JPH11214896A5 - - Google Patents

Info

Publication number
JPH11214896A5
JPH11214896A5 JP1998015522A JP1552298A JPH11214896A5 JP H11214896 A5 JPH11214896 A5 JP H11214896A5 JP 1998015522 A JP1998015522 A JP 1998015522A JP 1552298 A JP1552298 A JP 1552298A JP H11214896 A5 JPH11214896 A5 JP H11214896A5
Authority
JP
Japan
Prior art keywords
component
holding
components
component mounting
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998015522A
Other languages
Japanese (ja)
Other versions
JPH11214896A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP10015522A priority Critical patent/JPH11214896A/en
Priority claimed from JP10015522A external-priority patent/JPH11214896A/en
Publication of JPH11214896A publication Critical patent/JPH11214896A/en
Publication of JPH11214896A5 publication Critical patent/JPH11214896A5/ja
Pending legal-status Critical Current

Links

Claims (12)

部品(20)を保持する部品保持位置(11)と保持した部品を被装着体(8)へ装着する部品装着位置(13)との間を第1回転軸(121)の軸回りへの回転により上記部品を搬送して上記被装着体へ装着していく部品装着ヘッドであって、
少なくとも上記部品保持位置及び上記部品装着位置に対応して配置され、同一種にてなる第1種類の複数の上記部品をそれぞれで保持する複数の同種の第1部品保持部材(233−1)を有する保持部材用ヘッド(201)を備え、
上記部品保持位置に対応して配置される上記保持部材用ヘッドに備わる複数の上記第1部品保持部材のそれぞれにて複数の上記部品の保持を行う動作と、上記部品装着位置に対応して配置される上記保持部材用ヘッドに備わる複数の上記第1部品保持部材のそれぞれに保持されているそれぞれの上記部品の上記被装着体への装着を行う動作とを、上記部品装着ヘッドを上記第1回転軸の軸回りへ回転せずに、並行して行うことを特徴とする部品装着ヘッド。
A component mounting head that transports a component (20) between a component holding position (11) that holds the component (20) and a component mounting position (13) that mounts the held component onto a substrate (8) by rotating around a first rotation axis (121), and mounts the component onto the substrate,
a holding member head (201) having a plurality of first component holding members (233-1) of the same type, each of which holds a plurality of the first type of components of the same type, arranged corresponding to at least the component holding positions and the component mounting positions;
A component mounting head characterized in that the operation of holding a plurality of components on each of a plurality of first component holding members provided on the holding member head arranged corresponding to the component holding positions and the operation of mounting each of the components held on each of the plurality of first component holding members provided on the holding member head arranged corresponding to the component mounting positions onto the substrate are performed in parallel without rotating the component mounting head around the axis of the first rotation axis.
上記保持部材用ヘッドは、同種で複数の上記第1部品保持部材に加えて、上記第1種類とは異なる少なくとも1種類の異種類の部品を保持する複数の第2部品保持部材(233−2,233−3)を有する、請求項1記載の部品装着ヘッド。2. The component mounting head of claim 1, wherein the holding member head has, in addition to a plurality of the first component holding members of the same type, a plurality of second component holding members (233-2, 233-3) that hold at least one different type of component different from the first type. 上記保持部材用ヘッドは、第2回転軸(231)の軸回りに回転する回転体(232)を有し、該回転体の周囲面には少なくとも上記第1部品保持部材が該回転体の周方向に沿って、かつ上記部品を保持したとき互いに隣接する少なくとも上記第1部品保持部材同士で保持部品の干渉しない間隔を有して配列されている、請求項1又は2記載の部品装着ヘッド。3. The component mounting head according to claim 1, wherein the holding member head has a rotating body (232) that rotates around the axis of a second rotating shaft (231), and at least the first component holding members are arranged on the peripheral surface of the rotating body along the circumferential direction of the rotating body, and at least adjacent first component holding members are arranged at a distance such that when the components are held, the held components do not interfere with each other. 上記保持部材用ヘッドは、上記回転体を上記第2回転軸の軸回りに回転させる部品保持部材回転用駆動装置(220)を有する、請求項3記載の部品装着ヘッド。4. The component mounting head according to claim 3, wherein the holder head has a component holder rotation drive device (220) for rotating the rotor about the second rotation shaft. 上記第1回転軸に平行な第3回転軸(113)の軸回りに上記保持部材用ヘッドを回転させる回転用駆動装置(112)をさらに備えた、請求項1ないし4のいずれかに記載の部品装着ヘッド。5. The component mounting head according to claim 1, further comprising a rotation drive device (112) for rotating the holding member head around a third rotation axis (113) parallel to the first rotation axis. 上記保持部材用ヘッドは、同種で複数の上記第1部品保持部材に加えて、上記第1種類とは異なる少なくとも1種類の異種類の部品を保持する複数の第2部品保持部材(233−2,233−3)を有し、上記第1部品保持部材及び上記第2部品保持部材の少なくとも一方は、上記部品を吸着動作にて保持する吸着ノズルである、請求項1ないし5のいずれかに記載の部品装着ヘッド。 6. A component mounting head as described in any one of claims 1 to 5, wherein the holding member head has, in addition to a plurality of the first component holding members of the same type, a plurality of second component holding members (233-2, 233-3) that hold at least one type of component different from the first type, and at least one of the first component holding members and the second component holding members is a suction nozzle that holds the component by suction operation. 上記保持部材用ヘッドは、同種で複数の上記第1部品保持部材に加えて、上記第1種類とは異なる少なくとも1種類の異種類の部品を保持する複数の第2部品保持部材(233−2,233−3)を有し、上記第1部品保持部材及び上記第2部品保持部材の少なくとも一方のそれぞれに保持される上記部品が上記部品を供給する部品供給装置(3)に干渉するのを防止するため、上記回転体は、上記部品保持位置において上記第2回転軸が上記部品装着ヘッドの直径方向に対して平行に配置される、請求項3ないし6のいずれかに記載の部品装着ヘッド。 7. A component mounting head as described in any one of claims 3 to 6, wherein the holding member head has, in addition to a plurality of the first component holding members of the same type, a plurality of second component holding members (233-2, 233-3) that hold at least one type of component different from the first type, and wherein the rotating body is arranged such that the second rotation axis is parallel to the diameter direction of the component mounting head at the component holding position to prevent the components held by at least one of the first component holding members and the second component holding members from interfering with a component supply device (3) that supplies the components. 請求項1ないし7のいずれかに記載の部品装着ヘッドを備えたことを特徴とする部品装着装置。8. A component mounting apparatus comprising the component mounting head according to claim 1. 上記装着ヘッドの上記軸回りへの回転の軌跡上における部品撮像位置に設置され、該部品撮像位置に配置された保持部材用ヘッドに備わる複数の上記第1部品保持部材に保持されている上記部品の保持状態を間欠的ではなく連続的に撮像する撮像装置(151)を備えた、請求項8記載の部品装着装置。 9. The component mounting device according to claim 8, further comprising an imaging device (151) that is installed at a component imaging position on the trajectory of rotation of the mounting head around the axis, and that continuously, rather than intermittently, images the holding state of the components held by the plurality of first component holding members provided on the holding member head arranged at the component imaging position. 部品(20)を保持する部品保持位置(11)と保持した部品を被装着体(8)へ装着する部品装着位置(13)との間を第1回転軸の軸回りへの回転により上記部品を搬送して上記部品を上記被装着体へ装着していく部品装着ヘッドを使用して実行される部品装着方法であって、
上記部品保持位置にて同種類の複数の上記部品の保持を行った後、上記第1回転軸の軸回りへの回転により保持した部品を上記部品装着位置へ搬送した後、
上記部品保持位置にて同種類の複数の上記部品の保持を行う動作と、上記部品装着位置における保持されている複数の上記部品の上記被装着体への装着を行う動作とを、上記部品装着ヘッドを上記第1回転軸の軸回りへ回転せずに、並行して行うことを特徴とする部品装着方法。
A component mounting method carried out using a component mounting head that transports a component (20) by rotating around a first rotation axis between a component holding position (11) that holds the component (20) and a component mounting position (13) that mounts the held component onto a substrate (8), and mounts the component onto the substrate,
After holding a plurality of components of the same type at the component holding position, the held components are transported to the component mounting position by rotating the components around the first rotation axis, and
a component mounting head for mounting a plurality of components of the same type at the component holding position and a component mounting head for mounting the plurality of components held at the component mounting position onto the substrate, the component mounting head being configured to rotate around the first rotation axis;
上記部品保持位置と上記部品装着位置との間に位置する部品撮像位置にて、少なくとも上記部品保持動作と並行して、保持されている複数の上記部品について間欠的ではなく連続的に撮像していく、請求項10記載の部品装着方法。11. The component mounting method according to claim 10, wherein images of the held components are taken continuously, not intermittently, at a component imaging position located between the component holding position and the component mounting position, at least in parallel with the component holding operation. 上記部品保持位置では、同種で複数の部品の保持に加えて、少なくとも1種類の異種類の部品を複数個保持する、請求項11記載の部品装着方法。12. The component mounting method according to claim 11, wherein the component holding position holds a plurality of components of at least one different type in addition to holding a plurality of components of the same type.
JP10015522A 1998-01-28 1998-01-28 Component mounting head, component mounting device provided with the component mounting head, and component mounting method Pending JPH11214896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10015522A JPH11214896A (en) 1998-01-28 1998-01-28 Component mounting head, component mounting device provided with the component mounting head, and component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10015522A JPH11214896A (en) 1998-01-28 1998-01-28 Component mounting head, component mounting device provided with the component mounting head, and component mounting method

Publications (2)

Publication Number Publication Date
JPH11214896A JPH11214896A (en) 1999-08-06
JPH11214896A5 true JPH11214896A5 (en) 2005-07-07

Family

ID=11891157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10015522A Pending JPH11214896A (en) 1998-01-28 1998-01-28 Component mounting head, component mounting device provided with the component mounting head, and component mounting method

Country Status (1)

Country Link
JP (1) JPH11214896A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004265886A (en) 2003-01-15 2004-09-24 Matsushita Electric Ind Co Ltd Electronic component mounting apparatus and electronic component mounting method

Similar Documents

Publication Publication Date Title
KR20190062167A (en) Work turning apparatus and coating method using the same
JP3768038B2 (en) Electronic component mounting apparatus and mounting head of electronic component mounting apparatus
CA2426134A1 (en) Package-strapping apparatus
JP2007083232A (en) Method and apparatus for manufacturing components
JP3513378B2 (en) Substrate processing equipment
JP2001319909A5 (en)
JPH10294304A (en) Substrate holding device and substrate treating device utilizing substrate holding device
JPH10189421A (en) Edge rinse equipment
JP4145605B2 (en) Substrate processing equipment
JPH1168394A5 (en)
JP3964517B2 (en) Cleaning device and method
JP4189663B2 (en) Wafer gripping device
JPS61217445A (en) Device for reversing substrate
JP3217983B2 (en) Supply device
JP3359508B2 (en) Substrate processing equipment
JPH05335226A (en) Semiconductor manufacturing apparatus
JPH04150051A (en) Wafer grasping device
JP2840182B2 (en) Rotary coating method for substrate and rotary coating apparatus for substrate
JP2007203169A (en) Spin coater
JPH02908Y2 (en)
JP2002033261A (en) Substrate processing equipment
JP2002036099A (en) Double-side polishing machine
JP3785285B2 (en) Stepping motor angle error correction device
JP2539472B2 (en) Workpiece storage support mechanism
JPH0345317Y2 (en)