press-fitting the material into a mold and projecting a part of the material for the laser element mounting portion from the surface of the heat sink body; and forming a through-hole for providing a connection terminal through-hole in the heat sink body. And characterized in that:

Further, according to the method for manufacturing a heat sink of a laser element of the present invention, a through hole forming step of forming a through hole in a plate-shaped heat sink main body, and a through hole formed in the through hole forming step for a laser element mounting portion. A press-fitting step of press-fitting the material, and after this press-fitting step, a compression step of compressing the laser element mounting portion material and the surface of the heat sink body so as to be flat, and after the compression step, the heat sink body and A molding step of press-fitting the material for the laser element mounting portion into the mold to form the heat sink body and projecting a part of the material for the laser element mounting portion from the surface of the heat sink body, and providing a connection terminal through hole in the heat sink body. And forming a through hole.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the present invention. In the figure, 21 is a heat sink of a semiconductor laser device, 22 is a semiconductor laser device, 23
Is a semiconductor laser device mounting portion, 23a is a projection of the semiconductor laser device mounting portion, 23b is a buried portion of the semiconductor laser device mounting portion, 24a and 24b are connection terminals, 25 is a heat sink body, 25a and 25b are terminal through holes, 26 Is the ground terminal,
27a and 27b are terminal portions, 28a and 28b are insulating glass, and 29 is a concave portion for a semiconductor laser element mounting portion. That is, the plate-shaped heat sink body 25 made of iron is provided with the terminal through holes 25a and 25b and the concave portion 29 for the semiconductor laser element mounting portion. A semiconductor laser device mounting portion 23 made of copper or a copper alloy is implanted in the concave portion 29 for the semiconductor laser device mounting portion. In this case, the laser element mounting portion 23 is formed such that the diameter of the embedded portion 23b embedded in the concave portion 29 for the semiconductor laser element mounting portion is larger than the diameter of the protruding portion 23a protruding from the surface of the heat sink body 25. The semiconductor laser element mounting part 23
The semiconductor laser element 22 is attached to a side surface protruding from the heat sink body 7. The terminal through holes 25a, 25
The connection terminals 24a and 24b respectively penetrate through b and are hermetically sealed with insulating glasses 28a and 28b. Terminal portions 27a and 27b are provided at upper ends of the connection terminals 24a and 24b, respectively, and the terminal portions 27a and 27b are connected to the semiconductor laser device 22 by wire bonding. The ground terminal 26 is attached to the lower surface of the heat sink body 25 by a method such as brazing or resistance welding.

As described above, since the semiconductor laser element mounting portion 23 made of copper or copper alloy is implanted in the concave portion 29 of the heat sink body 25 made of iron, the heat sink body 25 is formed.
Cracks and the like do not occur, and the airtightness of the heat sink body 25 is not impaired, so that the airtightness can be ensured. In addition, the laser element mounting portion 23 has a buried portion 23 buried in the concave portion 29 for the semiconductor laser device mounting portion.
The diameter of b is formed larger than the diameter of the protruding portion 23a protruding from the surface of the heat sink body 25, and a large amount of copper having a good heat radiation effect can be used, so that the heat radiation effect can be improved. By using iron for the heat sink body 25, the connection terminals 24a and 24b can be connected to the terminal through-holes 2.
When air-tightly sealing the insulating films 5a and 25b with the insulating glasses 28a and 28b, they can be sealed well.

FIGS. 2 (a) to 2 (e) and 2 (b ') to 2 (e').
3 (f) to 3 (j) and 3 (f ') are plan views ((a) to (j)) and enlarged cross-sectional views ((b') showing an example of a method for manufacturing a heat sink for a semiconductor laser device according to the present invention. ) ~
(F ')). That is, first, in the step of FIG. 2A, a pilot hole 31 and a first window hole 32 are provided near both side edges of the elongated iron plate 30 by press working. Next, in the steps shown in FIGS. 2B and 2B, a recess 29 for mounting a semiconductor laser element is provided between the first window holes 32 by press working. Next, FIG.
In the step (c ′), a second window hole 33 is formed by pressing so as to sandwich the first window hole 32 and the concave portion 29. Next, in the steps of FIGS. 2D and 2D,
A copper member 34 for a semiconductor laser element attachment is press-fitted into the recess 29 for the semiconductor laser element attachment. In this case, the copper member 34 is slightly smaller than the internal volume of the recess 29. Next, in the steps of FIGS. 2E and 2E ', press working is performed so that the upper surface of the portion surrounded by the first window hole 32 and the second window hole 33 becomes flat. In this case, the periphery of the opening of the recess 29 covers the periphery of the upper surface of the copper member 34, and the copper member 34 is caulked by the iron plate 30.
Next, in the steps shown in FIGS. 3F and 3F, press working is performed so that the upper surface of the portion surrounded by the first window hole 32 and the second window hole 33 is pressed into a mold (not shown). I do. In this case, the periphery is thinly pressed so as to leave the heat sink body 25 in a circular shape by processing, and the copper member 34 is pressed.
Are protruded from the upper surface of the heat sink body 25 to form the semiconductor laser element mounting portion 23. The semiconductor laser device mounting portion 23 is a buried portion 23 buried in a concave portion 29.
The diameter b is larger than the diameter of the protruding portion 23 a protruding from the surface of the heat sink body 25. Next, FIG.
In the step (g), an inclined concave portion 35 is formed on the upper surface of the heat sink main body 25 by press working so as to gradually become deeper from the vicinity of the semiconductor laser device mounting portion 23. Next, in the step of FIG.
5, through holes 25a and 25b are formed by press working. Next, in the step of FIG. 3 (i), the heat sink body 25 is formed into a predetermined shape by pressing so as to provide a notch portion 36 at the peripheral edge portion. Next, in the step of FIG. 3 (j), the heat sink body 25 is pulled out by press working.

FIGS. 2 (a) to 2 (e) and 2 (b ") to 2 (e")
3 (f) to 3 (j) and 3 (f ″) are plan views ((a) to (j)) and enlarged sectional views (((a) to (j)) illustrating another example of a method for manufacturing a heat sink for a semiconductor laser device according to the present invention. b ") ~
(F ″)) In other words, first, in the step of FIG. 2A, a pilot hole 31 and a first window hole 32 are formed near both side edges of the elongated iron plate 30 by press working, respectively. In the steps (b) and (b ″), a through hole 29 ′ for a semiconductor laser element mounting portion is provided between the first window holes 32 by press working. Next, FIG.
In the step (c ″), a second window hole 33 is formed by press working so as to sandwich the first window hole 32 and the through hole 29 ′. Next, in the steps of FIGS. Then, a copper member 34 'for the semiconductor laser element mounting portion is press-fitted into the through hole 29' for the semiconductor laser device mounting portion. In this case, the copper member 34 'is slightly smaller than the internal volume of the through hole 29'. 2 (e) and 2 (e ″), press processing is performed so that the upper surface of the portion surrounded by the first window hole 32 and the second window hole 33 becomes flat. The periphery of the opening of the through hole 29 ′ is the copper member 3.
The copper member 34 ′ is swaged by the iron plate 30 so as to cover the periphery of the upper surface of 4 ′. Next, FIG.
In the step (f ″), the first window hole 32 and the second
Is pressed so that the upper surface of the portion surrounded by the window hole 33 is pressed into a mold (not shown). In this case, the periphery is thinly pressed so that the heat sink main body 25 remains circular by processing, and a part of the copper member 34 'is projected from the upper surface of the heat sink main body 25 to form the semiconductor laser element mounting portion 23'. Is done. In the semiconductor laser element mounting portion 23 ', a diameter of a buried portion 23'b buried in the through hole 29' is formed larger than a diameter of a protruding portion 23'a protruding from the surface of the heat sink body 25. Next, FIG.
In the step (3), an inclined concave portion 35 is formed on the upper surface of the heat sink main body 25 by press working so as to gradually become deeper from the vicinity of the semiconductor laser element mounting portion 23 '. Next, in the step of FIG. 3H, terminal through holes 25a and 25b are formed in the heat sink body 25 by press working. Next, in the step of FIG. 3 (i), the heat sink body 25 is formed into a predetermined shape by pressing so as to provide a notch portion 36 at the peripheral edge portion. Next, in the step of FIG. 3 (j), the heat sink body 25 is pulled out by press working.

As described above, in the method for manufacturing a heat sink of a semiconductor laser device according to the present invention, since the semiconductor laser device mounting portions 23 and 23 'can be manufactured by press working, the semiconductor laser device mounting portions 23 and 23' can be dramatically increased. It can be manufactured with high accuracy, and is easy to manufacture, resulting in a dramatic cost reduction.

FIGS. 4 and 5 are plan views each showing a modification of the present invention. In the figure, portions corresponding to the same portions as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. That is,
FIG. 4 shows a heat sink body 251 of a semiconductor laser device in which a concave portion 291 for a semiconductor laser device mounting portion having a small waveform portion 37 in a part of a circular outer periphery is provided, and FIG. The heat sink main body 252 of the semiconductor laser device provided with a concave portion 292 for a semiconductor laser device mounting portion having a large waveform portion 38. in this way,
By providing the corrugated portion in the concave portion for the semiconductor laser device mounting portion, the semiconductor laser device mounting portion does not rotate, and the degree of adhesion of the semiconductor laser device mounting portion is improved.

[0016]

As described above, according to the present invention, the heat sink body can be reliably made airtight, the heat radiation effect can be improved, and the semiconductor laser element mounting portion can be manufactured by press working. It is possible to provide a heat sink for a laser element and a method for manufacturing the same, which can dramatically manufacture the semiconductor laser element mounting portion with high precision, facilitates the manufacture, and dramatically reduces the cost.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

2A and 2B are a plan view and an enlarged cross-sectional view illustrating an example of a method for manufacturing a heat sink of a semiconductor laser device according to the present invention.

3A and 3B are a plan view and an enlarged cross-sectional view illustrating an example of a method for manufacturing a heat sink of a semiconductor laser device according to the present invention.

FIG. 4 is a plan view showing a modification of the present invention.

FIG. 5 is a plan view showing a modification of the present invention.

FIG. 6 is a perspective view showing a heat sink of a conventional semiconductor laser device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Heat sink of semiconductor laser element 22 Semiconductor laser element 23 Semiconductor laser element mounting part 23a Projection part of semiconductor laser element mounting part 23b Embedded part of semiconductor laser element mounting part 24a, 24b Connection terminal 25 Heat sink main body 25a, 25b Terminal through hole 26 Ground Terminals 27a, 27b Terminals 28a, 28b Insulating glass 29 Recess for mounting semiconductor laser element

Claims (3)

[Claims] 1. A plate-shaped heat sink body provided with a concave portion on its surface and a plurality of connection terminal through holes, and a laser partially embedded in the concave portion of the heat sink body and provided so as to protrude from the surface of the heat sink main body. A heat sink for the laser device, wherein the laser device mounting portion is formed such that a diameter of a buried portion of the heat sink main body concave portion is larger than a diameter of a portion protruding from the heat sink main body surface. 2. A recess forming step of forming a recess in the plate-shaped heat sink main body, a press-fitting step of press-fitting a laser element mounting portion material into the recess formed in the recess forming step, and after the press-fitting step, A compression step of compressing the material of the laser element mounting portion and the surface of the heat sink body so as to be flat; and, after the compression step, press-fitting the material of the heat sink body and the material of the laser element mounting portion into a mold to heat sink. A laser comprising: a molding step of molding a main body part and projecting a part of a material for a laser element mounting part from a surface of a heat sink main body; and a through hole forming step of providing a connection terminal through hole in the heat sink main body. A method for manufacturing a heat sink for an element. 3. A through-hole forming step of forming a through-hole in a plate-shaped heat sink body, a press-in step of press-fitting a laser element mounting material into the through-hole formed in the through-hole forming step, After the step, a compression step of compressing the laser element mounting portion material and the surface of the heat sink body so that the surfaces thereof become flat, and after the compression step, the heat sink body portion and the laser element mounting portion material are molded into a mold. A press-fitting step of molding the heat sink body and projecting a part of the material for the laser element mounting portion from the surface of the heat sink body; and a through hole forming step of providing connection terminal through holes in the heat sink body. A method for manufacturing a heat sink for a laser element.